CN219106086U - Wafer and chuck cleaning device - Google Patents

Abstract

The utility model relates to the technical field of semiconductors, in particular to a wafer and chuck cleaning device, which comprises a frame, a movable cleaning mechanism and a nozzle, wherein the movable cleaning mechanism is arranged on the frame and can move between a non-working station and a cleaning station, the movable cleaning mechanism comprises a cleaning brush, a high-pressure spray head and an oilstone component, the high-pressure spray head can carry out high-pressure flushing on the surfaces of the wafer and the chuck, the cleaning brush can scrub the surfaces of the wafer, and the oilstone component can carry out grinding and washing on the surfaces of the chuck; the nozzle is capable of providing a cleaning fluid to the wafer surface and the chuck surface. The wafer and chuck cleaning device can effectively clean the wafer and the chuck and remove residues and sediments.

Description

Wafer and chuck cleaning device

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a wafer and chuck cleaning device.

Background

Before packaging an integrated circuit, a certain thickness of redundant machine body materials on the back of a wafer is required to be removed so as to reduce the packaging and mounting height, reduce the packaging volume of a chip and improve the heat diffusion efficiency of the chip. This process engineering is called wafer backside thinning process, and the corresponding equipment is a wafer thinning machine.

After the wafer is thinned, a certain amount of residues can remain on the surface of the wafer, the existence of the residues has various effects, firstly, the chuck of a transfer hand (out transfer hand) is unfavorable to grasp, secondly, the residues are easy to drop in the transfer process, pollution is caused to other modules, certain sediment can exist between the outer edge of the wafer and the outer edge of the chuck, the sediment can affect the thinning thickness of the next wafer, and even the wafer is worn or even cracked when serious.

Disclosure of Invention

The utility model aims to provide a wafer and chuck cleaning device which can effectively clean a wafer and a chuck and avoid residues and sediments.

To achieve the purpose, the utility model adopts the following technical scheme:

the wafer and chuck cleaning device is characterized by comprising a frame, a movable cleaning mechanism and a nozzle, wherein the movable cleaning mechanism is arranged on the frame and can move between a non-working station and a cleaning station, the movable cleaning mechanism comprises a cleaning brush, a high-pressure spray head and an oilstone component, the high-pressure spray head can perform high-pressure flushing on the surface of the wafer and the surface of the chuck, the cleaning brush can brush the surface of the wafer, and the oilstone component can perform grinding and washing on the surface of the chuck; the nozzle is capable of providing a cleaning fluid to the wafer surface and the chuck surface.

Optionally, the whetstone assembly includes a first whetstone and a second whetstone, the first whetstone and the second whetstone are both eccentrically disposed with respect to the chuck, the first whetstone being capable of cleaning the entire chuck, and the second whetstone being capable of cleaning an outer edge portion of the chuck greater than the wafer.

Optionally, the cleaning brush further comprises a first driving piece, a second driving piece and a third driving piece, wherein the first oilstone is installed at the output end of the first driving piece, the first driving piece is movably arranged on the frame, the first driving piece is configured to drive the first oilstone to lift, the second oilstone is installed at the output end of the second driving piece, the second driving piece is movably arranged on the frame, the second driving piece is configured to drive the second oilstone to lift, the cleaning brush is installed at the output end of the third driving piece, the third driving piece is movably arranged on the frame along the movable arrangement, and the third driving piece is configured to drive the cleaning brush to lift.

Optionally, the cleaning device further comprises a fourth driving piece, wherein the movable cleaning mechanism is installed at the output end of the fourth driving piece, and the fourth driving piece is configured to drive the movable cleaning mechanism to move between the non-working station and the cleaning station.

Optionally, the first oilstone and the second oilstone are arranged at intervals along the driving direction of the fourth driving piece, and the cleaning brush and the high-pressure nozzle are located between the first oilstone and the second oilstone.

