CN109712865A - A kind of wet chemical etching technique device and wet chemical etch process - Google Patents
A kind of wet chemical etching technique device and wet chemical etch process Download PDFInfo
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- CN109712865A CN109712865A CN201811619524.3A CN201811619524A CN109712865A CN 109712865 A CN109712865 A CN 109712865A CN 201811619524 A CN201811619524 A CN 201811619524A CN 109712865 A CN109712865 A CN 109712865A
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Abstract
The present invention relates to the wafer cleaning technical fields of semiconductor crystal wafer manufacture there is technical issues that wafer more particularly, to a kind of wet chemical etching technique device and wet chemical etch process to alleviate existing wet chemical etching technique device.The device includes the first swing arm, the second swing arm and third swing arm；The working space for setting and being formed for holding wafer is enclosed in first swing arm, the second swing arm and third swing arm；First swing arm, the second swing arm and third swing arm are respectively used to spray medical fluid, million sound water and nitrogen to wafer top surface.The first swing arm for spraying medical fluid, the second swing arm of million sound water of spray and the third swing arm of spray nitrogen are integrated in inside same device by the present invention, chemical attack, the cleaning of million sound water, these three dry techniques of nitrogen can be completed in portion to wafer in the device, eliminate transportational process of the wafer between three techniques, the secondary pollution of wafer during transportation is avoided, is improved work efficiency.
Description
Technical field
The present invention relates to the wafer cleaning technical fields of semiconductor crystal wafer manufacture, more particularly, to a kind of wet chemical etching technique
Device and wet chemical etch process.
Background technique
In integrated circuit fabrication process, the wet processing process step of multiple tracks wafer is contained.So-called wet processing, just
It is that wafer is impregnated or rinsed using liquid chemicals such as soda acid organic matters, to reach clean the surface particle, removal instead
The purpose of emergencing copolymer, etching surface film layer.
Etching is one of the critical process in integrated circuit fabrication process, and etching is that have selection with method chemically or physically
The process of the ground removal unwanted material of silicon chip surface.The quality of etching quality directly affects the yield rate and performance of chip.?
In semiconductor processing technology there are two types of common etching technics: wet chemical etching technique and dry etching.Wet chemical etching technique is extensive
It applies in semiconductor fabrication process.It is the material for removing crystal column surface in the way of chemically reacting by chemical corrosion liquid.?
In wafer manufacturing process, wet chemical etch process is sprayed by the way that wafer is immersed in corrosive liquid, or to crystal column surface
The method of corrosive liquid is drenched to realize.Immersion etching process is that wafer is immersed into corrosive liquid, the temperature of corrosive liquid and is stirred
It mixes and is affected to corrosion rate.Fountain etching process is by providing stable new corrosive liquid to crystal column surface, thus
Corrosion rate is higher, and erosion uniformity is than immersion process stabilizing.
In fountain etching process, the machined surface of wafer needs to carry out chemical attack, the cleaning of million sound water, nitrogen drying.It is existing
Have in technology, the different device of above three process requirement is completed, and will cause the two of wafer in device replacement and transportational process
Secondary pollution, influences the cleaning quality of wafer, and working efficiency is low.Meanwhile during spray after spray liquid is sprayed to crystal column surface,
Since various spray liquids mix, lead to not recycle, the usage amount of spray liquid is larger, and raw material availability is low.
Therefore, existing wet chemical etching technique device there is technical issues that wafer.
Summary of the invention
It is existing to alleviate the purpose of the present invention is to provide a kind of wet chemical etching technique device and wet chemical etch process
Wet chemical etching technique device there is technical issues that wafer.
In order to solve the above technical problems, technical solution provided by the invention is:
A kind of wet chemical etching technique device, including the first swing arm, the second swing arm and third swing arm；
It is empty that the work set to be formed for holding wafer is enclosed in first swing arm, second swing arm and the third swing arm
Between；
First swing arm, second swing arm and the third swing arm are respectively used to spray medicine to the wafer top surface
Liquid, million sound water and nitrogen.
Further,
First swing arm, second swing arm and the third swing arm are arranged around the center of the wafer and end is equal
It is provided with nozzle, and respective nozzle can turn to above the wafer.
