CN219085943U

CN219085943U - Wafer cleaning device

Info

Publication number: CN219085943U
Application number: CN202320081209.XU
Authority: CN
Inventors: 万先进; 胡孟杰; 边逸军
Original assignee: Ningbo Xinfeng Precision Technology Co ltd
Current assignee: Ningbo Xinfeng Precision Technology Co ltd
Priority date: 2023-01-13
Filing date: 2023-01-13
Publication date: 2023-05-26
Anticipated expiration: 2033-01-13

Abstract

The utility model belongs to the technical field of wafer processing, and discloses a wafer cleaning device. The wafer cleaning device comprises a workbench, a washing mechanism and a brushing mechanism, wherein the workbench is used for bearing a wafer and can drive the wafer to rotate, the washing mechanism is arranged on the workbench and used for spraying cleaning liquid to a part to be cleaned of the wafer, the brushing mechanism comprises a fixing frame, a first driving assembly and a cleaning brush, the fixing frame is arranged on the workbench, the first driving assembly is arranged on the fixing frame, the cleaning brush is connected to the output end of the first driving assembly, and the first driving assembly can drive the cleaning brush to rotate around the axis of the cleaning brush so as to brush the part to be cleaned of the wafer. The cleaning brush can brush burrs on the part to be cleaned of the wafer, and the cleaning liquid can wash away the brushed burrs, so that the burrs on the part to be cleaned of the wafer are effectively cleaned, the wafer is prevented from being damaged in the next step of fine grinding and polishing, and the yield of the wafer is improved.

Description

Wafer cleaning device

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a wafer cleaning device.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and is formed by grinding, polishing and slicing a silicon crystal bar. After the wafer is ground and thinned, burrs are generated at the edge, the existence of the burrs not only affects the accuracy of the wafer size and the surface smoothness, but also damages the wafer and working equipment during the next fine grinding and polishing, and the yield of the wafer is reduced.

The existing method for removing the burrs of the wafer is to rotate a workbench where the wafer is positioned, drive the wafer to rotate, simultaneously use pure water to wash the edge of the wafer, and utilize centrifugal force generated by rotation to bring the burrs away from the wafer and the workbench. However, after grinding and thinning, the burrs are slightly connected with the wafer body, pure water is used for washing, the burrs cannot be completely cleaned, the situation that the burrs are connected to the wafer body still exists after the cleaning is finished, the risk that the wafer is damaged during the next step of fine grinding and polishing still exists, and the yield of the wafer cannot be guaranteed.

Disclosure of Invention

The utility model aims to provide a wafer cleaning device which is used for effectively cleaning burrs generated at the edge of a thinned wafer, ensuring that the wafer and a workbench are free of burrs, preventing the wafer from being damaged in the next step of fine grinding and polishing, and improving the yield of the wafer.

To achieve the purpose, the utility model adopts the following technical scheme:

wafer cleaning device includes:

the workbench is used for bearing a wafer and can drive the wafer to rotate;

the washing mechanism is arranged on the workbench and is used for spraying a cleaning liquid to the to-be-cleaned part of the wafer;

the cleaning mechanism comprises a fixing frame, a first driving assembly and a cleaning brush, wherein the fixing frame is arranged on the workbench, the first driving assembly is arranged on the fixing frame, the cleaning brush is connected to the output end of the first driving assembly, and the first driving assembly can drive the cleaning brush to rotate around the axis of the cleaning brush so as to brush the part to be cleaned of the wafer.

Preferably, the first driving assembly comprises a first mounting frame and a first driving member, the first mounting frame is arranged on the mounting frame, the first driving member is arranged on the first mounting frame, and the cleaning brush is connected to the output end of the first driving member.

Preferably, the first driving assembly further comprises a rotating shaft and a connecting frame, one end of the rotating shaft is connected to the output end of the first driving piece, the other end of the rotating shaft is connected to the top of the connecting frame, and the cleaning brush is connected to the bottom of the connecting frame.

