CN111001606A - Semiconductor cleaning equipment - Google Patents
Semiconductor cleaning equipment Download PDFInfo
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- CN111001606A CN111001606A CN201911377428.7A CN201911377428A CN111001606A CN 111001606 A CN111001606 A CN 111001606A CN 201911377428 A CN201911377428 A CN 201911377428A CN 111001606 A CN111001606 A CN 111001606A
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- plate
- recovery
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- recycling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0217—Use of a detergent in high pressure cleaners; arrangements for supplying the same
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0264—Splash guards
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses semiconductor cleaning equipment, which comprises a cleaning disc, wherein the cleaning disc is used for placing a wafer; the driving component drives the cleaning disc to rotate at high speed; the vacuum component adsorbs the wafer on the cleaning disc; the cleaning assembly is used for spraying cleaning liquid to the wafer; the cleaning device comprises a plurality of lifting mechanisms, a plurality of recovery rings are arranged at the lifting end of each lifting mechanism, splash guards are correspondingly arranged above each recovery ring, a drainage channel is formed between every two adjacent splash guards, and a cleaning disc, a driving assembly and a vacuum assembly are positioned in a space defined by the recovery rings; and the controller receives the cleaning instruction and controls the corresponding lifting mechanism to lift so as to enable the corresponding splash shield to be level with the cleaning disc. The semiconductor cleaning equipment can select the corresponding splash shield and the corresponding recovery ring according to different cleaning liquids, so that cross contamination can be effectively prevented.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a semiconductor cleaning device.
Background
The surface of the single wafer needs to be cleaned in order to effectively remove residues, micro-dust and dirt of the surface structure of the single wafer. At present, a single wafer is cleaned by using a semiconductor cleaning device, when the single wafer is cleaned, the single wafer is placed in a cavity of the semiconductor cleaning device, the single wafer is rapidly rotated, and the upper surface and the lower surface of the single wafer are cleaned by gas jet, however, when the gas jet is carried out, cleaning liquid such as acid, alkali, organic solution and the like or residual liquid carrying dirt is sputtered inside the cavity of the semiconductor cleaning device by shearing force of a rotating mechanism, and a relative position area of sputtering cannot be expected. Therefore, the cleaning of the single crystal wafer is liable to cause cross contamination.
Therefore, how to reduce the cross contamination during the cleaning of the single wafer is a problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention provides a semiconductor cleaning apparatus, which is used to reduce cross contamination during cleaning a single wafer.
In order to achieve the purpose, the invention provides the following technical scheme:
a semiconductor cleaning apparatus comprising:
the cleaning disc is used for placing a wafer;
the driving component drives the cleaning disc to rotate at a high speed;
the vacuum assembly adsorbs the wafer on the cleaning disc;
the cleaning assembly is used for spraying cleaning liquid to the wafer;
the cleaning device comprises a plurality of lifting mechanisms, a plurality of recovery rings are arranged at the lifting end of each lifting mechanism, splash guards are correspondingly arranged above each recovery ring, a drainage channel is formed between every two adjacent splash guards, and the cleaning disc, the driving assembly and the vacuum assembly are positioned in a space surrounded by the recovery rings; and
and the controller receives the cleaning instruction and controls the corresponding lifting mechanism to lift so as to enable the corresponding splash shield to be level with the cleaning disc.
In one embodiment of the present invention, the lifting mechanism includes a first lifting mechanism and a second lifting mechanism.
In one embodiment of the present invention, the lifting end of the first lifting mechanism is provided with a first recycling ring, a second recycling ring and a third recycling ring, wherein the third recycling ring is fixed on the lifting end of the first lifting mechanism, the second recycling ring is located in a recycling cavity of the third recycling ring, and the first recycling ring is fixed on the third recycling ring.
In one embodiment of the present invention, the first recycling loop comprises: the first recovery plate is used for being fixed on the third recovery ring, the splash guard extends from the first recovery plate to the direction close to the cleaning disc, and the first splash guard extends from the first recovery plate or the splash guard to the direction close to the cleaning disc.
In one embodiment of the present invention, a surface of the first splash plate is provided with a first isolation ring.
In one embodiment of the present invention, the third recycling ring includes a lifting lug, a third outer recycling plate, a third inner recycling plate and a third splash plate, wherein the lifting lug is fixed to the lifting end of the first lifting mechanism; the third outer layer recovery plate extends downwards along the axial direction from the lifting lug, the third inner layer recovery plate extends upwards along the axial direction from the third outer layer recovery plate, a recovery cavity is formed between the third outer layer recovery plate and the third outer layer recovery plate, and the third splash plate extends towards the direction close to the cleaning disc from the third inner layer recovery plate.
