CN112916502B - Cleaning and drying method for wafer storage box - Google Patents
Cleaning and drying method for wafer storage box Download PDFInfo
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- CN112916502B CN112916502B CN202110179121.7A CN202110179121A CN112916502B CN 112916502 B CN112916502 B CN 112916502B CN 202110179121 A CN202110179121 A CN 202110179121A CN 112916502 B CN112916502 B CN 112916502B
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- cleaning
- storage box
- wafer storage
- box
- drying
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- 238000004140 cleaning Methods 0.000 title claims abstract description 103
- 238000003860 storage Methods 0.000 title claims abstract description 77
- 238000001035 drying Methods 0.000 title claims abstract description 54
- 230000007246 mechanism Effects 0.000 claims abstract description 78
- 239000013078 crystal Substances 0.000 claims abstract description 16
- 230000001680 brushing effect Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 19
- 239000007921 spray Substances 0.000 claims description 9
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 64
- 238000005406 washing Methods 0.000 description 15
- 230000013011 mating Effects 0.000 description 9
- 238000007789 sealing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000002337 anti-port Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/36—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by using brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
- B08B9/30—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking and having conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/42—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus being characterised by means for conveying or carrying containers therethrough
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
- F26B15/02—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in the whole or part of a circle
- F26B15/04—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in the whole or part of a circle in a horizontal plane
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/003—Handling, e.g. loading or unloading arrangements for articles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/02—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
- F26B3/04—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour circulating over or surrounding the materials or objects to be dried
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microbiology (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a cleaning and drying method of a wafer storage box, which comprises the following steps: the wafer storage box is washed, drained and dried sequentially from the feeding through the conveying mechanism, and discharging after the wafer storage box is washed and dried is completed. The cleaning and brushing are completed by a cleaning mechanism and a cleaning and brushing mechanism hung on the conveying mechanism, the draining is completed when the wafer storage box passes through the draining rack, and the drying is completed by a drying mechanism. According to the invention, the cleaning mechanism is matched with the cleaning mechanism and the drying mechanism, so that the cleaning efficiency is improved in a flow line mode, the drying effect is ensured, and the cleaning mechanism is matched with the limiting frame, the limiting slide rail, the first matching rack and the second matching rack, so that the cleaning brush and the round crystal storage box can rotate reversely, the cleaning effect is improved, the round crystal storage box is not damaged, and the working efficiency is improved.
Description
Technical Field
The invention relates to the field of cleaning of wafer storage boxes, in particular to a cleaning and drying integrated machine for a wafer storage box.
Background
Currently, cassettes are often used to transfer wafers between processes in semiconductor manufacturing. The existing wafer box comprises a box body with an opening on one side and a door cover, wherein the door cover is matched with the opening of the box body and used for sealing the box body, and a plurality of grooves used for placing wafers are formed in the inner wall of the box body.
After a certain amount of wafers are transferred by the wafer cassette, a large amount of particulate matter is easily accumulated during the contact between the wafers and the wafer cassette due to repeated placement and removal of the wafers. Therefore, the wafer cassette needs to be cleaned periodically. At present, the common cleaning method is as follows: the wafer box is opened first, then the wafer boxes are placed into a cleaning cavity of a large cleaning device, and then the wafer boxes are washed in the cleaning cavity. However, the method has the problem that the wafer box is not dried after being washed, and cannot be directly used for wafer transmission, and the method can be used for wafer transmission only after the wafer box is completely dried.
Disclosure of Invention
The present invention is directed to a method for cleaning and drying a wafer storage box.
