CN115020302B - Cleaning and drying equipment and cleaning and drying method for wafer storage box - Google Patents
Cleaning and drying equipment and cleaning and drying method for wafer storage box Download PDFInfo
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- CN115020302B CN115020302B CN202210828946.1A CN202210828946A CN115020302B CN 115020302 B CN115020302 B CN 115020302B CN 202210828946 A CN202210828946 A CN 202210828946A CN 115020302 B CN115020302 B CN 115020302B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B23/00—Heating arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Abstract
The invention discloses a cleaning and drying device and a cleaning and drying method for a wafer storage box, wherein the cleaning and drying device comprises a rack, a manipulator, a feeding device, a cleaning device, a drying device and a discharging device, wherein the cleaning device and the drying device are respectively provided with a corresponding knob mechanism and a corresponding positioning mechanism, so that a cover of the wafer storage box and a box body can be separated when the wafer storage box is cleaned and dried, the cover and the box body are relatively independent and are not covered, the box body and the cover can be sufficiently cleaned and dried, the cleaning degree is ensured, meanwhile, the boiling point of liquid can be reduced by improving the nitrogen environment in the drying process of the wafer storage box, the drying efficiency is improved, the moisture residue in gaps is avoided, and the excellent drying effect is achieved.
Description
Technical Field
The invention relates to the technical field of post-processing devices of wafer storage boxes, in particular to a cleaning and drying device and a cleaning and drying method for a wafer storage box.
Background
With the continuous development of semiconductor processing technology, the requirement for environmental cleanliness is higher and higher in the processes of wafer processing and storage, and the cleanliness of wafers needs to be controlled, and the cleanliness of wafers depends on the environment in a FOUP (front opening unified pod), so that the FOUP needs to be cleaned to ensure cleanliness.
As shown in fig. 9 to 10, the conventional wafer storage box has a box body and a cover, the cover is covered on the box body to form a sealed chamber, and locking or unlocking needs to be realized by rotating a knob extending into a knob hole by a certain angle (generally rotating by 90 °). However, in the prior art, for example, a magazine cleaning machine with publication number CN113578900A and a method for using the same disclose that under the cooperation of a conveying line, a cleaning station, a blow-drying station and an air supply assembly, cleaning and blow-drying of a wafer magazine are achieved, cleanliness of the wafer magazine is ensured, and further cleanliness of particles of a wafer is ensured, but it does not disclose how to unlock and separate a lid and a magazine body in the cleaning and drying process, and how to lock the lid and the magazine body after cleaning and drying are completed.
Disclosure of Invention
The invention aims to provide a cleaning and drying device and a cleaning and drying method for a wafer storage box, so as to solve the technical problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a washing and drying equipment of wafer case, includes frame and manipulator, still includes:
the feeding device is used for feeding the wafer storage box and moving the wafer storage box to the cleaning device through the manipulator;
the cleaning device comprises a barrel body and a first cover body, wherein a spray pipe is arranged in the barrel body, a material tray is arranged at the lower part in the barrel body, the first cover body is hinged on the barrel body, a first positioning mechanism and a first knob mechanism are arranged on the first cover body, the first knob mechanism extends into a knob hole of a cover of a wafer storage box clamped by the manipulator to rotate and is used for unlocking the cover to enable the cover to be separated from the box body, the cover separated from the box body is fixed by the first positioning mechanism, and the box body is reversely buckled on the material tray by the manipulator;
the drying device comprises a shell and a second cover body, wherein a heater is arranged in the shell, an air inlet and an air outlet are formed in the shell, the second cover body is hinged to the shell, a second positioning mechanism and a second knob mechanism are arranged on the second cover body, the second knob mechanism extends into a knob hole in a cover of a wafer storage box clamped by the manipulator and rotates to unlock the cover so that the cover is separated from the box body, the cover is fixed by the second positioning mechanism, and the box body is placed in the shell by the manipulator;
and the blanking device is used for blanking the wafer storage box moved from the drying device by the manipulator.
As a further optimization, the first positioning mechanism comprises a positioning disc and a first vacuum suction nozzle, and the first vacuum suction nozzle is arranged on the positioning disc; a first limiting block is mounted on the positioning disc.
As a further optimization, the material tray and the positioning plate are respectively rotatably mounted on the barrel body and the first cover body, a first rotating motor and a second rotating motor are respectively arranged outside the barrel body and on the first cover body, an output shaft of the first rotating motor is connected with the material tray, and an output shaft of the second rotating motor is connected with the positioning plate.