In one embodiment of the present invention, the second recovery ring includes a second recovery plate and a second splash shield, wherein the second recovery plate is provided with a first guide hole, the first guide hole extends along an axial direction, and the third inner layer recovery plate passes through the first guide hole and can slide in the first guide hole along the axial direction;
the second splash guard extends from the second recovery plate in the direction of the cleaning disc; and a first drainage channel is formed between the second splash guard and the first splash guard, and a second drainage channel is formed between the second splash guard and the third splash guard.
In one embodiment of the present invention, a surface of the second splash plate is provided with a second isolation ring.
In one embodiment of the invention, a first liquid spray conduit is embedded in the second splash guard, and a first nozzle communicated with the first liquid spray conduit is arranged on the upper surface of the second splash guard.
In one embodiment of the present invention, a third isolation ring is disposed on a surface of the third sputtering plate.
In one embodiment of the invention, a second liquid spraying conduit is embedded in the third splash plate, and a second nozzle communicated with the second liquid spraying conduit is arranged on the upper surface of the third splash plate.
In one embodiment of the present invention, the lifting end of the second lifting mechanism is provided with a housing, a fourth recovery ring, a fifth recovery ring and a sixth recovery ring, wherein the housing is fixed on the lifting end of the second lifting mechanism, the fourth recovery ring and the fifth recovery ring are fixed on the housing, and the sixth recovery ring is arranged on the fifth recovery ring.
In one embodiment of the present invention, the fourth recycling ring includes a fourth inner recycling plate, a fourth outer recycling plate, a fourth splash plate, and a fifth splash plate, the fourth splash plate extends from the fourth outer recycling plate to the direction of the cleaning tray, the fifth splash plate extends from the fourth inner recycling plate to the direction of the cleaning tray, a third drainage channel is formed between the fourth splash plate and the third splash plate, a fourth drainage channel is formed between the fourth splash plate and the fifth splash plate, and a recycling cavity is formed between the fourth inner recycling plate and the fourth outer recycling plate;
the fifth recycling ring comprises a fifth recycling plate extending axially from the fourth inner recycling plate, and a recycling cavity is formed between the fifth recycling plate and the fourth inner recycling plate.
In one embodiment of the present invention, a surface of the fourth splash plate is provided with a fourth isolation ring;
and a fifth isolation ring is arranged on the surface of the fifth splash guard.
In one embodiment of the invention, a third liquid spraying conduit is embedded in the fourth splash guard, and a third nozzle communicated with the third liquid spraying conduit is arranged on the upper surface of the third splash guard;
a fourth liquid spraying conduit is embedded in the fifth anti-splash plate, and a fourth nozzle communicated with the fourth liquid spraying conduit is arranged on the upper surface of the fifth anti-splash plate.
In one embodiment of the present invention, the sixth recycling ring includes a sixth outer recycling plate and a sixth inner recycling plate, the sixth inner recycling plate is fixed on the fifth recycling plate, and a recycling cavity is formed between the sixth outer recycling plate and the sixth inner recycling plate.
In one embodiment of the present invention, the recycling device further comprises a seventh recycling ring disposed at the bottom, the seventh recycling ring comprises a seventh outer recycling plate and a seventh inner recycling plate, the seventh outer recycling plate is sleeved on the sixth outer recycling plate, the seventh inner recycling plate extends from the seventh outer recycling plate in the radial direction, and an end surface of the first inner recycling plate forms a recycling cavity.
In one embodiment of the present invention, the cleaning disc includes:
a rotating disk fixed on a rotating shaft of the driving assembly;
the supporting disc is positioned above the rotating disc and is arranged on a rotating shaft of the driving assembly through a bearing; and
the positioning disc is arranged on the surface of the supporting disc, and a supporting column for supporting the wafer is arranged at the edge of the positioning disc.
In one embodiment of the present invention, the vacuum assembly comprises:
a vacuum suction tube passing through a rotating shaft of the drive assembly; and
and the vacuum generator is connected with the vacuum suction pipe.
In one embodiment of the present invention, the cleaning assembly comprises:
a first liquid supply assembly;
a spray tube extending from the first liquid supply assembly to above the cleaning tray;
the mounting seat is arranged in the middle of the positioning plate;
the second nozzle is arranged in the mounting seat, and a nozzle of the second nozzle points to the wafer;
the liquid inlet pipe is communicated with the second nozzle; and
and a second liquid supply assembly supplies liquid to the liquid inlet pipe.
In one embodiment of the present invention, the liquid inlet pipe is disposed inside the rotating shaft of the driving assembly.