Optionally, the cleaning brush further comprises a fifth driving piece, the fifth driving piece is installed at the output end of the third driving piece, the output end of the fifth driving piece is connected with a swinging rod, the cleaning brush and the high-pressure spray head are installed at the second end, far away from the fifth driving piece, of the swinging rod, the fifth driving piece is configured to drive the cleaning brush and the high-pressure spray head to swing, and in the swinging process, the cleaning brush and the high-pressure spray head can pass through the center of the chuck.

Optionally, the chuck further comprises a sixth driving member, the sixth driving member is mounted at the output end of the first driving member, the first whetstone is mounted at the output end of the sixth driving member, the sixth driving member is configured to drive the first whetstone to rotate, and the rotation direction of the sixth driving member is opposite to the rotation direction of the chuck.

Optionally, the swing area of the swing rod is in a sector shape, and residues on the wafer can move to a sector opening position of the swing area of the swing rod when the wafer rotates.

Optionally, the cleaning brush is a sponge brush.

Optionally, a water pan is arranged below the non-working station of the movable cleaning mechanism.

The beneficial effects of the utility model are as follows: according to the wafer and chuck cleaning device, the cleaning brush and the two fluids are utilized to clean the surface of the wafer, the nozzle is used in an auxiliary mode, the oilstone component is utilized to clean the chuck, the nozzle is also used in an auxiliary mode, the wafer and the chuck can be effectively cleaned, and residues are avoided.

Drawings

FIG. 1 is a schematic perspective view of a wafer and chuck cleaning apparatus (non-working station) according to an embodiment of the present utility model;

FIG. 2 is an elevation view (cleaning station) of a wafer and chuck cleaning apparatus according to an embodiment of the present utility model;

FIG. 3 is a schematic view of the internal structure of a frame according to an embodiment of the present utility model;

FIG. 4 is a schematic view of a first mounting seat according to an embodiment of the present utility model;

FIG. 5 is a schematic view of a second mounting seat according to an embodiment of the present utility model;

fig. 6 is a positional relationship diagram of the moving cleaning mechanism and the nozzle proposed in the embodiment of the present utility model.

In the figure, 1, a rack; 2. a cleaning brush; 3. a high pressure nozzle; 4. a first oilstone; 5. a second oilstone; 6. a nozzle; 7. a first driving member; 8. a second driving member; 9. a third driving member; 10. a fourth driving member; 11. a fifth driving member; 12. a sixth driving member; 13; a wafer; 14. a slide rail; 15. a slide block; 16. a base; 17. a first mount; 18. a second mounting base; 19. a limiting piece; 20. swing rod; 21. a chuck.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of operation, and are not intended to indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

This embodiment proposes a wafer and chuck belt cleaning device that is used for carrying out abluent chuck and wafer on the wafer thinning machine, and the chuck is used for fixing the wafer at the wafer thinning in-process to can carry the wafer around the centre of a circle rotation of self in order to cooperate other processing units of wafer thinning machine to process the wafer, the chuck generally sets up on the revolving platform and is provided with a plurality ofly, the revolving platform can carry the chuck rotation, makes the chuck switch between different stations. After polishing, the wafer rotates to the cleaning station along with the chuck, and the wafer and chuck cleaning device provided by the embodiment can effectively clean the wafer and the chuck.

Referring to fig. 1 to 6, the wafer and chuck cleaning apparatus in this embodiment includes a frame 1, a moving cleaning mechanism and a nozzle 6, the moving cleaning mechanism is movably disposed on the frame 1 (the moving direction of the moving cleaning mechanism is defined as a first direction), the moving cleaning mechanism can move between a non-working position and a cleaning position under the action of an external force, the moving cleaning mechanism includes a cleaning brush 2, a high-pressure nozzle 3 and an oilstone component, the high-pressure nozzle 3 can perform high-pressure cleaning on the surface of the wafer 13 and the surface of the chuck 21, the cleaning brush 2 can be contacted with the surface of the wafer 13 to brush the surface of the wafer 13, the oilstone component can be contacted with the surface of the chuck 21 to polish the chuck 21, the nozzle 6 is connected with an external water tank, the speed and pressure of the cleaning liquid supplied by the nozzle 6 are smaller than the pressure and the speed of the fluid sprayed by the high-pressure nozzle 3 to assist the cleaning brush 2, the high-pressure nozzle 3 and the oilstone component, and the residues and the deposition range of the cleaning liquid can be formed along with the cleaning liquid and the deposition of the chuck 21.