As further optimization, first knob mechanism includes lift cylinder, revolving cylinder, bearing frame, bearing and first knob, the bearing frame is installed on first lid, the bearing is installed in the bearing frame, liftable and synchronous pivoted are equipped with the guide arm in the bearing, guide arm one end is connected with first knob after passing first lid, the guide arm other end links to each other with lift cylinder output, revolving cylinder's output is equipped with the action wheel, the action wheel passes through the hold-in range and links to each other with being fixed in bearing outer wall from the driving wheel transmission.
As a further optimization, a through hole is formed in the positioning plate, and the first knob penetrates through the through hole under the driving of the lifting cylinder.
As a further optimization, the second positioning mechanism comprises a clamping jaw and a second vacuum suction nozzle which are arranged on the second cover body, and the clamping jaw is connected with the output end of the positioning cylinder on the second cover body; and a second limiting block is arranged on the second cover body.
As a further optimization, the feeding device comprises a first front support and a first rear support, a first electric cylinder is arranged below the first front support and the first rear support, a first jacking cylinder is arranged on the first electric cylinder, and a first bracket is arranged on the first jacking cylinder; and a weighing inductor is arranged on the first rear bracket.
As a further optimization, the blanking device comprises a second front support and a second rear support, a second electric cylinder is arranged below the second front support and the second rear support, a second jacking cylinder is arranged on the second electric cylinder, and a second bracket is arranged on the second jacking cylinder; and the nitrogen gas inflating mechanism is arranged on the second rear support and used for filling nitrogen gas into the wafer storage box.
The invention provides a cleaning and drying method of a wafer storage box, which comprises the following steps:
s1, feeding a wafer storage box through a feeding device, and moving the wafer storage box to a cleaning device by a manipulator;
s2, a first knob mechanism on the first cover body extends into a knob hole of the cover and then rotates, the cover is unlocked to be separated from the box body, the cover separated from the box body is fixed by the first positioning mechanism, the box body is reversely buckled on the material tray by a mechanical arm, the first cover body closes the barrel body, and the box body and the cover are cleaned and dried by a spray pipe;
s3, opening the first cover body, enabling the manipulator to clamp the box body to abut against the cover, enabling a first knob mechanism on the first cover body to extend into a knob hole of the cover and then rotate, enabling the cover to be locked on the box body, resetting the first knob mechanism, releasing the cover through the first positioning mechanism, and clamping the wafer storage box to the drying device through the manipulator;
s4, a second knob mechanism on a second cover body extends into a knob hole of the cover and then rotates to unlock and position the cover, the cover is fixed by a second positioning mechanism, the box body is placed in the shell by the mechanical arm, the shell is covered by the second cover body, air is exhausted and nitrogen is introduced, and the box body and the cover are heated by the heater until the box body and the cover are dried;
s5, opening a second cover body, clamping the box body by a manipulator and abutting the box body on a cover, extending a second knob mechanism into a knob hole of the cover to rotate so as to lock the cover on the box body, releasing the cover by a second positioning mechanism, and clamping the wafer storage box to a blanking device by the manipulator;
and S6, injecting nitrogen into the wafer storage box by the blanking device, and blanking.
As a further optimization, in the step S4, after the second cover body covers the shell, air is pumped until the pressure in the shell is maintained at 500-1800Pa, nitrogen is filled into the shell at a flow rate of 2-5 l/min, and the dryness degree of the box body and the cover is detected by a temperature and humidity sensor; after complete drying, the evacuation is stopped and nitrogen is introduced into the enclosure at a flow rate of 50-100 liters/minute to restore the pressure in the enclosure to standard atmospheric pressure.
Compared with the prior art, the invention has the beneficial effects that:
1. the cover and the box body of the wafer storage box can be separated when the wafer storage box is cleaned and dried by respectively arranging the corresponding knob mechanism and the corresponding positioning mechanism on the cleaning device and the drying device, so that the cover and the box body are relatively independent and do not cover, the box body and the cover can be sufficiently cleaned and dried, the cleaning degree is ensured, and the storage environment of the wafer is optimized;
2. through improving the nitrogen environment among the wafer case stoving process to under low vacuum environment, can reduce the liquid boiling point, improve drying efficiency, still can avoid moisture in the gap to remain, have excellent stoving effect.