According to the technical scheme, when the semiconductor cleaning equipment is adopted, the wafer is placed on the cleaning disc, and the vacuum is formed between the wafer and the cleaning disc under the action of the vacuum assembly, so that the wafer can be fixed on the cleaning disc. The controller receives the cleaning instruction, controls the corresponding lifting mechanism to adjust the corresponding splash guard to be level with the cleaning disc, drives the cleaning disc to rotate, simultaneously cleans the cleaning assembly, and recovers the cleaning liquid into the corresponding recovery ring. The semiconductor cleaning equipment can select the corresponding splash shield and the corresponding recovery ring according to different cleaning liquids, so that cross contamination can be effectively prevented.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic front view of a semiconductor cleaning apparatus according to the present invention;
FIG. 2 is a schematic front view of a semiconductor cleaning apparatus according to the present invention;
FIG. 3 is a schematic perspective view of a semiconductor cleaning apparatus according to the present invention;
FIG. 4 is a schematic perspective view of a semiconductor cleaning apparatus according to the present invention;
FIG. 5 is a schematic cross-sectional view of a semiconductor cleaning apparatus according to the present invention;
FIGS. 6 and 7 are schematic cross-sectional views of a semiconductor cleaning apparatus according to the present invention in two states;
FIGS. 8 to 11 are schematic cross-sectional structural views of a wafer cleaning apparatus according to the present invention;
fig. 12 is a schematic top view of a wafer cleaning apparatus according to the present invention.
In the drawings, 100 is a lifting mechanism, 200 is a recycling ring, 300 is a cleaning tray, 400 is a driving assembly, 500 is a vacuum assembly, 600 is a cleaning assembly, 201 is a first recycling ring, 202 is a second recycling ring, 203 is a third recycling ring, 204 is a fourth recycling ring, 205 is a fifth recycling ring, 206 is a sixth recycling ring, 207 is a seventh recycling ring, 2011 is a first recycling plate, 2012 is a splash guard, 2013 is a first splash guard, 2014 is a first isolation ring, 2021 is a second recycling plate, 2022 is a second splash guard, 2023 is a second isolation ring, 2024 is a first spray conduit, 2031 is a lifting lug, 2032 is a third outer recycling plate, 2033 is a third inner recycling plate, 2034 is a third splash guard, 2035 is a third isolation ring, 2036 is a second spray conduit, 2041 is a fourth outer recycling plate, 2042 is a fourth outer recycling plate, 2043 is a fifth inner recycling plate, 2044 is a fourth splash guard, 2045 is a fifth isolation ring, 2046 is a fifth isolation ring, 2051 is a fifth recovery plate, 2061 is a sixth outer recovery plate, 2062 is a sixth inner recovery plate.
Detailed Description
The core of the invention is to provide a semiconductor cleaning device to reduce cross contamination during cleaning of a single wafer.
The embodiments described below do not limit the contents of the invention described in the claims. The entire contents of the configurations shown in the following embodiments are not limited to those required as solutions of the inventions described in the claims.
Referring to fig. 1 to 12, a semiconductor cleaning apparatus according to an embodiment of the present invention includes:
the cleaning disc is used for placing a wafer;
the driving component drives the cleaning disc to rotate at a high speed;
the vacuum assembly adsorbs the wafer on the cleaning disc;
the cleaning assembly is used for spraying cleaning liquid to the wafer;
the cleaning device comprises a plurality of lifting mechanisms, a plurality of recovery rings are arranged at the lifting end of each lifting mechanism, splash guards are correspondingly arranged above each recovery ring, a drainage channel is formed between every two adjacent splash guards, and the cleaning disc, the driving assembly and the vacuum assembly are positioned in a space surrounded by the recovery rings; and
and the controller receives the cleaning instruction and controls the corresponding lifting mechanism to lift so as to enable the corresponding splash shield to be level with the cleaning disc.
When the semiconductor cleaning equipment is adopted, the wafer is placed on the cleaning disc, and vacuum is formed between the wafer and the cleaning disc under the action of the vacuum assembly, so that the wafer can be fixed on the cleaning disc. The controller receives the cleaning instruction, controls the corresponding lifting mechanism to adjust the corresponding splash guard to be level with the cleaning disc, drives the cleaning disc to rotate, simultaneously cleans the cleaning assembly, and recovers the cleaning liquid into the corresponding recovery ring. The semiconductor cleaning equipment can select the corresponding splash shield and the corresponding recovery ring according to different cleaning liquids, so that cross contamination can be effectively prevented.
