CN109482538A - Wafer washing and brushing device - Google Patents
Wafer washing and brushing device Download PDFInfo
- Publication number
- CN109482538A CN109482538A CN201811509094.XA CN201811509094A CN109482538A CN 109482538 A CN109482538 A CN 109482538A CN 201811509094 A CN201811509094 A CN 201811509094A CN 109482538 A CN109482538 A CN 109482538A
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- China
- Prior art keywords
- wafer
- brush
- carrying component
- wafer carrying
- brushing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005406 washing Methods 0.000 title claims abstract description 37
- 230000001680 brushing effect Effects 0.000 title claims abstract description 36
- 235000012431 wafers Nutrition 0.000 claims abstract description 147
- 238000004140 cleaning Methods 0.000 claims abstract description 75
- 230000007246 mechanism Effects 0.000 claims description 30
- 238000009826 distribution Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 239000003344 environmental pollutant Substances 0.000 abstract description 7
- 231100000719 pollutant Toxicity 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005201 scrubbing Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to cleaning equipment technical fields, in particular to a kind of wafer washing and brushing device.Wafer washing and brushing device, comprising: wafer carrying component, upper brush driving assembly and upper brush cleaning platform；The upper brush cleaning platform and the wafer carrying inter-module are every setting, the upper brush cleaning platform is for cleaning the upper round brush being arranged on the upper brush driving assembly, the wafer carrying component is arranged in close to the side of the upper brush cleaning platform in one end of the upper brush driving assembly, and the other end of the upper brush driving assembly can be swung between the upper brush cleaning platform surface and wafer carrying component upper surface with alleviate exist in the prior art round brush to multiple wafers carry out cleaning rear surface generate more pollutant, the technical issues of influencing subsequent scrubbing effect.
Description
Technical field
The present invention relates to cleaning equipment technical fields, in particular to a kind of wafer washing and brushing device.
Background technique
In semiconductor integrated circuit chip manufacturing process, CMP process (CMP) has many applications.Chemical machine
Tool polissoir just develops towards integrated, intelligent, automation direction.
But after CMP process (CMP), crystal column surface can remain organic compound, particle and metal ion
Impurity dirt can be effectively removed using round brush cleaning technique in cleaning process after cmp in the prior art in equal multiple pollutants
Dye, round brush to multiple wafers carry out cleaning rear surface generate more pollutant, influence subsequent scrubbing effect.
Summary of the invention
The purpose of the present invention is to provide a kind of wafer washing and brushing devices, and round brush exists in the prior art to multiple to alleviate
Wafer carries out the technical issues of cleaning rear surface generates more pollutant, influences subsequent scrubbing effect.
The embodiment of the present invention is achieved in that
A kind of wafer washing and brushing device, comprising: wafer carrying component, upper brush driving assembly and upper brush cleaning platform；
Every setting, the upper brush cleaning platform is set for cleaning for the upper brush cleaning platform and the wafer carrying inter-module
The upper round brush on the upper brush driving assembly is set, one end setting of the upper brush driving assembly is leaned in the wafer carrying component
The side of the nearly upper brush cleaning platform, and the other end of the upper brush driving assembly can be in the upper brush cleaning platform
It is swung between surface and wafer carrying component upper surface.
Further, the upper brush driving assembly includes the first mounting rack, the first driving motor and the upper round brush；
One end of first mounting rack is arranged above the wafer carrying component, and the upper round brush setting is described the
First mounting rack is arranged in close to the side of upper round brush in the other end of one mounting rack, first driving motor, and described
One driving motor drives the upper round brush rotation by the first driving member.
Further, first mounting rack include the first pivoted arm, the second pivoted arm, guiding axis, the first rotating support shaft and
Second rotating support shaft；
First rotating support shaft and second rotating support shaft are separately positioned on first pivoted arm and described
The outside of two pivoted arms, first rotating support shaft and second rotary shaft support are oppositely arranged, and the guiding axis passes through institute
It states the first pivoted arm and second pivoted arm is connect with first rotating support shaft and second rotating support shaft, and described lead
One end of the wafer carrying component is positioned close to axis；
First driving member is arranged between first pivoted arm and second pivoted arm and far from the guiding axis
Side of first pivoted arm far from second pivoted arm, first driving member is arranged in one end, first driving motor
It is connect across first pivoted arm with first driving motor.
