KR20100046799A - Single type substrate treating apparatus and method - Google Patents

Abstract

PURPOSE: A single type substrate processing device and a controlling method thereof are provided to improve productivity by preventing a work time loss and an error due to the setting of a fixing nozzle. CONSTITUTION: A single type substrate processing device(1) includes a substrate support unit(200), a process container(100), and a fixing nozzle(500). A substrate support unit includes a spin head(210) on which a substrate is loaded. The process container surrounds the spin head and includes a plurality of suction ducts(130) which collect the process fluid scattered on the substrate according to the sort. The fixing nozzle is installed on the process container and sprays the process fluid to the substrate loaded on the spin head. The fixing nozzle controls the angle of the spray.

Description

Single sheet substrate processing apparatus and method {SINGLE TYPE SUBSTRATE TREATING APPARATUS AND METHOD}

The present invention relates to a substrate processing apparatus, and more particularly, to a sheet type substrate processing apparatus and method for cleaning a substrate.

In general, as semiconductor devices become dense, highly integrated, and high-performance, microcirculation of circuit patterns proceeds rapidly, and contaminants such as particles, organic contaminants, and metal contaminants remaining on the surface of the substrate have a great effect on device characteristics and production yield. Will be affected. For this reason, the cleaning process for removing various contaminants and unnecessary films adhering to the substrate surface is very important in the semiconductor manufacturing process, and the process for cleaning the substrate is performed at the front and rear stages of each unit process for manufacturing the semiconductor. .

Currently, the cleaning method used in the semiconductor manufacturing process is roughly divided into dry cleaning and wet cleaning, and wet cleaning is a bath for removing contaminants by chemical dissolution by depositing a substrate in a chemical solution. Type and a sheet type which removes contaminants by supplying a chemical to the surface of the substrate while the substrate is placed on the spin chuck and the substrate is rotated.

In the single-leaf type cleaning apparatus, various kinds of cleaning liquids are used depending on the kind of contaminants and film to be removed on the substrate. Recently, a new sheet type cleaning apparatus capable of recovering and reusing used cleaning liquids has been introduced, and such equipment has been applied to semiconductor manufacturing lines.

In a conventional single wafer type cleaning apparatus, a support for rotating a semiconductor substrate moves up and down inside a tank to perform a photographic process, in particular, a cleaning process. Here, the tank has a structure in which three annular ducts are stacked, and the chemical liquid to be recovered from each annular duct is predetermined, and is configured to vertically transfer the support to a position corresponding to the chemical liquid.

In the conventional single-leaf type cleaning apparatus, a fixed nozzle is fixed to the tank in addition to the swing nozzles to spray the treatment liquid onto the substrate. The fixed nozzle adjusts the discharge position at the flow rate of the processing liquid in accordance with the height of the substrate. However, since the fixed nozzle adjusts the discharge position to the flow rate of the processing liquid, it is very difficult to spray the processing liquid to the substrate surface at the desired position.

SUMMARY OF THE INVENTION An object of the present invention is to provide a sheet type substrate processing apparatus and method capable of adjusting the spray angle of a fixed nozzle to enable a process response to each of the suction ducts.

It is also an object of the present invention to provide a sheet type substrate processing apparatus and method which can improve productivity by preventing errors and loss of working time due to setting of a fixed nozzle.

It is also an object of the present invention to provide a substrate processing apparatus and method capable of preventing mixing of an alkaline treatment fluid and an acid treatment fluid due to a rebound phenomenon of the treatment fluid.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

The sheet type substrate processing apparatus of the present invention for achieving the above object includes a substrate support member including a spin head on which a substrate is placed; A processing container installed to surround the spin head and having annular suction ducts arranged in multiple stages to recover processing fluids scattered on a substrate for each type; And a fixed nozzle installed in the processing container and spraying the processing fluid to the substrate placed on the spin head and capable of adjusting the spray angle.