The invention realizes the purpose through the following technical scheme:
the invention relates to a cleaning and drying method of a wafer storage box,
the method comprises the following steps: the wafer storage box is washed, drained and dried sequentially from the feeding through the conveying mechanism, and the wafer storage box is washed, dried and then discharged;
the cleaning and washing are completed by a cleaning mechanism and a washing mechanism hoisted on the conveying mechanism, the draining is completed when the wafer storage box passes through the draining rack, and the drying is completed by a drying mechanism;
the cleaning mechanism comprises a cleaning box, an ultrasonic cleaning machine, a circulating pump and a transmission pipe, the ultrasonic cleaning machine is arranged at the bottom end inside the cleaning box, the circulating pump is arranged at the rear side of the cleaning box, the transmission pipe is connected to the circulating pump, a high-pressure sprayer is arranged on the transmission pipe, a limiting frame is arranged on the inner side surface of the cleaning box, a limiting slide rail is arranged on the lower side of the limiting frame, the inner side surface of the cleaning box of the limiting slide rail is of a Z-shaped structure, a first matching rack is arranged on the side opposite to the lower end of the limiting slide rail, a second matching rack is arranged on the lower side of the limiting slide rail, and a draining frame is arranged between the cleaning box and the drying mechanism;
the cleaning mechanism comprises a moving block, a connecting rod, a moving frame and a first matching gear, the connecting rod is mounted at the lower end of the moving block, the moving frame is connected to the lower end of the connecting rod, the clamping mechanism is arranged on the inner side of the moving frame, the first matching gear is connected to the lower end of the clamping mechanism, the lower end of the first matching gear is connected to a limiting disc, a cleaning brush is arranged on the lower side of the limiting disc, a round crystal storage box passes through the limiting disc and the cleaning brush, the power end of the cleaning brush is connected to a second matching gear, the front side of the first matching gear is matched with the first matching rack, the rear side of the first matching gear is limited by the limiting slide rail, and the rear end of the second matching gear is matched with the second matching rack;
drying mechanism includes seal box, exhaust fan, air heater, stoving nozzle, install the seal box upper end the exhaust fan, the seal box lower extreme is provided with the air heater, the air heater passes through the pipe connection to inside the seal box stoving nozzle.
According to the cleaning and drying method of the wafer storage box, the water spraying angle of the high-pressure spray head is 20-70 degrees.
According to the cleaning and drying method of the wafer storage box, the number of the high-pressure nozzles is 3, two high-pressure nozzles are located on two sides of the top of the wafer storage box, the other high-pressure nozzle is arranged corresponding to the middle of the wafer storage box, or the other high-pressure nozzle is arranged corresponding to the bottom of the wafer storage box.
According to the cleaning and drying method of the wafer storage box, the temperature of the air blown out by the hot air blower is 50-80 ℃.
According to the cleaning and drying method of the wafer storage box, gas blown out by the hot air blower is nitrogen.
According to the cleaning and drying method of the wafer storage box, the cleaning brush is made of the soft brush.
According to the cleaning and drying method of the wafer storage box, the conveying mechanism is of a runner type, and the feeding and the discharging of the wafer storage box are located on the same side.
According to the cleaning and drying method of the wafer storage box, the clamping mechanism (6) comprises a first sliding column (61), a first return spring (62) and a sliding groove (63), the first return spring (62) is arranged on the outer side of the first sliding column (61), the lower end of the first return spring (62) is connected with the first matching gear (54), and the sliding groove (63) is formed between the first matching gear (54) and the first sliding column (61).
According to the cleaning and drying method of the wafer storage box, the clamping mechanism (6) comprises a second sliding column (611), a connecting block (612), a second return spring (613) and a sliding groove (63), the first matching gear (54) is connected to the outer portion of the second sliding column (611) in a sliding mode, the sliding groove (63) is formed between the second sliding column (611) and the first matching gear (54), the connecting block (612) is arranged on the inner side face of the first matching gear (54), the connecting block (612) is connected with the second sliding column (611) through the second return spring (613), and a groove for the connecting block (612) to slide is formed in the second sliding column (611).
Compared with the prior art, the invention has the following beneficial effects:
1. the washing mechanism is matched with the washing mechanism and the drying mechanism, so that the washing efficiency is improved in a flow line mode, and the drying effect is ensured;
2. utilize washing mechanism cooperation spacing, spacing slide rail, first cooperation rack, second cooperation rack to make washing brush and brilliant case of circle can the antiport, thereby improve the cleaning performance, and can not take place the damage to brilliant case of circle, improve work efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a cleaning and drying machine for wafer storage cassettes according to the present invention;
FIG. 2 is a schematic diagram of an internal structure of a cleaning box of the integrated cleaning and drying machine for wafer storage boxes according to the present invention;
FIG. 3 is a schematic diagram of the internal structure of a sealing box of the integrated cleaning and drying machine for wafer storage boxes according to the present invention;
FIG. 4 is a schematic structural diagram of a washing mechanism of the integrated washing and drying machine for wafer storage boxes according to the present invention;
FIG. 5 is a schematic structural diagram of a cleaning brush of the integrated cleaning and drying machine for wafer storage boxes according to the present invention;
FIG. 6 is a schematic structural diagram of a first state of a first mating gear of the integrated cleaning and drying machine for wafer storage cassettes according to the present invention;
FIG. 7 is a schematic structural diagram of a second state of a first mating gear of the integrated cleaning and drying machine for wafer storage boxes according to the present invention;
FIG. 8 is a schematic structural view of a first slide column of the integrated cleaning and drying machine for wafer storage boxes according to the present invention;
fig. 9 is a schematic structural view of a second slide column of the integrated cleaning and drying machine for wafer storage boxes according to the present invention.
