CN117457554B - Wafer pickling device - Google Patents

Wafer pickling device Download PDF

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Publication number
CN117457554B
CN117457554B CN202311785546.8A CN202311785546A CN117457554B CN 117457554 B CN117457554 B CN 117457554B CN 202311785546 A CN202311785546 A CN 202311785546A CN 117457554 B CN117457554 B CN 117457554B
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China
Prior art keywords
base
piece
wafer
inner cavity
barrel
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Active
Application number
CN202311785546.8A
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Chinese (zh)
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CN117457554A (en
Inventor
马胜南
轩云喜
陈永春
任玉飞
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Nanxuan Tianjin Technology Co ltd
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Nanxuan Tianjin Technology Co ltd
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Priority to CN202311785546.8A priority Critical patent/CN117457554B/en
Publication of CN117457554A publication Critical patent/CN117457554A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The application relates to the technical field of semiconductors, and discloses a wafer pickling device, in order to solve impurity and wafer adhesion, lead to the problem that the wafer purification degree is influenced. According to the invention, through the arrangement of the cylinder body and the bearing piece, the basket loaded with the wafer is limited to a certain height by the bearing piece, so that impurities desorbed from the surface of the wafer can leave the position of the basket in the deposition process, the probability of adhering the impurities on the wafer is further reduced, and the purification degree of the wafer is not easily affected.