Further,
The wet chemical etching technique device further includes the liquid medicine collecting shell in the working space, the medical fluid
Assembling supporting member bottom is connect with the first lifting assembly；The liquid medicine collecting shell can be under the drive of first lifting assembly
Lifting is realized to collect and be isolated the medical fluid for being sprayed to the crystal column surface.
Further,
First lifting assembly includes connecting rod and the first cylinder slide unit；
Described connecting rod one end is connect with the liquid medicine collecting housing bottom, the work of the other end and the first cylinder slide unit
Moved end connection；
The fixing end of the first cylinder slide unit is installed on bottom of device；
The movable end of the first cylinder slide unit can be moved along the length direction of the connecting rod, and drive the medical fluid
Assembling supporting member lifting.
Further,
The wet chemical etching technique device further includes that can accommodate first swing arm, second swing arm and described
The shell of three swing arms, the housing side are equipped with feed inlet.
Further,
The wet chemical etching technique device further includes the load carrier positioned at the working space, the load carrier packet
Include objective table and motor；
The output axis connection of the objective table and the motor, and can be around own axis；The objective table is used for
Support the wafer.
Further,
The objective table is set as vacuum chuck.
Further,
The wet chemical etching technique device further includes first jet mechanism, and the nozzle of the first jet mechanism is towards institute
The top surface for stating wafer, for spraying DI water to the top surface of the wafer.
Further,
The wet chemical etching technique device further includes second nozzle mechanism, and the nozzle of the second nozzle mechanism is towards institute
The bottom surface for stating wafer, for spraying DI water or the nitrogen to the bottom surface of the wafer.
A kind of wet chemical etch process using the wet chemical etching technique device, comprising:
The liquid medicine collecting shell rises；
The backward wafer top surface sprays the medical fluid above the nozzle rotation of first swing arm to the wafer；
Decline after the liquid medicine collecting shell collection medical fluid extraction raffinate and exits；
The backward wafer top surface sprays the million sound water above the nozzle rotation of second swing arm to the wafer；
The backward wafer top surface sprays the nitrogen above the nozzle rotation of the third swing arm to the wafer.
In conjunction with above technical scheme, the beneficial effect that the present invention reaches is:
Wet chemical etching technique device provided by the invention will spray the first swing arm of medical fluid, spray the second swing arm of million sound water
And the third swing arm of spray nitrogen is integrated in inside same device, chemical attack, million sound can be completed in portion to wafer in the device
Water cleaning, these three dry techniques of nitrogen, eliminate transportational process of the wafer between three techniques, avoid wafer and transporting
Secondary pollution in the process, improves work efficiency.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is wet chemical etching technique apparatus structure schematic diagram provided in an embodiment of the present invention；
Fig. 2 is the top view of wet chemical etching technique device provided in an embodiment of the present invention；
Fig. 3 is the cross-sectional view of wet chemical etching technique device provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of wet chemical etching technique device Chinese medicine liquid assembling supporting member provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the first swing arm in wet chemical etching technique device provided in an embodiment of the present invention.
Icon: 100- shell；The first swing arm of 200-；The second swing arm of 300-；400- third swing arm；500- wafer；600- is held
Mounted mechanism；700- first jet mechanism；800- second nozzle mechanism；900- exhaust duct；110- liquid medicine collecting shell；111- row
Put mouth；120- lifting assembly；121- connecting rod；122- cylinder slide unit；130- feed inlet；210- nozzle；220- rotating mechanism；
221- central axis；222- rotating arm；223- first motor；230- nozzle rotation；The first driving assembly of 231-；232- is actively
Wheel；233- driven wheel；234- transmission belt；235- driven shaft；240- elevating mechanism；The second driving assembly of 241-；610- objective table；
620- motor；The first fixing seat of 710-；720- first jet；730- shaft；The second fixing seat of 810-；820- second nozzle.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Embodiment 1 to embodiment 2 is described in detail with reference to the accompanying drawing.
Embodiment 1
A kind of wet chemical etching technique device is present embodiments provided, please with reference to Fig. 1 to Fig. 5.Fig. 1 is that the present invention is implemented
The wet chemical etching technique apparatus structure schematic diagram that example provides；Fig. 2 is wet chemical etching technique device provided in an embodiment of the present invention
Top view；Fig. 3 is the cross-sectional view of wet chemical etching technique device provided in an embodiment of the present invention；Fig. 4 provides for the embodiment of the present invention
Wet chemical etching technique device Chinese medicine liquid assembling supporting member structural schematic diagram；Fig. 5 is wet chemistry provided in an embodiment of the present invention
The structural schematic diagram of first swing arm in corrosion device.
