TWI505878B - Atomization spray device for wafer cleaning - Google Patents

Description

Cleaning atomization spraying device

The present invention relates to the field of semiconductor wafer process technology, and more particularly to a cleaning atomization spray device.

This application claims the benefit of priority to the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit.

There are hundreds of cleaning processes in the manufacturing process of the integrated circuit. In order to ensure the cleanliness of the surface of the wafer material, the cleaning process accounts for 30% of the entire manufacturing process. The wafer refers to a tantalum of a pure tantalum substrate and a tantalum with a copper interconnect structure. According to statistics, each 200mm diameter 矽 substrate wafer consumes 5 tons of high-purity deionized water throughout the manufacturing process, plus the cost of other various consumables in cleaning, which will be a very high number.

Further statistics show that more than 50% of the loss in the manufacture of the entire semiconductor component is caused by surface contamination and incomplete cleaning. If the particle contamination causes poor contact between the photoresist and the mask, the film and the reticle are damaged during the alignment and exposure process, causing the resolution to decrease, causing pattern defects such as pinholes and small islands. During the exposure process, if particles are adhered to the reticle or the photoresist film, the pattern may be defective or bridged after the transfer of the pattern, causing the circuit to be broken or short-circuited, respectively.

At present, the cleaning equipment for copper interconnect wafers is mainly based on rotary jet type, that is, the wafer is fixed on the rotating chuck of the washing machine, and is transported with the chuck at high speed. Moving, there is a nozzle spray cleaning liquid and deionized water above the chuck. When the jetted cleaning fluid impacts the cymbal at a high flow rate, a physical force is generated. The use of jets and the centrifugal force generated by wafer rotation ensure efficient cleaning with reduced amounts of chemical and deionized water.

However, with the rapid development of integrated circuits, especially the line width of copper interconnects is further reduced, the requirements for cleaning technology are getting higher and higher, which makes the cleaning process of copper interconnect surfaces difficult with the reduction of line width. getting bigger. However, the conventional cleaning and spraying technology has large-sized droplets or jets, and the damage to the pattern on the wafer surface of 65 nm and below is more serious, and the utilization rate of cleaning liquid and deionized water is low, resulting in resources. Extremely wasteful.

The technical problem to be solved by the present invention is to provide a cleaning atomization spraying device which is simple in structure and realizes spraying ultrafine atomized droplets, so as to overcome the simple atomization mechanism to generate large-sized droplets or jets, for 65 nm and The wafer surface pattern of the following processes causes serious damage, low utilization of cleaning liquid and deionized water, and the like.

To achieve the above object, the present invention provides a cleaning atomizing spray device comprising: an upper casing, a lower casing connected to the upper casing; the upper casing being a second-order cylindrical shape including a first-order casing And a second-stage housing having a cross-sectional area smaller than a cross-sectional area of the second-stage housing, wherein the second-stage housing is provided with a transducer; both sidewalls of the lower housing A second venting hole is disposed, and a center of the lower casing is provided with an atomizing spray through hole, and the second vent hole communicates with the atomizing spray through hole and has an angle.

Further, the transducer includes a transducer body having a cylindrical shape and a plurality of first vent holes on a surface thereof, and a coupling layer fixed to the inside of the transducer body by a coupling layer supporting member .

Further, the coupling layer includes a piezoelectric crystal and a coupling piece, and the piezoelectric crystal is connected to the coupling piece through a conductive paste.

Furthermore, the coupling piece is made of a single medium or a plurality of mediums having a thickness of an integral multiple of 1/4 wavelength.

Further, the cleaning atomizing spray device further includes a sealing ring disposed on a lower surface of the coupling layer for sealing the coupling layer and the coupling layer supporting member.

Further, one side of the first-stage housing is provided with an air inlet hole, and one side of the second-stage housing is provided with a liquid inlet hole.

Further, an angle between the second vent hole and the atomizing spray through hole is 20-70°.

Further, a vertical distance between the lower surface of the coupling layer and the upper surface of the atomizing spray through hole of the lower casing is 1 mm to 10 mm.

Further, the distance from the side wall of the transducer body to the inner wall of the second-order housing in the upper casing is 1 mm to 10 mm.

Further, the first vent hole has a hole diameter of 1-3 mm, which is sequentially arranged on the transducer body in the circumferential direction from top to bottom.

As described above, the cleaning atomizing spray device of the present invention has a simple structure and high integration, and can effectively spray the ultra-micro atomized droplets, and effectively clean the wafer without damaging the surface pattern of the wafer, and Maximum water conservation.

The above and other features and advantages of the present invention will become more apparent from the description of the appended claims.

The features and embodiments of the present invention will be described in detail below with reference to the drawings and embodiments, which are sufficient to enable those skilled in the art to fully understand the technical means to which the present invention solves the technical problems, and The achievable effects of the present invention will be explained by the same reference numerals.