Drawings
Fig. 1 is a structural diagram of a cleaning and drying apparatus for a wafer storage box according to the present invention.
Fig. 2 is a structural view of the charging device of the present invention.
Fig. 3 is a structural view of the cleaning apparatus of the present invention with the first cover opened.
Fig. 4 is a view of the other side of fig. 3.
Fig. 5 is a structural view of the first knob mechanism of the present invention.
Fig. 6 is a structural view of the drying device of the present invention with the second cover opened.
Fig. 7 is a view of the other side of fig. 6.
Fig. 8 is a structural view of the blanking apparatus of the present invention.
Fig. 9 is a structural view of the wafer storage box of the present invention.
FIG. 10 is a schematic view of another side of the wafer storage cassette of the present invention.
Detailed Description
The following are specific embodiments of the present invention, and the technical solutions of the present invention are further described with reference to the drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1, a cleaning and drying apparatus for a wafer storage box includes a rack 50, a manipulator 60, a feeding device 10, a cleaning device 20, a drying device 30, and a discharging device 40, where the feeding device 10, the cleaning device 20, the drying device 30, and the discharging device 40 may have a plurality of stations, and cooperate with each other to improve cleaning and drying efficiency of the wafer storage box 100, where the feeding device 10 is used for feeding the wafer storage box 100 and moves to the cleaning device 20 through the manipulator 60, as shown in fig. 2, a specific structure of the feeding device 10 includes a first front support 11 located outside a housing of the cleaning and drying apparatus and a first rear support 12 located inside the housing of the cleaning and drying apparatus, a first electric cylinder 13 is provided below the first front support 11 and the first rear support 12, a first jacking cylinder 14 is provided on the first jacking cylinder 13, a first bracket 15 is provided on the first jacking cylinder 14, the wafer storage box 100 is placed on the first front support 11, the first jacking cylinder 14 drives the first bracket 15 to lift the wafer storage box 100 upwards, then drives the wafer storage box 100 to move to a horizontal lifting and drying cylinder 12 to move from the upper side of the cleaning and drying apparatus, and a cleaning and drying robot moves to the upper side of the first lifting cylinder 12, and lifting cylinder 14, and moves to the cleaning and drying apparatus 100, and moves to the cleaning and drying robot 100, and drying apparatus, and moves to the cleaning and drying apparatus, and drying apparatus 100. In the present invention, a weighing sensor 16 may be further installed on the first rear frame 12 to weigh the wafer storage box 100 before cleaning and drying.
As shown in fig. 3 to 5, the cleaning apparatus 20 includes a barrel body 211 and a first cover body 212, the barrel body 211 is provided with a shower pipe, the shower pipe may include a vertical shower pipe 221 for cleaning the inner wall of the box body 101 and a horizontal shower pipe 222 for cleaning the bottom wall of the lid 102, the lower portion of the barrel body 211 is provided with a tray (not shown) for inversely covering the box body 101, the first cover body 212 is hinged on the barrel body 211, and is driven by the first door motor 26 to close or open the barrel body 211, the first cover body 212 is provided with a first positioning mechanism 25a and a first knob mechanism 24a, the first knob mechanism 24a is used for extending into a knob hole 1020 of the lid 102 of the wafer storage box 100 held by the robot arm 60, after the first knob mechanism 24a is rotated, the lid 102 is unlocked from the box body 101 so that the two can be separated, and the lid 102 is located on the first knob mechanism 24a and is kept in a vertical state, the first positioning mechanism 25a acts to fix the lid 102, the robot 60 reversely buckles the box body 101 of the wafer storage box 100 on the tray, and at this time, the box body 101 is reversely buckled outside the vertical spraying pipe 221, in summary, in other words, the butt joint and the unlocking of the lid 102 of the wafer storage box 100 are completed through the first knob mechanism 24a, then the lid 102 is fixed through the first positioning mechanism 25a, the box body 101 is placed in the cleaning chamber 200 of the barrel body 211 by the robot 60, after the barrel body 211 is closed by driving the first cover body 212 by the first door body motor 26, the inner wall of the box body 101 and the bottom wall of the lid 102 can be respectively cleaned through the vertical spraying pipe 221 and the horizontal spraying pipe 222, and after the spraying pipe cleaning action is completed, air drying is performed, so that each surface in the space of the wafer storage box 100 is effectively cleaned and dried, and it is ensured that no impurity residue exists in the wafer storage environment.