Description

Wafer pickling device
Technical Field
The application relates to the technical field of semiconductors, in particular to a wafer pickling device.
Background
In the process of semiconductor manufacturing, in order to ensure the purification degree of a wafer, a wafer pickling device is commonly used nowadays to remove impurities on the surface of the wafer, so that the quality of chips prepared by the purified wafer is higher.
The existing wafer pickling equipment mainly comprises a tank body, a flower basket, a liquid inlet mechanism and a liquid outlet mechanism, when the acid pickling equipment is used, acid solution is injected into the tank body through the liquid inlet mechanism, then the flower basket loaded with a plurality of wafers is placed at the bottom of the tank body, the acid solution in the tank body is completely immersed into the wafers, after a period of time, the acid solution in the tank body is discharged by the liquid outlet mechanism, the flower basket is taken out, and through the actions, the acid solution is contacted and reacted with impurities on the surface of the wafers, so that the impurities are dissolved or desorbed, and further the purification degree of the wafers is ensured.
However, in the above process, since the basket is kept still at the bottom of the tank body, the desorbed impurities are deposited at the bottom of the basket, and the part of the wafer at the bottom of the basket is still in contact with the impurities, so that after the subsequent acidic solution is discharged, part of the impurities still adhere to the wafer, and the purification degree of the wafer is affected.
Disclosure of Invention
The application provides a wafer pickling device, possesses the advantage that reduces the probability of impurity adhesion on the wafer for solve impurity and wafer adhesion, lead to the problem that the wafer purification degree is influenced.
In order to achieve the above purpose, the present application adopts the following technical scheme: a wafer pickling apparatus comprising:
the cylinder body, one side of the cylinder body is provided with a first base in a sealing and rotating manner, the other side of the cylinder body is provided with a second base in a sealing and rotating manner, the first base, the cylinder body and the second base enclose a cavity together, an opening in the first base is provided with a sealing door in a sealing manner, and the upper side of the sealing door is hinged with the cylinder body;
the liquid outlet pipe is arranged at the lower side of the inner cavity of the cylinder body and used for exhausting liquid in the inner cavity of the cylinder body, and the liquid inlet pipe is arranged at the upper side of the inner cavity of the cylinder body and used for conveying liquid to the inner cavity of the cylinder body;
the carrier is arranged at the middle lower side of the inner cavity of the cylinder body, one side of the carrier is fixedly connected with the first base, the other side of the carrier is fixedly connected with the second base, and a flower basket is arranged on the upper side of the carrier and used for loading wafers;
the power teeth are fixedly arranged on the circumference and the outer side of the cylinder body at equal intervals, and are in transmission connection with the power mechanism.
Further, a sliding groove is formed in the upper side face of the bearing piece, and the sliding groove and the supporting legs of the flower basket form movable clamping connection.
Further, the method also comprises the following steps:
the separation mechanism is arranged in the inner cavity of the cylinder body and used for slowing down the flow rate of liquid flow contacting the flower basket;
the communication mechanism is arranged in the second base and used for bearing the overflowed solution in the cylinder.
Further, the separating mechanism comprises a separating piece and a telescopic rod, the separating piece is sleeved at the outer side position of the basket in the cavity of the barrel, the separating piece penetrates through the second base towards one side of the second base, the separating piece penetrates through the second base to form sealing movable connection with the second base, the telescopic rod is fixedly installed at the upper side position of the separating piece and away from the side face of the barrel, and the extending end of the telescopic rod is fixedly connected with one side of the separating piece penetrating through the second base.
Further, the communication mechanism includes connecting piece, piston plate, elastic component and pressure release hole, the side of No. two bases back to the barrel is fixed with the connecting piece, the inner chamber of connecting piece communicates with the inner chamber of barrel, sealed movable mounting has the piston plate in the inner chamber of connecting piece, just be provided with the elastic component in the inner chamber that is located piston plate back to base one side in the inner chamber of connecting piece, the inner wall that the both ends of elastic component respectively fixed connection piston plate and connecting piece face base one side, the pressure release hole has been seted up to the inside of connecting piece, the both ends in pressure release hole communicate external environment and connecting piece respectively in the cavity that is located the elastic component.
Further, the lower side of the partition piece is provided with a notch.
Further, the connecting piece and the flower basket are positioned at the same axial position.
Further, the port that connecting piece is linked together with the inner chamber of barrel is the setting of toper reducing structure.