Wet chemical etching technique device includes the first swing arm 200, the second swing arm 300 and third swing arm 400；First swing arm 200,
The working space for setting and being formed for holding wafer 500 is enclosed in second swing arm 300 and third swing arm 400；First swing arm 200, second pendulum
Arm 300 and third swing arm 400 are respectively used to spray medical fluid, million sound water and nitrogen to 500 top surface of wafer.
Wet chemical etching technique device provided in this embodiment will spray the of the first swing arm 200 of medical fluid, million sound water of spray
Two swing arms 300 and the third swing arm 400 for spraying nitrogen are integrated in inside same device, and portion can be complete in the device for wafer 500
At chemical attack, the cleaning of million sound water, these three dry techniques of nitrogen, transport of the wafer 500 between three techniques is eliminated
Journey avoids the secondary pollution of wafer 500 during transportation, improves work efficiency.
In the optinal plan of the present embodiment, more preferably,
First swing arm 200, the second swing arm 300 and third swing arm 400 are around the setting of the center of wafer 500 and end is respectively provided with
There is nozzle 210, and respective nozzle 210 can turn to 500 top of wafer.First swing arm 200, the second swing arm 300 and
Three swing arms 400 can be uniformly arranged around the center of wafer 500, and nozzle 210 can turn to 500 top of wafer to wafer 500
Top surface sprayed.But not limited to this, other, which can be realized respective nozzle 210, can turn to the arrangement of 500 top of wafer
Mode belongs to the present embodiment scope of disclosure.
It should be noted that the first swing arm 200, the second swing arm 300 are identical with the structure of third swing arm 400, it is only right here
The structure of first swing arm 200 is specifically introduced.
In view of the nozzle 210 of the first swing arm 200 needs uniformly to spray medical fluid to 500 top surface of wafer, setting rotation here
Rotation mechanism 220 drives nozzle 210 to swing in 500 top surface of wafer.Rotating mechanism 220 includes central axis 221, rotating arm 222 and the
One motor 223；The output axis connection of central axis 221 and first motor 223, and can be around own axis；Rotating arm 222 is pacified
Loaded on central axis 221, and central axis 221 can be followed to rotate；Nozzle 210 is installed on the separate central axis 221 of rotating arm 222
One end.First motor 223 drives central axis 221 to rotate forward, and central axis 221 drives rotating arm 222 and nozzle 210 to rotate clockwise；
First motor 223 drives central axis 221 to invert, and central axis 221 drives rotating arm 222 and nozzle 210 to rotate counterclockwise.Pass through
The variation of 222 moving region of rotating arm is realized in the positive and negative rotation of one motor 223, so that nozzle 210 being capable of Fang Yun on wafer 500
It is dynamic, realize the uniform spray of medical fluid, while avoiding medical fluid from being sprayed to other regions to cause to waste.
In order to further realize the effect uniformly sprayed, mode one are as follows: be equipped with nozzle rotation 230 in rotating arm 222
To drive 210 rotation of nozzle.Nozzle rotation 230 includes the first driving assembly 231, driving wheel 232, driven wheel 233, transmission
Band 234 and driven shaft 235；Driving wheel 232 is set to the output end of the first driving assembly 231, and can be around own axis；
Transmission belt 234 is engaged with driving wheel 232 and driven wheel 233；Driven shaft 235 and driven wheel 233 are rotatablely connected；Nozzle 210 rotates
It is installed on driven shaft 235.First driving assembly 231 drive driving wheel 232 rotate, driving wheel 232 by transmission belt 234 drive from
Driving wheel 233 rotates, and the driven shaft 235 being rotatablely connected with driven wheel 233 also rotates with it, and nozzle 210 is driven to rotate.It needs
Bright, the first driving assembly 231 can be set to the second motor, may be set to be central axis 221.It is driving wheel 232, driven
Wheel 233, transmission belt 234 may be arranged as chain conveyer.