In the present invention, the first positioning mechanism 25a includes a positioning plate 252 and a first vacuum suction nozzle 253, the first vacuum suction nozzle 253 is mounted on the positioning plate 252 to complete the suction and fixation of the cover 102, and meanwhile, a first stopper 254 can be mounted on the positioning plate 252 to ensure that the cover 102 is at a correct position after being sucked by the first vacuum suction nozzle 253, as shown in fig. 3, the pair of first vacuum suction nozzles 253 are oppositely disposed, and are supported and positioned by the pair of oppositely disposed first stoppers 254 after sucking the cover 102, so as to ensure the suction stability of the cover 102.
In the invention, the material tray and the positioning plate 252 can be respectively and rotatably arranged on the barrel body 211 and the first cover body 212, and are matched with each other, the first rotating motor 23 and the second rotating motor 251 are respectively arranged outside the barrel body 211 and on the first cover body 212, the output shaft of the first rotating motor 23 is connected with the material tray, and the output shaft of the second rotating motor 251 is connected with the positioning plate 252, so that the material tray and the positioning plate 252 can rotate, the box body 101 and the cover 102 are driven to rotate, all-dimensional cleaning and drying can be realized, no dead angle in cleaning can be ensured, and the cleaning cleanliness can be improved; meanwhile, the box body 101 and the cover 102 can rotate to be dried, and drying is performed in cooperation, so that the drying efficiency after cleaning is further improved, and the working pressure of a subsequent drying device can be reduced.
Since the positioning plate 252 realizes a rotatable function, that is, a rotating function of the cover 102 is realized, and the cover 102 is fixed on the positioning plate 252 by the first knob mechanism 24a in an absorbing manner after being positioned and kept in a vertical state, the first knob mechanism 24a must be detached from the cover 102 to avoid affecting the rotation of the positioning plate after the cover 102 abuts against the first vacuum suction nozzle 253 on the positioning plate 252, so that the specific structure of the first knob mechanism 24a can be as shown in fig. 5, which includes a lifting cylinder 2411, a rotating cylinder 2421, a bearing block 2424, a bearing 2425 and a first knob 2414, the bearing block 2424 is fixed on the first cover 212, the bearing 2425 is installed in the bearing block 2424, A guide rod 2413 is arranged in the bearing 2425, the guide rod 2413 can be lifted and can synchronously rotate (the matching surface is a non-circular surface, the synchronous rotation can be realized), one end of the guide rod 2413 penetrates through the bearing 2425 and the first cover body 212 and then is connected with a first knob 2414, the other end of the guide rod is connected with a mounting plate 2412 at the output end of the lifting cylinder 2411, the output end of the rotating cylinder 2421 is provided with a driving wheel 2422, the driving wheel 2422 is in transmission connection with a driven wheel 2426 fixed on the outer wall of the bearing 2425 through a synchronous belt 2423, meanwhile, a through hole 250 is formed in the positioning disc 252, the first knob 2414 penetrates through the through hole 250 through the driving of the lifting cylinder 2411, for ensuring the stability, the first knob 2414 is provided with a pair and is matched with knob holes 1020 at two sides of the cover 102, and therefore, the through hole 250 is also provided with a pair.
Based on the above arrangement, when the cover 102 needs to be sucked and fixed, the lifting cylinder 2411 drives the guide rod 2413 to drive the first knob 2414 to move towards the cover 102 of the wafer storage box 100, the first knob 2414 penetrates into the knob hole 1020 of the cover 102, the rotary cylinder 2421 drives the bearing 2425 to rotate in the bearing seat 2424, so that the guide rod 2413 drives the first knob 2414 to rotate, thereby realizing the staggered clamping of the first knob 2414 and the knob hole 1020, keeping the cover 102 in a vertical state, the cover 102 is sucked and fixed by the first vacuum suction nozzle 253 immediately, and the rotary cylinder 2421 is reset, during the resetting process of the lifting cylinder 2411, the guide rod 2413 drives the first knob 2414 to reversely pass through the through hole 250, because the guide rod 2413 or the first knob 2414 does not exist in the through hole 250 at this time, in this state, the positioning plate 252 can be driven by the second rotary motor 251 to rotate, so as to realize that the action between the first knob mechanism 24a and the first positioning mechanism 25a is not influenced by interference.