The reference numerals are explained below:
1. a support mechanism; 2. a transport mechanism; 3. a cleaning mechanism; 4. a drying mechanism; 5. a washing mechanism; 6. a clamping mechanism; 7. a wafer storage box; 11. a column; 12. a support frame; 13. a slide rail; 21. a motor mounting bracket; 22. an electric motor; 23. a drive chain set; 31. a cleaning tank; 32. an ultrasonic cleaning machine; 33. a circulation pump; 34. a conveying pipe; 35. a high pressure spray head; 36. a limiting frame; 37. a limiting slide rail; 38. a first mating rack; 39. a second mating rack; 310. a draining rack; 41. a sealing box; 42. an exhaust fan; 43. a hot air blower; 44. drying the nozzle; 51. a moving block; 52. a connecting rod; 53. a movable frame; 54. a first mating gear; 55. a limiting disc; 56. a second mating gear; 57. cleaning brushes; 61. a first traveler; 62. a first return spring; 63. a chute; 611. a second strut; 612. connecting blocks; 613. a second return spring.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be further described with reference to the accompanying drawings in which:
example 1
As shown in fig. 1-8, a cleaning and drying integrated machine for a wafer storage box comprises a supporting mechanism 1, a conveying mechanism 2, a cleaning mechanism 3 and a drying mechanism 4, wherein the conveying mechanism 2 is installed at the upper end of the supporting mechanism 1, the cleaning mechanism 3 is arranged at the lower side of the conveying mechanism 2, the drying mechanism 4 is arranged at the rear side of the cleaning mechanism 3, a cleaning mechanism 5 is hung on the conveying mechanism 2, and a clamping mechanism 6 is arranged at the inner side of the cleaning mechanism 5;
the supporting mechanism 1 comprises an upright post 11, a supporting frame 12 and a sliding rail 13, wherein the supporting frame 12 is installed at the upper end of the upright post 11, and the sliding rail 13 is connected to the outer side of the supporting frame 12;
the conveying mechanism 2 comprises a motor mounting frame 21, a motor 22 and a transmission chain group 23, the motor mounting frame 21 is mounted at the upper end of the slide rail 13, the motor 22 is mounted at the upper end of the motor mounting frame 21, the power output end of the motor 22 is provided with the transmission chain group 23, and a matching groove is formed between the transmission chain group 23 and the slide rail 13;
the cleaning mechanism 3 comprises a cleaning box 31, an ultrasonic cleaning machine 32, a circulating pump 33 and a transmission pipe 34, the ultrasonic cleaning machine 32 is arranged at the bottom end inside the cleaning box 31, the circulating pump 33 is arranged at the rear side of the cleaning box 31, the transmission pipe 34 is connected onto the circulating pump 33, a high-pressure nozzle 35 is arranged on the transmission pipe 34, a limiting frame 36 is arranged on the inner side surface of the cleaning box 31, a limiting slide rail 37 is arranged on the lower side of the limiting frame 36, the inner side surface of the cleaning box 31 of the limiting slide rail 37 is of a Z-shaped structure, a first matching rack 38 is arranged on the opposite side of the lower end of the limiting slide rail 37, a second matching rack 39 is arranged on the lower side of the limiting slide rail 37, and a draining rack 310 is arranged between the cleaning box 31 and the drying mechanism 4;
the drying mechanism 4 comprises a sealing box 41, an exhaust fan 42, a hot air blower 43 and a drying nozzle 44, wherein the exhaust fan 42 is installed at the upper end of the sealing box 41, the hot air blower 43 is arranged at the lower end of the sealing box 41, and the hot air blower 43 is connected to the drying nozzle 44 in the sealing box 41 through a pipeline;
the washing mechanism 5 comprises a moving block 51, a connecting rod 52, a moving frame 53 and a first matching gear 54, the connecting rod 52 is mounted at the lower end of the moving block 51, the moving frame 53 is connected to the lower end of the connecting rod 52, a clamping mechanism 6 is arranged on the inner side of the moving frame 53, the first matching gear 54 is connected to the lower end of the clamping mechanism 6, a limiting disc 55 is singly connected to the first matching gear 54, a washing brush 57 is arranged on the lower side of the limiting disc 55, a round crystal storage box 7 is arranged between the limiting disc 55 and the washing brush 57, the power end of the washing brush 57 is connected with a second matching gear 56, the front side of the first matching gear 54 is matched with the first matching rack 38, the rear side of the first matching gear 54 is limited by a limiting slide rail 37, and the rear end of the second matching gear 56 is matched with the second matching rack 39.