The application has the following beneficial effects:
the utility model provides a wafer pickling device, through the setting of barrel and carrier, utilize the carrier to restrict the basket of flowers that is loaded with the wafer at certain height for the impurity of wafer surface desorption can leave the position that the basket of flowers was located at the in-process of deposit, and then reduces the probability of impurity adhesion on the wafer, makes the purification degree of wafer be difficult for receiving.
Through the setting of barrel and power tooth, utilize power tooth to drive barrel circumference rotation for the sour solution in the barrel has enough to meet the need in step, through above-mentioned action, makes the impurity of desorption receive the effect of centrifugal force, and then is close to the inner wall of barrel, because the basket of flowers is in the central point in the barrel this moment, makes the probability of wafer and the impurity contact of desorption further reduce, thereby further reduces the probability of impurity adhesion on the wafer.
Through the setting of power tooth, barrel and carrier for solution in the barrel is circumferential direction and rotates, makes the impurity of desorption receive the stirring of solution liquid stream, and then more easily passes the space of basket of flowers, through above-mentioned action, makes the contact probability of impurity and wafer in the basket of flowers reduce, thereby improves the purification degree of wafer.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.
The present application will be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:
FIG. 1 is a schematic view of the internal structure of a cylinder according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram showing the arrangement positions of a liquid inlet pipe and a liquid outlet pipe according to the first embodiment of the present invention;
FIG. 3 is a schematic view of the internal structure of a barrel according to a second embodiment of the present invention;
FIG. 4 is a schematic view showing the arrangement positions of the partition and the connecting member according to the second embodiment of the present invention;
fig. 5 is a schematic diagram illustrating an internal structure of a connector according to a second embodiment of the present invention.
In the figure: 1. a cylinder; 2. a first base; 3. a second base; 4. closing the door; 5. a liquid outlet pipe; 6. a liquid inlet pipe; 7. a carrier; 8. flower basket; 9. a power tooth; 10. a partition; 11. a telescopic rod; 12. a connecting piece; 13. a piston plate; 14. an elastic member; 15. and the pressure relief hole.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Example 1
Referring to fig. 1 and 2, a wafer pickling device includes a cylinder 1, a first base 2 is installed on one side of the cylinder 1 in a sealing and rotating manner (such as an end face sealing and rotating manner in the prior art), a second base 3 is installed on the other side of the cylinder 1 in a sealing and rotating manner (such as an end face sealing and rotating manner in the prior art), a cavity is enclosed by the first base 2, the cylinder 1 and the second base 3, a sealing door 4 is sealed and arranged at an opening inside the first base 2, an upper side of the sealing door 4 is hinged with the cylinder 1, a liquid outlet pipe 5 is arranged at a lower side position of an inner cavity of the cylinder 1, one end of the liquid outlet pipe 5 is communicated with the inner cavity of the cylinder 1, the other end of the liquid outlet pipe 5 penetrates the first base 2 and is communicated with a collecting mechanism (such as a collecting tank, not shown in the figure), one end of the liquid inlet pipe 6 is communicated with the inner cavity of the cylinder 1, the other end of the liquid inlet pipe 6 penetrates the second base 3 and is communicated with a transfusion mechanism (not shown in the prior art), a liquid pump is arranged at a lower side position of the cylinder 1 is hinged with the cylinder 1, a carrier 7 is arranged at a lower side position of the cylinder 1 is welded with the carrier 7, a carrier basket 7 is welded with the carrier basket 8 is formed at the carrier basket 8, and a carrier basket 8 is welded with the carrier basket 8 is formed at the carrier basket 8.
When the wafer-loaded flower basket 8 is used, firstly, the flower basket 8 loaded with the wafer is placed on the bearing piece 7, then, the sealing door 4 is closed, and an acid solution is input into the cylinder 1 through the liquid inlet pipe 6, so that the acid solution submerges the wafer, through the actions, the acid solution is contacted and reacted with impurities on the surface of the wafer, the impurities are dissolved or desorbed, and as the flower basket 8 loaded with the wafer is limited to a certain height by the bearing piece 7, the impurities desorbed from the surface of the wafer can fall to the bottom position of the cylinder 1 through the grid of the flower basket 8 in the process of depositing, the probability of the impurities adhering to the wafer is further reduced through the actions, the purification degree of the wafer is not easily affected, after the wafer is washed, the acid solution in the cylinder 1 is emptied through the liquid outlet pipe 5, and then, the sealing door 4 is opened, and the flower basket 8 is taken out.
Referring to fig. 1 and 2, power teeth 9 are fixedly mounted on the circumferential outer side of the cylinder 1 at equal intervals, and the power teeth 9 are in transmission connection with a power mechanism (in the prior art, such as a combination of a motor and a gear, not shown).
