CN201126812Y - Scan cleaning device - Google Patents

Abstract

The utility model relates to a technology for cleaning wafers during semiconductor wafer processing, in particular to a scanning cleaning device for cleaning the surface of wafers, which can solve the problems of traditional cleaning structures such as fixed spraying angles and positions that tend to produce dead angles. The device is equipped with a nozzle motor, a spindle motor, a chip holder, a nozzle, a nozzle shaft, and a nozzle arm. One end of the nozzle arm is installed on the nozzle shaft of the nozzle motor, and the other end of the nozzle arm is connected to a nozzle. A bearing is installed on the spindle of the spindle motor. The wafer stage, the nozzle corresponds to the wafer on the wafer stage. In the cleaning process, the utility model controls the position of the nozzle and the characteristics of the wafer rotation, and adopts the mode of water spraying and rotating scanning cleaning, which can meet the cleaning needs to the greatest extent and realize the purpose of effectively cleaning the wafer surface, that is, the surface of the wafer Particles are all removed.

Description

Scan cleaning device

technical field

The utility model relates to the technology for cleaning the wafer during the processing of the semiconductor wafer, in particular to a scanning and cleaning device for cleaning the surface of the wafer.

Background technique

As we all know, semiconductor wafer processing requires a highly clean environment to reduce the impact of unwanted particles on the process. However, with the continuous improvement of precision, the continuous reduction of line width and the continuous improvement of cleanliness requirements. Not only a high cleanliness purification environment is required, but in many cases, the surface of the wafer needs to be cleaned to meet the requirements for the cleanliness of the surface of the processed wafer.

The original wafer cleaning method is to fix the wafer on the wafer stage by vacuum adsorption, and then start the cleaning equipment to make the wafer table rotate with the wafer. Since the particles of the wafer are hidden in the grooves of the wafer, Gu generally uses deionized water to directly rinse the surface of the lens to clean it. In this way, relying on the centrifugal force when the wafer is rotated by the wafer table, coupled with the scouring force of ionized water, the particles on the wafer are removed to achieve the purpose of cleaning. However, the ionized water used in this method is prone to dead angles due to the fixed spray angle and position. In this way, no matter how the rotating speed of the wafer stage is changed or the cleaning time is increased, the particles on the surface of the wafer cannot be completely and effectively washed away.

Utility model content

The purpose of this utility model is to provide a scanning cleaning device, which solves the problems of traditional cleaning structure, such as fixed spray angle and position, which are easy to produce dead angles, etc., and adopts the method of water spraying and rotating scanning cleaning, so as to realize the purpose of effectively cleaning the wafer surface.

The technical scheme of the utility model is:

A scanning and cleaning device, the device is provided with a nozzle motor, a spindle motor, a chip holder, a nozzle, a nozzle shaft, and a nozzle arm, one end of the nozzle arm is installed on the nozzle shaft of the nozzle motor, the other end of the nozzle arm is connected with a nozzle, and the spindle motor A wafer stage is installed on the main shaft, and the nozzle corresponds to the wafer on the wafer stage.

In the scanning cleaning device, a nozzle shaft waterproof sleeve is installed on the nozzle shaft, and the nozzle shaft waterproof sleeve and the nozzle shaft are in an interference fit.

In the scanning cleaning device, the high-pressure water pipe processed into a spiral shape is installed around the nozzle shaft, and the high-pressure water pipe is wound up in a spiral and then connected to the nozzle along the nozzle arm.

The scanning and cleaning device described above is arranged in a casing, and the casing is composed of an upper casing and a lower casing with upper and lower layers, and the upper and lower layers mesh with each other at the joint.

In the scanning cleaning device, a retractable main shaft waterproof cover is installed between the main shaft of the main shaft motor and the lower casing, and the main shaft waterproof cover is fixed to the main shaft and the lower casing respectively.

In the scanning and cleaning device described above, the nozzle shaft is mounted on the lower casing through rolling bearings.

The beneficial effects of the utility model are:

1. The cleaning device provided by the utility model includes two motors, a wafer holder, a spray head and a control unit. Through the control of the position of the nozzle and the characteristics of the wafer rotation during the cleaning process, the cleaning needs can be met to the greatest extent, and the purpose of cleaning can be achieved, that is, all the particles on the surface of the wafer can be removed.