When the cover 102 needs to be covered on the box body 101 after the cleaning is finished, the first door motor 26 drives the first cover body 212 to open the barrel body 211, the manipulator 60 clamps the inverted box body 101 to move in the direction of the cover 102 of the wafer storage box 100 on the first cover body 212 after adjusting the angle, and abuts the box body 101 on the cover 102, the lifting cylinder 2411 drives the guide rod 2413 to drive the first knob 2414 to penetrate through the through hole 250 and then extend into the knob hole 1020, then the rotating cylinder 2421 drives the first knob 2414 to rotate to lock the cover 102 on the box body 101, so that the covering action of the cover 102 and the box body 101 is finished, the first vacuum suction nozzle 253 is desorbed, and the rotating cylinder 2421 and the lifting cylinder 2411 are reset in sequence.
After the cleaning process is completed, the wafer storage box 100 which is cleaned and assembled into a whole is fed to the drying device 30 by the robot 60, as shown in fig. 6 to 7, the drying device 30 includes a casing 311 and a second cover 312, a heater 33 is disposed in the drying chamber 300 of the casing 311, the casing 311 is provided with an air inlet 321 and an air outlet 322, the air outlet 322 is used for exhausting air and is matched with the air inlet 321 to introduce nitrogen gas to form a nitrogen gas environment, the second cover 312 is hinged to the casing 311, the casing 311 can be closed or opened by being driven by a second door motor 36, the second cover 312 is provided with a second positioning mechanism 34a and a second knob mechanism 35a, the second knob mechanism 35a extends into a knob hole 1020 on the cover 102 of the wafer storage box 100 clamped by the robot 60 to rotationally unlock and position the cover 102, the second positioning mechanism 34a fixes the cover 102, the robot 60 places the box 101 in the casing 311, to sum up, that the second knob mechanism 35a completes the docking and unlocking of the cover 102 of the wafer storage box 100, and guarantees the vertical state of the cover 102, the second positioning mechanism 34a fixes the box 101 in the casing 311, thereby guaranteeing the drying chamber 100 and the drying efficiency of the wafer storage box 100.
The second knob mechanism 35a cooperates with the second positioning mechanism 34a to complete the fixing of the lid 102 to the second cover 312, when the robot 60 grips the cleaned wafer storage box 100 to the second cover 312, the knob hole 1020 on the lid 102 of the wafer storage box 100 aligns with the second knob 352 of the second knob mechanism 35a, the knob hole 1020 is sleeved on the second knob 352 by moving the robot 60, the air cylinder 351 drives the second knob 352 to rotate, so that the lid 102 is unlocked from the box 101 and kept in a correct state, the second positioning mechanism 34a includes a clamping jaw 343 and a second vacuum suction nozzle 341 arranged on the second cover 312, the clamping jaw 343 is connected with the output end of the positioning air cylinder 342 on the second cover 312, initially, the lid 102 is fixed by the second vacuum suction nozzle 341, when the drying chamber 300 is evacuated after the second cover 312 is closed, the clamping jaw 343 is driven by the positioning air cylinder 343 to clamp the lid 102 up and down to replace the second vacuum suction nozzle 341 in a near vacuum state, so as to continue to fix the lid 102 to the second cover 312, as shown in fig. 6, when a pair of the second vacuum suction nozzles 102 is arranged to support the lid 102, and the lid 102, the second vacuum suction nozzle is arranged relatively fixed, and the lid 102, the second suction stopper 344 is further arranged to ensure stability.
After the box 101 and the cover 102 are dried, the second door motor 36 drives the second cover 312 to open the housing 311, the manipulator 60 grips the box 101 and the cover 102, and the second positioning mechanism 34a and the second knob mechanism 35a are reset.
After the wafer storage box 100 is dried, the robot 60 moves the wafer storage box 100 from the drying device 30 to the unloading device 40 for unloading.
As shown in fig. 8, the blanking device 40 includes a second front support 41 located outside the cleaning and drying device housing and a second rear support 42 located inside the cleaning and drying device housing, a second electric cylinder 43 is disposed below the second front support 41 and the second rear support 42, a second jacking cylinder 44 is disposed on the second electric cylinder 43, a second bracket 45 is disposed on the second jacking cylinder 44, when the dried wafer storage box 100 is blanked, the wafer storage box 100 is placed on the second rear support 42 by a manipulator 60, the second jacking cylinder 44 drives the second bracket 45 to lift the wafer storage box 100 upward, and then the wafer storage box 100 is driven by the second electric cylinder 43 to translate to the upper side of the second front support 41, the wafer storage box 100 is moved outside the cleaning and drying device housing, the second jacking cylinder 44 is reset, the wafer storage box 100 is placed on the second front support 41, and blanking is completed.