According to an embodiment of the invention, the fixed nozzle comprises a nozzle body; A nozzle head rotatably installed on the nozzle body; And a processing fluid supply pipe connected to the nozzle head through the nozzle body.

According to an embodiment of the present invention, the fixed nozzle member may include a bracket fixed to the processing container; A nozzle body installed on the bracket; A nozzle head rotatably installed at one end of the nozzle body; And a processing fluid supply pipe connected to the nozzle head through the nozzle body.

According to an embodiment of the present invention, the nozzle body is adjustable in height and rotation to the bracket.

According to an embodiment of the present invention, the fixed nozzle further includes a fixing bolt for fixing the nozzle head angled in the nozzle body.

According to an embodiment of the present invention, the fixed nozzle further includes a driving unit for adjusting the injection angle of the nozzle head.

According to an embodiment of the present invention, the fixed nozzle has an injection angle of the nozzle head adjusted according to the relative height of the spin head relative to the suction ducts in the processing container.

According to an embodiment of the present invention, the suction ducts include a first suction duct at the top, a second suction duct below the first suction duct, and a third suction duct at the bottom, and the second suction duct is neutral treated. The fluid is recovered, the first suction duct recovers an acidic treatment fluid, and the third suction duct recovers an alkaline treatment fluid.

According to an embodiment of the present invention, the fixed nozzle sprays a rinse liquid for cleaning the substrate to a substrate positioned at a height corresponding to the second suction duct.

The sheet type substrate processing apparatus of the present invention for achieving the above object includes a substrate support member including a spin head on which a substrate is placed; A processing container installed to surround the spin head and having annular suction ducts arranged in multiple stages to recover processing fluids scattered on a substrate for each type; A first moving nozzle for spraying an alkaline treatment fluid onto the substrate; A second moving nozzle for spraying an acid treatment fluid onto the substrate; And a fixed nozzle installed in the processing container and spraying the neutral processing fluid onto the substrate placed on the spin head and capable of adjusting the spray angle.

According to an embodiment of the present invention, the suction ducts include: a first suction duct at a top end of the acid treatment fluid which is injected from the first moving nozzle to the substrate; A second suction duct disposed under the first suction duct, for recovering a neutral processing fluid injected from the fixed nozzle to the substrate; And a third suction duct disposed under the second suction duct, for recovering an alkaline processing fluid injected from the second moving nozzle to the substrate.

According to an embodiment of the present invention, the fixed nozzle comprises: a bracket fixed to the processing container; A nozzle body installed on the bracket; A nozzle head rotatably installed at one end of the nozzle body; And a processing fluid supply pipe connected to the nozzle head through the nozzle body.

According to an embodiment of the present invention, the nozzle body is adjustable in height and rotatable on the bracket.

The sheet-fed substrate processing method of the present invention for achieving the above object is to sequentially spray the processing fluids to the substrate, and the used processing fluids are separated and recovered through the suction duct; In the suction duct located at the uppermost stage, the separation and recovery of the treatment fluids is carried out. The intermediate stage suction duct is located to recover the neutral treatment fluid.

According to an embodiment of the invention, the neutral processing fluid is injected into the substrate through the fixed nozzle.

According to the present invention, since the spray angle of the fixed nozzle can be adjusted, a process response to each of the suction ducts is possible.

In addition, the present invention can improve the productivity by preventing the error and work time loss due to the setting of the fixed nozzle.

In addition, the present invention can prevent the alkaline treatment fluid and the acid treatment fluid from being mixed due to the rebound phenomenon of the treatment fluid.

Hereinafter, a sheet type substrate processing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

In the following examples, an apparatus for cleaning a substrate using processing fluids such as alkaline chemical liquid (including ozone water), acidic chemical liquid, rinse liquid, and dry gas (gas containing IPA) will be described as an example. However, the technical idea of the present invention is not limited thereto, and the present invention may be applied to all kinds of apparatuses that perform a process while rotating a substrate such as an etching process.

