CN110148573A - A kind of wafer elevating device of semiconductor equipment process cavity - Google Patents
A kind of wafer elevating device of semiconductor equipment process cavity Download PDFInfo
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- CN110148573A CN110148573A CN201910308718.XA CN201910308718A CN110148573A CN 110148573 A CN110148573 A CN 110148573A CN 201910308718 A CN201910308718 A CN 201910308718A CN 110148573 A CN110148573 A CN 110148573A
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- wafer
- brush board
- cleaning machine
- fixed ring
- semiconductor equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a kind of wafer elevating devices of semiconductor equipment process cavity, its structure includes wafer cleaning machine, set material mouth, control panel, maintenance door, support leg, header tank, wafer cleaning machine is by body, spray thrower, lifting device, rotating electric machine composition, wafer mounter structure is driven to rise by lifting motor, rotation is provided using rotating electric machine, allow wafer mounter structure can be rotate at high speed, wafer mounter structure passes through centrifugal force again and provides kinetic energy for knockout press wiper mechanism, allow knockout press wiper mechanism that can synchronize cleaning to crystal column surface, and the cleaning stable structure, when can't be because of mechanical breakdown and to wafer cleaning, it damages, first brush board and the second brush board are scrubbed using particular abrasive cleaning brush, it prevents from scratching and omit, realize that precision cleaning does not apply pressure to wafer, realize wafer in the shortest time The moisture removal on surface, and after removal, the appearance of wafer does not have any washmarking, avoids the yield for reducing wafer.
Description
Technical field
The present invention relates to semiconductor fields, particularly with regard to a kind of wafer elevating device of semiconductor equipment process cavity.
Background technique
It is several that the manufacturing process of chip can generally be divided into wafer-process process, wafer probing process, structure dress process, test step etc.
A step.Wherein wafer-process process and wafer probing process are front-end-of-line, and structure dress process, test step are back segment work
Sequence.Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer.It obtains
After wafer, photosensitive material is uniformly applied on wafer, complicated circuit structure is transferred on photosensitive material using litho machine,
The part being exposed can dissolve and be washed out by water, to expose complicated circuit structure in crystal column surface, reuse etching machine
The wafer sections being exposed are etched away, need the moisture removal in the shortest time crystal column surface, and after removal
The appearance of wafer not have any washmarking, otherwise can reduce the yield of wafer.
Summary of the invention
In view of the deficiencies of the prior art, the present invention is to realize by the following technical solutions: a kind of semiconductor equipment work
The wafer elevating device of skill chamber, structure include wafer cleaning machine, set material mouth, control panel, maintenance door, support leg, header tank,
The wafer cleaning machine front-end surface is equipped with and sets material mouth, and the wafer cleaning machine front end has maintenance door, described
Wafer cleaning machine and maintenance door are gap-matched, and the wafer cleaning machine bottom end is equipped with support leg, the wafer cleaning
Machine and support leg are threadedly coupled, and have header tank, the wafer cleaning machine and header tank on the left of the wafer cleaning machine
It is flexibly connected, the wafer cleaning machine front end is equipped with control panel；
The wafer cleaning machine is made of body, spray thrower, lifting device, rotating electric machine, the body inner wall peace
There are four spray thrower, the internal bodies to be equipped with lifting device for dress, and the body and lifting device are gap-matched, institute
The lifting device bottom end stated is equipped with rotating electric machine, and the lifting device is connected with rotating electric machine.
As advanced optimizing for the technical program, the lifting device by lifting motor, bearing fixed frame,
Telescoping tube, knockout press wiper mechanism, wafer mounter structure composition, the lifting motor front end is equipped with bearing fixed frame, described
Lifting motor and bearing fixed frame one end mechanical connection, the bearing fixed frame other end are equipped with telescoping tube, and described stretches
Draw top is equipped with wafer mounter structure, the telescoping tube and wafer mounter structure feather joint, the wafer mounter structure
Surface is equipped with knockout press wiper mechanism, and the wafer mounter structure and knockout press wiper mechanism are slidably matched.
