TWI726617B - Device for cleaning wafer - Google Patents

Abstract

An device for cleaning a wafer comprising at least one washing unit, at least two brushing units, at least one drying unit and at least one robot arm, which are included in a frame. The at least one washing unit, the at least two brushing units, and the at least one drying unit are configured to correspond to the at least one robot arm when the device is in operation. The at least one washing unit and the at least two brushing units are configured to vertically receive the wafer and the at least one drying unit is configured to horizontally receive and fix the wafer.

Description

Device for cleaning wafer

The invention relates to the field of wafer cleaning, in particular to a wafer cleaning device.

After the wafer has undergone a chemical mechanical polishing or chemical mechanical polishing (Chemical Mechanical Planarization/Polish, CMP) process, the wafer needs to be cleaned to remove all contaminants brought by the polishing process. There are two cleaning techniques commonly used in conventional wafer cleaning devices: The first solution: in the three modules of washing, scrubbing, and dehydration, the wafers are placed horizontally. This placement can ensure the best dehydration efficiency. However, in this solution, because the wafers are placed horizontally during the cleaning process, particles or residual polishing liquid cannot be discharged in time, resulting in poor wafer cleaning effects. The second solution: In the three modules of washing, scrubbing, and dehydration, the wafers are placed vertically. The advantage of this scheme is that the wafer is placed vertically during washing, and the washing effect is the best; however, in the dehydration process, due to gravity, moisture is unevenly distributed on the wafer, resulting in the presence of watermark residues on the wafer. Therefore, the conventional wafer cleaning device has the disadvantage of poor cleaning effect.

The reason is that in order to solve the above problems, one of the objectives of the present invention is to provide a device for cleaning a wafer, which includes at least one washing unit, at least two scrubbing units, at least one dehydration unit and At least one robotic arm, the flushing unit, The scrubbing unit and the dehydration unit are configured to correspond to the robot arm during operation. The cleaning unit is provided with a cleaning rotating wheel for placing wafers. The cleaning rotating wheel is configured to receive the wafer vertically. The unit is provided with a scrubbing rotating wheel for placing wafers, the scrubbing rotating wheel is configured to receive the wafer vertically, and the dehydration unit is configured to hold the wafer horizontally.

4: Robotic arm

10: flushing unit

20: scrubbing unit

30: Dehydration unit

40: Partition wall

45: opening

100: frame

101: Cleaning the rotating wheel

101a: Cleaning the driving wheel

101b: Clean the driven wheel

102: Cleaning the containment box

103: Megasound device

201: Scrub the containment box

202: Brush your hair

203: Brush the rotating wheel

203a: Scrub driving wheel

203b: Scrub the driven wheel

204: Brush nozzle

301: Dehydration container

302: Lifting table

303: fixed claw

304: Water spray nozzle

305: fixed block

306: Rotation axis

307: drive motor

FIG. 1 is a schematic diagram showing a washing unit, a scrubbing unit, and a dehydration unit in a wafer cleaning apparatus provided by an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a washing unit provided by an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a scrubbing unit provided by an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a dehydration unit provided by an embodiment of the present invention.

Fig. 5 is a schematic diagram of the position of a robotic arm provided by an embodiment of the present invention.

FIG. 6 is a three-dimensional schematic diagram of a wafer cleaning apparatus provided by an embodiment of the present invention.

Please refer to FIGS. 1 and 6, which are perspective schematic diagrams of a wafer cleaning apparatus provided by an embodiment of the present invention. The apparatus includes a washing unit 10, two scrubbing units 20, and a dehydration unit 30 arranged in a frame 100. And a robot arm 4, the washing unit 10, the scrubbing unit 20, and the dehydration unit 30 are configured to correspond to the robot arm 4 during operation. The washing unit is provided with a washing rotating wheel 101 for placing wafers. The cleaning rotating wheel 101 is configured to receive the wafer vertically, the scrubbing unit is provided with a scrubbing rotating wheel 203 for placing the wafer, the scrubbing rotating wheel 203 is configured to receive the wafer vertically, and the dehydration unit is configured The shape holds the wafer horizontally.

The flushing unit 10 and the scrubbing unit 20 are arranged horizontally, and the device further includes a partition 40, wherein the flushing unit 10 and the scrubbing unit 20 are arranged on one side of the partition 40, and the dehydration unit 30 is arranged on the On the other side of the partition 40, the partition 40 includes a window 45 in which the robot arm 4 can transfer the wafer.