Referring to Figures 1 to 5, the cleaning atomizing spray device of the present invention comprises: an upper casing 2 and a lower casing 10 joined together by threading or other connection, the upper casing 2 being made of PVDF or other corrosion resistant and strong Made of a better non-metallic material. The upper casing 2 is a second-order cylindrical shape, and includes a first-stage casing 21 and a second-stage casing 22, the cross-sectional area of the first-stage casing 21 being smaller than the cross-sectional area of the second-stage casing 22; The step housing 21 is provided with a cable connector 1 connectable to a power amplifier (not shown). The second step housing 22 is provided with a transducer, and the transducer comprises a transducer body 4 and a coupling layer 8. The first step housing 21 is provided with an air inlet 14 , and the second step housing 22 is provided with a liquid inlet hole 13 .

The upper surface of the second-stage housing 22 is provided with a connecting hole 3 for fixing the transducer body 4 by means of a bolt, a connecting nail or the like. The transducer body 4 is cylindrical and evenly disposed on the side wall of the surface. a plurality of first vent holes 6 arranged in the circumferential direction from top to bottom in the transducer main body On body 4. The first vent hole 6 has a hole diameter of 1 mm to 3 mm, and its shape is preferably circular, fan-shaped or triangular. The first venting opening 6 can provide a gas source for pneumatic atomization to the internal transducer of the megasonic system, and convert the liquid flowing into the upper casing into a continuous turbulent flow, providing cooling function for the megasonic system and The inside of the atomizing spray device functions to purify and dry. The transducer body 4 is internally provided with a coupling layer 8, which is fixed to the inside of the transducer body 4 by a coupling layer supporting member 5, as shown in Figs. 1, 4 and 5. Wherein, the distance from the side wall of the transducer body 4 to the inner wall of the second-order housing 22 in the upper casing 2 is 1 mm to 10 mm, and the distance can make the liquid become a film as much as possible under the premise of ensuring the injection flow rate, which is more advantageous in Split into smaller droplets under mega oscillations.

The coupling layer 8 includes: a piezoelectric crystal 7 and a coupling piece; the piezoelectric crystal 7 is commonly used as a polarization-treated lead zirconate titanate, which is tightly bonded to the coupling piece by a conductive adhesive, wherein the coupling piece Made of a single medium or a multi-media, the thickness is an integral multiple of 1/4 wavelength, and the upper surface thereof can be connected by a screw crimping cable. In addition, the cleaning atomizing spray device further includes a sealing ring 12 provided on the lower surface of the coupling layer 8 for sealing the coupling layer 8 and the coupling layer supporting member 5.

The two opposite sidewalls of the lower casing 10 are provided with a second venting hole 9, and a surface perpendicular to the opposite sidewall is provided with a screw hole 15 through which the cleaning atomizing spray device can be fixed to a certain component, for example Fixed to the dispensing arm. The center of the lower casing 10 is provided with an atomizing spray through hole 11 . As shown in FIGS. 1 and 3 , the second vent hole 9 located at the side wall communicates with the atomized spray through hole 11 at the center position and has a certain angle. The clip The angle is 20 degrees to 70 degrees. The angle between the second vent hole 9 and the atomizing spray through hole 11 provides two functions for the injected gas, on the one hand, speeding up the spraying of the atomized liquid from the nozzle, and on the other hand, accelerating the effect of atomization, The atomized droplets are smaller.

Wherein, the ratio of the length of the atomizing spray through hole 11 to the equivalent diameter is 10:1-30:1, so as to ensure a more thorough and uniform splitting of the atomized droplets. For example, the longer the distance traveled by the atomized droplets in the through-holes of a fixed diameter, the more uniform and uniform the split. The second venting hole 9 is used to provide the gas required for the spraying device, accelerate the further splitting of the liquid droplets, and enhance the atomization effect. In addition, the side wall of the lower casing 10 of the atomizing spray device has a certain angular section which provides a supporting surface for manufacturing the second vent hole 9 with a certain inclination angle. The vertical distance from the lower surface of the coupling layer 8 to the upper surface of the atomizing spray through hole 11 in the center of the lower casing is 1 mm to 10 mm. In this way, it is possible to ensure that the liquid becomes a thin film under the premise of the injection flow rate, and it is more advantageous to split into smaller droplets under megasonic oscillation.

The working principle of cleaning the atomizing spray device will be described in detail below:

Gas enters the transducer body 4 through the air inlet 14 and is injected into the passage between the transducer body 4 and the upper casing 2 through the first vent hole 6 on the transducer body 4. The liquid enters the passage between the transducer body 4 and the upper casing 2 through the inlet port 13, and the gas ejected from the first vent hole 6 in the transducer body 4 is ejected to the liquid in the passage to make the liquid Under the action of the capillary and the gas jet, a certain split flow is generated, and when the split flow flows through the passage between the coupling layer 8 and the lower casing 10, it further splits into a flow of ultrafine droplets under the action of megasound.