(Example)

1 is a plan view showing the configuration of a sheet type substrate processing apparatus according to the present invention. Figure 2 is a side cross-sectional view showing the configuration of a single wafer substrate processing apparatus according to the present invention. In FIG. 2, the moving nozzle member is omitted for convenience of drawing.

In this embodiment, although the semiconductor substrate is illustrated and described as an example of the substrate processed by the sheet type substrate processing apparatus 1, the present invention is not limited thereto, and may be applied to various kinds of substrates such as glass substrates.

1 and 2, the sheet type substrate processing apparatus 1 according to the present invention is a device for removing foreign matter and film remaining on the surface of the substrate using various processing fluids, the chamber 10, the processing container ( 100, the substrate support member 200, the moving nozzle member 300, the fixed nozzle 500, and the exhaust member 400.

The chamber 10 provides a sealed inner space, and a fan filter unit 12 is installed at the top. The fan filter unit 12 generates vertical airflow inside the chamber 10.

The fan filter unit 12 is a unit in which the filter and the air supply fan are modularized into one unit, and filter the clean air to supply the inside of the chamber. The clean air passes through the fan filter unit 12 and is supplied into the chamber to form vertical airflow. The vertical airflow of the air provides a uniform airflow over the substrate, and contaminants (fumes) generated in the process of treating the substrate surface by the processing fluid are exhausted through the suction ducts of the processing vessel 100 together with the air. By being discharged to and removed from the member 400, high cleanliness in the processing container is maintained.

As shown in FIG. 2, the chamber 10 is partitioned into a process region 16 and a maintenance region 18 by horizontal partitions 14. Although only a portion is shown in the drawing, the maintenance area 18 includes a drive unit of the elevating unit and a moving nozzle of the moving nozzle member 300 in addition to the discharge lines 141, 143, 145 and the sub-exhaust line 410 connected to the processing container 100. It is preferable that the maintenance area 18 is isolated from the process area where the substrate treatment is performed.

The processing container 100 has a cylindrical shape with an open upper portion, and provides a process space for processing the substrate w. An open upper surface of the processing container 100 serves as a carrying-out and carrying-in passage of the substrate w. The substrate support member 200 is positioned in the process space. The substrate support member 200 supports the substrate W during the process and rotates the substrate.

Hereinafter, the processing container 100 and the substrate supporting member 200 will be described in detail with reference to the accompanying drawings.

FIG. 2 is a cross-sectional view illustrating the processing container and the substrate supporting member shown in FIG. 1.

Referring to FIG. 2, the processing container 100 is divided into an upper space 132a in which the spin head 210 is located, and an upper space 132a by the spin head 210, and is provided at a lower end thereof to allow forced exhaust. The exhaust duct 190 provides a lower space 132b to which the exhaust duct 190 is connected. In the upper space 132a of the processing container 100, annular first, second, and third suction ducts 110, 120, and 130 for introducing and inhaling chemical liquid and gas scattered on a rotating substrate are disposed in multiple stages. .

The annular first, second and third suction ducts 110, 120, 130 have exhaust holes H communicating with one common annular space (corresponding to the lower space of the container). An exhaust duct 190 connected to the exhaust member 400 is provided in the lower space 132b.

In detail, the first to third suction ducts 110, 120, and 130 each have a bottom surface having an annular ring shape and a sidewall extending from the bottom surface and having a cylindrical shape. The second suction duct 120 surrounds the first suction duct 110 and is spaced apart from the first suction duct 110. The third suction duct 130 surrounds the second suction duct 120 and is spaced apart from the second suction duct 120.

The first to third suction ducts 110, 120, and 130 provide first to third recovery spaces RS1, RS2, and RS3 into which air flows including the treatment liquid and the fume scattered from the substrate w flow. . The first recovery space RS1 is defined by the first suction duct 110, and the second recovery space RS2 is defined by the separation space between the first suction duct 110 and the second suction duct 120. The third recovery space RS3 is defined by the separation space between the second suction duct 120 and the third suction duct 130.

