CN112750734A - Single wafer carrier cleaning and drying device - Google Patents
Single wafer carrier cleaning and drying device Download PDFInfo
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- CN112750734A CN112750734A CN202011630260.9A CN202011630260A CN112750734A CN 112750734 A CN112750734 A CN 112750734A CN 202011630260 A CN202011630260 A CN 202011630260A CN 112750734 A CN112750734 A CN 112750734A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
Abstract
The invention discloses a single-wafer carrier cleaning and drying device, which relates to the technical field of semiconductors and comprises a cleaning solution recovery mechanism, a wafer cleaning mechanism, a wafer drying module, a first cleaning module, a second cleaning module and a third cleaning module, wherein the wafer cleaning mechanism is arranged in the cleaning solution recovery mechanism in a lifting manner, the first cleaning module is rotatably arranged on one side of the cleaning solution recovery mechanism, the second cleaning module is rotatably arranged on the other side of the cleaning solution recovery mechanism, the third cleaning module is rotatably arranged at one end of the cleaning solution recovery mechanism, and the wafer drying module is arranged between the first cleaning module and the second cleaning module. According to the invention, the cleaning effect of the front side of the wafer can be improved, the cleanliness can be improved, the classified recovery of different types of cleaning liquids can be realized, and the cleaning of the back side of the wafer can also be realized; the front side and the back side of the wafer can be cleaned integrally, and the consistency of double-side cleaning of the wafer is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a single-wafer carrier cleaning and drying device.
Background
In a semiconductor cleaning process, particularly in a manufacturing process of high-level wafer products such as logic integrated circuits, memories, power devices and other related wafer products, various complicated processes such as photolithography, wet process, deposition, oxidation and the like are used for processing, however, the subsequent process at each point needs to be processed through the wet process, so that the accuracy and the reproducibility of the subsequent process yield are ensured.
Particularly, in the semiconductor wet process of related requirements, the requirement of wet cleaning on the back of a wafer is mostly applied to the practical application of single-chip cleaning equipment, so that the capability of establishing effective and complete wafer cleaning effect control is the key point of attention required by the existing high-order semiconductor wet process, the matching of a special cleaning module with high wafer cleaning cleanliness and flow field control is realized, and the problem and embodiment of attention required currently are realized.
Disclosure of Invention
The invention aims to provide a single-wafer carrier cleaning and drying device which is used for solving the technical problem.
The technical scheme adopted by the invention is as follows:
the utility model provides a single wafer carrier washs drying device, retrieves mechanism, wafer wiper mechanism, wafer drying module, first washing module, second washing module and third washing module including the washing liquid, wherein, wafer wiper mechanism locates with liftable in the washing liquid retrieves the mechanism, first washing module rotatably locates one side of mechanism is retrieved to the washing liquid, the second washs the module and rotatably locates the opposite side that the mechanism was retrieved to the washing liquid, the third washs the module and rotatably locates the one end that the mechanism was retrieved to the washing liquid, wherein, first washing module with be equipped with between the second washing module the wafer drying module.
Preferably, the wafer drying module comprises a plurality of nitrogen blowing pipes, one end of each nitrogen blowing pipe is an air outlet end, and the air outlet end is obliquely arranged from top to bottom in a direction close to the wafer cleaning mechanism.
Preferably, the third cleaning module comprises a first cleaning pipe mechanism, a second cleaning pipe mechanism and a third cleaning pipe mechanism which are arranged side by side.
Preferably, the cleaning solution recycling device further comprises a mounting plate, the cleaning solution recycling mechanism is arranged in the middle of the mounting plate, and the wafer drying module, the first cleaning module, the second cleaning module and the third cleaning module are respectively arranged at the upper end of the mounting plate.
As a further preference, the second cleaning module comprises an installation pipe, an installation block, a nitrogen sprayer, a first sprayer and a second sprayer, wherein one end of the installation pipe is connected with the upper end of the installation plate, the other end of the installation pipe is connected with one end of the installation block, and the other end of the installation block is provided with the nitrogen sprayer, the first sprayer and the second sprayer.