Preferably, the connecting frame comprises a top plate, a bottom plate and a vertical plate, wherein the top surface of the top plate is connected with the rotating shaft, one end of the vertical plate is connected with the bottom surface of the top plate, the other end of the vertical plate is connected with the top surface of the bottom plate, and the cleaning brush is connected with the bottom surface of the bottom plate.

Preferably, the brushing mechanism further comprises a second driving assembly, the second driving assembly is arranged on the fixing frame, the output end of the second driving assembly is connected with the first driving assembly, and the second driving assembly can drive the first driving assembly to move so as to drive the cleaning brush to move along the direction close to or far away from the part to be cleaned of the wafer.

Preferably, the brushing mechanism further comprises a third driving assembly and a water receiving disc, the third driving assembly is arranged on the fixing frame, the water receiving disc is connected to the output end of the third driving assembly, and the third driving assembly can drive the water receiving disc to move to be blocked between the cleaning brush and the wafer.

Preferably, the third driving assembly comprises a second mounting frame, a third driving member and a connecting plate, the second mounting frame is arranged on the mounting frame, the third driving member is arranged on the second mounting frame, one end of the connecting plate is connected with the output end of the third driving member, the other end of the connecting plate is connected with the water receiving disc, and the third driving member can drive the connecting plate to move so as to drive the water receiving disc to reciprocate between the side of the cleaning brush and the lower part of the cleaning brush.

Preferably, the water pan comprises a back plate, a main plate and two side plates, wherein the back plate and the two side plates are sequentially arranged on three sides of the main plate and form a water receiving groove together with the main plate, and the back plate is connected to the output end of the third driving assembly.

Preferably, the washing mechanism comprises a waste water collecting tank, a notch is formed in the rear plate, and when the water receiving disc moves to the lower side of the cleaning brush, the waste water collecting tank is located below the notch, so that water in the water receiving disc flows into the waste water collecting tank.

Preferably, the water washing mechanism comprises a water supply tank and a spray head, wherein the water supply tank is arranged on the workbench and used for containing the cleaning liquid, the spray head is communicated with the water supply tank, and the cleaning liquid in the water supply tank can be sprayed to the to-be-cleaned part of the wafer.

The utility model has the beneficial effects that:

the utility model provides a wafer cleaning device, which is characterized in that when in use, a wafer is placed on a workbench, so that a cleaning brush can be contacted with a part to be cleaned of the wafer, then the workbench drives the wafer to rotate, a first driving component drives the cleaning brush to rotate around the axis of the first driving component, and a water washing mechanism sprays cleaning liquid to the part to be cleaned of the wafer. The wafer and the cleaning brush rotate simultaneously, so that the cleaning brush can brush burrs on the wafer better, the cleaning liquid can wash away the brushed burrs, and the burrs are carried away from the wafer by centrifugal force generated by rotation, so that the burrs on the part to be cleaned of the wafer are effectively cleaned, the wafer is prevented from being damaged during the next accurate grinding and polishing, and the yield of the wafer is improved.

Drawings

FIG. 1 is a schematic diagram of a wafer cleaning apparatus according to an embodiment of the present utility model;

FIG. 2 is a top view of a wafer cleaning apparatus according to an embodiment of the present utility model;

FIG. 3 is a top view of a wafer, a cleaning brush, and a water tray in a water-receiving state provided by an embodiment of the present utility model;

FIG. 4 is a schematic view of a first drive assembly and cleaning brush provided in accordance with an embodiment of the present utility model;

FIG. 5 is a schematic view of a third drive assembly and a drip tray according to an embodiment of the present utility model;

fig. 6 is a schematic structural view of a water pan according to an embodiment of the present utility model.