2. In the cleaning device of the present invention, the water used for cleaning is high-pressure water. In this way, in order to ensure absolute safety during operation, all devices are installed in a square "labyrinth" housing. Controlled by the control unit, when one motor drives the wafer stage and the wafer to rotate, the other motor drives the nozzle arm to rotate so that the nozzle moves in a circular motion driven by the nozzle arm, that is, scanning. The angle and speed of nozzle swing can be adjusted arbitrarily according to different process needs.

3. At the same time, waterproof sleeves are installed on the rotating shaft of the nozzle and the rotating shaft of the bearing table to prevent the liquid from leaking downwards and causing damage to the motor and causing accidents. In this device, the housing is machined from plastic. The rest of the parts are made of stainless steel, which can ensure that no particles will be generated to cause secondary pollution of the wafer.

4. In addition, due to the high pressure of the cleaning fluid sometimes used, it is necessary to use materials such as stainless steel pipes to ensure its pressure resistance. The stainless steel tube has strong rigidity and is not suitable for repeated bending, but the nozzle has to rotate repeatedly, so the stainless steel tube is specially made into a spiral shape, so that the function of nozzle rotation can be satisfied while ensuring its pressure resistance.

Description of drawings

Fig. 1 and Fig. 2 are the schematic structural diagrams of the utility model. Among them, Fig. 1 is a front view; Fig. 2 is a top view.

Figure 3 is a high-pressure water pipe processed into a spiral.

Fig. 4 is an enlarged cross-sectional schematic view of the junction of the upper and lower housings.

In the figure, 1-nozzle motor; 2-spindle motor; 3-supporting piece table; 4-lower shell; 5-spindle waterproof cover; 6-nozzle shaft waterproof cover; 7-nozzle; Nozzle shaft; 11-nozzle arm; 12-wafer; 13-upper casing; 14-high-pressure water pipe; 15-main shaft.

Detailed ways

As shown in Figure 1-2, the scanning cleaning device of the present invention has a nozzle motor 1, a main shaft motor 2, a film holder 3, a housing, a main shaft waterproof cover 5, a nozzle shaft waterproof cover 6, a nozzle 7, rolling bearings 8, 9, Nozzle shaft 10, nozzle arm 11, wafer 12, etc.; one end of the nozzle arm 11 is installed on the nozzle shaft 10 of the nozzle motor 1, the other end of the nozzle arm 11 is connected with the nozzle 7, and the spindle 15 of the spindle motor 2 is equipped with a wafer holder 3 , the nozzle 7 corresponds to the wafer 12 on the chip holder 3; the nozzle shaft waterproof sleeve 6 is installed on the nozzle shaft 10, and the nozzle shaft waterproof sleeve 6 and the nozzle shaft 10 are interference fit; the device is located in the housing , the housing is composed of upper and lower layers (i.e. upper housing 13 and lower housing 4), the upper housing 13 and the lower housing 4 are plugged and engaged with each other at the connection, forming a structure similar to a labyrinth; the housing adopts such a labyrinth Type structure (Figure 4), it is difficult for the liquid to leak from the connection of the shell, and the processing material can be saved at the same time. A retractable main shaft waterproof cover 5 is also installed between the main shaft 15 of the main shaft motor 2 and the lower casing 4, and the main shaft waterproof cover 5 is respectively fixed with the main shaft 15 and the lower casing 4; on the lower case 4.

As shown in FIG. 2 , the nozzle 7 rotates with the nozzle axis 10 as the center and the nozzle arm 11 as the radius, so as to realize rotating cleaning, and its height, rotation angle and radius are all adjustable.

As shown in Figure 3, the high-pressure water pipe 14 processed into a spiral shape is installed around the nozzle shaft 10. After the high-pressure water pipe 14 is threaded from below, it is processed into a spiral shape, and after being spirally wound, it is connected to the nozzle 7 along the nozzle arm 11. When the high-pressure water pipe swings, it will not generate a large torque, which can ensure its pressure resistance and reduce the load torque.

