CN110148573B - Wafer lifting device of semiconductor equipment process chamber - Google Patents
Wafer lifting device of semiconductor equipment process chamber Download PDFInfo
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- CN110148573B CN110148573B CN201910308718.XA CN201910308718A CN110148573B CN 110148573 B CN110148573 B CN 110148573B CN 201910308718 A CN201910308718 A CN 201910308718A CN 110148573 B CN110148573 B CN 110148573B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a wafer lifting device of a semiconductor equipment process chamber, which structurally comprises a wafer cleaning machine, a material placing port, a control panel, an access door, supporting legs and a water collecting tank, wherein the wafer cleaning machine consists of a machine body, a sprayer, a lifting device and a rotating motor, the lifting motor drives a wafer fixing mechanism to ascend, the rotating motor is used for providing rotation, the wafer fixing mechanism can rotate at high speed, the wafer fixing mechanism provides kinetic energy for a throwing force cleaning mechanism through centrifugal force, the throwing force cleaning mechanism can synchronously clean the surface of a wafer, the cleaning structure is stable, the wafer cannot be damaged when being cleaned due to mechanical faults, a first brush plate and a second brush plate are scrubbed by using special frosted cleaning brushes, scratching and omission are prevented, precise cleaning is realized, no pressure is applied to the wafer, and the moisture on the surface of the wafer is removed in the shortest time, and the surface of the removed wafer has no water mark, thereby avoiding reducing the yield of the wafer.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a wafer lifting device of a semiconductor equipment process cavity.
Background
The manufacturing process of the chip can be roughly divided into a wafer processing procedure, a wafer probing procedure, a packaging procedure, a testing procedure and so on. The wafer processing step and the wafer probing step are the front stage steps, and the packaging step and the testing step are the back stage steps. The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. After a wafer is obtained, a photosensitive material is uniformly coated on the wafer, a photoetching machine is used for transferring a complex circuit structure onto the photosensitive material, the exposed part can be dissolved and washed away by water, so that the complex circuit structure is exposed on the surface of the wafer, an etching machine is used for etching away the exposed silicon wafer part, the water on the surface of the wafer needs to be removed in the shortest time, no water mark exists on the surface of the removed wafer, and the yield of the wafer can be reduced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: a wafer lifting device of a semiconductor equipment process chamber structurally comprises a wafer cleaning machine, a material placing port, a control panel, an access door, supporting legs and a water collecting tank, wherein the material placing port is formed in the surface of the front end of the wafer cleaning machine, the access door is arranged below the front end of the wafer cleaning machine, the wafer cleaning machine and the access door are in clearance fit, the supporting legs are arranged at the bottom end of the wafer cleaning machine, the wafer cleaning machine is in threaded connection with the supporting legs, the water collecting tank is arranged below the left side of the wafer cleaning machine, the wafer cleaning machine is movably connected with the water collecting tank, and the control panel is installed at the front end of the wafer cleaning machine;
the wafer cleaning machine comprises a machine body, sprayers, a lifting device and a rotating motor, wherein the four sprayers are installed on the inner wall of the machine body, the lifting device is arranged inside the machine body, the machine body and the lifting device are in clearance fit, the rotating motor is arranged at the bottom end of the lifting device, and the lifting device is connected with the rotating motor.
As a further optimization of the technical scheme, the lifting device comprises a lifting motor, a bearing fixing frame, a telescopic pipe, a throwing force cleaning mechanism and a wafer fixing mechanism, wherein the bearing fixing frame is arranged at the front end of the lifting motor, the lifting motor is mechanically connected with one end of the bearing fixing frame, the telescopic pipe is installed at the other end of the bearing fixing frame, the wafer fixing mechanism is arranged at the top end of the telescopic pipe, the telescopic pipe is in tenon connection with the wafer fixing mechanism, the throwing force cleaning mechanism is arranged on the surface of the wafer fixing mechanism, and the wafer fixing mechanism is in sliding fit with the throwing force cleaning mechanism.
