CN208954954U - Wafer cleaning equipment - Google Patents
Wafer cleaning equipment Download PDFInfo
- Publication number
- CN208954954U CN208954954U CN201822036974.1U CN201822036974U CN208954954U CN 208954954 U CN208954954 U CN 208954954U CN 201822036974 U CN201822036974 U CN 201822036974U CN 208954954 U CN208954954 U CN 208954954U
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- China
- Prior art keywords
- wafer
- cleaning solution
- cleaning
- solution container
- injection unit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 170
- 239000000243 solution Substances 0.000 claims abstract description 103
- 238000002347 injection Methods 0.000 claims abstract description 37
- 239000007924 injection Substances 0.000 claims abstract description 37
- 239000007921 spray Substances 0.000 claims abstract description 25
- 230000004888 barrier function Effects 0.000 claims abstract description 23
- 239000013078 crystal Substances 0.000 claims abstract description 9
- 238000010926 purge Methods 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 238000005119 centrifugation Methods 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 45
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229960002163 hydrogen peroxide Drugs 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000009510 drug design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000008141 laxative Substances 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001543 purgative effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model is related to a kind of wafer cleaning equipment, comprising: cleaning chamber is provided with wafer and places position, and for placing wafer to be cleaned, the wafer, which places position, can drive the wafer rotation being placed on wafer placement position, to get rid of the cleaning solution of de- crystal column surface；Cleaning solution container, be set to it is described cleaning it is intracavitary, get rid of de- cleaning solution for receiving crystal column surface；Air injection unit is set at the cleaning solution container, can spray gas, to form airflow barrier at the cleaning solution container.The airflow barrier that the air injection unit of the wafer cleaning equipment of the utility model generates with the cleaning solution drop that centrifugation flies out is non-resilient contacts, cleaning solution drop will not be sprung back, but the flow direction of airflow barrier is followed to move in slot, a possibility that reducing cleaning solution splash to wafer to be cleaned, causing defect.
Description
Technical field
The utility model relates to wafer production fields, and in particular to a kind of wafer cleaning equipment.
Background technique
In semiconductor wet cleaning process, slot type cleaning and monolithic cleaning can be divided into distinguish with operation mode, but
It is the continuous diminution with characteristic size, the requirement of cleaning process is also higher and higher.The one chip cleaning method slot type that compares is clear
The cleaning effect washed is more preferably.In the one chip cleaning process of wafer, wafer is driven to rotate using the rotational structure of cleaning equipment,
Chemical cleaning solution passes through nozzle from cavity uppermost spray in crystal column surface, and the cleaning solution used is thrown away through rotation, carries out respectively
Recycling or direct emission.
Cleaning liquor collecting device is provided in one chip cleaning chamber at present, cleaning solution is thrown away under the influence of centrifugal force
It to cleaning liquor collecting device, and flows down along cleaning liquor collecting device and converges to outlet, into liquids recovery pipeline or straight
Row pipeline.During operation, the drop due to throwing away at a high speed cleans liquor collecting device hitting with very big kinetic energy
When, it is likely that there is a phenomenon where sputterings to rebound, and causes cleaning solution splash to wafer, causes defect.
In existing technology, the sidewall design shape in the arc-shaped of liquor collecting device is cleaned.Side relative to right-angle structure
Wall, this structure can reduce sputtering when cleaning solution low speed rotation, but in high-speed rotation process, still there is the hair of splash
It is raw.If pollution caused by splash cleaning solution cannot be handled in time, defect can be caused at the edge of wafer and the back side.
The wafer cleaning equipment that a kind of structure is simple, easy to use must be designed, the rational design to cavity can be passed through
The splash at liquor collecting device is being cleaned to reduce cleaning solution, secondary pollution is being prevented, improves the recovery efficiency of cleaning solution.
Utility model content
The purpose of this utility model is to provide a kind of wafer cleaning equipments, can reduce cleaning solution returning when throwing away
It splashes, prevents from causing secondary pollution to wafer, improve the recovery efficiency of cleaning solution.