As a further optimization, the device further comprises a nitrogen conveying pipe, a first infusion pipe and a second infusion pipe, wherein the nitrogen conveying pipe, the first infusion pipe and the second infusion pipe are respectively installed in the installation pipe, the nitrogen conveying pipe is connected with the nitrogen sprayer, the first infusion pipe is connected with the first sprayer, and the second infusion pipe is connected with the second sprayer.
Preferably, the nitrogen sprayer, the first sprayer and the second sprayer are arranged side by side, the first sprayer is located between the nitrogen sprayer and the second sprayer, and the nitrogen sprayer is obliquely arranged from top to bottom in a direction close to the first sprayer.
Preferably, the wafer cleaning mechanism includes a wafer bearing platform, a wafer supporting pipe, a rotating shaft set, a first lifting mechanism and a wafer positioner, wherein the wafer positioner is arranged on the outer edge of the upper surface of the wafer bearing platform, the rotating shaft set and the first lifting mechanism are respectively arranged at the lower end of the wafer bearing platform, the first lifting mechanism drives the rotating shaft set, the wafer supporting pipe penetrates through the rotating shaft set along the axial direction of the rotating shaft set, and one end of the wafer supporting pipe penetrates through the wafer bearing platform and extends to the upper side of the wafer bearing platform.
As a further preferred option, the wafer cleaning mechanism further comprises a first pipe casing and a liquid spraying pipe, wherein the first pipe casing is arranged at the outer edge of one end of the wafer supporting pipe, a first gas nozzle obliquely arranged is formed in the middle of the first pipe casing, and the liquid spraying pipe is arranged at the upper end of the first pipe casing.
As a further preference, the wafer cleaning mechanism further comprises a second pipe shell, the outer edge of one end of the wafer supporting pipe is further sleeved with the second pipe shell, the second pipe shell is arranged at the lower end of the first pipe shell, a second air jet is formed between the lower end face of the first pipe shell and the upper end face of the second pipe shell, and the lower end of the second pipe shell is embedded in the wafer bearing platform.
The technical scheme has the following advantages or beneficial effects:
according to the invention, the drying module and each cleaning module are arranged, so that the cleaning effect of the front side of the wafer can be improved, and the cleanliness is improved; through the arrangement of the cleaning liquid recovery mechanism and the wafer cleaning mechanism, different types of cleaning liquid can be classified and recovered, and the back of the wafer can be cleaned; the front side and the back side of the wafer can be cleaned integrally, and the consistency of double-side cleaning of the wafer is ensured.
Drawings
FIG. 1 is a front view of a single wafer carrier cleaning and drying apparatus according to the present invention;
FIG. 2 is a plan view of a single wafer carrier cleaning and drying apparatus according to the present invention;
FIG. 3 is a schematic structural diagram of a second cleaning module according to the present invention;
FIG. 4 is a schematic view of a portion of the wafer cleaning mechanism of the present invention;
FIG. 5 is a top view of the wafer cleaning mechanism of the present invention;
FIG. 6 is a schematic view showing the internal structure of the cleaning liquid recovery mechanism of the present invention.