As a further optimization of the technical scheme, the throwing power cleaning mechanism consists of a clamping block, balls, a sliding column, a first brush plate and a second brush plate, the balls are mounted at the bottoms of the upper end and the lower end of the clamping block, the first brush plate is arranged at the upper end of the clamping block, the clamping block and the first brush plate are in clearance fit, the second brush plate is arranged at the lower end of the clamping block, the clamping block is movably connected with the second brush plate, the sliding column is arranged on the surface of one end of the second brush plate, and the second brush plate is fixedly connected with the sliding column.
As a further optimization of the technical scheme, the second brush plate further comprises a torsion spring, one end of the second brush plate is provided with the torsion spring, and the second brush plate is buckled with the torsion spring.
As a further optimization of this technical scheme, wafer fixed establishment constitute by solid fixed ring, closed strip, bolt axle, double-layered groove, bracing piece, guide rail groove, solid fixed ring on the surface be equipped with closed strip, solid fixed ring and closed strip pass through bolt axle swing joint, solid fixed ring all be equipped with the guide rail groove on the surface from top to bottom, solid fixed ring inboard be equipped with double-layered groove, solid fixed ring bottom intermediate position on be equipped with the bracing piece, solid fixed ring and bracing piece both ends pass through the electric welding.
As a further optimization of the technical scheme, the clamping groove further comprises an annular clamping ring, the inner side of the clamping groove is provided with the annular clamping ring, and the clamping groove is connected with the annular clamping ring through glue.
As a further optimization of the technical scheme, more than two drain holes are formed in the surfaces of the fixing ring and the closing strip, and the drain holes are distributed on the surfaces of the fixing ring and the closing strip at equal intervals to form an annular structure.
As the further optimization of the technical scheme, the annular clamping ring is made of resin materials, so that the surface of the wafer is not scratched, and the use of the wafer is further influenced.
As a further optimization of the technical scheme, the telescopic pipe is arranged right above the rotating motor, and the bottom end of the telescopic pipe is in threaded connection with the rotating motor through a motor shaft.
As the further optimization of the technical scheme, the clamping block and the fixing ring are in sliding fit with the guide rail groove through the ball.
As a further optimization of the technical scheme, the first brush plate and the second brush plate are parallel to each other and are in the same-row horizontal position.
Advantageous effects
The invention relates to a wafer lifting device of a semiconductor equipment process chamber, which is characterized in that a closing strip is opened through a bolt shaft, a wafer is inserted into an annular clamping ring, the closing strip is closed, one end of a telescopic pipe is driven to move upwards by a lifting motor, the telescopic pipe drives a fixing ring to move upwards through a support rod, a sprayer is controlled by a control panel to spray and wash the wafer, a rotary motor drives the telescopic pipe to rotate, so that the telescopic pipe transmits kinetic energy to the fixing ring, the fixing ring drives a clamping block to rotate by rotary centrifugal force, the clamping block can slide on a guide rail groove on the fixing ring through balls, the clamping block washes the wafer through a first brush plate and a second brush plate, the first brush plate can displace a bit at night under the influence of the centrifugal force to wash the surface of the wafer, and the second brush plate is matched with the gravity and the centrifugal force to carry out contact washing on the bottom, when the rotating motor stops rotating, the fixing ring is influenced by inertia, does not stop at once but stops rotating slowly, when the rotating motor stops rotating slowly, the first brush plate can be slowly separated from the contact of the wafer under the influence of centrifugal force smaller than gravity, and the second brush plate can be lifted by the torsion spring when the centrifugal force is smaller than the influence of the torsion spring, so that the wafer is separated from the contact of the wafer, and the wafer is dried by the water on the surface through the residual force of rotation, so that the cleaning work is completed.