The upper surface of each of the first to third suction ducts 110, 120, and 130 is formed as an inclined surface whose center portion is opened, and the distance from the corresponding bottom surface gradually increases from the connected side wall toward the opening side. Accordingly, the processing liquid scattered from the substrate w flows into the recovery spaces RS1, RS2, and RS3 along the upper surfaces of the first to third suction ducts 110, 120, and 130.

The first treatment liquid introduced into the first recovery space RS1 is discharged to the outside through the first recovery line 141. The second treatment liquid introduced into the second recovery space RS2 is discharged to the outside through the second recovery line 143. The third treatment liquid introduced into the third recovery space RS3 is discharged to the outside through the third recovery line 145.

On the other hand, the processing container 100 is coupled with the lifting unit 600 for changing the vertical position of the processing container 100. The lifting unit 600 linearly moves the processing container 100 in the vertical direction. As the processing container 100 is moved up and down, the relative height of the processing container 100 with respect to the spin head 210 is changed. The elevating unit 600 has a bracket 612, a moving shaft 614, and a driver 616. The bracket 612 is fixedly installed on the outer wall of the processing container 100, and the movement shaft 614, which is moved in the vertical direction by the driver 616, is fixedly coupled to the bracket 612. When the substrate W is loaded onto the spin head 210 or unloaded from the spin head 210, the processing container 100 descends such that the spin head 210 protrudes above the processing container 100. In addition, when the process is in progress, the height of the processing container 100 is adjusted to allow the processing liquid to flow into the predetermined suction ducts 110, 120, and 130 according to the type of the processing liquid supplied to the substrate W. Accordingly, the relative vertical position between the processing container 100 and the substrate w is changed. Therefore, the processing container 100 may vary the types of the processing liquid and the contaminated gas recovered for each of the recovery spaces RS1, RS2, and RS3.

In this embodiment, the substrate processing apparatus 1 changes the relative vertical position between the processing container 100 and the substrate supporting member 200 by vertically moving the processing container 100. However, the substrate processing apparatus 1 may change the relative vertical position between the processing container 100 and the substrate supporting member 200 by vertically moving the substrate supporting member 200.

The substrate support member 200 is provided inside the processing container 100. The substrate support member 200 supports the substrate W during the process and may be rotated by the driver 240 to be described later during the process. The substrate support member 200 has a spin head 210 having a circular top surface, and the support pins 212 and chucking pins 214 supporting the substrate W are formed on the top surface of the spin head 210. Have The support pins 212 are disposed in a predetermined arrangement at a predetermined interval spaced apart from the upper surface edge of the spin head 210, and are provided to protrude upward from the spin head 210. The support pins 212 support the bottom surface of the substrate W so that the substrate W is supported while being spaced upward from the spin head 210. The chucking pins 214 are disposed on the outer side of the support pins 212, and the chucking pins 214 are provided to protrude upward. The chucking pins 214 align the substrate W such that the substrate W supported by the plurality of support pins 212 is placed in position on the spinhead 210. During the process, the chucking pins 214 are in contact with the side of the substrate W to prevent the substrate W from being displaced from its position.

A support shaft 220 supporting the spin head 210 is connected to the lower portion of the spin head 210, and the support shaft 220 is rotated by the driving unit 230 connected to the lower end thereof. The driving unit 230 may be provided by a motor or the like. As the support shaft 220 rotates, the spin head 210 and the substrate W rotate.

The exhaust member 400 is to provide an exhaust pressure (suction pressure) to the suction duct for recovering the processing liquid of the first to third suction ducts (110, 120, 130) during the process. The exhaust member 400 includes a sub exhaust line 410 and a damper 420 connected to the exhaust duct 190. The sub exhaust line 410 receives exhaust pressure from an exhaust pump (not shown) and is connected to a main exhaust line embedded in a bottom space of a semiconductor production line (fab).