In the present invention, a nitrogen gas charging mechanism may be further disposed on the second rear support 42, the charging mechanism includes at least one charging hole 461 and at least one pumping hole 462, when the wafer storage box 100 is placed on the second rear support 42, the wafer storage box 100 may be clamped by the clamping mechanism 467, so that four air holes on the wafer storage box 100 correspond to the charging hole 461 and the pumping hole 462, nitrogen gas is injected into the wafer storage box 100, that is, three charging holes 461 are aligned with three first air holes 1011 on the wafer storage box 100 for charging, one pumping hole 462 is aligned with one second air hole 1012 on the wafer storage box 100 for pumping, so that the nitrogen concentration of the gas in the wafer storage box 100 is 95-97% under the condition that the pressure is substantially unchanged (since the internal and external pressures of the wafer storage box 100 are nearly equal, the first air hole 1011 and the second air hole 1012 will not leak gas and cause the nitrogen gas to leak out of the wafer storage box 100), a nitrogen gas environment is formed, in the later process, the wafer storage box 100 may be placed in the whole nitrogen gas environment, and then the wafer storage box 100 is placed in the wafer storage box 100, so as to avoid the wafer from being oxidized; the upper ends of the gas charging hole 461 and the gas exhaust hole 462 can be provided with elastic pads which are abutted with the wafer storage box 100 in an interference manner, so that the sealing performance during gas charging is ensured, in addition, the lower ends of the gas charging hole 461 and the gas exhaust hole 462 can be provided with spring structures, and the abutting effect is enhanced by the counterforce upwards formed by the springs during spring compression after the gas charging hole 461 and the gas exhaust hole 462 are abutted with the first gas hole 1011 and the second gas hole 1012 respectively, so that the sealing performance during gas charging is further enhanced.
In the present invention, the method for cleaning and drying the wafer storage box 100 includes the following steps:
s1, feeding the wafer storage box 100 through a feeding device 10, and transferring the wafer storage box to a cleaning device 20 by a manipulator 60;
s2, the first knob mechanism 24a on the first cover body 212 extends into a knob hole 1020 of the cover 102 and then rotates, the cover 102 is unlocked and can be separated from the box body 101, the cover 102 separated from the box body 101 is fixed by the first positioning mechanism 25a, the box body 101 is placed on a tray by the manipulator 60, the first cover body 212 closes the barrel body 211, and the shower pipe cleans and dries the box body 101 and the cover 102;
s3, the first cover body 212 is opened, the manipulator 60 clamps the box body 101 and abuts against the cover 102, the first knob mechanism 24a on the first cover body 212 extends into the knob hole 1020 of the cover 102 and then rotates, so that the cover 102 is locked on the box body 101, the first knob mechanism 24a resets, the first positioning mechanism 25a releases the cover 102, and the manipulator 60 moves the wafer storage box 100 to the drying device 30;
s4, the second knob mechanism 35a on the second cover 312 extends into a knob hole 1020 of the cover 102 and then rotates to unlock and position the cover 102, the second positioning mechanism 34a fixes the cover 102, the manipulator 60 places the box body 101 in the shell 311, the second cover 312 covers the shell 311, the box body 101 and the cover 102 are heated by the heater 33 after exhausting and introducing nitrogen gas until the box body 101 and the cover 102 are dry, specifically, the second cover 312 covers the shell 311 and then exhausts until the pressure in the shell 311 is maintained at 500-1800Pa, the nitrogen gas is introduced into the shell 311 at the flow rate of 2-5 liters/minute, and the dryness degree of the box body 101 and the cover 102 is detected by a temperature and humidity sensor; after complete drying, the evacuation was stopped, and nitrogen gas was introduced into the case 311 at a flow rate of 50 to 100 liters/minute to return the pressure in the case 311 to the standard atmospheric pressure.
S5, the second cover body 312 is opened, the manipulator 60 clamps the box body 101 and enables the box body 101 to abut against the cover 102, the second knob mechanism 35a extends into the knob hole 1020 of the cover 102 to rotate, the cover 102 is locked on the box body 101, and the manipulator 60 clamps the wafer storage box 100 to the blanking device 40;
s6, the blanking device 40 injects nitrogen into the wafer storage box 100 through the box body 101 and carries out blanking.