When the wafer 13 and the chuck 21 are cleaned, the chuck 21 drives the wafer 13 to rotate, the high-pressure spray head 3 moves to the upper part of the wafer 13 to perform high-pressure flushing on the wafer 13, then the cleaning brush 2 is in contact with the surface of the wafer 13 to clean the wafer 13, the high-pressure spray head 3 can wash away large particle residues in advance, friction between the large particle residues and the wafer 13 is avoided when the cleaning brush 2 cleans the wafer 13, and meanwhile, the nozzle 6 can be matched with the cleaning brush 2 to timely remove small particle residues formed when the cleaning brush 2 cleans the wafer 13, so that friction with the wafer 13 is avoided; after the wafer 13 is cleaned, the wafer 13 is taken away by the transplanting transmission hand, and the oilstone component is contacted with the surface of the chuck 21 and matched with the nozzle 6 to clean the chuck 21. The whole cleaning process is not easy to damage the surface of the wafer 13, and the cleaning efficiency is high.

The high-pressure nozzle 3 is exemplified by a two-fluid nozzle, specifically by a two-fluid nozzle having two oppositely disposed outlets, which is connected to an external water tank by a booster water pump and also to a gas compression device, while the nozzle 6 is directly connected to the external water tank.

The whetstone assembly comprises a first whetstone 4 and a second whetstone 5, wherein the first whetstone 4 is eccentrically disposed with respect to the chuck 21 when in a cleaning station and the first whetstone 4 is capable of cleaning the entire chuck 21 when the chuck 21 is rotated, the second whetstone 5 is smaller than the first whetstone 4 in size, and the second whetstone 5 is also eccentrically disposed with respect to the chuck 21 and is capable of contacting an outer edge portion of the chuck 21 greater than the wafer 13 for further removal of deposits from the outer edge of the chuck 21. Illustratively, the first whetstone 4 and the second whetstone 5 are each provided in a circular shape, the diameter of the first whetstone 4 is larger than the radius of the chuck 21, and the center of the second whetstone 5 coincides with the boundary line of the chuck 21.

Referring to fig. 4 to 5, in order to facilitate the movement of the first and second whetstones 4 and 5 while being able to contact the chuck 21 after the first and second whetstones 4 and 5 are moved to the cleaning station, the first and second whetstones 4 and 5 are able to be moved up and down. The lifting motion is realized through a first driving piece 7 and a second driving piece 8, wherein the first oilstone 4 is arranged at the output end of the first driving piece 7, the first driving piece 7 is movably arranged on the frame 1 along the first direction, the first driving piece 7 is configured to drive the first oilstone 4 to lift, the second oilstone 5 is arranged at the output end of the second driving piece 8, the second driving piece 8 is movably arranged on the frame 1 along the first direction, and the second driving piece 8 is configured to drive the second oilstone 5 to lift. Similarly, the brush 2 can be moved up and down in order to facilitate movement of the brush 2 while being able to contact the chuck 21 after the brush 2 is moved to the cleaning station. The lifting movement is realized by a third driving member 9, the cleaning brush 2 is mounted at the output end of the third driving member 9, the third driving member 9 is movably arranged on the frame 1 along the first direction, and the third driving member 9 is configured to drive the cleaning brush 2 to lift.