The moving nozzle member 300 includes a plurality of moving nozzles 310 located outside the processing container 100. The moving nozzles 310 supply a processing fluid (acid solution, alkaline solution, neutral solution, dry gas) for cleaning or etching the substrate w to the substrate w fixed to the substrate support member 200.

The fixed nozzles 500 are installed on the top of the processing container 100. The fixed nozzle 500 sprays a processing fluid onto the substrate W placed on the spin head 210. The fixed nozzle 500 may adjust the spray angle according to the processing position of the substrate.

3 is a perspective view of the fixed nozzle, FIG. 4 is a side view of the fixed nozzle, and FIG. 5 is a side cross-sectional view of the fixed nozzle. 6 is a cross-sectional view taken along the line a-a shown in FIG. 4, and FIG. 7 is a cross-sectional view taken along the line b-b shown in FIG. 4.

3 to 7, the fixed nozzle 500 is provided at one end of the bracket 510 fixedly installed at the processing container 100, the nozzle body 520 installed at the bracket 510, and the nozzle body 520. It includes a nozzle head 530 rotatably installed, a processing fluid supply pipe 540 connected to the nozzle head 530 through the nozzle body 520.

The bracket 510 is fixedly installed on the outer surface of the uppermost suction duct 130 of the processing container 100. The bracket 510 has hollow shafts 512 to which the nozzle body 520 is coupled. The treatment fluid supply pipe 540 flows into the nozzle body 520 through the hollow of the shaft 512 and is coupled to the nozzle head 530.

The nozzle body 520 is installed on the shaft 512 of the bracket 510 to adjust the height and rotate the shaft 512 about the axis. The nozzle body 520 has an inner passage 522 in the form of a reservoir so that the processing fluid supply pipe 540 can pass therethrough. The nozzle body 520 has an upper mount 524 to which the nozzle head 530 is coupled, and a lower mount 526 to which the shaft 512 is fitted. The nozzle body 520 is fixed to the shaft 512 by inserting the shaft 512 into the lower mounting portion 526, and fastening two fixing bolts 527 to the lower mounting portion 526 while adjusting the height and the direction. do. 7 is a cross-sectional view illustrating a state in which the fixing bolt 527 is fastened to the lower mounting portion 526 of the nozzle body 520. As shown in FIG. 7, the lower mounting portion 526 has a cutout 526a in the middle, and the fixing bolt 527 is fixed to the shaft 512 by being fastened through the cutout 526a. In order to adjust the height or direction of the nozzle body 520, loosen the fixing bolt 527 slightly to loosen it, then adjust the height or direction of the next nozzle body 520, and then tighten the fixing bolt 527 firmly. .

The nozzle head 530 is rotatably hinged to the top mounting portion 524 of the nozzle body 520. A hinge bolt 528, which is a rotational axis of the nozzle head 530, and a fixing bolt 529 for fixing the rotation state of the nozzle head 530 are fastened to the upper mounting portion 524 of the nozzle body 520. do. The nozzle head 530 may manually adjust the spray angle in the nozzle body 520. The nozzle head 530 has an injection tip 532 at the front side, and has an insertion hole 534 into which the end of the treatment fluid supply pipe 540 is fitted.

In this embodiment, the nozzle head 530 has been described as manually adjusting the spray angle to the nozzle body 520, the nozzle head 530 may automatically adjust the spray angle by a separate drive unit.

8 is a view showing a fixed nozzle having a drive for adjusting the injection angle of the nozzle head.

As shown in FIG. 8, the driving unit 550 is coupled to the rotating shaft of the nozzle head 530 to automatically adjust the injection angle of the nozzle head 530. The fixed nozzle 500 capable of automatically adjusting the injection angle may automatically adjust the injection angle of the nozzle head 530 according to the relative height of the spin head 210 with respect to the suction ducts in the processing container 100. .