In the figure:

1. a water washing mechanism; 11. a waste water collection tank; 12. a spray head;

2. a brushing mechanism; 21. a fixing frame; 211. a first fixing frame; 212. the second fixing frame; 22. a first drive assembly; 221. a first mounting frame; 222. a first driving member; 223. a rotating shaft; 224. a connecting frame; 2241. a top plate; 2242. a bottom plate; 2243. a vertical plate; 225. a coupling; 226. a protective plate; 23. a cleaning brush; 24. a second drive assembly; 25. a third drive assembly; 251. a second mounting frame; 252. a third driving member; 253. a connecting plate; 26. a water receiving tray; 261. a rear plate; 262. a main board; 263. a side plate; 264. a notch;

100. and (3) a wafer.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", and the like are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.

The present embodiment provides a wafer cleaning apparatus, particularly referring to fig. 1 and 2, for cleaning a portion to be cleaned of a wafer 100 on a workbench to remove burrs on the wafer 100.

The wafer cleaning device comprises a workbench (not shown in the figure), a water washing mechanism 1 and a brushing mechanism 2, wherein the workbench is used for bearing a wafer 100 and can drive the wafer 100 to rotate; the washing mechanism 1 is arranged on the workbench, and the washing mechanism 1 is used for spraying a cleaning liquid to the part to be cleaned of the wafer 100; the brushing mechanism 2 comprises a fixing frame 21, a first driving component 22 and a cleaning brush 23, wherein the fixing frame 21 is arranged on a workbench, the first driving component 22 is arranged on the fixing frame 21, the cleaning brush 23 is connected to the output end of the first driving component 22, and the first driving component 22 can drive the cleaning brush 23 to rotate around the axis of the cleaning brush 23 so as to brush the part to be cleaned of the wafer 100.

In use, the wafer 100 is placed on the workbench, so that the cleaning brush 23 can contact the part to be cleaned of the wafer 100, then the workbench drives the wafer 100 to rotate, the first driving assembly 22 drives the cleaning brush 23 to rotate around the axis of the first driving assembly, and the cleaning mechanism 1 sprays cleaning liquid to the part to be cleaned of the wafer 100. The wafer 100 and the cleaning brush 23 rotate simultaneously, so that the cleaning brush 23 can brush burrs on the wafer 100 better, the cleaning liquid can wash away the brushed burrs, and the burrs are carried away from the wafer 100 by centrifugal force generated by rotation, so that the burrs on the part to be cleaned of the wafer 100 are effectively cleaned, the wafer 100 is prevented from being damaged in the next fine grinding and polishing process, and the yield of the wafer 100 is improved.

The portion to be cleaned may be any portion of the wafer 100 that needs cleaning, especially a portion that is prone to burrs. In this embodiment, the portion to be cleaned is the peripheral edge of the wafer 100, and since the burrs are concentrated at the peripheral edge of the wafer 100 after the wafer 100 is ground and thinned, only the peripheral edge of the wafer 100 needs to be cleaned. Further, the wafer 100 can rotate around the axis on the workbench, and in the cleaning process, the wafer 100 rotates around the axis due to the contact between the cleaning brush 23 and the edge of the wafer 100, so that the peripheral edge of the wafer 100 can be cleaned in place under the condition that the cleaning brush 23 is not moved, and the operation is more convenient and quicker.

In this embodiment, as shown in fig. 3, the center of the cleaning brush 23 is aligned with the edge of the wafer 100, so that the cleaning brush 23 can brush the edge of the wafer 100 and the workbench in a larger range at the same time, so that no burr is generated at the positions of the wafer 100 and the workbench close to the wafer 100, and damage to the wafer 100 and the workbench in the next fine grinding and polishing process is avoided. Further, the rotation direction of the cleaning brush 23 is the same as the rotation direction of the wafer 100, so that at the edge of the wafer 100, the cleaning brush 23 and the wafer 100 form a reverse motion, so that the cleaning brush 23 can brush burrs on the wafer 100 better.

Further, the water washing mechanism 1 includes a water supply tank (not shown) provided on the table for holding the cleaning liquid, and a shower head 12 communicated with the water supply tank, capable of spraying the cleaning liquid in the water supply tank to the portion to be cleaned of the wafer 100. Thus, the cleaning brush 23 brushes the wafer 100, and the cleaning liquid is sprayed to a position where the wafer 100 contacts the cleaning brush 23 through the shower head 12 to wash the edge of the wafer 100 and the cleaning brush 23, so that burrs brushed by the cleaning brush 23 are washed away. In this embodiment, the cleaning liquid is pure water.