In the process of purifying the wafer by the acid solution, the power mechanism drives the power teeth 9 to rotate, so that the barrel 1 synchronously rotates circumferentially, the acid solution in the barrel 1 forms a rotary liquid flow, the desorbed impurities are enabled to be acted by centrifugal force through the action, and then the desorbed impurities are close to the inner wall of the barrel 1, because the basket 8 is positioned at the central position in the barrel 1, the probability that the wafer contacts with the desorbed impurities is further reduced, so that the probability that the impurities adhere to the wafer is further reduced, meanwhile, because the solution in the barrel 1 forms the rotary liquid flow, the desorbed impurities are stirred by the liquid flow, and then the impurities can more easily pass through gaps of the basket 8 (when the impurities are naturally deposited, the impurities only pass through the lower grid of the basket 8, and when the rotary liquid flow contacts with the impurities, the impurities can pass through the lower grid of the basket 8, the lateral grid and the upper side space, and then move to the edge position of the barrel 1), and through the action, the contact probability of the impurities and the wafer in the basket 8 is reduced, so that the purification degree of the wafer is improved.
Referring to fig. 1 and 2, a sliding groove is formed on the upper side of the carrier 7, and the sliding groove is in sliding engagement with the supporting leg of the basket 8.
Through the arrangement, when the flower basket 8 is pushed by the rotary liquid flow, the flower basket is limited by the sliding groove, and is more stable.
Example two
Referring to fig. 1-5, this embodiment is a further improvement of the first embodiment, and the improvement is that: the partition piece 10 has been cup jointed in the cavity of barrel 1 and be located the outside position of basket 8, the partition piece 10 is passed No. two base 3 towards No. two base 3 one side, the part that partition piece 10 passed No. two base 3 forms sealed sliding connection with No. two base 3, no. two base 3 is kept away from the side of barrel 1 and is located the upside position fixed mounting of partition piece 10 has telescopic link 11 (like the automatically controlled telescopic link in prior art), the extension end of telescopic link 11 forms fixed connection with the one side that partition piece 10 passed No. two base 3, the downside of partition piece 10 is the breach setting, no. two base 3 is kept away from the side welding of barrel 1 has connecting piece 12, the inner chamber of connecting piece 12 communicates with the inner chamber of barrel 1, sealing sliding mounting has piston plate 13 in the inner chamber of connecting piece 12 and be provided with elastic component 14 in the cavity of piston plate 13 back to No. 2 one side, the both ends of elastic component 14 are fixed connection plate 13 respectively and connecting piece 12 are kept away from the inner wall of No. 2, the inside of connecting piece 12 has seted up hole 15, the pressure release that the external pressure release of connecting piece 12 is located the external pressure release department of elastic component 14 is located to the connecting piece 12 respectively.
In the circumferential rotation process of the cylinder 1, the telescopic rod 11 intermittently operates and drives the partition 10 to reciprocate to extend into and extend out, when the partition 10 extends into, the partition 10 further extends into the inner cavity of the cylinder 1 and then extrudes the solution in the cylinder 1, so that part of the solution pushes the piston plate 13 to compress the elastic piece 14, in the process, the partition 10 is positioned at the outer side of the basket 8 and further stops the circumferential flow of the solution positioned at the inner side of the partition 10 to a certain extent, after that, when the partition 10 extends out, the partition 10 is not positioned at the outer side of the basket 8, so that the solution originally positioned at the inner side of the partition 10 forms a rotating liquid flow again, and thus the reciprocating force applied by the impurity in the basket 8 is intermittently reduced or eliminated, and then the impurity is more easily separated from the basket 8 (due to the intermittent change of the force applied by the impurity in the basket 8, the position of the impurity is easily changed, and then the probability that the impurity is blocked by the wafer or the basket 8 is reduced), thereby improving the purification degree of the wafer, and finally, when the wafer 11 drives the partition 10 to extend out, the solution is again brought into contact with the inner wall of the cylinder 1, the inner wall of the cylinder 1 is prevented from being in contact with the inner wall of the cylinder 5, and the liquid flow is completely separated from the inner wall of the basket 1 again.
Example III
The second embodiment is a further improvement of the second embodiment, and the improvement is that the connecting piece 12 and the flower basket 8 are positioned at the same axial position, and the port of the connecting piece 12 communicated with the inner cavity of the barrel 1 is in a conical diameter-reducing structure (not shown in the figure).
In the process that the partition piece 10 extends out of the cylinder body 1, the elastic piece 14 drives the piston plate 13 to reset, so that the piston plate 13 extrudes the acid solution in the connecting piece 12, the solution is sprayed to one side of the basket 8, impurities in the basket 8 are subjected to acting forces in different directions through the actions, the positions of the impurities are changed, and the impurities are easier to separate from the wafer.