In the figure: 1. a cleaning liquid recovery mechanism; 11. an outer housing; 12. a cleaning fluid recovery chamber; 2. a wafer cleaning mechanism; 21. a wafer carrying platform; 22. a wafer support tube; 23. a rotating shaft group; 24. a wafer positioner; 25. a first tubular housing; 26. a liquid spraying pipe fitting; 27. a first air injection port; 28. a second tubular housing; 29. a first wafer stage positioner; 290. a second wafer bearing platform positioner; 3. a wafer drying module; 31. a nitrogen blowing pipe; 4. a first cleaning module; 41. a first head protective case; 5. a second cleaning module; 51. installing a pipe; 52. mounting blocks; 53. a nitrogen nozzle; 54. a first nozzle; 55. a second nozzle; 56. a second head protective case; 6. a third cleaning module; 61. a first purge tube mechanism; 62. a second purge tube mechanism; 63. a third purge line mechanism; 64. a third nozzle protective housing; 7. mounting a plate; 8. and (5) a wafer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
FIG. 1 is a front view of a single wafer carrier cleaning and drying apparatus according to the present invention; FIG. 2 is a plan view of a single wafer carrier cleaning and drying apparatus according to the present invention; FIG. 3 is a schematic structural diagram of a second cleaning module according to the present invention; FIG. 4 is a schematic view of a portion of the wafer cleaning mechanism of the present invention; FIG. 5 is a top view of the wafer cleaning mechanism of the present invention; FIG. 6 is a schematic view showing the internal structure of the cleaning liquid recovery mechanism of the present invention. Referring to fig. 1 to 6, a preferred embodiment of a single wafer carrier cleaning and drying apparatus is shown, which includes a cleaning solution recycling mechanism 1, a wafer cleaning mechanism 2, a wafer drying module 3, a first cleaning module 4, a second cleaning module 5, and a third cleaning module 6, wherein the wafer cleaning mechanism 2 is liftably disposed in the cleaning solution recycling mechanism 1, the first cleaning module 4 is rotatably disposed on one side of the cleaning solution recycling mechanism 1, the second cleaning module 5 is rotatably disposed on the other side of the cleaning solution recycling mechanism 1, the third cleaning module 6 is rotatably disposed at one end of the cleaning solution recycling mechanism 1, and the wafer drying module 3 is disposed between the first cleaning module 4 and the second cleaning module 5. In this embodiment, the cleaning solution recovery mechanism 1 is used for recovering the cleaning solution, and the cleaning action of the wafer is completed in the cleaning solution recovery mechanism 1; wafer wiper mechanism 2 is used for adjusting the position of wafer, also is the back that is used for wasing the wafer simultaneously, and first washing module 4, second washing module 5 and third washing module 6 all are the front that is used for wasing the wafer, and wherein, what first washing module 4 sprayed is the mixed liquid of sulphuric acid and hydrogen peroxide solution, and what second washing module 5 sprayed is the mixed liquid and the nitrogen gas of aqueous ammonia and hydrogen peroxide solution, and wafer drying module 3 blows nitrogen gas for the front of wafer is dry.
Further, as a preferred embodiment, the wafer drying module 3 includes a plurality of nitrogen gas blowing pipes 31, wherein one end of each nitrogen gas blowing pipe 31 is an air outlet end, and the air outlet end is inclined from top to bottom toward the direction close to the wafer cleaning mechanism 2. In this embodiment, as shown in fig. 1, the nitrogen blowing pipe 31 is used for blowing nitrogen along the horizontal direction of the surface of the wafer to quickly discharge the cleaning liquid and the dirt on the surface of the wafer, so as to achieve the effect of drying and cleaning.
Further, as a preferred embodiment, the third cleaning module 6 includes a first cleaning pipe mechanism 61, a second cleaning pipe mechanism 62 and a third cleaning pipe mechanism 63 which are arranged side by side. In this embodiment, as shown in fig. 2, the second cleaning pipe mechanism 62 is located between the first cleaning pipe mechanism 61 and the third cleaning pipe mechanism 63, wherein the first cleaning pipe mechanism 61 can be used for blowing nitrogen, the nozzle on the first cleaning pipe mechanism 61 is located on the upper side of the wafer by rotating the first cleaning pipe mechanism 61, and then the nitrogen is blown, so that the nitrogen is vertically injected to the surface of the wafer, and the first cleaning pipe mechanism 61 in this embodiment is used in cooperation with the wafer drying module 3, so that the cleanliness of the surface of the wafer can be improved. The second cleaning pipe mechanism 62 and the third cleaning pipe mechanism 63 may be used to spray cleaning liquids, such as ultrapure water, hydrofluoric acid, sulfuric acid, hydrogen peroxide, and the like. The first cleaning pipe mechanism 61, the second cleaning pipe mechanism 62 and the third cleaning pipe mechanism 63 in this embodiment are all conventional structures, and will not be described in detail here. The first cleaning pipe mechanism 61, the second cleaning pipe mechanism 62, and the third cleaning pipe mechanism 63 in this embodiment are all rotatable and can be automatically lifted.