An alternating voltage is applied to the piezoelectric crystal 7 through the connection of the cable connector 1 to the power amplifier. The piezoelectric crystal 7 generates vibration under the action of an alternating voltage to form a megasonic wave, and the megasonic wave propagates through the coupling layer 8 and the lower casing 10. The ultrafine droplet flow generated after the megasonic action is ejected through the atomizing ejection through hole 11 of the lower casing 10 of the injection device, and is received by the lower casing in the atomizing ejection through hole 11 of the lower casing 10 before being ejected. The gas action of the second venting hole 9 in 10 accelerates the decomposition of the ultrafine droplet stream into a single ultrafine droplet.

The cleaning atomization spraying device provided by the invention has the advantages of simple structure and high integration, and can effectively realize the spraying of ultra-micro atomized droplets, and effectively cleans the wafer without damaging the surface pattern of the wafer, and maximizes the degree of Save water resources.

The embodiments of the present invention are as described above, but the contents are not intended to directly limit the scope of the invention. Equivalent modifications or variations of the present invention are intended to be included within the scope of the appended claims.

1‧‧‧ cable connector

2‧‧‧Upper casing

21‧‧‧First-order housing

22‧‧‧ second-order housing

3‧‧‧connection hole

4‧‧‧Transducer body

5‧‧‧Coupling layer support parts

6‧‧‧First vent

7‧‧‧Piezoelectric crystal

8‧‧‧Coupling layer

9‧‧‧second vent

10‧‧‧ Lower case

11‧‧‧Atomized spray through hole

12‧‧‧ Seal

13‧‧‧ inlet port

14‧‧‧air inlet

15‧‧‧ screw holes

1 is a schematic structural view of a cleaning atomizing spray device according to an embodiment of the present invention; FIG. 2 is a plan view showing a cleaning atomizing spray device according to an embodiment of the present invention; 4 is a schematic view showing the structure of a transducer in a cleaning atomizing spray device according to an embodiment of the present invention; and FIG. 5 is a cross-sectional view showing the transducer in the cleaning atomizing spray device according to an embodiment of the present invention.

1‧‧‧ cable connector

2‧‧‧Upper casing

21‧‧‧First-order housing

22‧‧‧ second-order housing

3‧‧‧connection hole

4‧‧‧Transducer body

5‧‧‧Coupling layer support parts

6‧‧‧First vent

7‧‧‧Piezoelectric crystal

8‧‧‧Coupling layer

9‧‧‧second vent

10‧‧‧ Lower case

12‧‧‧ Seal

13‧‧‧ inlet port

14‧‧‧air inlet

15‧‧‧ screw holes

Claims (10)

A cleaning atomizing spray device includes: an upper casing and a lower casing connected to the upper casing; the upper casing is a second-order cylindrical shape, and includes a first-stage casing and a second-order casing. The cross-sectional area of the first-stage housing is smaller than the cross-sectional area of the second-stage housing, and the second-stage housing is provided with a transducer, the transducer includes a cylindrical shape and a plurality of surfaces thereof a transducer body of the first venting hole and a coupling layer; a sidewall of the lower casing is provided with a second venting hole, and a center of the lower casing is provided with an atomizing spray through hole, the second vent hole It is in communication with the atomizing spray through hole and has an included angle. The cleaning atomizing spray device of claim 1, wherein the coupling layer is fixed inside the transducer body by a coupling layer supporting member. The cleaning atomizing spray device of claim 2, wherein the coupling layer comprises a piezoelectric crystal and a coupling piece, and the piezoelectric crystal is connected to the coupling piece by a conductive paste. The cleaning atomizing spray device according to claim 3, wherein the coupling piece is made of a single medium or a plurality of mediums, and has a thickness of an integral multiple of 1/4 wavelength. The cleaning atomizing spray device of claim 3, further comprising a sealing ring disposed on a lower surface of the coupling layer for sealing the coupling layer and the coupling layer supporting member. The cleaning atomizing spray device according to claim 1, wherein One side of the first-stage housing is provided with an air inlet hole, and one side of the second-stage housing is provided with a liquid inlet hole. The cleaning atomizing spray device of claim 1, wherein the angle between the second vent hole and the atomizing spray through hole is 20-70°. The cleaning atomizing spray device of claim 2, wherein a vertical distance between the lower surface of the coupling layer and the upper surface of the atomizing spray through hole of the lower casing is 1 mm to 10 mm. The cleaning atomizing spray device of claim 1, wherein the distance between the side wall of the transducer body and the inner wall of the second step housing in the upper casing is 1 mm to 10 mm. The cleaning atomizing spray device according to claim 2, wherein the first vent hole has a hole diameter of 1-3 mm, which is sequentially arranged on the transducer body in a circumferential direction from top to bottom.