Referring to fig. 1 and 2, the moving washing mechanisms are each movably provided on the frame 1 by a fourth driving member 10. Specifically, a first driving piece 7 for driving a first oilstone 4, a second driving piece 8 for driving a second oilstone 5, a third driving piece 9 for driving a cleaning brush 2 and a high-pressure spray head 3 are all arranged on a base 16, the base 16 is connected with the output end of a fourth driving piece 10 and is arranged on a frame 1 in a sliding manner, the fourth driving piece 10 is positioned in the frame 1, a sliding rail 14 consistent with the driving direction of the fourth driving piece 10 and a sliding block 15 in sliding fit with the sliding rail 14 are further arranged in the frame 1, and the base 16 is fixedly connected with the sliding block 15. The number of the sliding rails 14 is two, and the sliding rails 14 are respectively located at two sides of the fourth driving member 10, and the side walls of the frame 1 are provided with bar-shaped through holes corresponding to the sliding rails 14 and the positions of the fourth driving member 10, so that the base 16 is connected with the sliding blocks 15 and the output ends of the fourth driving member 10.

Compared with separate driving, the fourth driving member 10 is used to synchronously drive the components (the cleaning brush 2, the high-pressure nozzle 3, the first oilstone 4 and the second oilstone 5) in the movable cleaning mechanism, so that the number of driving members can be reduced, the manufacturing cost of the device can be reduced, and the components in the movable cleaning mechanism need to be reasonably arranged at the moment, so that the components can not interfere with each other in the cleaning station. In this embodiment, the first oilstone 4 and the second oilstone 5 are disposed on the base 16 at intervals along the first direction, and the cleaning brush 2 and the high-pressure nozzle 3 are located between the first oilstone 4 and the second oilstone 5. Specifically, the output end of the first driving member 7 is provided with a first mounting seat 17, the first oilstone 4 is mounted on the first mounting seat 17, the output end of the third driving member 9 is provided with a second mounting seat 18, and the cleaning brush 2, the high-pressure nozzle 3 and the second driving member 8 are all mounted on the second mounting seat 18.

Referring to fig. 5, the wafer cleaning device further includes a fifth driving member 11, wherein the fifth driving member 11 is fixed on the second mounting seat 18, the output end of the fifth driving member 11 is connected with the cleaning brush 2 and the high-pressure nozzle 3, and the fifth driving member 11 is configured to drive the cleaning brush 2 and the high-pressure nozzle 3 to swing so as to realize omnibearing cleaning of the wafer 13. Specifically, the output end of the fifth driving member 11 is connected with a swing rod 20, and the cleaning brush 2 and the high-pressure nozzle 3 are fixed at one end of the swing rod 20 far away from the fifth driving member 11. The swing rod 20 is arranged in an L shape, a first end of the swing rod which is horizontally arranged is horizontally connected with the fifth driving piece 11, a second end which is vertically arranged is connected with the high-pressure spray head 3 and the cleaning brush 2, and the high-pressure spray head 3 is positioned right above the cleaning brush 2. It should be noted that the swing rod 20 can make the cleaning brush 2 and the high-pressure spray head 3 pass through the center of the chuck 21 during the swing process, and meanwhile, the distance between the rotation center of the swing rod 20 and the center of the chuck 21 is not smaller than the distance between the rotation center of the swing rod 20 and the boundary line of the chuck 21, so that the residues on the wafer 13 are carried away by the cleaning brush 2. The cleaning brush 2 and the high-pressure head 3 can clean the wafer 13 in the entire surface with the spin chuck 21.

The swing amplitude of the swing rod 20 does not exceed 180 degrees, so that the wafer 13 can be completely cleaned, namely the swing area of the swing rod 20 is in a fan shape. In order to further improve the cleaning efficiency of the two fluids and the cleaning brush 2, when the wafer 13 rotates along with the chuck 21, the residues on the wafer 13 can move towards the fan-shaped opening position of the swinging area of the swinging rod 20 under the action of inertial centrifugal force, so that the high-pressure fluid sprayed by the cleaning brush 2 or the high-pressure spray head 3 is quickly carried away from the wafer 13.