Treatment fluids used in substrate processing are hydrofluoric acid (HF), sulfuric acid (H3SO4), nitric acid (HNO3), phosphoric acid (H3PO4), ozone water, and SC-1 solutions (ammonium hydroxide (NH ₄ OH), hydrogen peroxide (H ₂ O). ₂ ) and water (mixture of H ₂ O)). Ultra rinse water (DIW: Deionized Water) may be used as the rinse liquid, and isopropyl alcohol gas (IPA: Isopropyl alcohol gas) may be used as the dry gas. The fixed nozzle 500 sprays the neutral treatment fluid onto the substrate.

According to the substrate processing apparatus of the present invention having the above-described configuration, the first to third suction ducts (110, 120, 130) recover the processing fluid supplied to the substrate (w) during the processing of the substrate (w) do. In the present invention, the substrate cleaning process is performed using an acidic treatment fluid, an alkaline treatment fluid, and a neutral treatment fluid such as ultrapure water. Each of the treatment fluids injected into the substrate is separated and recovered into the first suction duct 110, the second suction duct 120, and the third suction duct 130. Among the treatment fluids recovered, the acid treatment fluid and the alkaline The treatment fluid is sent to a recycling device (not shown) for reuse. In the present invention, the acid treatment fluid is recovered from the third suction duct 130, the alkaline treatment fluid is recovered from the first recovery duct 110, and the neutral treatment fluid is recovered from the second recovery duct 120, or It is preferable to recover the alkaline treatment fluid from the third suction duct 130 and to recover the acid treatment fluid from the first suction duct 110.

In the present invention, the spray angle of the fixed nozzle 500 may be adjusted to recover the neutral treatment fluid from the second recovery duct 120. Part of the processing fluid scattered from the substrate during the recovery of the processing fluid flows into the suction duct located under the suction duct. Even though the acid processing fluid is rebounded because the acid processing fluid is recovered from the third suction duct 130. It does not flow into the first suction duct 110. Therefore, contamination of the alkaline treatment fluid recovered through the first suction duct 130 can be prevented, and the alkaline treatment fluid can be reused. Of course, the neutral treatment fluid recovered from the second suction duct 120 may be introduced into the first suction duct 110, but the neutral treatment fluid does not become a big problem for reuse because it causes only a change in the concentration of the alkaline treatment fluid. .

9 is a view illustrating a process in which a substrate is processed at a height corresponding to the first suction duct. 10 is a view illustrating a process in which a substrate is processed at a height corresponding to a second suction duct. FIG. 11 is a view illustrating a process in which a substrate is processed at a height corresponding to a third suction duct. The dotted line represents the exhaust flow, and the solid line represents the flow of the processing liquid injected from the nozzle onto the substrate.

As shown in FIGS. 9 to 11, the fixed nozzle 500 is rotated at an injection angle corresponding to the first, second and third suction ducts, respectively, so that the treatment fluid may be injected to the injection point of the substrate.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

1 is a plan view showing the configuration of a sheet type substrate processing apparatus according to the present invention.

Figure 2 is a side cross-sectional view showing the configuration of a single wafer substrate processing apparatus according to the present invention.

3 is a perspective view of the fixed nozzle.

4 is a side view of the fixed nozzle.

5 is a side cross-sectional view of the fixed nozzle.

6 is a cross-sectional view taken along the line a-a shown in FIG. 4.

FIG. 7 is a cross-sectional view taken along the line b-b shown in FIG. 4.

8 is a view showing a fixed nozzle having a drive to adjust the spray angle of the nozzle head.

9 is a view illustrating a process in which a substrate is processed at a height corresponding to the first suction duct.

10 is a view illustrating a process in which a substrate is processed at a height corresponding to a second suction duct.

FIG. 11 is a view illustrating a process in which a substrate is processed at a height corresponding to a third suction duct.