In order to further realize the effect uniformly sprayed, mode two are as follows: wet chemical etching technique device further includes being located at work
The load carrier 600 in space, load carrier 600 include objective table 610 and motor 620；The output of objective table 610 and motor 620
Axis connection, and can be around own axis；Objective table 610 is used to support wafer 500.Motor 620 being capable of driving objective table 610
Rotation, and the wafer 500 being further driven on objective table 610 rotates, so as to be sprayed to the medical fluid of 500 top surface of wafer, million sound water
It is more uniform with nitrogen.Wafer 500 is detached from objective table 610 in rotary course in order to prevent, sets vacuum for objective table 610
Sucker, vacuum chuck utilize pressure adsorption wafer 500, and wafer 500 is prevented to be detached from.
In addition, for the ease of adjusting the spray distance of nozzle 210 and 500 top surface of wafer, here provided with elevating mechanism
240, so that nozzle 210 and rotating arm 222 can be gone up and down.Elevating mechanism 240 include the second driving assembly 241, central axis 221 with
The output axis connection of second driving assembly 241, the second driving assembly 241 can drive central axis 221 to transport along length direction
It is dynamic.It should be noted that the second driving assembly 241 can be set to third motor, cylinder may be set to be.Elevating mechanism
240 are able to drive the lifting of rotating arm 222, are sprayed so that nozzle 210 moves to suitable position.
In the optinal plan of the present embodiment, more preferably,
Liquid medicine collecting shell 110 is equipped in working space to collect medical fluid and separate medical fluid and million sound water.Specifically
For, 110 bottom of liquid medicine collecting shell is connect with lifting assembly 120；Lifting assembly 120 is able to drive liquid medicine collecting shell 110
It goes up and down (specifically referring to Fig. 4), when the first swing arm 200 sprays medical fluid to 500 top surface of wafer, lifting assembly 120 drives medical fluid
Assembling supporting member 110 rises, and liquid medicine collecting shell 110 is paperwrapped in outside wafer 500, is sprayed to the medical fluid extraction raffinate of 500 top surface of wafer
It flows to inside liquid medicine collecting shell 110.After medical fluid sprays, lifting assembly 120 drives liquid medicine collecting shell 110 to decline,
It is sprayed to outside the million sound water flowings to liquid medicine collecting shell 110 on 500 surface of wafer.More preferably, 110 bottom of liquid medicine collecting shell
Portion is symmetrically arranged with two lifting assemblies 120 to guarantee even support liquid medicine collecting shell 110.
Wherein, the specific structure of lifting assembly 120 are as follows: lifting assembly 120 includes connecting rod 121 and cylinder slide unit 122；Even
121 one end of extension bar is connect with 110 bottom of liquid medicine collecting shell, and the other end is connect with the movable end of cylinder slide unit 122；Cylinder slide unit
122 fixing end is installed on bottom of device.The movable end of cylinder slide unit 122 can be moved along the length direction of connecting rod 121, and
Liquid medicine collecting shell 110 is driven to go up and down.
The specific structure of liquid medicine collecting shell 110 are as follows: liquid medicine collecting shell 110 can be, but not limited to be set as cylindric knot
Structure.110 bottom of liquid medicine collecting shell is equipped with the discharge outlet 111 for discharging medical fluid, and discharge outlet 111 and medical liquid recovering device connect
Logical, the medical fluid extraction raffinate in liquid medicine collecting shell 110 is discharged into medical liquid recovering device through discharge outlet 111.In addition, for the ease of liquid medicine jet
Leaching is equipped with avoid holes, the medical fluid of the first swing arm 200 spray is through avoid holes to 500 top surface of wafer at the top of liquid medicine collecting shell 110
Into inside liquid medicine collecting shell 110,500 top surface of wafer is then moved to.
In the optinal plan of the present embodiment, more preferably,
Wet chemical etching technique device further includes that can accommodate the first swing arm 200, the second swing arm 300 and third swing arm 400
Shell 100, chemical attack, the cleaning of million sound water, these three dry techniques of nitrogen carry out in shell 100, while 100 energy of shell
Enough working space is isolated from the outside is come, to reduce the pollution to wafer 500.The side of shell 100 is equipped with feed inlet 130,
When manipulator transports wafer 500, wafer 500 is entered inside shell 100 by the feed inlet 130 for being located at 100 side of shell.