Preferably: the clamping mechanism 6 comprises a first sliding column 61, a first return spring 62 and a sliding chute 63, wherein the first return spring 62 is arranged on the outer side of the first sliding column 61, the lower end of the first return spring 62 is connected with a first matching gear 54, the sliding chute 63 is formed between the first matching gear 54 and the first sliding column 61, when the limiting sliding rail 37 gradually becomes lower, the first matching gear 54 is pressed to become lower to slide downwards on the first sliding column 61, and meanwhile, the limiting disc 55 is driven to press the round crystal storage box 7 on the upper end of the cleaning brush 57; the support frame 12 is connected with the upright post 11 through welding, the slide rail 13 is connected with the support frame 12 through bolts, the slide rail 13 is hollow inside, a groove for limiting the moving block 51 is formed in the bottom of the slide rail 13, and the slide rail 13 plays a role in transmission; the motor mounting frame 21 is connected with the motor 22 through bolts, the motor 22 is connected with the transmission chain group 23 through bolts, a clamping block is arranged on the transmission chain group 23 and matched with a chain on the moving block 51, and the transmission chain group 23 plays a role in driving the washing mechanism 5 to move; the included angle range between the high-pressure spray head 35 and the horizontal plane is 20 degrees to 70 degrees, the high surface of the limiting slide rail 37 is the same as the initial position of the first matching gear 54, the low surface of the limiting slide rail 37 is the same as the height of the first matching rack 38, and the high-pressure spray head 35 cleans the exterior and the interior of the round crystal storage box 7; the limiting disc 55 is in key connection with the first matching gear 54, the limiting disc 55 is made of rubber, and the limiting disc 55 is used for tightly pressing the round crystal storage box 7, so that the round crystal storage box 7 can be matched with the cleaning brush 57 to rotate reversely; the second matching gear 56 is connected with the moving frame 53 through a bearing seat, the cleaning brush 57 is in key connection with the second matching gear 56, and the moving frame 53 plays a role in installation and fixation; the cleaning brush 57 is made of a soft brush, and the cleaning brush 57 cleans the inner side surface of the wafer storage box 7 and simultaneously ensures that the inner side surface is not damaged; the first mating gear 54 is slidably connected to the first sliding column 61, the first return spring 62 is connected to the moving frame 53 and the first mating gear 54 through screws, and the first mating gear 54 is used for driving the limiting disc 55 to descend and rotate.
Example 2
As shown in fig. 9, the present embodiment is different from embodiment 1 in that:
the clamping mechanism 6 includes a second sliding column 611, a connecting block 612, a second return spring 613, and a sliding slot 63, the first engaging gear 54 is slidably connected to the outside of the second sliding column 611, the sliding slot 63 is provided between the second sliding column 611 and the first engaging gear 54, the connecting block 612 is provided on the inner side of the first engaging gear 54, the connecting block 612 is connected to the second sliding column 611 through the second return spring 613, a slot for the connecting block 612 to slide is provided on the second sliding column 611, when the limiting sliding rail 37 gradually becomes lower, the first engaging gear 54 is pressed to become lower and slide downward on the second sliding column 611, and at the same time, the limiting disc 55 is driven to press the round crystal storage box 7 on the upper end of the cleaning brush 57.