<Description of Symbols for Main Parts of Drawings>

10 chamber 100 processing container

200 substrate support member 400 exhaust member

500: fixed nozzle 520: nozzle body

530: nozzle head

Claims (15)

In single wafer processing apparatus: A substrate support member including a spin head on which the substrate is placed; A processing container installed to surround the spin head and having annular suction ducts arranged in multiple stages to recover processing fluids scattered on a substrate for each type; And And a fixed nozzle which is installed in the processing container and sprays the processing fluid to the substrate placed on the spin head, and which is capable of adjusting the spray angle. The method of claim 1, The fixed nozzle Nozzle body; A nozzle head rotatably installed on the nozzle body; And Single sheet substrate processing apparatus comprising a processing fluid supply pipe connected to the nozzle head through the nozzle body. The method of claim 1, The fixed nozzle member is A bracket fixed to the processing container; A nozzle body installed on the bracket; A nozzle head rotatably installed at one end of the nozzle body; Single sheet substrate processing apparatus comprising a processing fluid supply pipe connected to the nozzle head through the nozzle body. The method of claim 3, wherein The nozzle body is Single sheet substrate processing apparatus, characterized in that the height can be adjusted and rotated on the bracket. The method according to claim 2 or 3, The fixed nozzle Single sheet substrate processing apparatus further comprises a fixing bolt for fixing the nozzle head angled in the nozzle body. The method according to claim 2 or 3, The fixed nozzle Single sheet substrate processing apparatus further comprises a drive for adjusting the injection angle of the nozzle head. The method according to claim 2 or 3, The fixed nozzle And the spray angle of the nozzle head is adjusted according to a relative height of the spin head with respect to the suction ducts in the processing container. The method according to claim 2 or 3, The suction ducts A first suction duct at the top, a second suction duct below the first suction duct, and a third suction duct at the bottom; The second suction duct recovers the neutral treatment fluid, the first suction duct recovers the acid treatment fluid, and the third suction duct recovers the alkaline treatment fluid. The method of claim 8, The fixed nozzle Single-sheet substrate processing apparatus characterized in that for spraying the rinse liquid for cleaning the substrate to the substrate located at the height corresponding to the second suction duct. In single wafer processing apparatus: A substrate support member including a spin head on which the substrate is placed; A processing container installed to surround the spin head and having annular suction ducts arranged in multiple stages to recover processing fluids scattered on a substrate for each type; A first moving nozzle for spraying an alkaline treatment fluid onto the substrate; A second moving nozzle for spraying an acid treatment fluid onto the substrate; And And a fixed nozzle which is installed in the processing container and sprays a neutral processing fluid onto a substrate placed on the spin head, and which is capable of adjusting an injection angle. The method of claim 10, The suction ducts A first suction duct at the uppermost stage for recovering the acid treatment fluid injected from the first moving nozzle to the substrate; A second suction duct disposed under the first suction duct, for recovering a neutral processing fluid injected from the fixed nozzle to the substrate; And And a third suction duct disposed under the second suction duct, the third suction duct recovering an alkaline processing fluid injected from the second moving nozzle to the substrate. The method of claim 10, The fixed nozzle A bracket fixed to the processing container; A nozzle body installed on the bracket; A nozzle head rotatably installed at one end of the nozzle body; And Single sheet substrate processing apparatus comprising a processing fluid supply pipe connected to the nozzle head through the nozzle body. The method of claim 12, The nozzle body is Single sheet substrate processing apparatus, characterized in that the height can be adjusted and rotated on the bracket. A substrate processing method in a sheet type substrate processing apparatus having a processing container in which suction ducts arranged to surround a spin head are arranged in multiple stages, and a fixed nozzle fixed to the processing container. Sequentially spraying treatment fluids onto the substrate, and the used treatment fluids are separated and recovered through the suction ducts; Separation and recovery of the treatment fluids The suction duct located in the uppermost stage recovers the acidic treatment fluid and the neutral treatment fluid sprayed onto the substrate, and the suction duct located in the lowermost stage recovers the alkaline treatment fluid and the neutral treated fluid. A substrate processing method in a sheet type substrate processing apparatus characterized by recovering a neutral processing fluid. The method of claim 14, And the neutral processing fluid is injected to the substrate through the fixed nozzle.

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