Further, the upper brush cleaning platform includes erecting bed, positioning protrusion and wiper mechanism；
The one end of the erecting bed far from the wafer carrying component is arranged in the wiper mechanism, and the positioning protrusion is set
One end of the nearly wiper mechanism is rested against, the positioning protrusion with the upper round brush for abutting.
Further, the wafer washing and brushing device further includes driving positioned at the lower brush in the wafer carrying component central lower
Dynamic component；
The lower brush driving assembly includes the first support frame, lower round brush and the first driving mechanism；First driving mechanism
The one end of first support frame far from the wafer carrying component is set, and the lower round brush is arranged in first support frame
It close to one end of the wafer carrying component, and is connect with first driving mechanism, first driving mechanism is used for and drive
It is mobile to one end close to or far from the wafer carrying component to move the lower round brush.
Further, the wafer carrying component includes at least three rotor wafers；
At least three rotor wafer distributions triangular in shape, wafer setting are mounted at least three rotor wafers
Top.
Further, the rotor wafer is four, and four rotor wafers are in distributed rectangular.
Further, wherein three rotor wafers include the first rotor main body and the second driving motor, described second
Driving motor drives the first rotor body rotation；
Another described rotor wafer includes the second rotor subject, pedestal and velocity sensor, second rotor subject
It is rotatably arranged on the base, the velocity sensor is arranged on second rotor subject.
Further, the wafer washing and brushing device further includes megasonic cleaning component；
Megasonic cleaning component setting in the wafer carrying component far from the upper brush cleaning platform side, described million
Sound cleaning assembly is for cleaning the wafer being located on the wafer carrying component.
Further, the megasonic cleaning component includes swing arm and nozzle；
One end of the swing arm is arranged in the nozzle, and the swing arm can be rotated relative to the wafer carrying component, with
Make the nozzle to close to or far from the movement of wafer carrying component one end.
A kind of wafer washing and brushing device provided by the invention, comprising: wafer carrying component, upper brush driving assembly and the cleaning of upper brush
Platform；The upper brush cleaning platform and the wafer carrying inter-module are every setting, and the upper brush cleaning platform is for cleaning setting
One end setting of upper round brush on the upper brush driving assembly, the upper brush driving assembly is close in the wafer carrying component
The side of the upper brush cleaning platform, and the other end of the upper brush driving assembly can be in the upper brush cleaning platform table
It is swung between face and wafer carrying component upper surface.Using above-mentioned scheme, the upper round brush on upper brush driving assembly is being incited somebody to action
After wafer on wafer carrying component is scrubbed, put down since one end that upper brush driving assembly is provided with upper round brush can be cleaned in upper brush
It is swung between platform surface and wafer carrying component upper surface, upper round brush can be swung on brush cleaning platform, and upper brush cleaning is flat
Platform cleans upper round brush, and round brush can be made to keep clean state in this way, and round brush exists in the prior art to more to alleviate
A wafer carries out the technical issues of cleaning rear surface generates more pollutant, influences subsequent scrubbing effect.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structural schematic diagram of wafer washing and brushing device provided in an embodiment of the present invention；
Fig. 2 is the structural representation of the first working condition of brush driving assembly on wafer washing and brushing device provided in an embodiment of the present invention
Figure；
Fig. 3 is the structural representation of the second working condition of brush driving assembly on wafer washing and brushing device provided in an embodiment of the present invention
Figure；
Fig. 4 is the structural representation of the megasonic cleaning component operation state on wafer washing and brushing device provided in an embodiment of the present invention
Figure；
Fig. 5 is the structural representation of brush driving assembly third working condition on wafer washing and brushing device provided in an embodiment of the present invention
Figure；
Fig. 6 is the structural schematic diagram of brush driving assembly on wafer washing and brushing device provided in an embodiment of the present invention.
In figure: 100- wafer carrying component；The upper brush cleaning platform of 200-；Brush driving assembly under 300-；It is brushed on 400-
Driving assembly；500- megasonic cleaning component；210- erecting bed；220- positioning protrusion；230- wiper mechanism；310- first
Support frame；Round brush under 320-；The first driving mechanism of 330-；The first driving motor of 410-；The upper round brush of 420-；430- first
Pivoted arm；The second pivoted arm of 440-；450- guiding axis；The first rotating support shaft of 460-；The second rotating support shaft of 470-；510-
Swing arm；520- nozzle.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, or be somebody's turn to do
Invention product using when the orientation or positional relationship usually put, be merely for convenience of description of the present invention and simplification of the description, without
It is that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore not
It can be interpreted as limitation of the present invention.In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, and cannot manage
Solution is indication or suggestion relative importance.
In addition, the terms such as term "horizontal", "vertical", " pendency " are not offered as requiring component abswolute level or pendency, and
It is that can be slightly tilted.It is not to indicate the structure if "horizontal" only refers to that its direction is more horizontal with respect to for "vertical"
It has to fully horizontally, but can be slightly tilted.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be indirect by intermediary
It is connected, can be the connection inside two elements.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
With reference to the accompanying drawing, it elaborates to some embodiments of the present invention.In the absence of conflict, following
Feature in embodiment and embodiment can be combined with each other.
Fig. 1 is the structural schematic diagram of wafer washing and brushing device provided in an embodiment of the present invention；Fig. 2 provides for the embodiment of the present invention
Wafer washing and brushing device on the first working condition of brush driving assembly structural schematic diagram；Fig. 3 is crystalline substance provided in an embodiment of the present invention
The structural schematic diagram of the second working condition of brush driving assembly on circle washing and brushing device；Fig. 5 is that wafer provided in an embodiment of the present invention is washed
The structural schematic diagram of brush driving assembly third working condition on brush device.As shown in Fig. 1-3 and 5, a kind of crystalline substance provided by the invention
Circle washing and brushing device, comprising: wafer carrying component 100, upper brush driving assembly 400 and upper brush cleaning platform 200；
The upper brush cleaning platform 200 and the setting of the wafer carrying component 100 interval, the upper brush cleaning platform 200
For cleaning the upper round brush 420 being arranged on the upper brush driving assembly 400, one end setting of the upper brush driving assembly 400
In the wafer carrying component 100 close to the side of the upper brush cleaning platform 200, and the upper brush driving assembly 400
The other end can be swung between upper 200 surface of brush cleaning platform and 100 upper surface of wafer carrying component.
In the present embodiment, the upper round brush 420 on upper brush driving assembly 400 is washed by the wafer on wafer carrying component 100
After brush, since one end that upper brush driving assembly 400 is provided with upper round brush 420 can be in upper 200 surface of brush cleaning platform and wafer
Bearing assembly is swung between 100 upper surface, and upper round brush 420 can be swung on brush cleaning platform 200, upper brush cleaning platform
200 clean upper round brush 420, round brush 420 can be made to keep clean state in this way, and round brush exists in the prior art to alleviate
The technical issues of cleaning rear surface generates more pollutant, influences subsequent scrubbing effect is being carried out to multiple wafers.
Fig. 6 is the structural schematic diagram of brush driving assembly on wafer washing and brushing device provided in an embodiment of the present invention.Such as Fig. 6 institute
Show, on the basis of the above embodiments, further, the upper brush driving assembly 400 includes the first mounting rack, the first driving electricity
Machine 410 and the upper round brush 420；
One end of first mounting rack is arranged above the wafer carrying component 100, and the upper setting of round brush 420 exists
First mounting rack is arranged in close to upper round brush 420 in the other end of first mounting rack, first driving motor 410
Side, first driving motor 410 drive the upper round brush 420 to rotate by the first driving member.
In the present embodiment, the first mounting rack is used to connect with external rotating drive mechanism, and rotating drive mechanism can drive
Dynamic first mounting rack is swung, and the first driving motor 410 is arranged on the first mounting rack, and such first driving motor 410 can
Round brush 420 constantly rotates in driving, can not only improve the degree of washing to wafer, additionally it is possible to be convenient for upper brush cleaning platform
200 pairs of round brush clean.
On the basis of the above embodiments, further, first mounting rack includes the first pivoted arm 430, the second pivoted arm
440, guiding axis 450, the first rotating support shaft 460 and the second rotating support shaft 470；
First rotating support shaft 460 and second rotating support shaft 470 are separately positioned on first pivoted arm 430
With the outside of second pivoted arm 440, first rotating support shaft 460 and second rotary shaft support are oppositely arranged, institute
Guiding axis 450 is stated across first pivoted arm 430 and second pivoted arm 440 and first rotating support shaft 460 and described
The connection of second rotating support shaft 470, and the guiding axis 450 is positioned close to one end of the wafer carrying component 100；
First driving member is arranged between first pivoted arm 430 and second pivoted arm 440 and leads far from described
To one end of axis 450, one of first pivoted arm 430 far from second pivoted arm 440 is arranged in first driving motor 410
Side, first driving member pass through first pivoted arm 430 and connect with first driving motor 410.
Wherein, the first through hole being guided through and second are separately provided on the first pivoted arm 430 and the second pivoted arm 440
It is additionally provided on through-hole, the first pivoted arm 430 and the second pivoted arm 440 for first the first mounting hole of driving member and the second mounting hole.
In the present embodiment, the first rotating support shaft 460 with rotating drive mechanism for connecting, the second rotating support shaft 470
It is connect by guiding axis 450 with the first rotating support shaft 460, by driving the first rotating support shaft 460 and the second rotation to support
Axis 470 rotates, and to drive the first pivoted arm 430 and the rotation of the second pivoted arm 440, and then makes to be arranged in the first pivoted arm 430 and second turn
Upper round brush 420 and the first driving member on arm 440 is with the first pivoted arm 430 and the rotation of the second pivoted arm 440.
On the basis of the above embodiments, further, the upper brush cleaning platform 200 includes erecting bed 210, convex
Play 220 and wiper mechanism 230；
The one end of the erecting bed 210 far from the wafer carrying component 100 is arranged in the wiper mechanism 230, described
Positioning protrusion 220 is arranged close to one end of the wiper mechanism 230, and the positioning protrusion 220 with the upper round brush 420 for supporting
It connects.
In the present embodiment, upper round brush 420 is turned at positioning protrusion 220, and wiper mechanism 230 sprays the mixing of medicament and water
On the supreme round brush 420 of object, pollutant on upper round brush 420 is washed, in order to upper round brush 420 being carried out to wafer again
Cleaning.
On the basis of the above embodiments, further, the wafer washing and brushing device further includes being located to hold in the wafer
Carry the lower brush driving assembly 300 of 100 central lower of component；
The lower brush driving assembly 300 includes the first support frame 310, lower round brush 320 and the first driving mechanism 330；It is described
The one end of first support frame 310 far from the wafer carrying component 100, the lower rolling is arranged in first driving mechanism 330
320 first support frame is arranged in close to one end of the wafer carrying component 100 in brush, and with first driving mechanism
330 connections, first driving mechanism 330 are used for the driving lower round brush 320 to close to or far from the wafer carrying group
One end of part 100 is mobile.
Wherein, third driving motor is additionally provided on the first support frame 310, third driving motor drives lower round brush 320 certainly
Turn.
In the present embodiment, when upper round brush 420 is to close to 100 1 end motion of wafer carrying component, the first driving mechanism 330
Driving drives lower round brush 320 to close to the movement of one end of wafer carrying component 100, and upper round brush 420 and lower round brush 320 hold wafer
Wafer clamping on component 100 is carried, to clean to wafer.
On the basis of the above embodiments, further, the wafer carrying component 100 turns including at least three wafers
Son；
At least three rotor wafer distributions triangular in shape, wafer setting are mounted at least three rotor wafers
Top.
Further, the rotor wafer is four, and four rotor wafers are in distributed rectangular.
Further, wherein three rotor wafers include the first rotor main body and the second driving motor, described second
Driving motor drives the first rotor body rotation；
Another described rotor wafer includes the second rotor subject, pedestal and velocity sensor, second rotor subject
It is rotatably arranged on the base, the velocity sensor is arranged on second rotor subject.
In the present embodiment, the top of the first rotor main body and the second rotor subject, the first rotor is arranged in the edge of wafer
Main body actively rotate, the second rotor subject be it is driven, wafer with the first rotor main body and the second rotor subject rotation, and speed
Degree sensor is able to detect the revolving speed of the second rotor subject.
Fig. 4 is the structural representation of the megasonic cleaning component operation state on wafer washing and brushing device provided in an embodiment of the present invention
Figure.As shown in figure 4, on the basis of the above embodiments, further, the wafer washing and brushing device further includes megasonic cleaning component
500；
The megasonic cleaning component 500 is arranged in the wafer carrying component 100 far from the upper brush cleaning platform 200 1
Side, the megasonic cleaning component 500 is for cleaning the wafer being located on the wafer carrying component 100.
Further, the megasonic cleaning component 500 includes swing arm 510 and nozzle 520；
One end of the swing arm 510 is arranged in the nozzle 520, and the swing arm 510 being capable of the relatively described wafer carrying group
Part 100 rotates, so that the nozzle 520 is to close to or far from the movement of described 100 one end of wafer carrying component.
Wherein, swing arm 510 is L-shaped.
In the present embodiment, swing arm 510 is arranged in close to one end of wafer carrying component 100 in nozzle 520, and nozzle 520 can
The water for having million sound is sprayed, when swing arm 510 turns to above wafer carrying component 100, nozzle 520 is sprayed water, with to setting
Set the wafer cleaning on wafer carrying component 100.
Specific in use, upper round brush 420 and lower round brush 320 drive electricity by the first driving motor 410 and third respectively
Machine driving carries out rotation, then when cleaning to wafer, and the first driving mechanism 330 drives upper round brush 420 to increase, upper round brush 420
The top of wafer is turned to, upper round brush 420 and lower round brush 320 clamp wafer, and scrub terminates under the drive of the first driving mechanism 330
Round brush 320 declines, and the rotation of upper round brush 420 upward 200 one end of brush cleaning platform, megasonic cleaning component 500 turns to wafer at this time
Wafer is cleaned in top again, and when manipulator takes piece after the completion of megasonic cleaning component 500 cleans, upper round brush 420 is turned to
On upper brush cleaning platform 200.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of wafer washing and brushing device characterized by comprising wafer carrying component, upper brush driving assembly and the cleaning of upper brush are flat
Platform；
Every setting, the upper brush cleaning platform exists for cleaning setting for the upper brush cleaning platform and the wafer carrying inter-module
One end of upper round brush on the upper brush driving assembly, the upper brush driving assembly is arranged in the wafer carrying component close to institute
The side of the upper brush cleaning platform is stated, and the other end of the upper brush driving assembly can be on the upper brush cleaning platform surface
It is swung between wafer carrying component upper surface.
2. wafer washing and brushing device according to claim 1, which is characterized in that the upper brush driving assembly includes the first installation
Frame, the first driving motor and the upper round brush；
One end of first mounting rack is arranged above the wafer carrying component, and the upper round brush setting is in first peace
The other end shelved, first driving motor are arranged in first mounting rack and drive close to the side of upper round brush, described first
Dynamic motor drives the upper round brush rotation by the first driving member.
3. wafer washing and brushing device according to claim 2, which is characterized in that first mounting rack include the first pivoted arm,
Second pivoted arm, guiding axis, the first rotating support shaft and the second rotating support shaft；
First rotating support shaft and second rotating support shaft are separately positioned on first pivoted arm and second turn described
The outside of arm, first rotating support shaft and second rotary shaft support are oppositely arranged, and the guiding axis passes through described the
One pivoted arm and second pivoted arm are connect with first rotating support shaft and second rotating support shaft, and the guiding axis
It is positioned close to one end of the wafer carrying component；
First driving member is arranged between first pivoted arm and second pivoted arm and one end far from the guiding axis,
Side of first pivoted arm far from second pivoted arm is arranged in first driving motor, and first driving member passes through institute
The first pivoted arm is stated to connect with first driving motor.