There are at least two recovery rings 200 for each elevator mechanism, each recovery ring 200 being capable of recovering one type of cleaning fluid. And in the cleaning process, acid cleaning solution, alkaline cleaning solution or purified water is selected according to the type of an object to be cleaned. The corresponding lifting mechanism is lifted under the control of the controller to adjust the splash guard to be level with the cleaning disc so that the cleaning solution flows into the corresponding recovery ring 200 along the drainage channel, for example, when the cleaning solution is an acidic cleaning solution, the lifting mechanism is executed to enable the splash guard corresponding to the acidic cleaning solution to be level with the cleaning disc to be introduced into the recovery ring 200 for recovering the acidic cleaning solution under the action of the drainage channel; when the cleaning solution is alkaline cleaning solution, the lifting mechanism is executed to enable the splash guard corresponding to the alkaline cleaning solution to be kept level with the cleaning disc and to be led into the recovery ring 200 for recovering the alkaline cleaning solution under the action of the drainage channel; when the cleaning liquid is pure water, the lifting mechanism is executed to enable the splash guard corresponding to the pure water to be kept flat with the cleaning disc and to be led into the recovery ring 200 for recovering the pure water under the action of the drainage channel.
The controller is stored with cleaning instructions of the cleaning steps in advance, the type of the cleaning liquid applied in each cleaning step is used, when a certain step is executed, the controller calls the type of the cleaning liquid corresponding to the cleaning step in the cleaning instruction, and controls the corresponding lifting mechanism to operate. Or a cleaning instruction is input manually, and the controller calls the corresponding cleaning liquid type according to the cleaning instruction and controls the corresponding lifting mechanism to operate.
In one embodiment of the present invention, the lifting mechanism includes a first lifting mechanism and a second lifting mechanism. Of course, other numbers of lifting mechanisms are possible. For example, three, four, etc., and two lifting mechanisms are preferably considered in the invention for the sake of simplifying the structure.
In one embodiment of the present invention, the lifting end of the first lifting mechanism is provided with at least two recycling rings 200, for example, in the embodiment of the present invention, the lifting end of the first lifting mechanism is provided with a first recycling ring 201, a second recycling ring 202 and a third recycling ring 203, wherein the third recycling ring 203 is fixed on the lifting end of the first lifting mechanism, the second recycling ring 202 is located in a recycling cavity of the third recycling ring 203, and the first recycling ring 201 is fixed on the third recycling ring 203.
The first recovery ring 201, the second recovery ring 202 and the third recovery ring 203 are arranged layer by layer, wherein the third recovery ring 203 is located at the lowest layer, and the first recovery ring 201 is located at the uppermost layer. Wherein the second recovery ring 202 is directly fixed to the first recovery ring 201 or the third recovery ring 203, or other structures.
The first recycling ring 201 includes a first recycling plate 2011, a splash guard 2012 and a first splash guard 2013, wherein the first recycling plate 2011 is configured to be fixed to the third recycling ring 203, the splash guard 2012 extends from the first recycling plate 2011 to a direction close to the cleaning tray, and the first splash guard 2013 extends from the first recycling plate 2011 or the splash guard 2012 to a direction close to the cleaning tray. The first splash guard 2013 and the splash guard 2012 both have a splash guard function, and the first recovery plate 2011 has a two-layer room function, so that splashing of cleaning liquid is reduced.
The surface of the first splash plate 2013 is provided with a first isolation ring 2014. The first isolation ring 2014 is made of a material with high surface tension, so that the cleaning solution sputtered on the upper surface by rotation can be quickly separated from the surface of the first isolation ring 2014 due to the surface tension and then fall into the drainage channel.
The third recycling ring 203 comprises lifting lugs 2031, a third outer recycling plate 2032, a third inner recycling plate 2033 and a third splash plate 2034, wherein the lifting lugs 2031 are fixed with the lifting ends of the first lifting mechanism; the third outer recovery plate 2032 extends axially downward from the lifting lug 2031, the third inner recovery plate 2033 extends axially upward from the third outer recovery plate 2032, and a recovery cavity is formed between the third outer recovery plate 2032, and the third splash plate 2034 extends from the third inner recovery plate 2033 toward the direction close to the cleaning tray.
When the first lifting mechanism moves upward, the lifting end of the first lifting mechanism drives the lifting lug 2031 to move upward, so as to drive the third outer-layer recovery plate 2032, the third inner-layer recovery plate 2033 and the third splash plate 2034 to move upward; since the first recovery ring 201 is fixed to the third recovery ring 203, the first recovery ring 201 moves upward together with the third recovery ring 203; when the first lifting mechanism moves upward, the lifting end of the first lifting mechanism drives the lifting lug 2031 to descend, so as to drive the third outer-layer recovery plate 2032, the third inner-layer recovery plate 2033 and the third splash plate 2034 to move downward; since the first recovery ring 201 is fixed to the third recovery ring 203, the first recovery ring 201 moves downward together with the third recovery ring 203.