It is equipped with exhaust duct 900 in 100 side of shell, exhaust duct 900 is connected to shell 100, for shell 100 to be discharged
Interior gas.
It needs when chemical attack, the cleaning of million sound water, these three dry techniques of nitrogen switch to 500 surface spraying DI of wafer
Water (i.e. deionized water) is rinsed, therefore is arranged towards the first jet mechanism 700 of 500 top surface of wafer to the top of wafer 500
Face sprays DI water.First jet mechanism 700 includes the first fixing seat 710 and first jet 720；First fixing seat 710 is installed on
100 inner wall of shell；720 one end of first jet is installed on the first fixing seat 710, and the other end is extended obliquely downward to wafer 500
Side.Wherein, first jet 720 is set as slim cylindrical structure, and first jet 720 passes through the avoid holes of liquid medicine collecting shell 110,
Then extend to 500 top of wafer.Further, it is connected between first jet 720 and the first fixing seat 710 by shaft 730,
First jet 720 can be rotated around the axis of shaft 730, to adjust the spray direction of first jet 720.Due to first jet
Mechanism 700, the first swing arm 200, the second swing arm 300 and third swing arm 400 are intended to spray medical fluid to 500 top surface of wafer, so will
First jet mechanism 700, the first swing arm 200, the second swing arm 300 and third swing arm 400 are laid around the center of wafer 500
It sets, to prevent movement interference.
Wafer 500 only corrodes top surface, when carrying out chemical attack, the cleaning of million sound water, nitrogen drying to 500 top surface of wafer,
Need to 500 bottom surface of wafer spray DI water be isolated medical fluid and million sound water or spray nitrogen to dry 500 bottom surface of wafer, therefore,
It is arranged and sprays DI water or nitrogen towards the second nozzle mechanism 800 of 500 bottom surface of wafer to the bottom surface of wafer 500.It needs to illustrate
It is to be uniformly arranged around 500 center of wafer there are two second nozzle mechanism 800, sprays DI water and nitrogen to 500 bottom surface of wafer respectively
Gas.Second nozzle mechanism 800 includes the second fixing seat 810 and second nozzle 820；Second fixing seat 810 is installed on shell 100
Inner wall；820 one end of second nozzle is installed on the second fixing seat 810, and the other end, which tilts upward, extends to 500 lower section of wafer.
Embodiment 2
A kind of wet chemical etch process using the wet chemical etching technique device is present embodiments provided, please together
Referring to figs. 1 to Fig. 5.Fig. 1 is wet chemical etching technique apparatus structure schematic diagram provided in an embodiment of the present invention；Fig. 2 is that the present invention is real
The top view of the wet chemical etching technique device of example offer is provided；Fig. 3 is wet chemical etching technique device provided in an embodiment of the present invention
Cross-sectional view；Fig. 4 is the structural schematic diagram of wet chemical etching technique device Chinese medicine liquid assembling supporting member provided in an embodiment of the present invention；Fig. 5
For the structural schematic diagram of the first swing arm in wet chemical etching technique device provided in an embodiment of the present invention.
Wet chemical etch process includes:
Liquid medicine collecting shell 110 rises；
The nozzle 210 of first swing arm 200 turns to backward 500 top surface of the wafer spray medical fluid in 500 top of wafer；
Decline after the collection medical fluid extraction raffinate of liquid medicine collecting shell 110 and exits；
First jet mechanism 700 is rinsed 500 surface of wafer to 500 top surface of wafer spray DI water；
The nozzle 210 of second swing arm 300 turns to backward 500 top surface of wafer in 500 top of wafer and sprays million sound water；
The nozzle 210 of third swing arm 400 turns to backward 500 top surface of the wafer spray nitrogen in 500 top of wafer.
Wet chemical etch process provided in this embodiment will spray medical fluid, million sound water of spray and spray three works of nitrogen
Skill is integrated in inside same device, and chemical attack can be completed in portion to wafer 500 in the device, million sound water clean, nitrogen dries this
Three techniques eliminate transportational process of the wafer 500 between three techniques, avoid two of wafer 500 during transportation
Secondary pollution, improves work efficiency.