Further, as a preferred implementation mode, the cleaning solution recycling device further comprises a mounting plate 7, the cleaning solution recycling mechanism 1 is arranged in the middle of the mounting plate 7, and the wafer drying module 3, the first cleaning module 4, the second cleaning module 5 and the third cleaning module 6 are respectively arranged at the upper end of the mounting plate 7.
Further, as a preferred embodiment, the second cleaning module 5 includes a mounting tube 51, a mounting block 52, a nitrogen nozzle 53, a first nozzle 54 and a second nozzle 55, wherein one end of the mounting tube 51 is connected to the upper end of the mounting plate 7, the other end of the mounting tube 51 is connected to one end of the mounting block 52, and the other end of the mounting block 52 is provided with the nitrogen nozzle 53, the first nozzle 54 and the second nozzle 55. In this embodiment, as shown in fig. 3, the inside of the second nozzle 55 is provided with an ultrasonic oscillation sheet, the ultrasonic oscillation sheet can change the mixed liquid of ammonia water and hydrogen peroxide into a nano-scale water molecule to be sprayed, the second nozzle 55 sprays the mixed liquid of nano-scale ammonia water and hydrogen peroxide, the first nozzle 54 sprays the mixed liquid of large-droplet ammonia water and hydrogen peroxide, and the nitrogen nozzle 53 is used for blowing nitrogen. As shown in fig. 3, the mounting tube 51 is composed of two pipes, the mounting tube 51 is of a "Γ" type structure, and the mounting tube 51 in this embodiment can be driven to rotate by a positive and negative rotation motor. The first cleaning module 4 and the third cleaning module 6 in this embodiment can also be driven to rotate by a forward and reverse rotating motor.
Further, as a preferred embodiment, the device further comprises a nitrogen conveying pipe, a first infusion pipe and a second infusion pipe, wherein the nitrogen conveying pipe, the first infusion pipe and the second infusion pipe are respectively installed in the installation pipe 51, the nitrogen conveying pipe is connected with the nitrogen sprayer 53, the first infusion pipe is connected with the first sprayer 54, and the second infusion pipe is connected with the second sprayer 55.
Further, as a preferred embodiment, the nitrogen gas nozzle 53, the first nozzle 54 and the second nozzle 55 are arranged side by side, the first nozzle 54 is located between the nitrogen gas nozzle 53 and the second nozzle 55, and the nitrogen gas nozzle 53 is inclined from top to bottom in a direction close to the first nozzle 54. In this embodiment, the nitrogen gas sprayed by the nitrogen gas nozzle 53 can keep the surface of the liquid drop to form a nano-scale water film, which can prevent the liquid drop molecules from agglomerating, so that the mixed liquid of ammonia water and hydrogen peroxide can uniformly clean the surface of the wafer. The second cleaning module 5 is used in cooperation with the wafer drying module 3, so that the cleaning effect of the surface of the wafer can be further improved.