Further, as shown in fig. 4, the first driving assembly 22 includes a first mounting frame 221 and a first driving member 222, the first mounting frame 221 is disposed on the fixing frame 21, the first driving member 222 is disposed on the first mounting frame 221, and the cleaning brush 23 is connected to an output end of the first driving member 222. The first driving member 222 can drive the cleaning brush 23 to rotate around its own axis, in this embodiment, the first driving member 222 is preferably a motor, and the motor has a firm structure, reliable operation, convenient use and control, and high working efficiency. The first mounting frame 221 is movably disposed on the fixing frame 21, so that the first driving member 222 disposed on the first mounting frame 221 can also move relative to the fixing frame 21, thereby driving the cleaning brush 23 to move so as to adjust the position of the cleaning brush 23.

Further, the first driving assembly 22 further includes a rotating shaft 223 and a connecting frame 224, one end of the rotating shaft 223 is connected to the output end of the first driving member 222, the other end is connected to the top of the connecting frame 224, and the cleaning brush 23 is connected to the bottom of the connecting frame 224. The rotating shaft 223 and the cleaning brush 23 share a central shaft, so that the first driving piece 222 can drive the rotating shaft 223 to rotate, and then indirectly drive the cleaning brush 23 to rotate around the axis of the cleaning brush through the connecting frame 224.

Specifically, the link 224 includes a top plate 2241, a bottom plate 2242, and a vertical plate 2243, the top surface of the top plate 2241 is connected to the rotation shaft 223, one end of the vertical plate 2243 is connected to the bottom surface of the top plate 2241, the other end is connected to the top surface of the bottom plate 2242, and the cleaning brush 23 is connected to the bottom surface of the bottom plate 2242. This structure increases the connection area of the connection frame 224 and the cleaning brush 23, and improves the stability of the connection of the cleaning brush 23, thereby making the rotation of the cleaning brush 23 smoother. In this embodiment, the standing plates 2243 are provided in two and spaced apart from each other, so that the overall stability of the connection frame 224 is improved, and the connection stability of the cleaning brush 23 is further improved.

Further, to firmly connect the first driving member 222 with the rotation shaft 223, the first driving assembly 22 further includes a coupling 225, and one end of the coupling 225 is connected to the output end of the first driving member 222, and the other end is connected to the rotation shaft 223. Under high-speed power, the coupling 225 has cushioning and damping effects, which helps to extend the service life of the device.

Further, the first driving assembly 22 further includes a protection board 226, the protection board 226 is disposed on the first mounting frame 221 and surrounds the first mounting frame 221 to form a containing space, one end of the coupling 225 and one end of the rotating shaft 223 are located in the containing space, and the other end of the rotating shaft 223 extends out of the containing space. The protective plate 226 effectively protects the coupling 225 from damage and contamination. In addition, as shown in fig. 1, the fixing frame 21 is a frame structure formed by surrounding the first fixing frame 211 and the second fixing frame 212, and the first driving component 22 is arranged on the first fixing frame 211 and is located in the frame structure, so that when the first driving component 22 works, workers are prevented from contacting the first driving component 22, potential safety hazards can be effectively avoided, and the safety performance is higher.