In order to solve the above-mentioned technical problem, the utility model provides a kind of wafer cleaning equipment, comprising: cleaning chamber, if
It is equipped with wafer and places position, for placing wafer to be cleaned, wafer placement position, which can drive, is placed on wafer placement position
On wafer rotation, to get rid of the cleaning solution of de- crystal column surface；Cleaning solution container, be set to it is described cleaning it is intracavitary, for receiving
Crystal column surface gets rid of de- cleaning solution；Air injection unit is set at the cleaning solution container, gas can be sprayed, described
Airflow barrier is formed at cleaning solution container.
Optionally, the cleaning solution container places position setting around the wafer, has towards the wafer and places position
Notch.
Optionally, the air injection unit includes ring-shaped air chamber, and the ring-shaped air chamber is set to the cleaning solution container
Notch at, around the wafer place position setting.
Optionally, the air injection unit includes stomata, and the notch of the cleaning solution container is arranged in, around the wafer
Place position setting.
Optionally, the number of the stomata is three or more, is evenly distributed on the notch of the cleaning solution container.
It optionally, further include rotating electric machine, the rotating electric machine has rotating output shaft, can rotate around axis；
The rotating electric machine is connected to the wafer by the rotating output shaft and places position, drives the wafer to place and places on position
Wafer rotation, to get rid of the cleaning solution of de- crystal column surface.
Optionally, further includes: purge gas nozzle, be set to it is described cleaning it is intracavitary, towards the wafer place position be arranged,
Purge gas is sprayed for placing position towards the wafer.
Optionally, when the plane where the wafer places position is parallel to the horizontal plane, the gas of the air injection unit ejection
The airflow barrier of formation is towards in the cleaning solution container, horizontal by 30 ° to 60 ° of angle.
Optionally, when the plane where the wafer places position is parallel to the horizontal plane, the gas of the air injection unit ejection
The airflow barrier of formation is towards in the cleaning solution container, horizontal by 45 ° of angle.
Optionally, further include motor pressure regulation needle-valve, be connected to the air injection unit, sprayed for controlling the air injection unit
The number of gas.
The wafer cleaning equipment of the utility model includes air injection unit, places the wafer on position in wafer and rotates, brilliant
When the cleaning solution centrifugation of circular surfaces flies out, it is collected by the cleaning solution container.And it is set at the cleaning solution container
It is equipped with air injection unit.The air injection unit sprays gas and generates airflow barrier, the cleaning solution that the airflow barrier and centrifugation fly out
Non-resilient contact occurs for drop, and cleaning solution will not be sprung back, but the flow direction of the airflow barrier can be followed to move to
In the groove body of the cleaning solution container, reduce cleaning solution and when the cleaning chamber cavity collides cleaning solution splash extremely to
Cleaning wafer, a possibility that causing defect.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the wafer cleaning equipment in a kind of specific embodiment of the utility model.
Fig. 2 is the schematic top plan view of the wafer cleaning equipment in a kind of specific embodiment of the utility model.
Fig. 3 is the partial enlargement diagram of the wafer cleaning equipment in a kind of specific embodiment of the utility model.
Specific embodiment
Below in conjunction with the drawings and specific embodiments to the utility model proposes a kind of wafer cleaning equipment make it is further
It is described in detail.
Please refer to Fig. 1,2, wherein Fig. 1 is the wafer cleaning equipment in a kind of specific embodiment of the utility model
Structural schematic diagram, Fig. 2 are the schematic top plan view of the wafer cleaning equipment in a kind of specific embodiment of the utility model.
In this specific embodiment, the wafer cleaning equipment includes: cleaning chamber 101, is provided with wafer and places position
102, for placing wafer 103 to be cleaned, wafer placement position 102, which can drive, to be placed on wafer placement position 102
Wafer 103 rotate, to get rid of the cleaning solution on de- 103 surface of wafer；Cleaning solution container 106 is set to the cleaning chamber 101
It is interior, de- cleaning solution is got rid of for receiving 103 surface of wafer；Air injection unit 107 is set at the cleaning solution container 106, energy
Gas is sprayed, enough to form airflow barrier at the cleaning solution container 106.