Further, as a preferred embodiment, the wafer cleaning mechanism 2 includes a wafer supporting platform 21, a wafer supporting tube 22, a rotating shaft set 23, a first lifting mechanism and a wafer positioner 24, wherein the outer edge of the upper surface of the wafer supporting platform 21 is provided with a plurality of wafer positioners 24, the rotating shaft set 23 and the first lifting mechanism are respectively disposed at the lower end of the wafer supporting platform 21, the first lifting mechanism drives the rotating shaft set 23, the wafer supporting tube 22 penetrates through the rotating shaft set 23 along the axial direction of the rotating shaft set 23, and one end of the wafer supporting tube 22 penetrates through the wafer supporting platform and extends to the upper side of the wafer supporting platform 21. In this embodiment, the wafer carrying platform 21 is used for carrying a wafer, the wafer cleaning operation is completed on the wafer carrying platform 21, and the rotating shaft group 23 is used for controlling the rotation of the wafer carrying platform 21, so that the rotation of the wafer is realized in the cleaning process. The wafer positioner 24 is used to restrain the wafer and position the wafer away from the wafer support platform 21 during cleaning. The wafer supporting pipe 22 is used for injecting nitrogen gas, so that a vacuum area is formed between one end of the wafer supporting pipe 22 and the wafer. The first lifting mechanism is used for driving the wafer platform 21 to lift and lower, and can adjust the height of the wafer platform 21.
Further, as a preferred embodiment, the wafer cleaning mechanism 2 further includes a first tube housing 25 and a liquid spraying tube 26, wherein the first tube housing 25 is disposed at an outer edge of one end of the wafer supporting tube 22, a first gas nozzle 27 is disposed at a middle portion of the first tube housing 25, and the liquid spraying tube 26 is disposed at an upper end of the first tube housing 25. The first gas injection ports 27 are used for injecting nitrogen gas, and as shown in fig. 4, the nitrogen gas injected from the first gas injection ports 27 is injected obliquely, so that the contamination adhered to the back surface of the wafer can be carried away. In this embodiment, each of the liquid ejecting pipe members 26 can eject one kind of cleaning liquid, and the number of the liquid ejecting pipe members 26 can be configured as required. The cleaning liquid sprayed from the spray pipe 26 can be used for cleaning the backside of the wafer.
Further, as a preferred embodiment, the wafer cleaning mechanism 2 further includes a second tube housing 28, the outer edge of one end of the wafer supporting tube 22 is further sleeved with the second tube housing 28, the second tube housing 28 is disposed at the lower end of the first tube housing 25, a second air vent is formed between the lower end surface of the first tube housing 25 and the upper end surface of the second tube housing 28, and the lower end of the second tube housing 28 is embedded in the wafer supporting platform 21. In this embodiment, the second air nozzle is used for blowing nitrogen, as shown in fig. 4, the nitrogen blown by the second air nozzle and the nitrogen blown by the first air nozzle 27 cooperate to form an air flow circulation on the back surface of the wafer, so that the contamination can be effectively taken away, and the contamination can be placed on the surface of the first pipe housing 25 and the surface of the second pipe housing 28. In this embodiment, the stability of the vacuum region between the wafer support tube 22 and the backside of the wafer can also be enhanced by blowing nitrogen through the second gas nozzle. In this embodiment, when the positive wiper mechanism of wafer cleaned the wafer front side, the positive dirt of wafer can pile up in the outer fringe of wafer under the effect of centrifugal force, and through the setting of wafer support tube 22, first air jet 27 and second air jet, can effectually get rid of the dirt of the outer fringe of wafer, can place the positive dirt of wafer and pile up in the outer fringe of wafer.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope and the embodiments of the present invention.
The present invention has the following preferred embodiments based on the above-described embodiments.
Further, as a preferred embodiment, a first wafer stage positioner 29 and a second wafer stage positioner 290 are further included, as shown in fig. 4, the first wafer stage positioner 29 is disposed at a lower end of the wafer stage 21, the second wafer stage positioner 290 is disposed at a lower end of the first wafer stage positioner 29, and the rotating shaft group 23 penetrates through the first wafer stage positioner 29 and the second wafer stage positioner 290 and is connected to the wafer stage 21.