Further, as shown in fig. 2, the brushing mechanism 2 further includes a second driving assembly 24, the second driving assembly 24 is disposed on the fixing frame 21, an output end of the second driving assembly 24 is connected to the first driving assembly 22, and the second driving assembly 24 can drive the first driving assembly 22 to move so as to drive the cleaning brush 23 to move along a direction approaching or separating from the portion to be cleaned of the wafer 100. Specifically, the second driving assembly 24 is disposed on the first fixing frame 211, and an output end of the second driving assembly 24 is connected to the first mounting frame 221, and the second driving assembly 24 can drive the first mounting frame 221 to move along a direction approaching or separating from an edge of the wafer 100, so as to drive the cleaning brush 23 to move along a direction approaching or separating from the edge of the wafer 100. In this embodiment, the cleaning brush 23 is located directly above the edge of the wafer 100, the second driving assembly 24 drives the cleaning brush 23 to move up and down, when the wafer 100 needs to be cleaned, the second driving assembly 24 drives the cleaning brush 23 to move down to contact the edge of the wafer 100, and after the cleaning is completed, the second driving assembly 24 drives the cleaning brush 23 to move up to be away from the wafer 100, so that the wafer 100 is convenient to be taken and put.

Further, the second driving component 24 includes a second driving member, which in this embodiment is a cylinder, and the cylinder has a simple structure and is convenient to operate, so as to drive the cleaning brush 23 to perform a reciprocating linear motion. Preferably, the second driving member is a double-shaft cylinder, the guide performance of the double-shaft cylinder is better, the double-shaft cylinder has certain bending resistance and torsion resistance, and the double-shaft cylinder can bear certain side load.

Further, in order to prevent the burrs adhered to the surface of the cleaning brush 23 from falling back onto the wafer 100 along with the water drops after the cleaning is completed, and pollute the cleaned wafer 100, the brushing mechanism 2 further comprises a third driving assembly 25 and a water receiving disc 26, wherein the third driving assembly 25 is arranged on the fixing frame 21, the water receiving disc 26 is connected to the output end of the third driving assembly 25, and the third driving assembly 25 can drive the water receiving disc 26 to move to be blocked between the cleaning brush 23 and the wafer 100. Specifically, the third driving component 25 is disposed on the second fixing frame 212 and is located outside the frame structure of the fixing frame 21, so that the space required by the fixing frame 21 can be reduced, the material consumption of the fixing frame 21 can be reduced, and the device cost can be reduced. When the wafer 100 is cleaned, the third driving assembly 25 drives the water receiving disc 26 to move to avoid the cleaning brush 23 and the wafer 100, so that the cleaning work is not affected; when the cleaning is completed, the cleaning brush 23 moves upward, and the third driving assembly 25 drives the water receiving tray 26 to move between the cleaning brush 23 and the wafer 100, at this time, the water receiving tray 26 is in a water receiving state, and water drops on the cleaning brush 23 can fall into the water receiving tray 26, so as to avoid polluting the cleaned wafer 100.

Specifically, as shown in fig. 5, the third driving assembly 25 includes a second mounting frame 251, a third driving member 252 and a connecting plate 253, the second mounting frame 251 is disposed on the fixing frame 21, the third driving member 252 is disposed on the second mounting frame 251, one end of the connecting plate 253 is connected to an output end of the third driving member 252, the other end is connected to the water receiving tray 26, and the third driving member 252 can drive the connecting plate 253 to move so as to drive the water receiving tray 26 to reciprocate between a side of the cleaning brush 23 and a lower side of the cleaning brush 23. Alternatively, the third driving member 252 may drive the water tray 26 to move linearly, or may drive the water tray 26 to rotate. In this embodiment, the third driving member 252 is a rotation driving member capable of driving the water tray 26 to rotate in a horizontal plane between the cleaning brush 23 and the wafer 100. Preferably, the third driving member 252 is a swinging cylinder, and the swinging cylinder has simple structure, convenient operation and good stability.

Further, in order to reduce the material consumption of the water receiving tray 26 and reduce the device cost, the water receiving tray 26 is provided in a dustpan shape. As shown in fig. 6, the water tray 26 includes a back plate 261, a main plate 262 and two side plates 263, the back plate 261 and the two side plates 263 are sequentially disposed on three sides of the main plate 262 and enclose a water receiving groove with the main plate 262, and the back plate 261 is connected to an output end of the third driving assembly 25. When the third driving member 252 drives the water tray 26 to be in the water receiving state, the main plate 262 is located below the cleaning brush 23 and is in an inclined state, and one end of the main plate 262 facing away from the rear plate 261 is higher than one end of the main plate 262 close to the rear plate 261, so as to ensure that water dropped from the cleaning brush 23 is located in the water receiving groove of the water tray 26.