4. wafer washing and brushing device according to claim 1, which is characterized in that the upper brush cleaning platform include erecting bed,
Positioning protrusion and wiper mechanism；
The one end of the erecting bed far from the wafer carrying component is arranged in the wiper mechanism, and the positioning protrusion setting is leaned on
One end of the nearly wiper mechanism, the positioning protrusion with the upper round brush for abutting.
5. wafer washing and brushing device according to claim 1, which is characterized in that the wafer washing and brushing device further includes being located at
The lower brush driving assembly of the wafer carrying component central lower；
The lower brush driving assembly includes the first support frame, lower round brush and the first driving mechanism；The first driving mechanism setting
In the one end of first support frame far from the wafer carrying component, the lower round brush setting is close in first support frame
One end of the wafer carrying component, and connect with first driving mechanism, first driving mechanism is used for and driving institute
It is mobile to one end close to or far from the wafer carrying component to state lower round brush.
6. wafer washing and brushing device according to claim 1, which is characterized in that the wafer carrying component includes at least three
Rotor wafer；
The top for being mounted at least three rotor wafers is arranged in at least three rotor wafer distributions triangular in shape, wafer
End.
7. wafer washing and brushing device according to claim 6, which is characterized in that the rotor wafer is four, described in four
Rotor wafer is in distributed rectangular.
8. wafer washing and brushing device according to claim 7, which is characterized in that wherein three rotor wafers include first
Rotor subject and the second driving motor, second driving motor drive the first rotor body rotation；
Another described rotor wafer includes the second rotor subject, pedestal and velocity sensor, and second rotor subject can turn
It is arranged dynamicly on the base, the velocity sensor is arranged on second rotor subject.
9. wafer washing and brushing device according to claim 1, which is characterized in that the wafer washing and brushing device further includes that million sound are clear
Wash component；
The megasonic cleaning component is arranged in the wafer carrying component far from the upper brush cleaning platform side, and million sound is clear
Component is washed for cleaning the wafer being located on the wafer carrying component.
10. wafer washing and brushing device according to claim 9, which is characterized in that the megasonic cleaning component include swing arm and
Nozzle；
One end of the swing arm is arranged in the nozzle, and the swing arm can be rotated relative to the wafer carrying component, so that institute
Nozzle is stated to close to or far from the movement of wafer carrying component one end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811509094.XA CN109482538A (en) | 2018-12-10 | 2018-12-10 | Wafer washing and brushing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811509094.XA CN109482538A (en) | 2018-12-10 | 2018-12-10 | Wafer washing and brushing device |
Publications (1)
| Publication Number | Publication Date |
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| CN109482538A true CN109482538A (en) | 2019-03-19 |
Family
ID=65709820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811509094.XA Pending CN109482538A (en) | 2018-12-10 | 2018-12-10 | Wafer washing and brushing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109482538A (en) |
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| CN110148573A (en) * | 2019-04-17 | 2019-08-20 | 欧金森 | A kind of wafer elevating device of semiconductor equipment process cavity |
| CN110434489A (en) * | 2019-08-22 | 2019-11-12 | 刘彦杰 | A kind of clean type laser cutting machine with dehumidification function |
| CN111036605A (en) * | 2019-12-25 | 2020-04-21 | 上海先方半导体有限公司 | Mechanical device for improving cleaning capacity of high-density bump structure |
| CN111063639A (en) * | 2019-12-25 | 2020-04-24 | 上海先方半导体有限公司 | Mechanical device for improving cleaning capability of high-density bump structure and cleaning method thereof |
| CN113043158A (en) * | 2019-12-26 | 2021-06-29 | 株式会社荏原制作所 | Cleaning device and grinding device |
| CN113270347A (en) * | 2021-06-07 | 2021-08-17 | 北京烁科精微电子装备有限公司 | Cleaning device for trimming wafer |
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