A first filter 110 is provided above the side of the partition 40 where the washing unit 10 and the scrubbing unit 20 are provided, and a first filter 110 is provided above the other side of the partition 40 where the dehydration unit 30 is provided There is a second filter 120. Due to the turbulent flow of the air flow in the cleaning area during the use of the device, the particle distribution in the cleaning area is disordered and both acid and alkaline chemical liquids are used in the cleaning and scrubbing tanks. The volatiles of the two will produce chemical reactions in the cleaning area. Generate new particulate matter. These factors will cause the final cleaning effect to deteriorate. The arrangement of the partition 40 and the first filter 110 and the second filter 120 helps to improve the distribution of particulate matter in the cleaning area, so that the particulate matter can be removed from the dehydration zone, the scrubbing zone, and the scrubbing zone. The rinsing area is sequentially reduced, thereby improving the wafer cleaning effect.

The washing unit is provided with a washing rotating wheel 101 for placing wafers, and the washing rotating wheel 101 allows the wafers to be vertically arranged; the washing unit is provided with a washing rotating wheel 203 for placing wafers, and the washing rotates The wheel 203 makes the wafers be vertically arranged; the dehydration unit is provided with a fixed block 305 and a fixed claw 303 for placing the wafer, the fixed block 305 and the fixed claw 303 are installed on the lifting platform 302, and the fixed block 305 and the fixed claw 303 grasp Wafer, and set the wafer horizontally.

Figure 2 is a schematic diagram of the structure of the washing unit, the washing unit includes a washing capacity The receiving box 102, the megasound device 103, and the cleaning rotating wheel 101; the megasound device 103 is arranged at the bottom of the cleaning containing box 102; the cleaning rotating wheel 101 is arranged at the middle of the cleaning containing box 102, which includes the cleaning driving wheel 101a and the cleaning rotating wheel 101a. The driven wheel 101b, the cleaning driving wheel 101a provides rotation power, and the cleaning driven wheel 101b provides vertical support, monitors the rotation speed and feeds back. The megasonic device 103 cleans the wafer by the high frequency (850kHz) vibration effect combined with the chemical reaction of the chemical cleaning agent. During cleaning, the transducer emits high-energy sound waves with a wavelength of 1 μm and a frequency of 0.8 MHz. The solution molecules are accelerated by this sound wave, and the maximum instantaneous speed can reach 30cm/s. Therefore, the bubbles generated by ultrasonic cleaning are not formed, and high-speed fluid waves continuously impact the wafer surface, so that the fine particles of contaminants attached to the wafer surface are forcibly removed and enter the cleaning solution. Megasonic cleaning and polishing wafers can remove particles smaller than 0.2μm on the wafer surface.

Figure 3 is a schematic diagram of the structure of the scrubbing unit. The scrubbing unit includes a scrub accommodating box 201, a scrub head 202, a scrub nozzle 204, and a scrub rotation wheel 203; the scrub head 202 is horizontally arranged in the middle of the scrub unit, and the scrub nozzle 204 and the scrub head 202 are arranged in parallel On the side wall of the upper part of the scrubbing unit; the scrubbing rotating wheel 203 is arranged at the lower part of the scrubbing head 202, which includes a scrubbing driving wheel 203a and a scrubbing driven wheel 203b. The scrubbing driving wheel 203a provides rotation power, and the scrubbing driven wheel 203b provides vertical support and monitoring. Speed and feedback.

Figure 4 is a schematic diagram of the structure of the dehydration unit. The dehydration unit includes a dehydration containing box 301, a lifting platform 302, a fixed block 305, a fixed claw 303, a water spray nozzle 304, and a rotating shaft 306; Driven by the driving motor 307 to rotate, the fixed claw 303 and the fixed block 305 are arranged on the lifting platform 302; the lifting platform 302 is arranged in the middle of the dehydration containing box 301, and the water spray nozzle 304 is arranged on the side wall of the dehydration containing box 301.

Figure 5 is a schematic diagram of the position of the robot arm. The robot arm is set on the upper part of the washing unit and the scrubbing unit. It clamps the wafer in the vertical direction to move horizontally and horizontally above the washing unit and the scrubbing unit; the robot arm 4 on the upper end of the scrubbing unit can rotate horizontally , The wafer is placed horizontally on the lifting platform 302 on the dehydration unit.