Position 102 is placed around the wafer and is arranged with Fig. 2, the cleaning solution container 106 refering to fig. 1 simultaneously, and there is court
The notch 108 of position 102 is placed to the wafer, and notch is also placed position 102 around the wafer and is arranged.Shown in Fig. 1,2
In specific embodiment, the cleaning chamber 101 is cylindrical, and the cleaning solution container 106 is annular in shape, is hung on the cleaning
In the cavity wall of chamber 101, the center overlapping of axles of the top surface of the central axis of cyclic annular cleaning solution container and cylindric cleaning chamber.When described
Wafer places position 102 when being horizontally arranged, and the cleaning solution container 106 is also parallel with horizontal plane.
In a specific embodiment, the cleaning chamber 101 is quartz cleaning chamber, is made of quartz.In fact, can also
The cleaning chamber 101 is made in selection other materials as needed.
In a specific embodiment, cleaning solution is sprayed using cleaning solution spray orifice 104, is placed to the wafer is placed on
Wafer 103 on position 102 is cleaned.The cleaning solution spray orifice 104 is connected to cleaning solution storage box by cleaning fluid pipe
113, wherein cleaning fluid pipe is not shown in the figure.In specific embodiment shown in Fig. 1,104 direction of cleaning solution spray orifice
The wafer is placed position 102 and is arranged.In a specific embodiment, it can also be placed in the wafer and cleaning is set in position 102
Liquid spray orifice 104 is cleaned with the lower surface for placing the wafer 103 placed on position 102 to wafer, to have preferably cleaning
Effect.Meanwhile can also be placed in wafer and cleaning solution spray orifice 104 is set above position 102, it is placed on position 102 with being placed to wafer
The upper surface of wafer 103 is cleaned.
In a specific embodiment, the cleaning solution includes deionized water (DIW, Deionized water).At it
In his specific embodiment, the cleaning solution further includes dilution HF acid, for removing the oxide layer on 103 surface of wafer.
The dilution HF acid is HF:H2The HF acid solution of O=1:50.Further, the cleaning solution further includes that Sulfuric-acid-hydrogen-peroxide is mixed
It closes liquid (Sulfuric acid, hydrogen-Peroxide Mixing), for more serious to remove 103 surface of wafer
Organic contamination.
It should be noted that removing the more serious organic dirt in 103 surface of wafer using Sulfuric-acid-hydrogen-peroxide mixed liquor
When dye, need to expend more hydrogen peroxide, therefore it is noted that check the amount of 113 hydrogen peroxide of cleaning solution storage box, to prevent
Only the amount of hydrogen peroxide is very few and influence finally to the cleaning effect of wafer 103.
In a specific embodiment, the wafer cleaning equipment further includes rotating electric machine 105, the rotating electric machine
105 have rotating output shaft, can rotate around axis.The rotating output shaft is connected to the wafer and places position 102, band
It moves wafer placement position 102 to rotate, be rotated so that the wafer be made to place the wafer 103 placed on position 102, it is de- to get rid of
The cleaning solution on 103 surface of wafer.
In fact, other structures can also be set as needed to drive the wafer to place position 102 and rotate, described in driving
Wafer is placed the wafer 103 placed on position 102 and is rotated, and is centrifuged the cleaning solution on 103 surface of wafer and throws away.
In the specific embodiment shown in Fig. 1,2, the rotating output shaft of the rotating electric machine is connected to the wafer and puts
The lower surface of set 102.If the cleaning solution spray orifice 104 that the wafer is placed in position 102, which is arranged in, is located just on the rotation
Output shaft places the position that position 102 is connected with the wafer, then it is clear to place that through-hole can be opened up in the rotating output shaft
Washing lotion pipeline.In this specific embodiment, the cleaning fluid pipe is placed in through-hole, is connected to setting and is put in the wafer
Cleaning solution spray orifice 104 in set 102.
In a specific embodiment, the wafer cleaning equipment further include: purge gas nozzle 111 is set to institute
It states in cleaning chamber 101, places position 102 towards the wafer and be arranged, spray purgative gas for placing position 102 towards the wafer
Body places the wafer 103 placed on position 102 to act on wafer, carries out purge of gas to wafer 103.Have shown in Fig. 1,2
In body embodiment, the purge gas nozzle 111 is connected to a purge gas storage box 110, institute by purge gas pipeline
It states in purge gas storage box 110 and is stored with purge gas, sprayed for purge gas nozzle 111, the purge gas pipeline is simultaneously
It is not shown.