The working principle is as follows: before the feeding end of the cleaning box 31, the wafer storage box 7 is placed on the outer side of the cleaning brush 57, then the transmission chain group 23 drives the chain at the upper end of the moving block 51 to start conveying, after the moving frame 53 enters the cleaning box 31, the limiting frame 36 limits the front end and the rear end of the moving frame 53, at this time, the first matching gear 54 contacts the high-level surface of the limiting slide rail 37, the limiting slide rail 37 gradually becomes lower, the first matching gear 54 is gradually pressed down, when the limiting slide rail 37 reaches the lowest surface, the first matching gear 54 drives the limiting disc 55 to press down, the limiting disc 55 tightly presses the wafer storage box 7 on the upper end surface of the cleaning brush 57, at this time, the first matching gear 54 contacts the first matching rack 38, the second matching gear 56 contacts the second matching rack 39, the first matching gear 54 and the second matching gear 56 rotate reversely, while the wafer storage box 7 and the cleaning brush 57 also rotate reversely, and simultaneously the three high-pressure spray heads 35 spray water, the inner surface and the outer surface of the round crystal storage box 7 are cleaned, after the cleaning, the first matching gear 54 is separated from the limiting slide rail 37, the first matching gear 54 drives the limiting disc 55 to reset, the round crystal storage box enters the draining rack 310 for draining, and then the round crystal storage box 7 can be taken down after the round crystal storage box enters the sealing box 41 for drying.
Example 3
The embodiment provides a cleaning and drying method for a wafer storage box, which comprises the following steps:
the wafer storage box is washed, drained and dried sequentially from the feeding through the conveying mechanism 2, and the wafer storage box is washed, dried and then discharged;
the cleaning and brushing are completed by the cleaning mechanism 3 of the embodiment 1 or 2 and the cleaning and brushing mechanism 5 of the embodiment 1 or 2 hung on the conveying mechanism 2, the draining is completed when the wafer storage box passes through the draining rack 310 of the embodiment 1 or 2, and the drying is completed by the drying mechanism 4.
Preferably, the high pressure nozzle 35 sprays water at an angle of 20 to 70 degrees, thereby more completely cleaning the wafer storage cassette 7.
Preferably, the number of the high pressure nozzles 35 is 3, two of the high pressure nozzles 35 are located at two sides of the top of the wafer storage box 7, another one of the high pressure nozzles 35 is located corresponding to the middle of the wafer storage box 7 (if one side of the wafer storage box 7 is open, the high pressure nozzle 35 is aligned with the opening, for example, the top of the wafer storage box 7 is open, the wafer storage box 7 is placed at the side), or another one of the high pressure nozzles 35 is located corresponding to the bottom of the wafer storage box 7 (if the bottom of the wafer storage box 7 also has an opening).
Preferably, the temperature of the air blown by the hot air blower 43 is 50 to 80 degrees.
The gas blown by the hot air blower 43 is preferably nitrogen, but may be air.
Preferably, the conveying mechanism 2 is of a runway type, and the loading and unloading of the wafer storage box are located on the same side, as shown in fig. 1, so that a circular operation is formed, and the work efficiency is improved.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (9)
1. A cleaning and drying method for a wafer storage box is characterized by comprising the following steps: the method comprises the following steps:
the wafer storage box is washed, drained and dried sequentially from the feeding through the conveying mechanism (2), and the wafer storage box is cleaned, dried and then discharged;
the cleaning and brushing are finished by a cleaning mechanism (3) and a cleaning and brushing mechanism (5) hung on the conveying mechanism (2), the draining is finished when the wafer storage box passes through a draining rack (310), and the drying is finished by a drying mechanism (4);
the cleaning mechanism (3) comprises a cleaning box (31), an ultrasonic cleaning machine (32), a circulating pump (33) and a transmission pipe (34), the bottom end in the cleaning box (31) is provided with the ultrasonic cleaning machine (32), the back side of the cleaning box (31) is provided with the circulating pump (33), the circulating pump (33) is connected with the transmission pipe (34), a high-pressure spray head (35) is arranged on the transmission pipe (34), a limiting frame (36) is arranged on the inner side surface of the cleaning box (31), a limiting slide rail (37) is arranged on the lower side of the limiting frame (36), the inner side surface of the limiting slide rail (37) in the cleaning box (31) is of a Z-shaped structure, and the opposite side of the lower end of the limit slide rail (37) is provided with a first matching rack (38), a second matching rack (39) is arranged on the lower side of the limiting slide rail (37), and a draining rack (310) is arranged between the cleaning box (31) and the drying mechanism (4);