Claims (7)

1. A wafer pickling apparatus, comprising:
the novel sealing device comprises a barrel body (1), wherein a first base (2) is installed on one side of the barrel body (1) in a sealing and rotating mode, a second base (3) is installed on the other side of the barrel body (1) in a sealing and rotating mode, the first base (2), the barrel body (1) and the second base (3) jointly enclose a cavity, a sealing door (4) is arranged at an opening in the first base (2) in a sealing mode, and the upper side of the sealing door (4) is hinged to the barrel body (1);
the liquid outlet pipe (5), the lower side position of the inner cavity of the cylinder body (1) is provided with the liquid outlet pipe (5) for evacuating the liquid in the inner cavity of the cylinder body (1), and the upper side position of the inner cavity of the cylinder body (1) is provided with the liquid inlet pipe (6) for conveying the liquid to the inner cavity of the cylinder body (1);
the bearing piece (7) is arranged at the middle lower side of the inner cavity of the cylinder body (1), one side of the bearing piece (7) is fixedly connected with the first base (2), the other side of the bearing piece (7) is fixedly connected with the second base (3), and a flower basket (8) is arranged on the upper side surface of the bearing piece (7) and used for loading wafers;
the power teeth (9) are fixedly arranged on the circumferential outer side of the cylinder body (1) at equal intervals, and the power teeth (9) are in transmission connection with the power mechanism;
the separation mechanism is arranged in the inner cavity of the cylinder body (1) and used for slowing down the flow rate of liquid flow contacting the flower basket (8);
the separating mechanism comprises a separating piece (10) and a telescopic rod (11), the separating piece (10) is sleeved at the outer side position of the flower basket (8) in the cavity of the barrel (1), the separating piece (10) penetrates through the base (3) II towards one side of the base (3) II, the separating piece (10) penetrates through the base (3) II to form sealing movable connection with the base (3) II, the telescopic rod (11) is fixedly installed at the upper side position of the separating piece (10) and opposite to the side surface of the barrel (1), and the extending end of the telescopic rod (11) and one side of the separating piece (10) penetrating through the base (3) II form fixed connection.
2. Wafer pickling device according to claim 1, characterized in that the upper side of the carrier (7) is provided with a chute, which forms a movable clamping connection with the legs of the basket (8).
3. The wafer pickling apparatus of claim 1, further comprising:
the communication mechanism is arranged in the second base (3) and is used for bearing the overflowed solution in the cylinder (1).
4. The wafer pickling device according to claim 3, wherein the communication mechanism comprises a connecting piece (12), a piston plate (13), an elastic piece (14) and a pressure relief hole (15), the connecting piece (12) is fixed on the side surface of the second base (3) opposite to the barrel (1), the inner cavity of the connecting piece (12) is communicated with the inner cavity of the barrel (1), the piston plate (13) is movably installed in the inner cavity of the connecting piece (12) in a sealing mode, the elastic piece (14) is arranged in the inner cavity of the connecting piece (12) and positioned in the cavity of the piston plate (13) opposite to the first base (2), two ends of the elastic piece (14) are fixedly connected with the inner wall of the piston plate (13) and the connecting piece (12) opposite to the first base (2), the pressure relief hole (15) is formed in the inner portion of the connecting piece (12), and two ends of the pressure relief hole (15) are respectively communicated with the external environment and the cavity of the connecting piece (12) where the elastic piece (14) is positioned.
5. Wafer pickling device according to claim 1, characterized in that the underside of the partition (10) is provided with indentations.
6. Wafer pickling device according to claim 4, characterized in that the connection (12) is in the same axial position as the basket (8).
7. A wafer pickling apparatus according to claim 6, characterised in that the port of the connecting piece (12) communicating with the inner cavity of the cylinder (1) is provided in a conical reducing configuration.
CN202311785546.8A 2023-12-25 2023-12-25 Wafer pickling device Active CN117457554B (en)

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Application Number Priority Date Filing Date Title
CN202311785546.8A CN117457554B (en) 2023-12-25 2023-12-25 Wafer pickling device

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Application Number Priority Date Filing Date Title
CN202311785546.8A CN117457554B (en) 2023-12-25 2023-12-25 Wafer pickling device

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CN117457554A CN117457554A (en) 2024-01-26
CN117457554B true CN117457554B (en) 2024-03-19

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