The drying principle is as follows: when the vacuum degree is 1000Pa, the boiling point of water is only 7 ℃, and in a near vacuum state, the heated nitrogen and the heater 33 positioned around the wafer storage box 100 are used for heating, so that enough energy is provided for water vaporization, and when the drying cavity 300 is used for exhausting air, the water vaporization quickly overcomes the acting force between water molecules, so that the water fully absorbs the energy, the wafer storage box 100 is dried quickly, and the water is prevented from freezing in the wafer storage box 100. Compared with the prior art, the drying time is only 1/3-1/2 of that of the prior art, the drying efficiency of the wafer storage box 100 is improved, moisture does not remain in the gap 1010 of the dried wafer storage box 100, an ideal drying effect is obtained, and the hidden danger of subsequent wafer storage and manufacturing processes is eliminated.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. The utility model provides a washing and drying equipment of wafer case, includes frame and manipulator, its characterized in that still includes:
the feeding device is used for feeding the wafer storage box and moving the wafer storage box to the cleaning device through the manipulator;
the cleaning device comprises a barrel body and a first cover body, wherein a spray pipe is arranged in the barrel body, a material tray is arranged at the lower part in the barrel body, the first cover body is hinged on the barrel body, a first positioning mechanism and a first knob mechanism are arranged on the first cover body, the first knob mechanism extends into a knob hole of a cover of a wafer storage box clamped by the manipulator to rotate and is used for unlocking the cover to enable the cover to be separated from the box body, the cover separated from the box body is fixed by the first positioning mechanism, and the box body is reversely buckled on the material tray by the manipulator;
the drying device comprises a shell and a second cover body, wherein a heater is arranged in the shell, an air inlet and an air outlet are formed in the shell, the second cover body is hinged to the shell, a second positioning mechanism and a second knob mechanism are arranged on the second cover body, the second knob mechanism extends into a knob hole in a cover of a wafer storage box clamped by the manipulator and rotates to unlock the cover so that the cover is separated from the box body, the cover is fixed by the second positioning mechanism, and the box body is placed in the shell by the manipulator;
and the blanking device is used for blanking the wafer storage box moved from the drying device by the manipulator.
2. The cleaning and drying apparatus for wafer storage boxes according to claim 1, wherein the first positioning mechanism comprises a positioning plate and a first vacuum suction nozzle, and the first vacuum suction nozzle is installed on the positioning plate; a first limiting block is mounted on the positioning disc.
3. The apparatus for cleaning and drying wafer storage boxes according to claim 2, wherein the tray and the positioning plate are rotatably mounted on the barrel body and the first cover body, the first rotating motor and the second rotating motor are respectively mounted on the barrel body and the first cover body, an output shaft of the first rotating motor is connected to the tray, and an output shaft of the second rotating motor is connected to the positioning plate.
4. The wafer storage box cleaning and drying device according to claim 3, wherein the first knob mechanism comprises a lifting cylinder, a rotating cylinder, a bearing seat, a bearing and a first knob, the bearing seat is mounted on the first cover body, the bearing is mounted in the bearing seat, a guide rod is arranged in the bearing, can be lifted and can rotate synchronously, one end of the guide rod penetrates through the first cover body and then is connected with the first knob, the other end of the guide rod is connected with the output end of the lifting cylinder, the output end of the rotating cylinder is provided with a driving wheel, and the driving wheel is connected with a driven wheel fixed on the outer wall of the bearing through a synchronous belt in a transmission mode.
5. The wafer storage box cleaning and drying apparatus of claim 4, wherein a through hole is formed in the positioning plate, and the first knob is driven by the lifting cylinder to pass through the through hole.
6. The apparatus for cleaning and drying a wafer storage box according to claim 1, wherein the second positioning mechanism comprises a clamping jaw and a second vacuum suction nozzle, the clamping jaw is disposed on the second cover body, and the clamping jaw is connected to an output end of a positioning cylinder on the second cover body; and a second limiting block is arranged on the second cover body.
7. The wafer storage box cleaning and drying apparatus according to claim 1, wherein the loading device comprises a first front support and a first rear support, a first electric cylinder is arranged below the first front support and the first rear support, a first jacking cylinder is arranged on the first electric cylinder, and a first bracket is arranged on the first jacking cylinder; and a weighing sensor is arranged on the first rear bracket.