In one embodiment of the present invention, the second recycling ring 202 includes a second recycling plate 2021 and a second splash plate 2022, wherein the second recycling plate 2021 is provided with a first guiding hole, the first guiding hole extends along the axial direction, and the third inner recycling plate 2033 passes through the first guiding hole and can slide along the axial direction in the first guiding hole;
the second splash shield 2022 extends from the second recovery plate 2021 in the direction of the cleaning disk; a first drainage channel is formed between the second splash guard 2022 and the first splash guard 2013, and a second drainage channel is formed between the second splash guard 2022 and the third splash guard 2034.
The surface of the second splash plate 2022 is provided with a second isolation ring 2023. The second isolation ring 2023 is made of a material with high surface tension, so that the cleaning solution that is spun and sputtered onto the upper surface can be quickly separated from the surface of the second isolation ring 2023 due to the surface tension and then dropped into the second drainage channel.
For convenience of cleaning, the first liquid spray conduit 2024 is embedded inside the second splash guard 2022, and the first nozzle communicated with the first liquid spray conduit 2024 is arranged on the upper surface of the second splash guard 2022. The corresponding cleaning liquid enters the first nozzle through the first liquid spray conduit 2024 and is sprayed into the first drainage channel, and the cleaning liquid adhered to the lower surface of the first splash guard 2013 is washed into the first drainage channel and finally flows into the recovery cavity.
In one embodiment of the present invention, the surface of the third splash plate 2034 is provided with a third isolation ring 2035. The third isolation ring 2035 is made of a material with high surface tension, so that the cleaning solution that is spun onto the upper surface can quickly drop off the surface of the third isolation ring 2035 and then drop into the second drainage channel due to the surface tension.
In one embodiment of the present invention, the second liquid spray conduit 2036 is embedded inside the third splash plate 2034, and the upper surface of the third splash plate 2034 is provided with a second nozzle communicating with the second liquid spray conduit 2036. The corresponding cleaning liquid enters the second nozzle through the second liquid spray conduit 2036 and is sprayed into the second diversion channel, and washes the cleaning liquid adhered to the lower surface of the second splash guard 2022 into the second diversion channel, and finally flows into the recovery chamber.
The lifting end of the second lifting mechanism is provided with at least two recovery rings 200, for example, the lifting end of the second lifting mechanism is provided with a housing, a fourth recovery ring 204, a fifth recovery ring 205 and a sixth recovery ring 206 in the embodiment of the present invention, wherein the housing is fixed on the lifting end of the second lifting mechanism, the fourth recovery ring 204 and the fifth recovery ring 205 are fixed on the housing, and the sixth recovery ring 206 is arranged on the fifth recovery ring 205. The fourth recovery ring 204, the fifth recovery ring 205 and the sixth recovery ring 206 are arranged layer by layer or in the axial direction, wherein the fourth recovery ring 204 and the fifth recovery ring 205 are arranged in the axial direction, the fifth recovery ring 205 is located at the lowermost layer, and the sixth recovery ring 206 is located at the outermost layer. The second lifting mechanism drives the housing to move and drives the fourth recycling ring 204, the fifth recycling ring 205 and the sixth recycling ring 206 to move together.
The fourth recovery ring 204 and the fifth recovery ring 205 are of an integrated structure or a split structure, preferably, the fourth recovery ring 204 and the fifth recovery ring 205 are of an integrated structure, specifically, the fourth recovery ring 204 includes a fourth inner recovery plate 2042, a fourth outer recovery plate 2041, a fourth splash plate 2043 and a fifth splash plate 2044, the fourth splash plate 2043 extends from the fourth outer recovery plate 2041 to the direction of the cleaning disc, the fifth splash plate 2044 extends from the fourth inner recovery plate 2042 to the direction of the cleaning disc, a third drainage channel is formed between the fourth splash plate 2043 and the third splash plate 2034, a fourth drainage channel is formed between the fourth splash plate 2043 and the fifth splash plate 2044, and a recovery cavity is formed between the fourth inner recovery plate 2042 and the fourth outer recovery plate 2041;
the fifth recovery ring 205 includes a fifth recovery plate 2051 extending axially from the fourth inner recovery plate 2042, and a recovery cavity is formed between the fifth recovery plate 2051 and the fourth inner recovery plate 2042.
In one embodiment of the present invention, a surface of the fourth splash plate 2043 is provided with a fourth isolation ring 2045; a surface of the fifth splash plate 2044 is provided with a fifth isolation ring 2046. The fourth isolation ring 2045 and the fifth isolation ring 2046 are made of a material with high surface tension, so that the cleaning solution that is rotatably sputtered onto the surface can quickly separate from the surfaces of the fourth isolation ring 2045 and the fifth isolation ring 2046 due to the surface tension and then drop into the third drainage channel and the fourth drainage channel.