After starting the cleaning device, first the spindle motor 2 rotates, thereby driving the wafer holder 3 directly connected to it to rotate. In this way, the wafer 12 fixed on the wafer stage 3 by vacuum suction also rotates, and its rotation speed and acceleration are adjustable. At this time, the nozzle motor 1 rotates, which drives the nozzle shaft 10 connected to it to rotate, and the nozzle arm 11 and the nozzle 7 rotate accordingly, and their movement tracks are shown by the arrows in FIG. 2 . The angle and speed of rotation and cleaning can be adjusted by controlling the nozzle motor 1 as required. When the nozzle 7 rotates to the specified position, it will automatically return to the original position. During the cleaning process of the swing arm, because the high-pressure water pipe 14 (such as: steel pipe) connected to the nozzle 7 has been processed into a spiral shape, the load on the rotating nozzle motor 1 is not very large, and it can easily rotate with the nozzle 7 , while ensuring the pressure resistance characteristics of the high-pressure water pipe 14. In this way, the rotary nozzle motor 1 will not burn out due to too much load torque, nor will it cause the risk of rupture due to insufficient pressure resistance of the high-pressure water pipe.

Because in the cleaning process, it may be necessary to carry out some minor adjustments to the central position of the nozzle 7 relative to the wafer 12, and it may also be necessary to perform special cleaning of a specific angle and a specific range on the wafer 12, so the nozzle shaft 10, the nozzle arm 11 and the nozzle The connections among the 7 are all designed to be adjustable, and all adopt screw locking. When adjustment is required, the screw can be loosened, and the position of the nozzle 7 and the nozzle arm 11 can be shifted by using the gap between the shaft and the hole. When the position is suitable, the screw can be tightened again to fix it. In this way, the spray radius and height of the nozzle 7 can be adjusted at the same time to meet the requirements.

In order to ensure that the nozzle 7 does not leak liquid during the rotating scanning cleaning process, a nozzle shaft waterproof sleeve 6 is fixed on the middle and upper part of the nozzle shaft 10 . There is an interference fit between the nozzle shaft waterproof sleeve 6 and the nozzle shaft 10, and it is fixed on the nozzle shaft 10 with a top wire. In this way, it can be ensured that when the nozzle 7 is reciprocatingly rotating, the nozzle shaft waterproof sleeve 6 can not only realize its waterproof function well, but also not fall off. In addition, in order to prevent the liquid from leaking from the intermediate main shaft 15, a retractable main shaft waterproof cover 5 is installed between the main shaft 15 of the main shaft motor 2 and the lower housing 4. The main shaft waterproof cover 5 is made retractable because sometimes the bearing Platform needs to rise, and main shaft waterproof cover 5 is a kind of telescopic plastic tube, and material is exactly common plastics, butterfly shape, telescopic. The main shaft waterproof cover 5 is fixed with the lower housing 4, so that it can prevent leakage when it does not affect the lifting of the wafer holder 3.

Claims (6)

1. A scanning cleaning device, characterized in that: the device is provided with a nozzle motor (1), a spindle motor (2), a chip holder (3), a nozzle (7), a nozzle shaft (10), a nozzle arm (11 ), one end of the nozzle arm (11) is installed on the nozzle shaft (10) of the nozzle motor (1), the other end of the nozzle arm (11) is connected with the nozzle (7), and the spindle of the spindle motor (2) is installed with a film holder (3), the nozzle (7) corresponds to the wafer (12) on the wafer stage (3). 2. The scanning and cleaning device according to claim 1, characterized in that: a nozzle shaft waterproof cover (6) is installed on the nozzle shaft (10), and between the nozzle shaft waterproof cover (6) and the nozzle shaft (10) is interference fit. 3. The scanning and cleaning device according to claim 1, characterized in that: the spiral high-pressure water pipe (14) is installed around the nozzle shaft (10), and the high-pressure water pipe (14) is spirally wound along the nozzle arm ( 11) Connect with nozzle (7). 4. The scanning and cleaning device according to claim 1, characterized in that: the device is arranged in a casing, the casing is composed of an upper casing and a lower casing with upper and lower layers, and the upper and lower layers mesh with each other at the joint. 5. The scanning cleaning device according to claim 4, characterized in that: a retractable main shaft waterproof cover (5) is installed between the main shaft (15) of the main shaft motor (2) and the lower casing (4), and the main shaft Waterproof cover (5) is respectively fixed with main shaft (15) and lower casing (4). 6. The scanning and cleaning device according to claim 4, characterized in that the nozzle shaft (10) is mounted on the lower housing (4) through rolling bearings.

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