Compared with the prior art, the invention has the beneficial effects that: the wafer fixing mechanism is driven to ascend through the lifting motor, rotation is provided through the rotating motor, the wafer fixing mechanism can rotate at a high speed, the wafer fixing mechanism provides kinetic energy for the throwing-force cleaning mechanism through centrifugal force, the throwing-force cleaning mechanism can clean the surface of a wafer synchronously, the cleaning structure is stable, damage can not be caused when the wafer is cleaned due to mechanical faults, the first brush plate and the second brush plate are scrubbed through the special frosted cleaning brushes, scratching and omission are prevented, pressure is not applied to the wafer during precise cleaning, moisture on the surface of the wafer is removed in the shortest time, the appearance of the wafer cannot have any water mark after the wafer is removed, and the yield of the wafer is prevented from being reduced.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a wafer lifting device of a process chamber of a semiconductor device according to the present invention.
FIG. 2 is a schematic diagram of a front cross-sectional static structure of a wafer lifter of a process chamber of a semiconductor device according to the present invention.
FIG. 3 is a schematic structural diagram of a front cross-sectional working state of a wafer lifting device of a semiconductor device process chamber according to the present invention.
FIG. 4 is an enlarged view of A of FIG. 3 according to the present invention.
FIG. 5 is a schematic top view of a wafer fixing mechanism of a wafer lifter of a semiconductor device process chamber.
FIG. 6 is a schematic top view of a wafer lift system with a swing cleaning mechanism according to the present invention.
In the figure: the device comprises a wafer cleaning machine-1, a material placing port-2, a control panel-3, an access door-4, a supporting leg-5, a water collecting tank-6, a machine body-101, a sprayer-102, a lifting device-103, a rotating motor-104, a lifting motor-1031, a bearing fixing frame-1032, an extension tube-1033, a throwing force cleaning mechanism-1034, a wafer fixing mechanism-1035, a clamping block-10341, a ball-10342, a sliding column-10343, a first brush plate-10344, a second brush plate-10345, a torsion spring-10345 a, a fixing ring-1035 1, a closing bar-10352, a bolt shaft-10353, a clamping groove-10354, a supporting rod-10355, a guide rail groove-10356, an annular clamping ring-10354 a and a water discharging hole-10351 a.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Examples
Referring to fig. 1-6, the invention provides a wafer lifting device for a semiconductor device process chamber, which comprises a wafer cleaning machine 1, a material placing port 2, a control panel 3, an access door 4, supporting legs 5 and a water collecting tank 6, wherein the material placing port 2 is arranged on the surface of the front end of the wafer cleaning machine 1, the access door 4 is arranged below the front end of the wafer cleaning machine 1, the wafer cleaning machine 1 and the access door 4 are in clearance fit, the supporting legs 5 are arranged at the bottom end of the wafer cleaning machine 1, the wafer cleaning machine 1 is in threaded connection with the supporting legs 5, the water collecting tank 6 is arranged below the left side of the wafer cleaning machine 1, the wafer cleaning machine 1 is movably connected with the water collecting tank 6, the control panel 3 is arranged at the front end of the wafer cleaning machine 1, the wafer cleaning machine 1 consists of a machine body 101, a sprayer 102, a lifting device 103 and a rotating motor 104, four sprayers 102 are installed on the inner wall of the machine body 101, a lifting device 103 is arranged inside the machine body 101, the machine body 101 and the lifting device 103 are in clearance fit, a rotating motor 104 is arranged at the bottom end of the lifting device 103, and the lifting device 103 is connected with the rotating motor 104.
The lifting device 103 comprises a lifting motor 1031, a bearing fixing frame 1032, an extension tube 1033, a throwing force cleaning mechanism 1034 and a wafer fixing mechanism 1035, wherein the bearing fixing frame 1032 is arranged at the front end of the lifting motor 1031, the lifting motor 1031 is mechanically connected with one end of the bearing fixing frame 1032, the extension tube 1033 is arranged at the other end of the bearing fixing frame 1032, the wafer fixing mechanism 1035 is arranged at the top end of the extension tube 1033, the extension tube 1033 is in tenon connection with the wafer fixing mechanism 1035, the throwing force cleaning mechanism 1034 is arranged on the surface of the wafer fixing mechanism 1035, and the wafer fixing mechanism 1035 is in sliding fit with the throwing force cleaning mechanism 1034.