In one embodiment of the present invention, a third liquid spraying conduit is embedded in the fourth splash plate 2043, and a third nozzle communicated with the third liquid spraying conduit is arranged on the upper surface of the third splash plate 2034; a fourth liquid spraying conduit is embedded in the fifth anti-splash plate 2044, and a fourth nozzle communicated with the fourth liquid spraying conduit is arranged on the upper surface of the fifth anti-splash plate 2044. The corresponding cleaning liquid enters the third nozzle through the third liquid spray conduit, is sprayed into the third drainage channel, and washes the cleaning liquid adhered to the lower surface of the third splash plate 2034 into the third drainage channel, and finally flows into the recovery cavity. The corresponding cleaning solution enters the fourth nozzle through the fourth liquid spraying conduit, is sprayed into the fourth drainage channel, and washes the cleaning solution adhered to the lower surface of the fourth splash guard 2043 into the fourth drainage channel, and finally flows into the recovery cavity.
The sixth recovery ring 206 includes a sixth outer recovery plate 2061 and a sixth inner recovery plate 2062, the sixth inner recovery plate 2062 is fixed to the fifth recovery plate 2051, and a recovery cavity is formed between the sixth outer recovery plate 2061 and the sixth inner recovery plate 2062.
The recycling device further comprises a seventh recycling ring 207 arranged at the bottom, the seventh recycling ring 207 comprises a seventh outer recycling plate and a seventh inner recycling plate, the seventh outer recycling plate is sleeved on the sixth outer recycling plate 2061, the seventh inner recycling plate extends along the radial direction from the seventh outer recycling plate, and the end face of the first inner recycling plate forms a recycling cavity.
Referring to fig. 8 to 12, the cleaning plate 300 supports the wafer and drives the wafer to rotate under the driving of the driving assembly 400. In one embodiment of the present invention, the cleaning disc 300 includes: a rotating disk 303, the rotating disk 303 being fixed to a rotating shaft 401 of the driving assembly 400; and a positioning disc 301, wherein the positioning disc 301 is arranged on the surface of the rotating disc 303, and the edge of the positioning disc 301 is provided with a supporting column for supporting the wafer. When the positioning disc 301 is used, the edge of the wafer is placed on the positioning disc 301 and is abutted to the support columns, in order to ensure the uniformity of stress of the wafer, the number of the support columns is multiple, and the support columns are uniformly arranged on the positioning disc 301. Under the action of the supporting columns and the vacuum assembly 500, an interlayer can be formed between the wafer and the positioning plate 301, so that the second cleaning assembly 500 can clean the lower surface of the wafer conveniently.
In order to improve the stability of the positioning disc 301 during operation, a supporting disc 302 is disposed between the rotating disc 303 and the positioning disc 301, the supporting disc 302 is located above the rotating disc 303, and the supporting disc 302 is disposed on the rotating shaft 201 of the driving assembly 400 through a bearing. The positioning disc 301 can indirectly contact with the rotating disc 303 by arranging the supporting disc 302, so that the positioning disc 301 is more stable in the rotating process.
In the present invention, the vacuum assembly 500 functions to fix the wafer by forming a vacuum. The vacuum assembly 500 includes: a vacuum suction pipe 501 penetrating the rotation shaft 201 of the driving assembly 400; and a vacuum generator connected to vacuum suction pipe 501. When the wafer sucking device is used, the vacuum generator operates, and the vacuum generator is connected with the vacuum suction pipe 501, so that negative pressure can be formed around the vacuum suction pipe 501, and the wafer can be stably adsorbed around the vacuum suction pipe 501 under the action of pressure difference.
The cleaning assembly 600 is used for cleaning the upper and lower surfaces of the wafer, and the cleaning assembly 600 of the present invention includes: a first liquid supply assembly; a spray tube 602 extending from the first liquid supply assembly to above the wash tray 300; a first nozzle 601 provided on the liquid ejection tube 602; a mounting seat 603 in the middle of the positioning plate 301 is arranged; a second nozzle 604 arranged in the mounting seat 603, wherein the nozzle of the second nozzle 604 points to the wafer; a liquid inlet pipe 605 communicated with the second nozzle 604; and a second liquid supply assembly to supply liquid to the liquid inlet pipe 605.
In use, the first liquid supply assembly delivers the cleaning liquid to the liquid spraying tube 602, and the cleaning liquid is sprayed onto the upper surface of the wafer through the first nozzle 601 via the liquid spraying tube 602, and the wafer is rotated at a high speed under the action of the cleaning tray 300, so that the cleaning liquid sprayed from the first nozzle 601 can clean the dirt on the upper surface of the wafer. When the cleaning liquid spraying device is used, cleaning liquid is conveyed to the liquid inlet pipe 605 through the second liquid supply assembly, the cleaning liquid is conveyed to the second nozzle 604 through the liquid inlet pipe 605, and the cleaning liquid sprayed by the second nozzle 604 is in contact with the lower surface of a wafer. Since the nozzle of the second nozzle 604 is directed toward the wafer, the cleaning liquid discharged from the second nozzle 604 generates a rotational component force, thereby improving the cleaning effect.
To further enhance the cleaning effect, cleaning assembly 600 includes a rotating member that drives liquid spray tube 602 to oscillate. The first cleaning assembly 600 can swing in the cleaning process through the rotating member, and the high-pressure cleaning liquid sprayed by the first nozzle 601 in the swinging process can contact different parts on the wafer, so that the cleaning effect can be improved.
In order to further improve the cleaning effect, the number of the second nozzles 604 is plural. The plurality of second nozzles 604 are uniformly arranged in the mount 603.
In order to improve the sealing effect between the mounting seat 603 and the positioning plate 301, a sealing ring is arranged between the mounting seat 603 and the middle part of the positioning plate 301.
To simplify the result, the rotating shaft 201 of the driving assembly 400 is a hollow shaft in the present invention, and the liquid inlet pipe 605 is disposed inside the rotating shaft 201 of the driving assembly 400.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (21)
1. A semiconductor cleaning apparatus, comprising:
the cleaning disc is used for placing a wafer;
the driving component drives the cleaning disc to rotate at a high speed;
the vacuum assembly adsorbs the wafer on the cleaning disc;
the cleaning assembly is used for spraying cleaning liquid to the wafer;
the cleaning device comprises a plurality of lifting mechanisms, a plurality of recovery rings are arranged at the lifting end of each lifting mechanism, splash guards are correspondingly arranged above each recovery ring, a drainage channel is formed between every two adjacent splash guards, and the cleaning disc, the driving assembly and the vacuum assembly are positioned in a space surrounded by the recovery rings; and
and the controller receives the cleaning instruction and controls the corresponding lifting mechanism to lift so as to enable the corresponding splash shield to be level with the cleaning disc.
2. The semiconductor cleaning apparatus of claim 1, wherein the lift mechanism comprises a first lift mechanism and a second lift mechanism.
3. The semiconductor cleaning apparatus according to claim 2, wherein the lifting end of the first lifting mechanism is provided with a first recycle ring, a second recycle ring and a third recycle ring, wherein the third recycle ring is fixed to the lifting end of the first lifting mechanism, the second recycle ring is located in a recycle cavity of the third recycle ring, and the first recycle ring is fixed to the third recycle ring.
4. The semiconductor cleaning apparatus of claim 3, wherein the first recovery loop comprises: the first recovery plate is used for being fixed on the third recovery ring, the splash guard extends from the first recovery plate to the direction close to the cleaning disc, and the first splash guard extends from the first recovery plate or the splash guard to the direction close to the cleaning disc.
5. The semiconductor cleaning apparatus of claim 4, wherein a surface of the first splash plate is provided with a first isolation ring.
6. The semiconductor cleaning apparatus of claim 4, wherein the third recycling loop comprises a lifting lug, a third outer layer recycling plate, a third inner layer recycling plate and a third splash plate, wherein the lifting lug is fixed with a lifting end of the first lifting mechanism; the third outer layer recovery plate extends downwards along the axial direction from the lifting lug, the third inner layer recovery plate extends upwards along the axial direction from the third outer layer recovery plate, a recovery cavity is formed between the third outer layer recovery plate and the third outer layer recovery plate, and the third splash plate extends towards the direction close to the cleaning disc from the third inner layer recovery plate.
7. The semiconductor cleaning apparatus according to claim 6, wherein the second recovery ring comprises a second recovery plate and a second splash shield, wherein the second recovery plate is provided with a first guide hole, the first guide hole extends in the axial direction, and the third inner-layer recovery plate passes through the first guide hole and is capable of sliding in the axial direction in the first guide hole;
the second splash guard extends from the second recovery plate in the direction of the cleaning disc; and a first drainage channel is formed between the second splash guard and the first splash guard, and a second drainage channel is formed between the second splash guard and the third splash guard.
8. The semiconductor cleaning apparatus of claim 7, wherein a surface of the second splash plate is provided with a second isolation ring.
9. The semiconductor cleaning apparatus according to claim 8, wherein a first liquid spray conduit is embedded inside the second splash plate, and a first nozzle communicating with the first liquid spray conduit is provided on an upper surface of the second splash plate.
10. The semiconductor cleaning apparatus of claim 9, wherein a surface of the third sputtering plate is provided with a third isolation ring.
11. The semiconductor cleaning apparatus according to claim 10, wherein a second liquid spray conduit is embedded inside the third splash plate, and a second nozzle communicating with the second liquid spray conduit is provided on an upper surface of the third splash plate.