In Fig. 1, the purge gas nozzle 111 is set to the top that the wafer places position 102, sprays from top to bottom
Purge gas.The purge gas includes nitrogen, carbon dioxide etc..It, can be by crystalline substance when spray purge gas from top to bottom
The gravity of impurity to be cleaned, makes the impurity to be cleaned on the wafer 103 in the effect of self gravity and purge flow on circle 103
It is lower to be brushed out, to obtain the cleaning effect of better wafer 103.
Please refer to Fig. 3, the part for the wafer cleaning equipment in a kind of specific embodiment of the utility model shows
It is intended to.In this specific embodiment, the cleaning solution container 106 is placed position 102 around the wafer and is arranged, by described clear
It washes the cavity wall of chamber 101 and the baffle being arranged in cavity wall is constituted.Specifically, the cleaning solution container 106 includes overhead gage
302 and lower baffle plate 303, the overhead gage 302 and lower baffle plate 303 protrude from the cavity wall setting of the cleaning chamber 101, and opposite
In vertical plane there is certain angle to fly out to form accommodating space, i.e. cleaning solution container 106 to accommodate from 103 surface of wafer
Cleaning solution.
In Fig. 3, the cleaning solution container 106 further includes baffle 304 in one, is set to the overhead gage 302 under
Between baffle 303, the cleaning solution container 106 is divided into two spaces, can be used to realize and different liquids are divided
Class receiving.Specifically, realizing the receipts of the dilution HF acid to lighter weight using the upper space 1061 of cleaning solution container 106
Hold, the receipts to the heavier Sulfuric-acid-hydrogen-peroxide mixed solution of quality are realized using the lower layer space 1062 of cleaning solution container 106
Hold, to select different processing modes for different cleaning solutions, environmental protection is saved.
In this specific embodiment, the notch 108 has also been divided into two layers by middle baffle 304.Overhead gage 302 is in
Region between baffle 304 is upper notch 1081, is provided with air injection unit 107, shape above overhead gage 302 and middle baffle 304
At there is airflow barrier.
When the cleaning solution that centrifugation flies out flies to the cleaning solution container 106, regardless of the cleaning solution that centrifugation flies out is winged
Toward upper space or lower layer space, can all occur with the airflow barrier of the notch 108 of the cleaning solution container 106 non-resilient
Collision, rapidly enter the cleaning solution container 106 inside, so as to user further discharged or recycled again benefit
With processing.
The air injection unit 107 has the structure or component that can uniformly spray gas, to form airflow barrier.Scheming
In specific embodiment shown in 3, the air injection unit 107 includes ring-shaped air chamber 301.The ring-shaped air chamber 301 is set to institute
The notch 108 for stating cleaning solution container 106, it is consistent with 108 shape of notch of cleaning solution container 106, around the wafer
Position 102 is placed to be arranged.It air-flow is sprayed by the ring-shaped air chamber 301 outward, forms annular airflow barrier, play flying out to centrifugation
The anti-rebound effect of the drop of cleaning solution and guide functions.
In other specific embodiments, the air injection unit 107 includes stomata, is arranged in the cleaning solution container
106 notch 108 is placed position 102 around the wafer and is arranged.In this specific embodiment, gas is sprayed using stomata
Form the airflow barrier of 106 notch 108 of cleaning solution container.
In this specific embodiment, the number of the stomata is three or more, is evenly distributed on the cleaning solution receiving
The notch 108 of slot 106.In fact, the number and arrangement mode of stomata can be determined according to actual needs.Due to will be in cleaning solution
The notch 108 of container 106 forms airflow barrier, and the amount of the air-flow sprayed through stomata is extremely limited, therefore is arranged described
The stoma number of the notch 108 of cleaning solution container 106 should be enough, and the air-flow sprayed from stomata is enable to accommodate in cleaning solution
The notch 108 of slot 106 forms airflow barrier.Further, it is also necessary to guarantee the stomata in the cleaning solution container 106
Notch 108 is uniformly distributed, so that the airflow barrier thickness for forming the air-flow sprayed from the stomata is uniform, not will cause gas
Waste.