In addition, lifting assembly 120 drives liquid medicine collecting shell when the first swing arm 200 sprays medical fluid to 500 top surface of wafer
110 rise, and liquid medicine collecting shell 110 is paperwrapped in outside wafer 500, and the medical fluid extraction raffinate for being sprayed to 500 top surface of wafer flows to medicine
Inside liquid assembling supporting member 110.After medical fluid sprays, lifting assembly 120 drives liquid medicine collecting shell 110 to decline, and is sprayed to crystalline substance
Outside the million sound water flowings to liquid medicine collecting shell 110 on 500 surfaces of circle.The present embodiment realizes the separation of medical fluid and million sound water,
It can be recycled after medical fluid extraction raffinate and the recycling of million sound water extraction raffinates.
In view of wafer 500 only corrodes top surface, therefore, to 500 top surface of wafer carry out chemical attack, million sound water cleaning with
And when the cleaning of DI water, second nozzle mechanism 800 is to 500 bottom surface of wafer spray DI water to protect 500 bottom surface of wafer not to be corroded.
When carrying out nitrogen drying to 500 top surface of wafer, second nozzle mechanism 800 sprays nitrogen to 500 bottom surface of wafer.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of wet chemical etching technique device, which is characterized in that including the first swing arm, the second swing arm and third swing arm；
The working space for setting and being formed for holding wafer is enclosed in first swing arm, second swing arm and the third swing arm；
First swing arm, second swing arm and the third swing arm are respectively used to spray medical fluid, million to the wafer top surface
Sound water and nitrogen.
2. wet chemical etching technique device according to claim 1, which is characterized in that first swing arm, second pendulum
Arm and the third swing arm surround the center setting of the wafer and end is provided with nozzle, and respective nozzle can turn
It moves to the wafer.
3. wet chemical etching technique device according to claim 2, which is characterized in that further include being located in the working space
Liquid medicine collecting shell, the liquid medicine collecting housing bottom connect with lifting assembly；The liquid medicine collecting shell can be described
Lifting is realized under the drive of lifting assembly to collect and be isolated the medical fluid for being sprayed to the crystal column surface.
4. wet chemical etching technique device according to claim 3, which is characterized in that the lifting assembly include connecting rod and
Cylinder slide unit；
Described connecting rod one end is connect with the liquid medicine collecting housing bottom, and the movable end of the other end and the cylinder slide unit connects
It connects；
The fixing end of the cylinder slide unit is installed on bottom of device；
The movable end of the cylinder slide unit can be moved along the length direction of the connecting rod, and drive the liquid medicine collecting shell
Lifting.
5. wet chemical etching technique device according to claim 1, which is characterized in that further include that can accommodate first pendulum
Arm, second swing arm and the third swing arm shell, the housing side be equipped with feed inlet.
6. wet chemical etching technique device according to claim 1, which is characterized in that further include being located at the working space
Load carrier, the load carrier include objective table and motor；
The output axis connection of the objective table and the motor, and can be around own axis；The objective table is used to support
The wafer.
7. wet chemical etching technique device according to claim 6, which is characterized in that the objective table is set as vacuum suction
Disk.
8. wet chemical etching technique device according to claim 1, which is characterized in that it further include first jet mechanism, it is described
The nozzle of first jet mechanism is towards the top surface of the wafer, for spraying DI water to the top surface of the wafer.
9. wet chemical etching technique device according to claim 1, which is characterized in that it further include second nozzle mechanism, it is described
The nozzle of second nozzle mechanism is towards the bottom surface of the wafer, for spraying DI water or the nitrogen to the bottom surface of the wafer.
10. a kind of wet chemical etch process using such as the described in any item wet chemical etching technique devices of claim 3-4,
It is characterized in that, comprising:
The liquid medicine collecting shell rises；
The backward wafer top surface sprays the medical fluid above the nozzle rotation of first swing arm to the wafer；
Decline after the liquid medicine collecting shell collection medical fluid extraction raffinate and exits；
The backward wafer top surface sprays the million sound water above the nozzle rotation of second swing arm to the wafer；
The backward wafer top surface sprays the nitrogen above the nozzle rotation of the third swing arm to the wafer.