The throwing-force cleaning mechanism 1034 comprises a clamping block 10341, balls 10342, sliding columns 10343, a first brush plate 10344 and a second brush plate 10345, the balls 10342 are respectively installed at the bottoms of the upper end and the lower end of the clamping block 10341, the first brush plate 10344 is arranged at the upper end of the clamping block 10341, the clamping block 10341 and the first brush plate 10344 are in clearance fit, the second brush plate 10345 is arranged at the lower end of the clamping block 10341, the clamping block 10341 is movably connected with the second brush plate 10345, the sliding columns 10343 are arranged on the surface of one end of the second brush plate 10345, and the second brush plate 10345 is fixedly connected with the sliding columns 10343.
The above-mentioned ball 10342 is for allowing the fixture block 10341 to slide in the guide rail groove 10356 on the surface of the fixing ring 10351, and for allowing the fixture block 10341 to drive the first brush plate 10344 and the second brush plate 10345 to work.
The second brush plate 10345 further includes a torsion spring 10345a, one end of the second brush plate 10345 is provided with a torsion spring 10345a, the second brush plate 10345 and the torsion spring 10345a are buckled with each other,
the torsion spring 10345a is used to lift the second brush plate 10345 to prevent the wafer from contacting the wafer surface during mounting, and also to prevent the second brush plate 10345 from staying on the wafer surface after the wafer is completely brushed.
The wafer fixing mechanism 1035 is composed of a fixing ring 10351, a closing bar 10352, a bolt shaft 10353, a clamping groove 10354, a support rod 10355 and a guide rail groove 10356, the closing bar 10352 is arranged on the surface of the fixing ring 10351, the fixing ring 10351 and the closing bar 10352 are movably connected through the bolt shaft 10353, the guide rail groove 10356 is arranged on each of the upper surface and the lower surface of the fixing ring 10351, the clamping groove 10354 is arranged on the inner side of the fixing ring 10351, the support rod 10355 is arranged at the middle position of the bottom end of the fixing ring 10351, the two ends of the fixing ring 10351 and the support rod 10355 are welded through electric welding,
the closing bar 10352 is a valve for allowing the wafer to be mounted on the fixing ring 10351, and the support bar 10355 is a valve for connecting the telescopic tube 1033, so that the telescopic tube 1033 controls the rotation and up-and-down movement of the wafer fixing mechanism 1035 through the support bar 10355.
The clamping groove 10354 further comprises an annular clamping ring 10354a, the annular clamping ring 10354a is arranged on the inner side of the clamping groove 10354, the clamping groove 10354 and the annular clamping ring 10354a are connected by glue,
the ring-shaped clamp ring 10354a is a ring-shaped clamp ring that can prevent the wafer from being scratched when the wafer is clamped, and further prevent the wafer from being used.
The surfaces of the fixing ring 10351 and the closing strip 10352 are both provided with more than two water drainage holes 10351a, and the water drainage holes 10351a are distributed on the surfaces of the fixing ring 10351 and the closing strip 10352 at equal intervals to form an annular structure,
the drainage holes 10351a are provided to guide water out when the wafer is spun.
The annular clamping ring 10354a is made of resin, the surface of a wafer cannot be scratched, the use of the wafer is further influenced, the telescopic pipe 1033 is arranged right above the rotating motor 104, the bottom end of the telescopic pipe 1033 is in threaded connection with the rotating motor 104 through a motor shaft, the clamping block 10341 and the fixing ring 10351 are in sliding fit with the guide rail groove 10356 through the ball 10342, and the first brush plate 10344 and the second brush plate 10345 are parallel to each other and are in the same horizontal position.