Further, as a preferred embodiment, the cleaning liquid recovery mechanism 1 includes an outer shell 11 and a plurality of cleaning liquid recovery cavities 12 disposed in the outer shell 11, the plurality of cleaning liquid recovery cavities 12 are disposed along an axial direction of the outer shell 11, and the plurality of cleaning liquid recovery cavities 12 are disposed coaxially. The middle parts of the cleaning liquid recovery cavities 12 form an accommodating cavity for installing the wafer cleaning mechanism 2. The first lifting mechanism can be used for driving the wafer bearing platform 21 to drive the wafer to move in the accommodating cavity, so that the wafer bearing platform 21 corresponds to the designated cleaning solution recovery cavity 12, and the recovery of different types of cleaning solutions is realized. In this embodiment, each cleaning solution recycling cavity 12 can recycle one cleaning solution.
Further, as a preferred embodiment, the cleaning device further includes a plurality of liquid discharge pipelines, and each liquid discharge pipeline is connected to one cleaning liquid recovery chamber 12, and is used for discharging the cleaning liquid in the cleaning liquid recovery chamber 12 in time.
Further, as a preferred embodiment, the first cleaning module 4 is composed of a water outlet pipe and a nozzle mechanism.
Further, as a preferred embodiment, the cleaning device further includes a first nozzle protection case 41, wherein one side of the cleaning solution recovery mechanism 1 is provided with the first nozzle protection case 41, the first nozzle protection case 41 is opposite to the first cleaning module 4, the nozzle mechanism in the first cleaning module 4 can be screwed into or out of the first nozzle protection case 41, and the first nozzle protection case 41 is used for protecting the nozzle mechanism of the first cleaning module 4 and also used for collecting the cleaning solution leaked from the nozzle mechanism. When the first cleaning module 4 is not used, the first cleaning module 4 can be rotated, so that the nozzle mechanism enters the first nozzle protection shell 41, and when the first cleaning module 4 is used, the nozzle mechanism can leave the first nozzle protection shell 41 by rotating.
Further, as a preferred embodiment, the cleaning device further includes a second nozzle protection case 56, the other side of the cleaning solution recovery mechanism 1 is provided with the second nozzle protection case 56, and the second nozzle protection case 56 is opposite to the second cleaning module 5. The second head protecting case 56 is used to protect the nitrogen gas head 53, the first head 54 and the second head 55 in the second cleaning module 5.
Further, as a preferred embodiment, the cleaning device further includes a third nozzle protection case 64, the third nozzle protection cases 64 are disposed at one end of the cleaning liquid recovery mechanism 1, and a third nozzle protection case 64 is respectively disposed in the opposite directions of the first cleaning pipe mechanism 61, the second cleaning pipe mechanism 62 and the third cleaning pipe mechanism 63, and the third nozzle protection case 64 is used for protecting the nozzles of the first cleaning pipe mechanism 61, the second cleaning pipe mechanism 62 and the third cleaning pipe mechanism 63.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a single wafer carrier washs drying device, its characterized in that, retrieves mechanism, wafer wiper mechanism, wafer drying module, first washing module, second washing module and third washing module including the washing liquid, wherein, wafer wiper mechanism locates with liftable in the washing liquid retrieves the mechanism, first washing module rotatably locates one side that the mechanism was retrieved to the washing liquid, the second washs the module rotatably locates the opposite side that the mechanism was retrieved to the washing liquid, the third washs the module and rotatably locates the one end that the mechanism was retrieved to the washing liquid, wherein, first washing module with be equipped with between the second washing module the wafer drying module.
2. The apparatus as claimed in claim 1, wherein the wafer drying module comprises a plurality of nitrogen gas blowing pipes, each of the nitrogen gas blowing pipes has an outlet end, and the outlet ends are inclined from top to bottom toward the wafer cleaning mechanism.
3. The single wafer carrier cleaning and drying apparatus of claim 1, wherein the third cleaning module comprises a first cleaning pipe mechanism, a second cleaning pipe mechanism and a third cleaning pipe mechanism arranged side by side.
4. The single wafer carrier cleaning and drying apparatus according to claim 1, further comprising a mounting plate, wherein the cleaning solution recovery mechanism is disposed at a middle portion of the mounting plate, and the wafer drying module, the first cleaning module, the second cleaning module and the third cleaning module are respectively disposed at an upper end of the mounting plate.