The operation of wafer cleaning will be described in detail below in conjunction with this embodiment. In this embodiment, the number of washing units is one, the number of scrubbing units is two, and the number of dehydration units is one. The operation steps of wafer cleaning are as follows: First, put the wafer into the cleaning rotating wheel 101 in the vertical direction. The end of the cleaning rotating wheel 101 is connected with a motor, which provides the rotating power for the cleaning rotating wheel 101; The cleaning liquid is injected into the inside, and the megasonic device 103 located at the bottom of the cleaning containment box 102 starts to work, and the contaminants are separated from the wafer by over-frequency vibration, and the contaminants are taken away by the cleaning liquid.

Then, the robot arm 4 moves the wafer from the washing unit to the scrubbing unit in parallel, and the wafer enters the scrubbing unit in the vertical direction. The two scrubbing heads 202 arranged in parallel rotate in the direction of the wafer at the same time, and the wafer is squeezed downward. Enter the scrubbing rotating wheel 203. The scrubbing rotating wheel 203 is powered by a motor to drive the wafers to rotate at a uniform speed and stable in the scrubbing container 201. At the same time, the scrubbing nozzle 204 on the upper side wall of the scrubbing container 201 is injected with cleaning liquid to improve The removal efficiency of pollutants.

Next, the robotic arm 4 moves the wafer in parallel from the washing unit to the next One scrubbing unit, the wafer enters the next scrubbing unit again in the vertical direction; two scrubbing heads 202 arranged in parallel rotate in the direction of the wafer at the same time, and the wafer is squeezed downward and enters the scrubbing rotating wheel 203, and the scrubbing rotating wheel 203 is powered by a motor to drive the wafers to rotate at a uniform speed and stably in the scrubbing container 201. At the same time, the scrubbing nozzle 204 on the upper side wall of the scrubbing container 201 is injected with cleaning liquid to improve the removal efficiency of pollutants.

Finally, the robot arm 4 translates the wafer from the scrubbing unit to the dehydration unit. At the same time, the robot arm 4 rotates the clamped wafer as a whole horizontally, changing the wafer from vertical placement to horizontal placement. The wafer is placed horizontally on the lifting platform 302 of the dehydration unit, the fixed block 305 and the fixed claw 303 grip the wafer; the driving motor 307 drives the rotation shaft 306 to rotate, thereby driving the lifting platform 302 provided on the rotation shaft 306 to rotate freely; at the same time, The water spray nozzle 304 arranged on the side wall of the dehydration containment box 301 automatically opens and closes the water spray to spray out the debris indicated by the wafer; the lifting platform 302 continues to rotate until the liquid on the wafer surface is completely removed, and then the rotation function of the lifting platform 302 is closed. The lifting platform 302 is raised, the fixed claw 303 is opened, and the mechanical arm 4 translates the dried wafer to a designated position.

The washing unit 10 includes a sensor that monitors the rotation speed of the washing driven wheel 101b and provides a feedback signal to a server of the device, and the washing unit 20 monitors the rotation speed of the washing driven wheel 203b and provides a feedback signal to The server of the device.

The invention provides a wafer cleaning device. The flushing unit and the scrubbing unit are operated in a vertical direction, and the dehydration unit is operated in a horizontal direction. This effectively improves the wafer cleaning effect, solves the problem of residual watermarks, and improves the wafer cleaning device. The overall effect.

The term "one" or "one" in this article is used to describe the elements and components of this creation. This term is only for the convenience of description and to give the basic idea of this creation. This description should be understood to include one or at least one, and unless clearly indicated otherwise, the singular number also includes the plural number. When used with the word "include" in the scope of patent application, the term "one" can mean one or more than one. In addition, the term "or" in this article means the same as "and/or".

Unless otherwise specified, such as "above", "below", "up", "left", "right", "down", "body", "base", "vertical", "horizontal", "side" , "Higher", "Lower", "Upper", "Above", "Below" and other space descriptions refer to the directions shown in the figure. It should be understood that the spatial description used herein is only for illustrative purposes, and the actual implementation of the structure described herein can be spatially arranged in any relative direction, and this restriction will not change the advantages of the embodiments of the present invention. For example, in the description of some embodiments, providing an element "on" another element may cover the situation where the previous element is directly on the next element (for example, physically contacting the next element) and a Or a situation where a plurality of intervening elements are located between the previous element and the next element.