8. The apparatus for cleaning and drying a wafer storage box according to claim 1, wherein the blanking device comprises a second front support and a second rear support, a second electric cylinder is arranged below the second front support and the second rear support, a second jacking cylinder is arranged on the second electric cylinder, and a second bracket is arranged on the second jacking cylinder; and the second rear support is provided with a nitrogen gas inflation mechanism for filling nitrogen gas into the wafer storage box.
9. The method for cleaning and drying the cleaning and drying apparatus for wafer storage cassettes as claimed in any one of claims 1 to 8, comprising the steps of:
s1, feeding a wafer storage box through a feeding device, and moving the wafer storage box to a cleaning device by a manipulator;
s2, a first knob mechanism on the first cover body extends into a knob hole of the cover and then rotates, the cover is unlocked to be separated from the box body, the cover separated from the box body is fixed by the first positioning mechanism, the box body is reversely buckled on the material tray by a mechanical arm, the first cover body closes the barrel body, and the box body and the cover are cleaned and dried by a spray pipe;
s3, opening a first cover body, enabling the manipulator to clamp the box body to abut against the cover, enabling a first knob mechanism on the first cover body to stretch into a knob hole of the cover and rotate to enable the cover to be locked on the box body, resetting the first knob mechanism, releasing the cover through the first positioning mechanism, and enabling the manipulator to clamp the wafer storage box to the drying device;
s4, a second knob mechanism on a second cover body extends into a knob hole of the cover and then rotates to unlock and position the cover, the cover is fixed by a second positioning mechanism, the box body is placed in the shell by the mechanical arm, the shell is covered by the second cover body, air is exhausted and nitrogen is introduced, and the box body and the cover are heated by the heater until the box body and the cover are dried;
s5, opening a second cover body, clamping the box body by the manipulator and butting the box body on the cover, extending the second knob mechanism into a knob hole of the cover to rotate so as to lock the cover on the box body, releasing the cover by the second positioning mechanism, and clamping the wafer storage box to a blanking device by the manipulator;
s6, the blanking device injects nitrogen into the wafer storage box and carries out blanking.
10. The method as claimed in claim 9, wherein the second lid is closed to the housing in step S4, and then the housing is evacuated until the pressure inside the housing is maintained at 500-1800Pa, and nitrogen is introduced into the housing at a flow rate of 2-5 l/min, and the dryness of the housing and the lid is detected by a temperature/humidity sensor; after complete drying, the evacuation is stopped and nitrogen is introduced into the enclosure at a flow rate of 50-100 liters/minute to restore the pressure in the enclosure to standard atmospheric pressure.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210828946.1A CN115020302B (en) | 2022-07-15 | 2022-07-15 | Cleaning and drying equipment and cleaning and drying method for wafer storage box |
| PCT/CN2023/096515 WO2024012069A1 (en) | 2022-07-15 | 2023-05-26 | Cleaning and drying apparatus and cleaning and drying method for wafer storage box |
| PCT/CN2023/096511 WO2024012068A1 (en) | 2022-07-15 | 2023-05-26 | Cleaning device, drying device and cleaning and drying apparatus for wafer storage box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210828946.1A CN115020302B (en) | 2022-07-15 | 2022-07-15 | Cleaning and drying equipment and cleaning and drying method for wafer storage box |
Publications (2)
| Publication Number | Publication Date |
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| CN115020302A CN115020302A (en) | 2022-09-06 |
| CN115020302B true CN115020302B (en) | 2022-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210828946.1A Active CN115020302B (en) | 2022-07-15 | 2022-07-15 | Cleaning and drying equipment and cleaning and drying method for wafer storage box |
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| Country | Link |
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| CN (1) | CN115020302B (en) |
| WO (2) | WO2024012069A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115020302B (en) * | 2022-07-15 | 2022-10-14 | 江苏芯梦半导体设备有限公司 | Cleaning and drying equipment and cleaning and drying method for wafer storage box |
| WO2024064165A1 (en) * | 2022-09-19 | 2024-03-28 | Entegris, Inc. | Substrate container systems and methods of purging a substrate container |
| CN117457554B (en) * | 2023-12-25 | 2024-03-19 | 南轩（天津）科技有限公司 | Wafer pickling device |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2024012069A1 (en) | 2024-01-18 |
| CN115020302A (en) | 2022-09-06 |
| WO2024012068A1 (en) | 2024-01-18 |
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