As advanced optimizing for the technical program, the knockout press wiper mechanism is by fixture block, ball, traveller, the first brush
Plate, the second brush board composition, the fixture block upper and lower ends bottom are mounted on ball, and the fixture block upper end is equipped with the first brush
Plate, the fixture block and the first brush board are gap-matched, and the fixture block lower end is equipped with the second brush board, the fixture block and the
Two brush boards are flexibly connected, and the second brush board end surface is equipped with traveller, and second brush board is fixedly connected with traveller.
As advanced optimizing for the technical program, second brush board further includes torque spring, second brush
Plate one end is equipped with torque spring, and second brush board and torque spring are interlocked.
As advanced optimizing for the technical program, the wafer mounter structure by fixed ring, closure strip, bolt axle,
Clip slot, support rod, guide-track groove composition, the fixation ring surface are equipped with closure strip, and the fixed ring and closure strip pass through
Bolt axle is flexibly connected, and guide-track groove is equipped in the fixed ring upper and lower surface, is equipped with clip slot, institute on the inside of the fixed ring
The fixed ring bottom end middle position stated is equipped with support rod, and the fixed ring and support rod both ends pass through electric welding.
As advanced optimizing for the technical program, the clip slot further includes annular clamp ring, is set on the inside of the clip slot
There are annular clamp ring, the clip slot and annular clamp ring glue connection.
As advanced optimizing for the technical program, it is equipped in the fixed ring and closure strip surface more than two
Drainage hole, and drainage hole is equally distributed on one ring structure of formation on fixed ring and closure strip surface.
As advanced optimizing for the technical program, the annular clamp ring is made of resin material, will not be to wafer
Surface causes to scratch, and then influences the use of wafer.
As advanced optimizing for the technical program, the telescoping tube is set to right above rotating electric machine, and telescoping tube bottom
End is threadedly coupled with rotating electric machine by motor shaft.
As advanced optimizing for the technical program, the fixture block and fixed ring are matched by ball and guide-track groove sliding
It closes.
As advanced optimizing for the technical program, first brush board and the second brush board are parallel to each other between the two,
And and on same column horizontal position.
Beneficial effect
A kind of wafer elevating device of semiconductor equipment process cavity of the present invention opens closure strip by bolt axle, then
Wafer is inserted into annular clamp ring, shuts closure strip, drives telescoping tube one end up to move using lifting motor, telescoping tube passes through branch
Strut drives fixed ring to move up, and controls spray thrower by control panel and carries out hydro-peening to wafer, recycles rotating electric machine band
Dynamic telescoping tube rotation, so that kinetic energy is transmitted in fixed ring by telescoping tube, fixed ring drives fixture block to revolve using the centrifugal force of rotation
Turn, and fixture block can be slided by ball on the guide-track groove in fixed ring, fixture block is by the first brush board and the second brush board to crystalline substance
Circle is cleaned, and the first brush board is affected by centrifugal force and displacement a little can clean at night to crystal column surface, the second brush
Its bottom surface and crystal column surface are carried out contact cleaning by the cooperation of gravity and centrifugal force by plate, after rotating electric machine stops rotating,
Fixed ring is influenced by inertia, will not be static at once, but is slowly stopped rotating, when its slowly when stopping rotating, from
Mental and physical efforts be less than gravity the first brush board of influence can contact of the disengaging to wafer slowly, and centrifugal force is less than the influence of torque spring
When, the second brush board can be sling by torque spring, and then be detached from the contact to wafer, and wafer is got rid of the water on surface using rotation surplus energy
It is dry, complete cleaning.