The air injection unit 107 further includes air flow source 109, is connected with ring-shaped air chamber 301 or stomata, for storing annular
The gas that gas chamber 301 or stomata spray.In a specific embodiment, the gas in air flow source 109 is nitrogen or indifferent gas
Body.
In a specific embodiment, when wafer, which places 102 place plane of position, to be parallel to the horizontal plane, the jet list
The airflow barrier that the gases that member 107 sprays are formed is towards in the cleaning solution container 106, horizontal by 30 ° to 60 ° of folder
Angle, so that the air injection unit 107 can be followed to spray by the drop for the cleaning solution for brushing the notch to the cleaning solution container 106
Gas out, the interior movement of the slot of Xiang Suoshu cleaning solution container 106, further prevents cleaning solution to splash, and can shorten drop
The time required to entering container, so as to shorten the scavenging period of wafer 103.
It is described when wafer, which places 102 place plane of position, to be parallel to the horizontal plane in specific embodiment shown in Fig. 3
The airflow barrier that the gas that air injection unit 107 sprays is formed is horizontal by 45 ° of angle.
In a specific embodiment, the wafer cleaning equipment further includes motor pressure regulation needle-valve 114, the motor tune
Pressing valve 114 is connected to the air injection unit 107, and the number of gas is sprayed for controlling the air injection unit 107.Specifically,
The motor pressure regulation needle-valve 114 be arranged in the supply air injection unit 107 with the air flow source 109 of gas and air injection unit 107 it
Between, the amount for the gas that air injection unit 107 is flowed to from air flow source 109 is controlled.
In a specific embodiment, the motor pressure regulation needle-valve 114 is the motor pressure regulation needle-valve 114 of feedback-type, institute
Motor pressure regulation needle-valve 114 is stated with control unit.The control unit of the motor pressure regulation needle-valve 114 is connected to a gas flowmeter
112, the gas flowmeter 112 is used to measure the number that the air injection unit 107 sprays gas, and described control unit is according to working as
Preceding air injection unit 107 sprays the number of gas to adjust the motor pressure regulation needle-valve 114, and control flows to jet from air flow source 109
The amount of the gas of unit 107, to control the number that the air injection unit 107 sprays gas.
Specifically, the motor pressure regulation needle-valve 114 includes spool and motor portion.The spool is in cone shape, setting
In the gas circuit of connection air flow source 109 and air injection unit 107, the essence of gas circuit opening and closing and width is realized by adjusting spool state
Really adjustment, the motor portion have the output shaft being in contact with spool, and described control unit is connected to the motor portion, and
Control the output quantity of the output shaft of the motor portion.During the adjustment of motor pressure regulation needle-valve 114, by controlling motor part
The output quantity of the output shaft divided, controls the squeezed state of cone shape spool, to change opening and closing and the width of gas circuit
Narrow, control flows to the gas flow of air injection unit 107 from air flow source 109, has good seal performance, the high advantage of output accuracy.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of wafer cleaning equipment characterized by comprising
Chamber is cleaned, wafer is provided with and places position, for placing wafer to be cleaned, wafer placement position, which can drive, is placed on institute
It states the wafer that wafer is placed on position to rotate, to get rid of the cleaning solution of de- crystal column surface；
Cleaning solution container, be set to it is described cleaning it is intracavitary, get rid of de- cleaning solution for receiving crystal column surface；
Air injection unit is set at the cleaning solution container, can spray gas, to be formed at the cleaning solution container
Airflow barrier.
2. wafer cleaning equipment according to claim 1, which is characterized in that the cleaning solution container is around the wafer
Position setting is placed, there is the notch for placing position towards the wafer.
3. wafer cleaning equipment according to claim 2, which is characterized in that the air injection unit includes ring-shaped air chamber, and
The ring-shaped air chamber is set at the notch of the cleaning solution container, places position setting around the wafer.
4. wafer cleaning equipment according to claim 2, which is characterized in that the air injection unit includes stomata, and setting exists
The notch of the cleaning solution container places position setting around the wafer.
5. wafer cleaning equipment according to claim 4, which is characterized in that the number of the stomata is three or more,
The even notch for being distributed in the cleaning solution container.