the cleaning mechanism (5) comprises a moving block (51), a connecting rod (52), a moving frame (53) and a first matching gear (54), the connecting rod (52) is installed at the lower end of the moving block (51), the moving frame (53) is connected to the lower end of the connecting rod (52), a clamping mechanism (6) is arranged on the inner side of the moving frame (53), the first matching gear (54) is connected to the lower end of the clamping mechanism (6), a limiting disc (55) is connected to the lower end of the first matching gear (54), a cleaning brush (57) is arranged on the lower side of the limiting disc (55), a wafer storage box (7) is arranged between the limiting disc (55) and the cleaning brush (57) in a passing mode, a second matching gear (56) is connected to the power end of the cleaning brush (57), the front side of the first matching gear (54) is matched with the first matching rack (38), and the rear side of the first matching gear (54) is limited by the limiting slide rail (37), the rear end of the second matching gear (56) is matched with the second matching rack (39);
drying mechanism (4) are including seal box (41), exhaust fan (42), air heater (43), drying nozzle (44), install seal box (41) upper end exhaust fan (42), seal box (41) lower extreme is provided with air heater (43), air heater (43) are connected to through the pipeline inside seal box (41) drying nozzle (44).
2. The method of claim 1, wherein the method comprises: the water spraying angle of the high-pressure spray head (35) is 20-70 degrees.
3. The method of claim 2, wherein the wafer storage box comprises: the number of the high-pressure nozzles (35) is 3, the two high-pressure nozzles (35) are located on two sides of the top of the round crystal storage box (7), the other high-pressure nozzle (35) is arranged in the middle of the round crystal storage box (7) correspondingly, or the other high-pressure nozzle (35) is arranged at the bottom of the round crystal storage box (7) correspondingly.
4. The method of claim 1, wherein the method comprises: the temperature of the air blown out by the hot air blower (43) is 50-80 ℃.
5. The method for cleaning and drying the wafer storage box according to claim 4, wherein: the gas blown out by the hot air blower (43) is nitrogen.
6. The method of claim 1, wherein the method comprises: the cleaning brush (57) is made of a soft brush.
7. The method of claim 1, wherein the method comprises: the conveying mechanism (2) is in a runway shape, and the feeding and the blanking of the wafer storage box are positioned on the same side.
8. The method of claim 1, wherein the method comprises: clamping mechanism (6) include first traveller (61), first reset spring (62), spout (63), first traveller (61) outside is provided with first reset spring (62), first reset spring (62) lower extreme is connected first cooperation gear (54), first cooperation gear (54) with the shaping has between first traveller (61) spout (63).
9. The method of claim 8, wherein the wafer cassette comprises: the clamping mechanism (6) comprises a second sliding column (611), a connecting block (612), a second return spring (613) and a sliding groove (63), the first matching gear (54) is connected to the outer portion of the second sliding column (611) in a sliding mode, the sliding groove (63) is formed between the second sliding column (611) and the first matching gear (54), the connecting block (612) is arranged on the inner side face of the first matching gear (54), the connecting block (612) is connected with the second sliding column (611) through the second return spring (613), and a groove used for the connecting block (612) to slide is formed in the second sliding column (611).
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| CN202110179121.7A CN112916502B (en) | 2021-02-08 | 2021-02-08 | Cleaning and drying method for wafer storage box |
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| CN115338214A (en) * | 2022-06-23 | 2022-11-15 | 横店集团东磁股份有限公司 | Tray cleaning system and tray cleaning method |
| CN115020302B (en) * | 2022-07-15 | 2022-10-14 | 江苏芯梦半导体设备有限公司 | Cleaning and drying equipment and cleaning and drying method for wafer storage box |
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| GB194976A (en) * | 1922-05-09 | 1923-03-22 | Arthur Leslie Flower | An improved bottle washing machine |
| FR2838659A1 (en) * | 2002-04-17 | 2003-10-24 | Sotic Mecanique | DEVICE FOR AUTOMATIC CLEANING OF BOTTLES AND INSTALLATION USING THE SAME |
| CN202290684U (en) * | 2011-10-17 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | Automatic cleaning device for wafer box |
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No.199, Keji Road, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |