CN104810310B - A kind of wafer-scanning cleans swinging arm device - Google Patents
A kind of wafer-scanning cleans swinging arm device Download PDFInfo
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- CN104810310B CN104810310B CN201510207442.8A CN201510207442A CN104810310B CN 104810310 B CN104810310 B CN 104810310B CN 201510207442 A CN201510207442 A CN 201510207442A CN 104810310 B CN104810310 B CN 104810310B
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- swing arm
- wafer
- belt wheel
- housing
- driving
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Swinging arm device is cleaned the present invention relates to a kind of wafer-scanning, wafer-scanning cleaning swinging arm device includes:Swing arm part, the swing arm part is provided with arm shaft;Nozzle, the nozzle is arranged on the swing arm part, can be rotated around swing arm part;Lift Part, for driving the swing arm part vertically moving;Tilting member, for driving the arm shaft of the swing arm part to rotate;Housing, for installing the swing arm part, Lift Part and tilting member.Because nozzle is arranged on the swing arm part, it can be rotated around swing arm part, spray angle of the nozzle to wafer can be conveniently adjusted.The arm shaft for driving the swing arm part using tilting member is rotated, and realizes that the scanning of swing arm part is swung.Drive the swing arm part vertically moving using Lift Part, only have scanning to swing a direction motion without traditional swing arm part, cleaning performance is poor in cleaning wafer, it is understood that there may be the problem of cleaning dead angle.
Description
Technical field
The invention belongs to the wafer cleaning technical field in semiconductor crystal wafer process, more particularly to a kind of realization pair
The scanning cleaning swinging arm device that crystal column surface is cleaned.
Background technology
During semiconductor wafer manufacturing technique, wafer is needed by multiple cleaning step.Due to device technology skill
The critical size of art constantly diminution and the introducing of new material so that table in front procedure (FEOL, ront end of line)
Face cleaning treatment is even more important.Critical dimension reduction causes the process window of cleaning to narrow, and to meet wafer cleaning efficiency and same
When accomplish that as far as possible few crystal column surface is carved and damage and structural failure becomes further difficult.
Wafer wet cleaning is divided into slot type cleaning and Single-Wafer Cleaning two ways.Single-Wafer Cleaning can be reduced and cleaned
The risk of cross pollution in journey, improves yield rate.100 nm and its following work can be effectively improved by using single-wafer technology
The yield rate of skill.For 300 mm and the large-size ultra-thin wafer of the above, the cost of wafer is too high, to avoid slot type cleaning process
Damaging for wafer can only use the cleaning way of single-wafer.
In existing Single-Wafer Cleaning device, generally using a kind of swinging arm device, driven, installed on swinging arm device by motor
There is nozzle, cleaning is scanned to the wafer of rotation, to reach the purpose for improving cleaning performance.In addition, on swinging arm device often
Million sound shower nozzles or the first-class heavier load of high pressure spray are needed, with the special technological requirement of satisfaction.Traditional wafer cleaning device
Swinging arm device, only possess scanning oscillating function, and it is steady, rapidly to be not enough to flusher of the driving with heavier load
Motion.With the development of cleaning, in order to improve cleaning performance, it is to avoid there is cleaning dead angle, swinging arm device does not require nothing more than energy
Enough work scanning is swung, and needs dynamically to adjust nozzle to the distance of wafer in vertical direction.
The content of the invention
The present invention provides a kind of wafer-scanning cleaning swinging arm device, and technical problem to be solved is traditional wafer cleaning dress
The swinging arm device put only possesses scanning oscillating function, and in cleaning wafer, cleaning performance is poor, it is understood that there may be cleaning dead angle.
The technical scheme that the present invention solves above-mentioned technical problem is as follows:A kind of wafer-scanning cleans swinging arm device, and it includes:
Swing arm part, the swing arm part is provided with arm shaft;
Nozzle, the nozzle is arranged on the swing arm part, can be rotated around swing arm part;
Lift Part, for driving the swing arm part vertically moving;
Tilting member, for driving the arm shaft of the swing arm part to rotate;
Housing, for installing the swing arm part, Lift Part and tilting member.
Wafer-scanning cleaning swinging arm device as described above of the invention, further, the swing arm part is additionally provided with:
Swing arm cross bar, one end of the swing arm cross bar is vertical with the arm shaft to be connected;
Nozzle mounting seat, the nozzle mounting seat is arranged on the other end of the swing arm cross bar, and can be horizontal around swing arm
Bar is rotated;The nozzle is arranged in the nozzle mounting seat.
Wafer-scanning cleaning swinging arm device as described above of the invention, further, the Lift Part includes:
Lifting motor, the lifting motor is fixed in the housing;
Leading screw, one end of the leading screw is connected with the motor shaft of the lifting motor;
Feed screw nut, the feed screw nut is connected with arm shaft, and feed screw nut is arranged in leading screw;
First control piece, for controlling the lifting motor to run or stopping.
Wafer-scanning cleaning swinging arm device as described above of the invention, further, first control piece includes:
Baffle ring, on the arm shaft;
First origin sensor, in the housing, position is corresponding with the baffle ring, for sensing baffle ring and first
The position of origin sensor;
First driving plate, in the housing, receives the signal of the first origin sensor and controls lifting motor to transport
Row stops.
Wafer-scanning cleaning swinging arm device as described above of the invention, further, the tilting member includes:
Pillar, the protective pipe sleeve is outside the leading screw, and one end of pillar is connected with feed screw nut;
Deceleration component, for driving the pillar to be rotated along pillar axle;
Oscillating motor, the oscillating motor is fixed in the housing, for driving the deceleration component;
Second control piece, for controlling the oscillating motor to run or stopping.
Wafer-scanning cleaning swinging arm device as described above of the invention, further, the deceleration component includes:
First belt wheel, in the rotating shaft of the oscillating motor;
Two ends connect the driving member of the second belt wheel and the 3rd belt wheel respectively;
4th belt wheel, for driving the pillar to rotate;
First timing belt, connects first belt wheel and the second belt wheel;
Second timing belt, connects the 3rd belt wheel and the 4th belt wheel;
The diameter of first belt wheel is less than the second belt wheel, and the diameter of the 3rd belt wheel is less than the 4th belt wheel.
Wafer-scanning cleaning swinging arm device of the invention as described above, further, the driving member include rolling bearing units and
Power transmission shaft;The rolling bearing units are fixed in the housing, and the power transmission shaft is arranged on the rolling bearing units.
Wafer-scanning cleaning swinging arm device as described above of the invention, further, second control piece includes:
Catch, on the pillar;
Second origin sensor, in the housing, position is corresponding with the catch, for sensing catch and second
The position of origin sensor;
Second driving plate, in the housing, receives the signal of the second origin sensor and controls oscillating motor to transport
Row stops.
Wafer-scanning cleaning swinging arm device as described above of the invention, further, in addition to outer side guard plate, the outside shield
Plate is arranged on outside the housing.
The beneficial effects of the invention are as follows:
1st, the present invention has separately constituted Lift Part and tilting member provided with lifting motor and oscillating motor etc..Can root
According to process requirements, the distance of the height and nozzle of control nozzle to wafer to crystal circle center, to reach optimal cleaning performance.
2nd, the present invention is provided with nozzle, nozzle mounting seat, clip and swing arm cross bar.Nozzle is arranged in nozzle mounting seat, spray
Mouth mounting seat is connected by clip with swing arm cross bar.Nozzle mounting seat opposed swing arms cross bar can be rotated about the axis thereof, so as to
To adjust the angle that nozzle sprays decoction, to reach optimal cleaning performance.
3rd, the present invention is swung provided with rolling bearing units, the belt wheel of the first belt wheel~the 4th and timing belt composition double reduction mechanism
Motor drives pillar by the two-step mechanism.When nozzle mounting seat is provided with million sound shower nozzles or multiple nozzles, swing arm part
Load increase, now needs larger moment of torsion, to drive swing arm part to make scanning motion.Using double reduction mechanism, Ke Yizeng
The moment of torsion of arm member is put on, driving swing arm part that can be reliable, stable makees scanning motion.Meanwhile, relative to equal mechanical property
Reductor, using the double reduction mechanism, compact conformation, speed reducing ratio are big.
4th, the present invention is provided with driving plate, and is installed on base.Origin sensor, lifting motor and oscillating motor are electric
Cable is connected thereto.The electrical connection of scanning cleaning swinging arm device and ancillary equipment involved in the present invention only needs to power supply and logical
Believe cable, reduce the electrical connection with ancillary equipment, enhance the independence of the device, improve the device reliability and
Stability.Multiple scanning cleaning swinging arm devices are needed in ancillary equipment, to realize during specific cleaning purpose, using above-mentioned knot
Structure, greatly strengthen the scalability of the device.
5th, the present invention is provided with outer guard plate and protective cover, can prevent cleaning decoction from entering in housing, to inner member
It can play and be effectively protected.
During the use of wafer-scanning cleaning swinging arm device of the present invention, the wafer of rotation is scanned clearly using nozzle
Wash to be cleaned.Because nozzle is arranged on the swing arm part, it can be rotated around swing arm part, nozzle pair can be conveniently adjusted
The spray angle of wafer.The arm shaft for driving the swing arm part using tilting member is rotated, and realizes the scanning pendulum of swing arm part
It is dynamic.Drive the swing arm part vertically moving using Lift Part, solve traditional swing arm part and only have scanning to swing one
Individual direction motion, in cleaning wafer, cleaning performance is poor, it is understood that there may be the problem of cleaning dead angle.
Brief description of the drawings
Fig. 1 cleans the profile of swinging arm device for a kind of wafer-scanning provided in an embodiment of the present invention;
Fig. 2 is Fig. 1 close-up schematic view;
Fig. 3 cleans the side view of swinging arm device for a kind of wafer-scanning provided in an embodiment of the present invention;
Fig. 4 cleans the axonometric drawing of swinging arm device for a kind of wafer-scanning provided in an embodiment of the present invention.
In accompanying drawing, portion's list of parts representated by each label is as follows:
1st, base, the 2, second driving plate, 3, oscillating motor, 4, lifting motor, the 5, first driving plate, 6, housing, 7, first
Central dividing plate, 8, shaft coupling, the 9, second central dividing plate, the 10, the 4th belt wheel, 11, pillar, 12, leading screw, 13, feed screw nut, 14,
Connector, 15, upper fagging, 16, sliding sleeve, 17, arm shaft, 18, protective cover, 19, nozzle, 20, nozzle mounting seat, 21, joint,
22nd, clip, 23, swing arm cross bar, the 24, first origin sensor, 25, baffle ring, the 26, second timing belt, the 27, the 3rd belt wheel, 28, gear
Piece, the 29, second origin sensor, 30, rolling bearing units, 31, power transmission shaft, the 32, second belt wheel, the 33, first timing belt, 34, first
Belt wheel, 35, outer side guard plate, 36, outer side guard plate, 100, swing arm part, 200, Lift Part, 300, tilting member.
Embodiment
The principle and feature of the present invention are described below in conjunction with accompanying drawing, the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the present invention.
The embodiment of the present invention needs the swinging arm device for solving traditional wafer cleaning device only to possess scanning oscillating function, clear
Cleaning performance is poor when washing wafer, it is understood that there may be the problem of cleaning dead angle.
As shown in figure 3, cleaning the side view of swinging arm device for a kind of wafer-scanning provided in an embodiment of the present invention.The wafer
Scanning cleaning swinging arm device includes:
Swing arm part 100, the swing arm part is provided with arm shaft 17;
Nozzle 19, the nozzle 19 is arranged on the swing arm part 100, can be rotated around swing arm part 100;
Lift Part 200, for driving the swing arm part 100 vertically moving;
Tilting member 300, for driving the arm shaft 17 of the swing arm part to rotate;
Housing 6, for installing the swing arm part 100, Lift Part 200 and tilting member 300.In specific implementation process
In, housing 6 includes base 1.
During the use of the wafer-scanning cleaning swinging arm device of the above embodiment of the present invention, crystalline substance of the nozzle to rotation is utilized
It is to be cleaned that circle is scanned cleaning.Because nozzle is arranged on the swing arm part, it can rotate, can facilitate around swing arm part
Ground adjusts spray angle of the nozzle to wafer.The arm shaft for driving the swing arm part using tilting member is rotated, and realizes swing arm
The scanning of part is swung.Drive the swing arm part vertically moving using Lift Part, solve traditional swing arm part only
There is scanning to swing a direction motion, cleaning performance is poor in cleaning wafer, it is understood that there may be the problem of cleaning dead angle.
It is as depicted in figs. 1 and 2, described in the specific implementation process that above-described embodiment wafer-scanning cleans swinging arm device
Swing arm part 100 is additionally provided with:
Swing arm cross bar 23, one end of the swing arm cross bar 23 is vertical with the arm shaft 17 to be connected;
Nozzle mounting seat 20, the nozzle mounting seat 20 is arranged on the other end of the swing arm cross bar 23, and can be around
Swing arm cross bar 23 is rotated;The nozzle 19 is arranged in the nozzle mounting seat 20, the joint 21 of nozzle 19 and conveying cleaning fluid
Connection.In specific implementation process, nozzle mounting seat 20 is connected with swing arm cross bar 23 by clip 22.In the embodiment for more having choosing
In, the protective cover 18 with protective effect is also equipped with outside arm shaft 17.
It is as depicted in figs. 1 and 2, described in the specific implementation process that above-described embodiment wafer-scanning cleans swinging arm device
Lift Part 200 includes:
Lifting motor 4, the lifting motor 4 is fixed in the housing 6;In the particular embodiment, lifting motor 4 is pacified
On the first central dividing plate 7 in housing.
Leading screw 12, one end of the leading screw 12 is connected with the motor shaft of the lifting motor 4;In specific implementation process,
Leading screw 12 is connected with motor shaft by 8 shaft couplings.
Feed screw nut 13, the feed screw nut 13 is connected with arm shaft 17, and feed screw nut 13 is arranged in leading screw 12;
In specific implementation process, arm shaft 17 is connected by connector 14 with feed screw nut 13.
First control piece, for controlling the lifting motor 4 to run or stopping.
In specific implementation process, the top of the housing is provided with fagging 15, and upper fagging 15 is provided with sliding sleeve 16, supplies
Arm shaft 17 is slided.
In a preferred embodiment, first control piece includes:
Baffle ring 25, on the arm shaft 17;Or on connector 14.
First origin sensor 24, in the housing 6, position is corresponding with the baffle ring 25, for sensing baffle ring
With the position of the first origin sensor;First origin sensor 24 is connected with the signal of the first driving plate 5;
First driving plate 5, in the housing 6, receives the signal of the first origin sensor 24 and controls lifting electricity
Machine 4 runs or stopped.First driving plate 5 is electrically connected with lifting motor 4.
It is as depicted in figs. 1 and 2, described in the specific implementation process that above-described embodiment wafer-scanning cleans swinging arm device
Tilting member 300 includes:
Pillar 11, the pillar 11 is enclosed on outside the leading screw 12, and one end of pillar 11 is connected with feed screw nut 13;
Deceleration component, for driving the pillar 11 to be rotated along pillar axle;
Oscillating motor 3, the oscillating motor 3 is fixed in the housing 6, for driving the deceleration component;Specific
Embodiment in, oscillating motor 3 is mounted on the first central dividing plate 7 in housing.
Second control piece, for controlling the oscillating motor 3 to run or stopping.
It is as depicted in figs. 1 and 2, described to slow down in a kind of above-described embodiment wafer-scanning cleaning embodiment of swinging arm device
Part includes:
First belt wheel 34, in the rotating shaft of the oscillating motor 3;
Two ends connect the driving member of the second belt wheel 32 and the 3rd belt wheel 27 respectively;The driving member includes the He of rolling bearing units 30
Power transmission shaft 31;The rolling bearing units 30 are fixed in the housing 6, and the power transmission shaft 31 is arranged on the rolling bearing units 30.
In specific embodiment, rolling bearing units 30 are mounted on the second central dividing plate 9 in housing 6.Second central dividing plate 9 is located at
The top of first central dividing plate 7.
4th belt wheel 10, for driving the pillar 11 to rotate;In a kind of specific implementation process, the outer wall of pillar 11 is set
There is fastener, connection corresponding with the neck of the 4th belt wheel 10.
First timing belt 33, connects the belt wheel 32 of the first belt wheel 34 and second;
Second timing belt 26, connects the 3rd belt wheel 27 and the 4th belt wheel 10;
The diameter of first belt wheel 34 is less than the second belt wheel 32, and the diameter of the 3rd belt wheel 27 is less than the 4th belt wheel 10.
In a preferred embodiment, second control piece includes:
Catch 28, on the pillar 11;
Second origin sensor 29, in the housing 6, position is corresponding with the catch 28, for sensing catch
With the position of the second origin sensor;Second origin sensor 29 is connected with the signal of the second driving plate 2;
Second driving plate 2, in the housing 6, receives the signal of the second origin sensor 29 and controls to swing electricity
Machine 3 runs or stopped.Second driving plate 2 is electrically connected with oscillating motor 3.
In the specific implementation process that above-described embodiment wafer-scanning cleans swinging arm device, in addition to outer side guard plate 35,36,
The outer side guard plate is arranged on outside the housing.Outer side guard plate make scanning clean swinging arm device in Lift Part, tilting member,
Electric-controlled product etc. plays a part of protection in a closed environment.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (6)
1. a kind of wafer-scanning cleans swinging arm device, it is characterised in that including:
Swing arm part, the swing arm part is provided with arm shaft;
Nozzle, the nozzle is arranged on the swing arm part, can be rotated around swing arm part;
Lift Part, for driving the swing arm part vertically moving;
Tilting member, for driving the arm shaft of the swing arm part to rotate;
Housing, for installing the swing arm part, Lift Part and tilting member;
Characterized in that, the Lift Part includes:
Lifting motor, the lifting motor is fixed in the housing;
Leading screw, one end of the leading screw is connected with the motor shaft of the lifting motor;
Feed screw nut, the feed screw nut is connected with arm shaft, and feed screw nut is arranged in leading screw;
First control piece, for controlling the lifting motor to run or stopping;
First control piece includes:
Baffle ring, on the arm shaft;
First origin sensor, in the housing, position is corresponding with the baffle ring, for sensing baffle ring and the first origin
The position of sensor;
First driving plate, in the housing, receive the first origin sensor signal and control lifting motor run or
Stop;
The tilting member includes:
Pillar, the protective pipe sleeve is outside the leading screw, and one end of pillar is connected with feed screw nut;
Deceleration component, for driving the pillar to be rotated along pillar axle;
Oscillating motor, the oscillating motor is fixed in the housing, for driving the deceleration component;
Second control piece, for controlling the oscillating motor to run or stopping.
2. wafer-scanning according to claim 1 cleans swinging arm device, it is characterised in that the swing arm part is also set up
Have:
Swing arm cross bar, one end of the swing arm cross bar is vertical with the arm shaft to be connected;
Nozzle mounting seat, the nozzle mounting seat is arranged on the other end of the swing arm cross bar, and can turn around swing arm cross bar
It is dynamic;The nozzle is arranged in the nozzle mounting seat.