Compared with prior art, the beneficial effects of the present invention are: driving wafer mounter structure to rise by lifting motor, benefit
Rotation is provided with rotating electric machine, allows wafer mounter structure can rotate at high speed, it is knockout press that wafer mounter structure passes through centrifugal force again
Wiper mechanism provides kinetic energy, allows knockout press wiper mechanism that can synchronize cleaning, and the cleaning stable structure to crystal column surface,
When can't be because of mechanical breakdown and to wafer cleaning, damage, the first brush board and the second brush board are cleaned using particular abrasive
Brush scrub is prevented from scratching and be omitted, and is realized that precision cleaning does not apply pressure to wafer, is realized wafer handle in the shortest time
The moisture removal on surface, and the appearance of wafer does not have any washmarking after removal, avoids the yield for reducing wafer.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is a kind of structural schematic diagram of the wafer elevating device of semiconductor equipment process cavity of the present invention.
Fig. 2 is that a kind of section stationary state structure of facing of the wafer elevating device of semiconductor equipment process cavity of the present invention is shown
It is intended to.
Fig. 3 is that a kind of section working state structure of facing of the wafer elevating device of semiconductor equipment process cavity of the present invention shows
It is intended to.
Fig. 4 is the enlarged drawing of A in Fig. 3 of the present invention.
Fig. 5 is a kind of wafer elevating device wafer mounter structure knockout press wiper mechanism of semiconductor equipment process cavity of the present invention
Overlooking structure diagram.
Fig. 6 is that a kind of structure that the wafer elevating device knockout press wiper mechanism of semiconductor equipment process cavity is overlooked of the present invention is shown
It is intended to.
In figure: wafer cleaning machine -1 sets material mouth -2, control panel -3, maintenance door -4, support leg -5, header tank -6, machine
Body -101, lifting device -103, rotating electric machine -104, lifting motor -1031, bearing fixed frame -1032, is stretched spray thrower -102
The draw -1033, knockout press wiper mechanism -1034, wafer mounter structure -1035, fixture block -10341, ball -10342, traveller -
10343, the first brush board -10344, the second brush board -10345, torque spring -10345a, fixed ring -10351, closure strip -
10352, bolt axle -10353, clip slot -10354, support rod -10355, guide-track groove -10356, annular clamp ring -10354a, draining
Hole -10351a.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment and Detailed description of the invention, the preferred embodiment that the present invention is further explained.
Embodiment
Fig. 1-Fig. 6 is please referred to, the present invention provides a kind of wafer elevating device of semiconductor equipment process cavity, and structure includes
Wafer cleaning machine 1 sets material mouth 2, control panel 3, maintenance door 4, support leg 5, header tank 6,1 front-end table of wafer cleaning machine
Face is equipped with and sets material mouth 2, and 1 front end of wafer cleaning machine has maintenance door 4, the wafer cleaning machine 1 and maintenance door 4
It is gap-matched, 1 bottom end of wafer cleaning machine is equipped with support leg 5,5 screw thread of the wafer cleaning machine 1 and support leg
It connects, header tank 6 is had on the left of the wafer cleaning machine 1, the wafer cleaning machine 1 and header tank 6 are flexibly connected, institute
1 front end of wafer cleaning machine stated is equipped with control panel 3, and the wafer cleaning machine 1 is by body 101, spray thrower 102, lifting
Device 103, rotating electric machine 104 form, and described 101 inner wall of the body installation is there are four spray thrower 102, in the body 101
Portion is equipped with lifting device 103, and the body 101 and lifting device 103 are gap-matched, 103 bottom of lifting device
End is equipped with rotating electric machine 104, and the lifting device 103 is connected with rotating electric machine 104.
The lifting device 103 is by lifting motor 1031, bearing fixed frame 1032, telescoping tube 1033, knockout press
Wiper mechanism 1034, wafer mounter structure 1035 form, and 1031 front end of lifting motor is equipped with bearing fixed frame 1032, institute
The lifting motor 1031 stated and 1032 one end of bearing fixed frame mechanical connection, 1032 other end of bearing fixed frame are equipped with
Telescoping tube 1033,1033 top of telescoping tube are equipped with wafer mounter structure 1035, and the telescoping tube 1033 and wafer are solid
Determine 1035 feather joint of mechanism, 1035 surface of wafer mounter structure is equipped with knockout press wiper mechanism 1034, the wafer
Fixed mechanism 1035 and knockout press wiper mechanism 1034 are slidably matched.