As used herein, the terms "approximately", "substantial", "substantial" and "about" are used to describe and consider minor changes. When used in conjunction with an event or situation, these terms can mean a situation in which the event or situation clearly occurred and the event or situation closely resembled the situation in which it occurred.

The above-mentioned embodiments are only to illustrate the technical ideas and characteristics of this creation, and their purpose is to enable those who are familiar with the art to understand the content of this creation and implement them accordingly. When they cannot be used to limit the patent scope of this creation, Equal changes or modifications made in accordance with the spirit of this creation should still be covered by the scope of the patent of this creation.

4: Robotic arm

10: flushing unit

20: scrubbing unit

30: Dehydration unit

40: Partition wall

45: opening

100: frame

Claims (5)

A device for cleaning a wafer includes a washing unit (10), a scrubbing unit (20), a dehydration unit (30) and a mechanical arm (4) arranged in a frame (100). The unit (10), the scrubbing unit (20), and the dehydration unit (30) are configured to correspond to a mechanical arm (4) during operation, and a cleaning rotating wheel for placing the wafer is provided on the washing unit (101), the cleaning rotating wheel (101) is configured to receive the wafer vertically, the scrubbing unit (20) is provided with a scrubbing rotating wheel (203) for placing the wafer, the scrubbing rotating wheel (203) ) Is configured to receive the wafer vertically, and the dehydration unit is configured to hold the wafer horizontally; wherein the washing unit (10) includes a washing container (102), a megasonic device (103), and a washing Rotating wheel (101), the megasound device (103) is arranged at the bottom of the cleaning containing box (102), the cleaning rotating wheel (101) is arranged in the cleaning containing box (102), which includes a cleaning driving wheel ( 101a) and a cleaning driven wheel (101b), wherein the cleaning driving wheel (101a) provides rotation power from the side, and the cleaning driven wheel (101b) provides vertical support to the wafer; wherein the scrubbing unit (20) includes a A scrubbing container (201), a pair of scrubbing heads (202), a scrubbing nozzle (204) and a scrubbing rotating wheel (203), the pair of scrubbing heads (202) are horizontally arranged inside the scrubbing unit (20) for scrubbing For the wafer, the scrubbing nozzle (204) is arranged on the side wall of the upper part of the scrubbing unit (20), and the scrubbing rotating wheel (203) is arranged below the pair of scrubbing heads (202), which includes a scrubbing driving wheel (203a) ) And a scrubbing driven wheel (203b), the scrubbing driving wheel (203a) provides rotation power from the side, and the scrubbing driven wheel (203b) is vertically supported; and the dehydration unit (30) includes a dehydration containing box (301) , A lifting platform (302), a fixed block (305), a fixed claw (303), a water spray nozzle (304) and a rotating shaft (306), wherein the lifting platform (302) is arranged on the rotating shaft (306) ), the rotation axis (306) consists of a The drive motor (307) drives and rotates, the fixed claw (303) and the fixed block (305) are arranged on the lifting platform (302), the lifting platform (302) is arranged in the dehydration containing box (301), and the The water spray nozzle (304) is arranged on the side wall of the dehydration containing box (301). Such as the device of claim 1, wherein the flushing unit (10) and the scrubbing unit (20) are arranged side by side, and the device further includes a partition (40), wherein the flushing unit (10) and the scrubbing unit (20) ) Is arranged on one side of the partition (40), the dehydration unit (30) is arranged on the other side of the partition (40), and the partition (40) includes a window (45) in it for the robot arm (4) Transfer the wafer. Such as the device of claim 2, wherein the robot arm (4) is arranged above the washing unit (10) and the scrubbing unit (20), and it is configured to vertically move from the washing unit (10) and the scrubbing unit (20). The unit (20) clamps the wafer and moves horizontally and laterally. The robotic arm (4) can rotate to a horizontal position so that the wafer passes through the window (45) and is placed horizontally on the dehydration unit (30). On the lifting platform (302). Such as the device of claim 3, wherein the flushing unit (10) includes a sensor that monitors the rotation speed of the cleaning driven wheel (101b) and provides a first feedback signal to a server of the device, and the scrubbing unit ( 20) Monitor the rotation speed of the cleaning driven wheel (203b) and provide a second feedback signal to the server of the device. For example, in the device of claim 4, a first filter (110) is provided above the side of the partition (40) provided with the flushing unit (10) and the scrubbing unit (20), and the A second filter (120) is arranged above the other side of the partition (40) of the dehydration unit (30).

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