6. wafer cleaning equipment according to claim 1, which is characterized in that it further include rotating electric machine, the rotating electric machine
With rotating output shaft, can be rotated around axis；The rotating electric machine is connected to the crystalline substance by the rotating output shaft
Circle places position, drives the wafer to place the wafer rotation placed on position, to get rid of the cleaning solution of de- crystal column surface.
7. wafer cleaning equipment according to claim 1, which is characterized in that further include:
Purge gas nozzle, be set to it is described cleaning it is intracavitary, towards the wafer place position be arranged, for being put towards the wafer
Set sprays purge gas.
8. wafer cleaning equipment according to claim 1, which is characterized in that plane and water where the wafer places position
When plane is parallel, airflow barrier that the gas that the air injection unit sprays is formed is towards in the cleaning solution container, with level
Face is in 30 ° to 60 ° of angle.
9. wafer cleaning equipment according to claim 1, which is characterized in that plane and water where the wafer places position
When plane is parallel, airflow barrier that the gas that the air injection unit sprays is formed is towards in the cleaning solution container, with level
Face is in 45 ° of angle.
10. wafer cleaning equipment according to claim 1, which is characterized in that further include motor pressure regulation needle-valve, be connected to institute
Air injection unit is stated, the number of gas is sprayed for controlling the air injection unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822036974.1U CN208954954U (en) | 2018-12-05 | 2018-12-05 | Wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822036974.1U CN208954954U (en) | 2018-12-05 | 2018-12-05 | Wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208954954U true CN208954954U (en) | 2019-06-07 |
Family
ID=66745586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822036974.1U Expired - Fee Related CN208954954U (en) | 2018-12-05 | 2018-12-05 | Wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208954954U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112222096A (en) * | 2019-07-15 | 2021-01-15 | 长鑫存储技术有限公司 | Cleaning device, wafer processing equipment and cleaning method of wafer carrying platform |
| CN113130299A (en) * | 2021-04-15 | 2021-07-16 | 广东先导微电子科技有限公司 | Wafer cleaning method |
| CN114453321A (en) * | 2022-02-25 | 2022-05-10 | 上海普达特半导体设备有限公司 | Single wafer type wafer cleaning device |
| CN114746586A (en) * | 2021-09-10 | 2022-07-12 | 株式会社荏原制作所 | Plating apparatus and rinsing method |
| CN117423644A (en) * | 2023-12-18 | 2024-01-19 | 北京青禾晶元半导体科技有限责任公司 | Wafer cleaning device and cleaning method |
| CN117457554A (en) * | 2023-12-25 | 2024-01-26 | 南轩（天津）科技有限公司 | Wafer pickling device |
-
2018
- 2018-12-05 CN CN201822036974.1U patent/CN208954954U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112222096A (en) * | 2019-07-15 | 2021-01-15 | 长鑫存储技术有限公司 | Cleaning device, wafer processing equipment and cleaning method of wafer carrying platform |
| CN112222096B (en) * | 2019-07-15 | 2023-10-10 | 长鑫存储技术有限公司 | Cleaning device, wafer processing equipment and cleaning method of wafer carrier |
| CN113130299A (en) * | 2021-04-15 | 2021-07-16 | 广东先导微电子科技有限公司 | Wafer cleaning method |
| CN113130299B (en) * | 2021-04-15 | 2023-08-22 | 广东先导微电子科技有限公司 | Wafer cleaning method |
| CN114746586A (en) * | 2021-09-10 | 2022-07-12 | 株式会社荏原制作所 | Plating apparatus and rinsing method |
| CN114453321A (en) * | 2022-02-25 | 2022-05-10 | 上海普达特半导体设备有限公司 | Single wafer type wafer cleaning device |
| CN117423644A (en) * | 2023-12-18 | 2024-01-19 | 北京青禾晶元半导体科技有限责任公司 | Wafer cleaning device and cleaning method |
| CN117423644B (en) * | 2023-12-18 | 2024-03-05 | 北京青禾晶元半导体科技有限责任公司 | Wafer cleaning method |
| CN117457554A (en) * | 2023-12-25 | 2024-01-26 | 南轩（天津）科技有限公司 | Wafer pickling device |
| CN117457554B (en) * | 2023-12-25 | 2024-03-19 | 南轩（天津）科技有限公司 | Wafer pickling device |
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