Further, as shown in fig. 1 and 2, the washing mechanism 1 includes a waste water collection tank 11 (only a part of the structure is shown in the drawings), and as shown in fig. 3 and 6, a notch 264 is provided on the rear plate 261, and when the water receiving tray 26 moves below the cleaning brush 23, the waste water collection tank 11 is located below the notch 264 so that water in the water receiving tray 26 flows into the waste water collection tank 11. The waste water collecting box 11 is used for collecting the cleaned waste water, the scrubbed burrs and other impurities, and the water in the water receiving tray 26 can flow into the waste water collecting box 11 through the notch 264, so that the water in the water receiving tray 26 is prevented from being full, overflows to the wafer 100 from other positions, and pollutes the wafer 100.

Specifically, in the present embodiment, the waste water collection tank 11 is disposed on the table and is disposed around the peripheral edge of the wafer 100 (only one of the panels of the waste water collection tank 11 is shown in fig. 1 and 2), and the top surface of the waste water collection tank 11 is higher than the top surface of the wafer 100. Therefore, the wafer 100 can be positioned in the wastewater collection box 11, so that the cleaned wastewater can be collected conveniently, and the wastewater can be treated and recycled at a later stage. In the cleaning process, the water receiving disc 26 is avoided between the cleaning brush 23 and the wafer 100, the cleaning brush 23 moves downwards to contact the part to be cleaned of the wafer 100, the spray head 12 sprays pure water to the part to be cleaned of the wafer 100, and the scrubbed burrs flow into the wastewater collection box 11 along with water flow; when the cleaning is completed, the cleaning brush 23 moves upward, the water pan 26 moves between the cleaning brush 23 and the wafer 100, and water drops on the cleaning brush 23 fall into the water pan 26 and then flow into the waste water collection tank 11 through the notch 264. The top surface of the waste water collecting tank 11 is higher than the top surface of the wafer 100, so that the splashing of water outside the waste water collecting tank 11 during cleaning can be effectively avoided.

Further, in the present embodiment, the shower head 12 is provided on the waste water collection tank 11 and extends in a direction toward the portion to be cleaned of the wafer 100. So set up, can fix shower nozzle 12, need not that people hold shower nozzle 12 and spray, practice thrift the manpower to can spray water to the portion of waiting to wash of wafer 100 more accurately, the reliability is high.

The specific work flow of the wafer cleaning device is as follows:

s1, placing a wafer 100 at a designated position of a workbench, wherein the workbench drives the wafer 100 to rotate around the axis of the workbench;

s2, the third driving assembly 25 drives the water receiving disc 26 to rotate to the side of the cleaning brush 23;

s3, the second driving component 24 drives the cleaning brush 23 to move downwards to contact the edge of the wafer 100, and meanwhile, the first driving component 22 drives the cleaning brush 23 to rotate around the axis of the first driving component, and the cleaning brush 23 brushes the edge of the wafer 100;

s4, the spray head 12 sprays water to the position where the wafer 100 contacts the cleaning brush 23, and washes the edge of the wafer 100 and the cleaning brush 23;

s5, after the cleaning is finished, the second driving assembly 24 drives the cleaning brush 23 to move upwards, and the first driving assembly 22 stops driving;

s6, the third driving assembly 25 drives the water receiving disc 26 to rotate to the lower side of the cleaning brush 23;

and S7, stopping spraying water by the spray head 12, and ending the whole cleaning process.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims

1. Wafer belt cleaning device, its characterized in that includes:

the workbench is used for bearing a wafer (100) and can drive the wafer (100) to rotate;

the washing mechanism (1) is arranged on the workbench, and the washing mechanism (1) is used for spraying a cleaning liquid to a part to be cleaned of the wafer (100);

the cleaning mechanism (2) comprises a fixing frame (21), a first driving assembly (22) and a cleaning brush (23), wherein the fixing frame (21) is arranged on the workbench, the first driving assembly (22) is arranged on the fixing frame (21), the cleaning brush (23) is connected to the output end of the first driving assembly (22), and the first driving assembly (22) can drive the cleaning brush (23) to rotate around the axis of the cleaning brush so as to brush the part to be cleaned of the wafer (100).