The principle of the invention is as follows: the wafer cleaning method comprises the steps of opening a closing bar 10352 through a latch shaft 10353, inserting a wafer into an annular clamping ring 10354a, closing the closing bar 10352, driving one end of a telescopic pipe 1033 to move upwards by using a lifting motor 1031, driving a fixing ring 10351 to move upwards by using a telescopic pipe 1033 through a supporting rod 10355, controlling a sprayer 102 to spray and clean the wafer through a control panel 3, driving the telescopic pipe 1033 to rotate by using a rotating motor 104, enabling the telescopic pipe 1033 to transmit kinetic energy to the fixing ring 10351, driving a fixture block 10341 to rotate by using rotating centrifugal force by using the fixing ring 10351, enabling the fixture block 10341 to slide on a guide rail groove 10356 on the fixing ring 10351 through a ball 10342, cleaning the wafer through a first brush plate 10344 and a second brush plate 10345 by the fixture block 10341, cleaning the wafer surface by displacing a little at night under the influence of the centrifugal force by the first brush plate 10344, and cleaning the wafer surface by the second brush plate 10345 under the cooperation of gravity and the, when the rotation of the rotary motor 104 is stopped, the fixed ring 10351 is influenced by inertia and does not stop immediately but stops slowly, when the rotation is stopped slowly, the first brush plate 10344 is slowly separated from the contact with the wafer due to the centrifugal force smaller than the gravity, and when the centrifugal force is smaller than the influence of the torsion spring 10345a, the second brush plate 10345 is lifted by the torsion spring 10345a and is separated from the contact with the wafer, and the wafer is dried by the residual force of the rotation to complete the cleaning operation.
The method for solving the problems comprises the following steps: the wafer fixing mechanism 1035 is driven to ascend through the lifting motor 1031, the rotating motor 104 is used for providing rotation, the wafer fixing mechanism 1035 can rotate at a high speed, the wafer fixing mechanism 1035 provides kinetic energy for the throwing force cleaning mechanism 1034 through centrifugal force, the throwing force cleaning mechanism 1034 can clean the surface of the wafer synchronously, the cleaning structure is stable and cannot damage the wafer when the wafer is cleaned due to mechanical faults, the first brush plate 10344 and the second brush plate 10345 are cleaned through special frosted cleaning brushes, scratching and omission are prevented, pressure is not applied to the wafer during precise cleaning, moisture on the surface of the wafer is removed in the shortest time, the surface of the wafer cannot have any water mark after the wafer is removed, and the yield of the wafer is prevented from being reduced.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. A wafer lifting device of a semiconductor equipment process chamber structurally comprises a wafer cleaning machine (1), a material placing port (2), a control panel (3), an access door (4), supporting legs (5) and a water collecting tank (6), wherein the material placing port (2) is arranged on the surface of the front end of the wafer cleaning machine (1), the access door (4) is arranged below the front end of the wafer cleaning machine (1), the wafer cleaning machine (1) and the access door (4) are in clearance fit, the supporting legs (5) are arranged at the bottom end of the wafer cleaning machine (1), the wafer cleaning machine (1) is in threaded connection with the supporting legs (5), the water collecting tank (6) is arranged below the left side of the wafer cleaning machine (1), the wafer cleaning machine (1) is movably connected with the water collecting tank (6), the control panel (3) is arranged at the front end of the wafer cleaning machine (1), the method is characterized in that:
the wafer cleaning machine (1) is composed of a machine body (101), sprayers (102), a lifting device (103) and a rotating motor (104), wherein the four sprayers (102) are installed on the inner wall of the machine body (101), the lifting device (103) is arranged inside the machine body (101), the machine body (101) and the lifting device (103) are in clearance fit, the rotating motor (104) is arranged at the bottom end of the lifting device (103), and the lifting device (103) is connected with the rotating motor (104);
the lifting device (103) consists of a lifting motor (1031), a bearing fixing frame (1032), an expansion pipe (1033), a throwing power cleaning mechanism (1034) and a wafer fixing mechanism (1035), wherein the bearing fixing frame (1032) is arranged at the front end of the lifting motor (1031), the lifting motor (1031) is mechanically connected with one end of the bearing fixing frame (1032), the expansion pipe (1033) is arranged at the other end of the bearing fixing frame (1032), the wafer fixing mechanism (1035) is arranged at the top end of the expansion pipe (1033), the expansion pipe (1033) is in tenon connection with the wafer fixing mechanism (1035), the throwing power cleaning mechanism (1034) is arranged on the surface of the wafer fixing mechanism (1035), and the wafer fixing mechanism (1035) is in sliding fit with the throwing power cleaning mechanism (1034);
swing force wiper mechanism (1034) constitute by fixture block (10341), ball (10342), traveller (10343), first brush board (10344), second brush board (10345), fixture block (10341) upper and lower both ends bottom all install ball (10342), fixture block (10341) upper end be equipped with first brush board (10344), fixture block (10341) and first brush board (10344) adopt clearance fit, fixture block (10341) lower extreme be equipped with second brush board (10345), fixture block (10341) and second brush board (10345) swing joint, second brush board (10345) one end on be equipped with traveller (10343) on the surface, second brush board (10345) and traveller (10343) fixed connection.