In this embodiment, the cleaning brush 2 is a sponge brush, and compared with a brush, the sponge brush is not easy to damage the surface of the wafer 13, is not easy to fall off, and residues are not easy to leave inside the cleaning brush 2, so that the cleaning effect is good. The sponge brush body may be provided in a circular, square or other shape, and is not particularly limited herein.

The first driving member 7, the second driving member 8, the third driving member 9 and the fourth driving member 10 are all linear driving members, and their specific structures may be the same or different, for example, they may be cylinders, cylinders or linear modules. In this embodiment, the first driving member 7, the second driving member 8, the third driving member 9 and the fourth driving member 10 are all cylinders, and the first driving member 7, the second driving member 8 and the third driving member 9 are vertically arranged, and the fourth driving member 10 is horizontally arranged. The fifth driver 11 may then be a rotating electrical machine.

During the swing of the high pressure nozzle 3 and the cleaning brush 2, the swing amplitude is controlled by the fifth driving member 11, but during the initial operation of the power on, the initial position of the swing rod 20 is uncertain, and it is difficult to ensure that the high pressure nozzle 3 and the cleaning brush 2 can pass through the center of the chuck 21, so that a sensor is required to find the initial position. After the machine is started, the fifth driving piece 11 needs to search the initial position of the swing rod 20 first, and then the cleaning purpose is achieved by reciprocally rotating the swing rod by a fixed angle. The sensor may be a visual sensor for capturing the center of the chuck 21, and the sensor may limit the rotation angle of the fifth driving member 11 by transmitting information to the controller of the fifth driving member 11.

In order to prevent the fifth driving member 11 from rotating excessively due to the sensor failure, the wafer and chuck cleaning apparatus of the present embodiment further includes a limiting member 19, where the limiting member 19 is disposed at the output end of the fifth driving member 11 and configured to limit the rotation angle of the fifth driving member 11. In this embodiment, the limiting member 19 is a screw fixed on the output end of the fifth driving member 11, and the second mounting seat 18 is correspondingly provided with a limiting block, where the limiting block includes two abutment surfaces capable of abutting against the screw, and the screw can rotate between the two abutment surfaces.

Further, referring to fig. 4, in order to improve the cleaning efficiency of the first whetstone 4, the wafer and chuck cleaning apparatus in this embodiment further includes a sixth driving member 12, the sixth driving member 12 is fixed on the first mounting seat 17, the first whetstone 4 is mounted at the output end of the sixth driving member 12, the sixth driving member 12 is configured to drive the first whetstone 4 to rotate, and when the first whetstone 4 cleans the chuck 21, the sixth driving member 12 can drive the first whetstone 4 to rotate in the opposite direction to the chuck 21, so as to better remove the residues. The sixth driver 12 may likewise be a rotating electrical machine.

Referring to fig. 1, the nozzle 6 is mounted on the turntable near the chuck 21, and is particularly detachably coupled to the turntable to facilitate adjustment of the angle of the nozzle 6. The number of the nozzles 6 is two, wherein the outlet of one nozzle 6 is positioned above the chuck 21 and used for assisting the cleaning of the wafer 13 and the chuck 21 by the high-pressure spray head 3, the cleaning brush 2 and the first oilstone 4, and the outlet of the other nozzle 6 corresponds to the outer edge part of the chuck 21 and is used for assisting the cleaning of the chuck 21 by the second oilstone 5. The nozzle 6 is illustratively secured to the turntable by a securing plate, the nozzle 6 being bolted to the securing plate.

In order to prevent the residual liquid drops on the movable cleaning mechanism from falling on the turntable or the chuck 21 and affecting the thinning process of the next wafer 13, the non-working station of the cleaning brush 2 is not located in the upper area of the turntable, and a water receiving tray is arranged below the non-working station and is used for storing the residual liquid dropped on the movable cleaning mechanism.

The flow of the cleaning of the wafer 13 and the chuck 21 will be briefly described with reference to fig. 3-4:

s1, the turntable rotates to enable the chuck 21 to carry the wafer 13 to rotate to a cleaning station.

S2, the fourth driving piece 10 moves the movable cleaning mechanism from a non-working station to a cleaning station, and the movable cleaning mechanism cleans the wafer 13, specifically comprising:

the chuck 21 rotates, the third driving piece 9 drives the cleaning brush 2 and the high-pressure spray head 3 to descend to a preset first position, at this time, the cleaning brush 2 is not contacted with the wafer 13, the fifth driving piece 11 drives the cleaning brush 2 and the high-pressure spray head 3 to rotate to a preset starting point position (the high-pressure spray head 3 is positioned right above the circle center of the wafer 13), the high-pressure spray head 3 carries out high-pressure flushing on the surface of the wafer 13, meanwhile, the nozzle 6 sprays water to the surface of the wafer 13, the swing rod 20 drives the high-pressure spray head 3 to swing slowly under the action of the fifth driving piece 11 so as to flush the whole surface of the wafer 13, and the movement track of the high-pressure spray head 3 is an arc taking the rotation center of the swing rod 20 as an axis and taking the first end of the swing rod 20 as an axis;

after the high-pressure spray head 3 is washed, the swinging rod 20 moves the cleaning brush 2 to the starting point position again under the action of the fifth driving piece 11, the third driving piece 9 descends to a preset second position, at the moment, the cleaning brush 2 is in contact with the wafer 13, the swinging rod 20 drives the cleaning brush 2 to swing, the cleaning brush 2 brushes the whole surface of the wafer 13, meanwhile, the nozzle 6 sprays water to the surface of the wafer 13, and the movement track of the cleaning brush 2 is an arc shape taking the rotation center of the swinging rod 20 as an axis and taking the first end of the swinging rod 20 as an axis;

after the wafer 13 is cleaned, the third driving piece 9 is lifted to the initial position, the fourth driving piece 10 moves back to the non-working station along the direction of the sliding rail 14, residual liquid on the cleaning brush 2 can drop on a water receiving disc, and the water receiving disc can be communicated with an external water tank to realize the recycling of water.

And S3, when the movable cleaning mechanism returns to the non-working station, the chuck 21 stops rotating, and the wafer 13 is taken away by the transplanting transmission hand.

S4, the fourth driving piece 10 moves the movable cleaning mechanism to the cleaning station again, and the movable cleaning mechanism cleans the chuck 21, which specifically comprises:

the chuck 21 rotates, the fourth driving piece 10 drives the movable cleaning mechanism to move to a working station, the first driving piece 7 drives the first oilstone 4 to descend to be in contact with the chuck 21, the sixth driving piece 12 drives the first oilstone 4 to rotate, the rotation direction of the first oilstone is opposite to that of the chuck 21, so that the surface of the chuck 21 is polished, and meanwhile, the nozzle 6 with an outlet arranged on the chuck 21 sprays water on the chuck 21 to match with the first oilstone 4 to clean the chuck 21;

after the first whetstone 4 is polished, the first driving member 7 drives the first whetstone 4 to ascend, the sixth driving member 12 stops rotating, the third driving member 9 drives the second whetstone 5 to descend so that the cleaning brush 2 and the high-pressure nozzle 3 descend to a preset first position, at this time, the cleaning brush 2 is not contacted with the wafer 13, then the second driving member 8 drives the second whetstone 5 to continue to descend to be contacted with the chuck 21, and the nozzle 6 with an outlet arranged on the outer edge of the chuck 21 sprays water to the chuck 21 so as to cooperate with the second whetstone 5 to remove sediment on the outer edge of the chuck 21.

And S5, after the chuck 21 is cleaned, the third driving piece 9 and the second driving piece 8 drive the second whetstone 5 to rise to the initial position, the fourth driving piece 10 moves the non-working station, and the whole cleaning process is finished.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (10)

1. Wafer and chuck belt cleaning device, its characterized in that includes:

a frame (1);

the movable cleaning mechanism is arranged on the frame (1) and can move between a non-working station and a cleaning station, the movable cleaning mechanism comprises a cleaning brush (2), a high-pressure spray head (3) and an oilstone component, the high-pressure spray head (3) can perform high-pressure flushing on the surface of a wafer (13) and the surface of a chuck (21), the cleaning brush (2) can brush the surface of the wafer (13), and the oilstone component can perform grinding and washing on the surface of the chuck (21);

-a nozzle (6), said nozzle (6) being capable of providing a cleaning liquid to the surface of said wafer (13) and to the surface of said chuck (21).

2. Wafer and chuck cleaning device according to claim 1, characterized in that the whetstone assembly comprises a first whetstone (4) and a second whetstone (5), both the first whetstone (4) and the second whetstone (5) being arranged eccentrically with respect to the chuck (21), the first whetstone (4) being capable of cleaning the entire chuck (21), the second whetstone (5) being capable of cleaning an outer edge portion of the chuck (21) being larger than the wafer (13).

3. The wafer and chuck cleaning device according to claim 2, further comprising a first driving member (7), a second driving member (8) and a third driving member (9), wherein the first whetstone (4) is mounted at an output end of the first driving member (7), the first driving member (7) is movably arranged on the frame (1), the first driving member (7) is configured to drive the first whetstone (4) to lift, the second whetstone (5) is mounted at an output end of the second driving member (8), the second driving member (8) is movably arranged on the frame (1), the second driving member (8) is configured to drive the second whetstone (5) to lift, the cleaning brush (2) is mounted at an output end of the third driving member (9), the third driving member (9) is movably arranged on the frame (1), and the third driving member (9) is configured to drive the cleaning brush (2) to lift.

4. The wafer and chuck cleaning apparatus according to claim 3, further comprising a fourth drive member (10), the mobile cleaning mechanism being mounted at an output end of the fourth drive member (10), the fourth drive member (10) being configured to drive the mobile cleaning mechanism between a non-working position and a cleaning position.

5. Wafer and chuck cleaning device according to claim 4, characterized in that the first oilstone (4) and the second oilstone (5) are arranged at intervals along the driving direction of the fourth driving member (10), the cleaning brush (2) and the high-pressure nozzle (3) being located between the first oilstone (4) and the second oilstone (5).

6. The wafer and chuck cleaning device according to claim 5, further comprising a fifth driving member (11), wherein the fifth driving member (11) is mounted at an output end of the third driving member (9), the output end of the fifth driving member (11) is connected with a swing rod (20), the cleaning brush (2) and the high-pressure nozzle (3) are mounted at a second end of the swing rod (20) far away from the fifth driving member (11), and the fifth driving member (11) is configured to drive the cleaning brush (2) and the high-pressure nozzle (3) to swing, wherein the cleaning brush (2) and the high-pressure nozzle (3) can pass through a center of the chuck (21) in a swinging process.

7. The wafer and chuck cleaning apparatus according to claim 6, wherein the swing area of the swing lever (20) has a fan shape, and the residue on the wafer (13) can move toward a fan-shaped opening position of the swing area of the swing lever (20) when the wafer (13) rotates.

8. The wafer and chuck cleaning apparatus according to claim 6, further comprising a sixth driving member (12), the sixth driving member (12) being mounted at an output end of the first driving member (7), the first whetstone (4) being mounted at an output end of the sixth driving member (12), the sixth driving member (12) being configured to rotate the first whetstone (4), a rotation direction of the sixth driving member (12) being opposite to a rotation direction of the chuck (21).

9. Wafer and chuck cleaning device according to any of claims 1-8, characterized in that the cleaning brush (2) is a sponge brush.

10. The wafer and chuck cleaning apparatus of claim 1, wherein a water pan is provided below a non-working station of the mobile cleaning mechanism.

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