2. The wafer cleaning device according to claim 1, wherein the first driving assembly (22) comprises a first mounting frame (221) and a first driving member (222), the first mounting frame (221) is disposed on the fixing frame (21), the first driving member (222) is disposed on the first mounting frame (221), and the cleaning brush (23) is connected to an output end of the first driving member (222).

3. The wafer cleaning apparatus according to claim 2, wherein the first driving assembly (22) further comprises a rotating shaft (223) and a connecting frame (224), one end of the rotating shaft (223) is connected to the output end of the first driving member (222), the other end is connected to the top of the connecting frame (224), and the cleaning brush (23) is connected to the bottom of the connecting frame (224).

4. The wafer cleaning apparatus according to claim 3, wherein the connection frame (224) includes a top plate (2241), a bottom plate (2242), and a standing plate (2243), the top surface of the top plate (2241) is connected to the rotation shaft (223), one end of the standing plate (2243) is connected to the bottom surface of the top plate (2241), the other end is connected to the top surface of the bottom plate (2242), and the cleaning brush (23) is connected to the bottom surface of the bottom plate (2242).

5. The wafer cleaning device according to claim 1, wherein the brushing mechanism (2) further comprises a second driving component (24), the second driving component (24) is arranged on the fixing frame (21), an output end of the second driving component (24) is connected with the first driving component (22), and the second driving component (24) can drive the first driving component (22) to move so as to drive the cleaning brush (23) to move along a direction approaching to or separating from the to-be-cleaned part of the wafer (100).

6. The wafer cleaning device according to claim 1, wherein the brushing mechanism (2) further comprises a third driving assembly (25) and a water receiving disc (26), the third driving assembly (25) is arranged on the fixing frame (21), the water receiving disc (26) is connected to the output end of the third driving assembly (25), and the third driving assembly (25) can drive the water receiving disc (26) to move to be blocked between the cleaning brush (23) and the wafer (100).

7. The wafer cleaning device according to claim 6, wherein the third driving assembly (25) comprises a second mounting frame (251), a third driving member (252) and a connecting plate (253), the second mounting frame (251) is arranged on the fixing frame (21), the third driving member (252) is arranged on the second mounting frame (251), one end of the connecting plate (253) is connected to the output end of the third driving member (252), the other end of the connecting plate is connected to the water receiving disc (26), and the third driving member (252) can drive the connecting plate (253) to move so as to drive the water receiving disc (26) to reciprocate between the side of the cleaning brush (23) and the lower side of the cleaning brush (23).

8. The wafer cleaning device according to claim 6, wherein the water tray (26) comprises a back plate (261), a main plate (262) and two side plates (263), the back plate (261) and the two side plates (263) are sequentially arranged on three sides of the main plate (262) and form a water receiving groove with the main plate (262), and the back plate (261) is connected to the output end of the third driving assembly (25).

9. The wafer cleaning device according to claim 8, wherein the water washing mechanism (1) comprises a waste water collection tank (11), a notch (264) is provided on the rear plate (261), and when the water receiving tray (26) moves below the cleaning brush (23), the waste water collection tank (11) is located below the notch (264) so that water in the water receiving tray (26) flows into the waste water collection tank (11).

10. The wafer cleaning apparatus according to any one of claims 1 to 9, wherein the water washing mechanism (1) includes a water supply tank and a shower head (12), the water supply tank is provided on the table for holding the cleaning liquid, and the shower head (12) is communicated with the water supply tank, and is capable of spraying the cleaning liquid in the water supply tank to the portion to be cleaned of the wafer (100).