2. The wafer lifting device of the semiconductor equipment process chamber as claimed in claim 1, wherein: the second brush plate (10345) further comprises a torsion spring (10345 a), one end of the second brush plate (10345) is provided with the torsion spring (10345 a), and the second brush plate (10345) is buckled with the torsion spring (10345 a).
3. The wafer lifting device of the semiconductor equipment process chamber as claimed in claim 1, wherein: the wafer fixing mechanism (1035) is composed of a fixing ring (10351), a closing bar (10352), a bolt shaft (10353), a clamping groove (10354), a supporting rod (10355) and a guide rail groove (10356), wherein the closing bar (10352) is arranged on the surface of the fixing ring (10351), the fixing ring (10351) and the closing bar (10352) are movably connected through the bolt shaft (10353), the upper surface and the lower surface of the fixing ring (10351) are respectively provided with the guide rail groove (10356), the clamping groove (10354) is arranged on the inner side of the fixing ring (10351), the supporting rod (10355) is arranged at the middle position of the bottom end of the fixing ring (10351), and the two ends of the fixing ring (10351) and the supporting rod (10355) are welded through electric welding.
4. The wafer lifting device of the semiconductor equipment process chamber as claimed in claim 3, wherein: the clamping groove (10354) further comprises an annular clamping ring (10354 a), the annular clamping ring (10354 a) is arranged on the inner side of the clamping groove (10354), and the clamping groove (10354) is connected with the annular clamping ring (10354 a) in a gluing mode.
5. The wafer lifting device of the semiconductor equipment process chamber as claimed in claim 3, wherein: the surfaces of the fixing ring (10351) and the closing strip (10352) are provided with more than two drainage holes (10351 a), and the drainage holes (10351 a) are distributed on the surfaces of the fixing ring (10351) and the closing strip (10352) at equal intervals to form an annular structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910308718.XA CN110148573B (en) | 2019-04-17 | 2019-04-17 | Wafer lifting device of semiconductor equipment process chamber |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910308718.XA CN110148573B (en) | 2019-04-17 | 2019-04-17 | Wafer lifting device of semiconductor equipment process chamber |
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| Publication Number | Publication Date |
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| CN110148573A CN110148573A (en) | 2019-08-20 |
| CN110148573B true CN110148573B (en) | 2020-12-04 |
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| CN201910308718.XA Active CN110148573B (en) | 2019-04-17 | 2019-04-17 | Wafer lifting device of semiconductor equipment process chamber |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110581094A (en) * | 2019-08-26 | 2019-12-17 | 泉州洛江元康工业设计有限公司 | Wafer processing equipment |
| CN113035743B (en) * | 2021-02-25 | 2022-01-25 | 无锡亚电智能装备有限公司 | Wafer cleaning method for gradually lifting wafer |
| CN113035744B (en) * | 2021-02-25 | 2021-12-03 | 无锡亚电智能装备有限公司 | Semiconductor wafer cleaning device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH08261648A (en) * | 1995-03-28 | 1996-10-11 | Hitachi Ltd | Drying apparatus |
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