5. The single wafer carrier cleaning and drying apparatus according to claim 4, wherein the second cleaning module comprises a mounting pipe, a mounting block, a nitrogen gas shower head, a first shower head and a second shower head, wherein one end of the mounting pipe is connected to an upper end of the mounting plate, the other end of the mounting pipe is connected to one end of the mounting block, and the nitrogen gas shower head, the first shower head and the second shower head are provided at the other end of the mounting block.
6. The single wafer carrier cleaning and drying device according to claim 5, further comprising a nitrogen delivery pipe, a first infusion pipe and a second infusion pipe, wherein the nitrogen delivery pipe, the first infusion pipe and the second infusion pipe are respectively installed in the installation pipe, the nitrogen delivery pipe is connected with the nitrogen sprayer, the first infusion pipe is connected with the first sprayer, and the second infusion pipe is connected with the second sprayer.
7. The single wafer carrier cleaning and drying apparatus of claim 5, wherein the nitrogen showerhead, the first showerhead and the second showerhead are arranged side by side with the first showerhead positioned between the nitrogen showerhead and the second showerhead, the nitrogen showerhead being inclined from top to bottom in a direction approaching the first showerhead.
8. The single-wafer carrier cleaning and drying apparatus according to claim 1, wherein the wafer cleaning mechanism comprises a wafer supporting platform, a wafer supporting tube, a set of rotating shafts, a first lifting mechanism and a wafer positioner, wherein a plurality of wafer positioners are disposed on an outer edge of an upper surface of the wafer supporting platform, the set of rotating shafts and the first lifting mechanism are respectively disposed on a lower end of the wafer supporting platform, the first lifting mechanism drives the set of rotating shafts, the wafer supporting tube penetrates the set of rotating shafts along an axial direction of the set of rotating shafts, and one end of the wafer supporting tube penetrates the wafer supporting platform and extends to an upper side of the wafer supporting platform.
9. The single wafer carrier cleaning and drying apparatus of claim 8, wherein the wafer cleaning mechanism further comprises a first tube housing and a liquid spray tube, wherein the first tube housing is provided at an outer edge of one end of the wafer support tube, a first gas injection port is formed at a middle portion of the first tube housing in an inclined manner, and the liquid spray tube is provided at an upper end of the first tube housing.
10. The single wafer carrier cleaning and drying apparatus of claim 9, wherein the wafer cleaning mechanism further comprises a second tube housing, the second tube housing is further sleeved on an outer edge of one end of the wafer supporting tube, the second tube housing is disposed at a lower end of the first tube housing, a second air jet port is formed between a lower end surface of the first tube housing and an upper end surface of the second tube housing, and a lower end of the second tube housing is embedded in the wafer supporting platform.
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| CN202011630260.9A CN112750734B (en) | 2020-12-30 | 2020-12-30 | Single wafer carrier cleaning and drying device |
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| CN202011630260.9A CN112750734B (en) | 2020-12-30 | 2020-12-30 | Single wafer carrier cleaning and drying device |
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| CN112750734A true CN112750734A (en) | 2021-05-04 |
| CN112750734B CN112750734B (en) | 2023-03-14 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114405909A (en) * | 2021-12-31 | 2022-04-29 | 至微半导体(上海)有限公司 | Control method for effectively achieving rotation and spraying in single-wafer cleaning process |
| CN114405908A (en) * | 2021-12-31 | 2022-04-29 | 至微半导体(上海)有限公司 | Cleaning method suitable for etched wafer chemicals |
| CN114453321A (en) * | 2022-02-25 | 2022-05-10 | 上海普达特半导体设备有限公司 | Single wafer type wafer cleaning device |
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| CN114453321A (en) * | 2022-02-25 | 2022-05-10 | 上海普达特半导体设备有限公司 | Single wafer type wafer cleaning device |
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