The knockout press wiper mechanism 1034 by fixture block 10341, ball 10342, traveller 10343, the first brush board 10344,
Second brush board 10345 composition, the 10341 upper and lower ends bottom of fixture block is mounted on ball 10342, the fixture block
10341 upper ends are equipped with the first brush board 10344, and the fixture block 10341 and the first brush board 10344 are gap-matched, described
10341 lower end of fixture block is equipped with the second brush board 10345, and the fixture block 10341 and the second brush board 10345 are flexibly connected, described
Second brush board, 10345 end surface is equipped with traveller 10343, and second brush board 10345 is fixedly connected with traveller 10343.
Above-mentioned ball 10342 is to allow fixture block 10341 can be in the guide-track groove 10356 on 10351 surface of fixed ring
Sliding, and allow fixture block 10341 that the first brush board 10344 and the second brush board 10345 is driven to work.
Second brush board 10345 further includes torque spring 10345a, and described 10345 one end of the second brush board is equipped with
Torque spring 10345a, second brush board 10345 and torque spring 10345a are interlocked,
Above-mentioned torque spring 10345a is to avoid wafer from connecing when installation to sling the second brush board 10345
Contact crystal column surface, it, will not be on staying in crystal column surface after completing brushing also for the second brush board 10345.
The wafer mounter structure 1035 is by fixed ring 10351, closure strip 10352, bolt axle 10353, clip slot
10354, support rod 10355, guide-track groove 10356 form, and 10351 surface of fixed ring is equipped with closure strip 10352, described
Fixed ring 10351 and closure strip 10352 be flexibly connected by bolt axle 10353, in 10351 upper and lower surface of fixed ring
It is equipped with guide-track groove 10356, is equipped with clip slot 10354 on the inside of the fixed ring 10351, in 10351 bottom end of fixed ring
Between position be equipped with support rod 10355, the fixed ring 10351 and 10355 both ends of support rod by electric welding,
Above-mentioned closure strip 10352 is a valve in order to allow wafer that can be installed to fixed ring 10351, support rod
10355 be a kind of for connecting telescoping tube 1033, and telescoping tube 1033 is allowed to control wafer mounter structure 1035 by support rod 10355
Rotation and move up and down work.
The clip slot 10354 further includes annular clamp ring 10354a, and annular clamp ring is equipped on the inside of the clip slot 10354
10354a, the clip slot 10354 and annular clamp ring 10354a glue connection,
Above-mentioned annular clamp ring 10354a is that one kind can be prevented to wafer in clamping, will not cause to draw to crystal column surface
Wound, and then influence the use of wafer.
It is equipped with more than two drainage hole 10351a on 10352 surface of fixed ring 10351 and closure strip, and arranges
Water hole 10351a is equally distributed on one ring structure of formation on 10352 surface of fixed ring 10351 and closure strip,
Above-mentioned drainage hole 10351a is to go water export to allow wafer in drying.
The annular clamp ring 10354a is made of resin material, will not cause to scratch to crystal column surface, and then is influenced
The use of wafer, the telescoping tube 1033 is set to right above rotating electric machine 104, and 1033 bottom end of telescoping tube and rotating electric machine
104 are threadedly coupled by motor shaft, and the fixture block 10341 and fixed ring 10351 pass through ball 10342 and guide-track groove 10356
It is slidably matched, first brush board 10344 and the second brush board 10345 are parallel to each other between the two, and and horizontal in same column
On position.
The principle of the present invention: closure strip 10352 is opened by bolt axle 10353, then wafer is inserted into annular clamp ring
In 10354a, closure strip 10352 is shut, drives 1033 one end of telescoping tube up to move using lifting motor 1031, telescoping tube
1033 by support rod 10355 drive fixed ring 10351 moves up, by control panel 3 control spray thrower 102 to wafer into
Row hydro-peening recycles rotating electric machine 104 that telescoping tube 1033 is driven to rotate, so that kinetic energy is transmitted to fixed ring by telescoping tube 1033
On 10351, fixed ring 10351 drives fixture block 10341 to rotate using the centrifugal force of rotation, and fixture block 10341 passes through ball 10342
It can be slided on the guide-track groove 10356 in fixed ring 10351, fixture block 10341 passes through the first brush board 10344 and the second brush board
10345 pairs of wafers clean, and the first brush board 10344 be affected by centrifugal force can at night displacement a little to crystal column surface into
Its bottom surface and crystal column surface are carried out contact cleaning by the cooperation of gravity and centrifugal force, work as rotation by row cleaning, the second brush board 10345
After rotating motor 104 stops rotating, fixed ring 10351 is influenced by inertia, will not be static at once, but slowly stops rotation
Turn, when its slowly when stopping rotating, centrifugal force be less than gravity the first brush board of influence 10344 can disengaging slowly to wafer
Contact, and when influence of the centrifugal force less than torque spring 10345a, the second brush board 10345 can be sling by torque spring 10345a,
And then it is detached from the contact to wafer, wafer is dried the water on surface using rotation surplus energy, completes cleaning.
Solution to the problem of the present invention is: driving wafer mounter structure 1035 to rise by lifting motor 1031, utilizes
Rotating electric machine 104 provides rotation, allows wafer mounter structure 1035 can rotate at high speed, wafer mounter structure 1035 passes through centrifugation again
Power is that knockout press wiper mechanism 1034 provides kinetic energy, allows knockout press wiper mechanism 1034 that can synchronize cleaning to crystal column surface, and
And the cleaning stable structure, when can't be because of mechanical breakdown and to wafer cleaning, damage, the first brush board 10344 and
Two brush boards 10345 are scrubbed using particular abrasive cleaning brush, are prevented from scratching and be omitted, and realize that precision cleaning does not apply pressure to crystalline substance
Circle realizes that the appearance of wafer does not have any washmarking to wafer the moisture removal on surface, and after removal in the shortest time,
Avoid reducing the yield of wafer.
The basic principles, main features and advantages of the present invention have been shown and described above, the technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention can not only be realized in other specific forms under the premise of not departing from spirit of that invention or essential characteristic
The present invention will also have various changes and improvements, these changes and improvements both fall within scope of the claimed invention, therefore this hair
Bright claimed range is defined by appended claims and its equivalent, rather than above description limits.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (7)
1. a kind of wafer elevating device of semiconductor equipment process cavity, structure includes wafer cleaning machine (1), sets material mouth (2), control
Panel (3) processed, maintenance door (4), support leg (5), header tank (6), the wafer cleaning machine (1) front-end surface are equipped with and set material
Mouth (2), the wafer cleaning machine (1) front end have maintenance door (4), and the wafer cleaning machine (1) and maintenance door (4) are adopted
With clearance fit, the wafer cleaning machine (1) bottom end is equipped with support leg (5), the wafer cleaning machine (1) and support leg
(5) it is threadedly coupled, has header tank (6) on the left of the wafer cleaning machine (1), the wafer cleaning machine (1) and catchment
Case (6) is flexibly connected, and the wafer cleaning machine (1) front end is equipped with control panel (3), it is characterised in that:
The wafer cleaning machine (1) is by body (101), spray thrower (102), lifting device (103), rotating electric machine (104) group
At for the installation of the body (101) inner wall there are four spray thrower (102), the body (101) is internal to be equipped with lifting device
(103), the body (101) and lifting device (103) are gap-matched, and the lifting device (103) bottom end is equipped with
Rotating electric machine (104), the lifting device (103) are connected with rotating electric machine (104).
2. a kind of wafer elevating device of semiconductor equipment process cavity according to claim 1, it is characterised in that: described
Lifting device (103) is by lifting motor (1031), bearing fixed frame (1032), telescoping tube (1033), knockout press wiper mechanism
(1034), wafer mounter structure (1035) forms, and the lifting motor (1031) front end is equipped with bearing fixed frame (1032), institute
The lifting motor (1031) stated and bearing fixed frame (1032) one end mechanical connection, described bearing fixed frame (1032) other end
It is equipped with telescoping tube (1033), the telescoping tube (1033) top is equipped with wafer mounter structure (1035), the telescoping tube
(1033) and wafer mounter structure (1035) feather joint, wafer mounter structure (1035) surface are equipped with knockout press cleaning machine
Structure (1034), the wafer mounter structure (1035) and knockout press wiper mechanism (1034) are slidably matched.
3. a kind of wafer elevating device of semiconductor equipment process cavity according to claim 2, it is characterised in that: described
Knockout press wiper mechanism (1034) is by fixture block (10341), ball (10342), traveller (10343), the first brush board (10344), second
Brush board (10345) composition, the fixture block (10341) upper and lower ends bottom is mounted on ball (10342), the fixture block
(10341) upper end is equipped with the first brush board (10344), and the fixture block (10341) and the first brush board (10344) are matched using gap
It closes, the fixture block (10341) lower end is equipped with the second brush board (10345), the fixture block (10341) and the second brush board
(10345) it is flexibly connected, the second brush board (10345) end surface is equipped with traveller (10343), second brush board
(10345) it is fixedly connected with traveller (10343).
4. a kind of wafer elevating device of semiconductor equipment process cavity according to claim 3, it is characterised in that: described
Second brush board (10345) further includes torque spring (10345a), and described the second brush board (10345) one end is equipped with torque spring
(10345a), second brush board (10345) and torque spring (10345a) are interlocked.
5. a kind of wafer elevating device of semiconductor equipment process cavity according to claim 2, it is characterised in that: described
Wafer mounter structure (1035) is by fixed ring (10351), closure strip (10352), bolt axle (10353), clip slot (10354), branch
Strut (10355), guide-track groove (10356) composition, the fixed ring (10351) surface is equipped with closure strip (10352), described
Fixed ring (10351) and closure strip (10352) be flexibly connected by bolt axle (10353), in the fixed ring (10351)
It is equipped on lower surface guide-track groove (10356), is equipped with clip slot (10354) on the inside of the fixed ring (10351), the fixation
Ring (10351) bottom end middle position is equipped with support rod (10355), the fixed ring (10351) and support rod (10355) two
End passes through electric welding.
6. a kind of wafer elevating device of semiconductor equipment process cavity according to claim 5, it is characterised in that: described
Clip slot (10354) further includes annular clamp ring (10354a), is equipped with annular clamp ring (10354a) on the inside of the clip slot (10354),
The clip slot (10354) and annular clamp ring (10354a) glue connection.
7. a kind of wafer elevating device of semiconductor equipment process cavity according to claim 5, it is characterised in that: described
It is equipped with more than two drainage holes (10351a) on fixed ring (10351) and closure strip (10352) surface, and drainage hole
(10351a) is equally distributed on one ring structure of formation on fixed ring (10351) and closure strip (10352) surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910308718.XA CN110148573B (en) | 2019-04-17 | 2019-04-17 | Wafer lifting device of semiconductor equipment process chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910308718.XA CN110148573B (en) | 2019-04-17 | 2019-04-17 | Wafer lifting device of semiconductor equipment process chamber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110148573A true CN110148573A (en) | 2019-08-20 |
| CN110148573B CN110148573B (en) | 2020-12-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910308718.XA Active CN110148573B (en) | 2019-04-17 | 2019-04-17 | Wafer lifting device of semiconductor equipment process chamber |
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| CN (1) | CN110148573B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110581094A (en) * | 2019-08-26 | 2019-12-17 | 泉州洛江元康工业设计有限公司 | Wafer processing equipment |
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| CN113035743A (en) * | 2021-02-25 | 2021-06-25 | 无锡亚电智能装备有限公司 | Wafer cleaning method for gradually lifting wafer |
| CN113035744A (en) * | 2021-02-25 | 2021-06-25 | 无锡亚电智能装备有限公司 | Semiconductor wafer cleaning device |
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