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| CN112750734A (en) * | 2020-12-30 | 2021-05-04 | 上海至纯洁净系统科技股份有限公司 | Single wafer carrier cleaning and drying device |
| CN112845298A (en) * | 2020-12-31 | 2021-05-28 | 至微半导体(上海)有限公司 | Nitrogen protection cleaning method for nano wafer product |
| CN113020078A (en) * | 2021-03-25 | 2021-06-25 | 长江存储科技有限责任公司 | Wafer cleaning device and wafer cleaning method |
| CN113118099A (en) * | 2019-12-31 | 2021-07-16 | 盛美半导体设备(上海)股份有限公司 | Rotary spray head, cleaning equipment and cleaning method |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63233528A (en) * | 1987-03-20 | 1988-09-29 | Mitsubishi Electric Corp | Development of semiconductor wafer |
| CN101414549A (en) * | 2007-10-17 | 2009-04-22 | 株式会社荏原制作所 | Substrate cleaning apparatus |
| CN101773917A (en) * | 2010-03-05 | 2010-07-14 | 上海集成电路研发中心有限公司 | Silicon slice cleaning device and method |
| CN104014497A (en) * | 2013-02-28 | 2014-09-03 | 细美事有限公司 | Nozzle assembly, substrate treatment apparatus, and method of treating substrate |
| CN205015612U (en) * | 2015-09-06 | 2016-02-03 | 中芯国际集成电路制造(北京)有限公司 | Shoot out device |
| US20160247697A1 (en) * | 2015-02-25 | 2016-08-25 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
| CN206059349U (en) * | 2016-05-13 | 2017-03-29 | 上海华力微电子有限公司 | The medicine liquid spray device of monolithic wet work |
| CN106711062A (en) * | 2015-11-17 | 2017-05-24 | 沈阳芯源微电子设备有限公司 | Technological reaction chamber air flow field realizing device and realizing method thereof |
| CN107258011A (en) * | 2014-10-31 | 2017-10-17 | 维克精密表面处理有限责任公司 | The system and method for performing wet etching process |
| CN108475630A (en) * | 2016-01-25 | 2018-08-31 | 株式会社斯库林集团 | Substrate board treatment and substrate processing method using same |
| US20180350594A1 (en) * | 2015-11-16 | 2018-12-06 | Tokyo Electron Limited | Coating Film Forming Method, Coating Film Forming Apparatus, and Storage Medium |
-
2018
- 2018-12-27 CN CN201811619524.3A patent/CN109712865B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63233528A (en) * | 1987-03-20 | 1988-09-29 | Mitsubishi Electric Corp | Development of semiconductor wafer |
| CN101414549A (en) * | 2007-10-17 | 2009-04-22 | 株式会社荏原制作所 | Substrate cleaning apparatus |
| CN101773917A (en) * | 2010-03-05 | 2010-07-14 | 上海集成电路研发中心有限公司 | Silicon slice cleaning device and method |
| CN104014497A (en) * | 2013-02-28 | 2014-09-03 | 细美事有限公司 | Nozzle assembly, substrate treatment apparatus, and method of treating substrate |
| CN107258011A (en) * | 2014-10-31 | 2017-10-17 | 维克精密表面处理有限责任公司 | The system and method for performing wet etching process |
| US20160247697A1 (en) * | 2015-02-25 | 2016-08-25 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
| CN205015612U (en) * | 2015-09-06 | 2016-02-03 | 中芯国际集成电路制造(北京)有限公司 | Shoot out device |
| US20180350594A1 (en) * | 2015-11-16 | 2018-12-06 | Tokyo Electron Limited | Coating Film Forming Method, Coating Film Forming Apparatus, and Storage Medium |
| CN106711062A (en) * | 2015-11-17 | 2017-05-24 | 沈阳芯源微电子设备有限公司 | Technological reaction chamber air flow field realizing device and realizing method thereof |
| CN108475630A (en) * | 2016-01-25 | 2018-08-31 | 株式会社斯库林集团 | Substrate board treatment and substrate processing method using same |
| CN206059349U (en) * | 2016-05-13 | 2017-03-29 | 上海华力微电子有限公司 | The medicine liquid spray device of monolithic wet work |
Non-Patent Citations (1)
| Title |
|---|
| 庞伟: "高压水射流清洗技术的探讨 ", 《农机化研究》 * |
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| CN112750734A (en) * | 2020-12-30 | 2021-05-04 | 上海至纯洁净系统科技股份有限公司 | Single wafer carrier cleaning and drying device |
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