3. wafer-scanning according to claim 1 cleans swinging arm device, it is characterised in that the deceleration component includes:
First belt wheel, in the rotating shaft of the oscillating motor;
Two ends connect the driving member of the second belt wheel and the 3rd belt wheel respectively;
4th belt wheel, for driving the pillar to rotate;
First timing belt, connects first belt wheel and the second belt wheel;
Second timing belt, connects the 3rd belt wheel and the 4th belt wheel;
The diameter of first belt wheel is less than the second belt wheel, and the diameter of the 3rd belt wheel is less than the 4th belt wheel.
4. wafer-scanning according to claim 3 cleans swinging arm device, it is characterised in that the driving member includes axle of usheing to seat
Hold and power transmission shaft;The rolling bearing units are fixed in the housing, and the power transmission shaft is arranged on the rolling bearing units.
5. wafer-scanning according to claim 1 cleans swinging arm device, it is characterised in that second control piece includes:
Catch, on the pillar;
Second origin sensor, in the housing, position is corresponding with the catch, for sensing catch and the second origin
The position of sensor;
Second driving plate, in the housing, receive the second origin sensor signal and control oscillating motor run or
Stop.
6. wafer-scanning according to claim 1 cleans swinging arm device, it is characterised in that described also including outer side guard plate
Outer side guard plate is arranged on outside the housing.
Priority Applications (1)
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CN201510207442.8A CN104810310B (en) | 2015-04-28 | 2015-04-28 | A kind of wafer-scanning cleans swinging arm device |
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CN201510207442.8A CN104810310B (en) | 2015-04-28 | 2015-04-28 | A kind of wafer-scanning cleans swinging arm device |
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CN104810310A CN104810310A (en) | 2015-07-29 |
CN104810310B true CN104810310B (en) | 2017-09-19 |
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CN105957821B (en) * | 2016-04-28 | 2018-08-24 | 中国电子科技集团公司第四十五研究所 | A kind of wafer scrub swinging arm device |
CN106312780B (en) * | 2016-09-28 | 2019-04-02 | 清华大学 | Polissoir |
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CN108677368B (en) * | 2018-05-31 | 2019-09-06 | 吉林省德盟欧纺织机械有限公司 | A kind of oscillating arm mechanisms |
CN109047092A (en) * | 2018-09-30 | 2018-12-21 | 宁波润华全芯微电子设备有限公司 | It is a kind of for cleaning the swing arm cleaning device of reticle |
CN109482538A (en) * | 2018-12-10 | 2019-03-19 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Wafer washing and brushing device |
CN111319970B (en) * | 2018-12-13 | 2021-11-02 | 北京华文永康科技有限公司 | Sucking disc bowl taking device |
CN111341690B (en) * | 2018-12-19 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Spraying structure and reaction chamber |
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CN110707022B (en) * | 2019-09-06 | 2022-07-29 | 长江存储科技有限责任公司 | Wafer cleaning device |
CN113118099A (en) * | 2019-12-31 | 2021-07-16 | 盛美半导体设备(上海)股份有限公司 | Rotary spray head, cleaning equipment and cleaning method |
CN112693228B (en) * | 2020-12-30 | 2022-04-19 | 大族激光科技产业集团股份有限公司 | Rotary liquid injection device and laser processing device |
CN114226317A (en) * | 2021-12-13 | 2022-03-25 | 上海提牛机电设备有限公司 | Wafer cleaning device |
CN115121515B (en) * | 2022-08-30 | 2022-12-16 | 智程半导体设备科技(昆山)有限公司 | Brush piece formula wafer cleaning machine swing arm mechanism |
CN115106315B (en) * | 2022-08-30 | 2022-11-18 | 智程半导体设备科技(昆山)有限公司 | Brush head mechanism of brush sheet type wafer cleaning machine |
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CN202290660U (en) * | 2011-09-28 | 2012-07-04 | 吴永清 | Straight line type track cleaning machine |
CN104051304A (en) * | 2013-03-15 | 2014-09-17 | 大日本网屏制造株式会社 | Substrate treatment apparatus and substrate treatment method |
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