12. The semiconductor cleaning apparatus according to claim 7, wherein the elevating end of the second elevating mechanism is provided with a housing, a fourth recovery ring, a fifth recovery ring and a sixth recovery ring, wherein the housing is fixed to the elevating end of the second elevating mechanism, the fourth recovery ring and the fifth recovery ring are fixed to the housing, and the sixth recovery ring is provided on the fifth recovery ring.
13. The semiconductor cleaning apparatus according to claim 12, wherein the fourth recycling ring comprises a fourth inner recycling plate, a fourth outer recycling plate, a fourth splash plate and a fifth splash plate, the fourth splash plate extends from the fourth outer recycling plate in the direction of the cleaning tray, the fifth splash plate extends from the fourth inner recycling plate in the direction of the cleaning tray, a third drainage channel is formed between the fourth splash plate and the third splash plate, a fourth drainage channel is formed between the fourth splash plate and the fifth splash plate, and a recycling cavity is formed between the fourth inner recycling plate and the fourth outer recycling plate;
the fifth recycling ring comprises a fifth recycling plate extending axially from the fourth inner recycling plate, and a recycling cavity is formed between the fifth recycling plate and the fourth inner recycling plate.
14. The semiconductor cleaning apparatus of claim 13, wherein a surface of the fourth splash plate is provided with a fourth isolation ring;
and a fifth isolation ring is arranged on the surface of the fifth splash guard.
15. The semiconductor cleaning apparatus according to claim 13, wherein a third liquid ejection conduit is embedded inside the fourth splash plate, and a third nozzle communicating with the third liquid ejection conduit is provided on an upper surface of the third splash plate;
a fourth liquid spraying conduit is embedded in the fifth anti-splash plate, and a fourth nozzle communicated with the fourth liquid spraying conduit is arranged on the upper surface of the fifth anti-splash plate.
16. The semiconductor cleaning apparatus according to claim 13, wherein the sixth recycling ring comprises a sixth outer recycling plate and a sixth inner recycling plate, the sixth inner recycling plate is fixed on the fifth recycling plate, and a recycling cavity is formed between the sixth outer recycling plate and the sixth inner recycling plate.
17. The semiconductor cleaning apparatus according to claim 16, further comprising a seventh recovery ring disposed at the bottom, the seventh recovery ring comprising a seventh outer recovery plate and a seventh inner recovery plate, the seventh outer recovery plate being fitted over the sixth outer recovery plate, and the seventh inner recovery plate extending radially from the seventh outer recovery plate, an end face of the first inner recovery plate forming a recovery cavity.
18. The semiconductor cleaning apparatus according to claim 1, wherein the cleaning tray comprises:
a rotating disk fixed on a rotating shaft of the driving assembly;
the supporting disc is positioned above the rotating disc and is arranged on a rotating shaft of the driving assembly through a bearing; and
the positioning disc is arranged on the surface of the supporting disc, and a supporting column for supporting the wafer is arranged at the edge of the positioning disc.
19. The semiconductor cleaning apparatus of claim 1, wherein the vacuum assembly comprises:
a vacuum suction tube passing through a rotating shaft of the drive assembly; and
and the vacuum generator is connected with the vacuum suction pipe.
20. The semiconductor cleaning apparatus of claim 1, wherein the cleaning assembly comprises:
a first liquid supply assembly;
a spray tube extending from the first liquid supply assembly to above the cleaning tray;
the mounting seat is arranged in the middle of the positioning plate;
the second nozzle is arranged in the mounting seat, and a nozzle of the second nozzle points to the wafer;
the liquid inlet pipe is communicated with the second nozzle; and
and a second liquid supply assembly supplies liquid to the liquid inlet pipe.
21. The semiconductor cleaning apparatus of claim 20, wherein the fluid inlet pipe is disposed inside a rotating shaft of the drive assembly.
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| CN201911377428.7A CN111001606B (en) | 2019-12-27 | 2019-12-27 | Semiconductor cleaning equipment |
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| CN201911377428.7A CN111001606B (en) | 2019-12-27 | 2019-12-27 | Semiconductor cleaning equipment |
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| CN111001606A true CN111001606A (en) | 2020-04-14 |
| CN111001606B CN111001606B (en) | 2022-03-11 |
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| CN115050643A (en) * | 2022-08-15 | 2022-09-13 | 宁波润华全芯微电子设备有限公司 | Wet etching device |
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| CN111001606B (en) | 2022-03-11 |
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Effective date of registration: 20210622 Address after: No. 170 purple sea road, Minhang District, Shanghai Applicant after: PURE & CLEAN PROCESS SYSTEMS Co.,Ltd. Applicant after: ZHIWEI SEMICONDUCTOR (SHANGHAI) Co.,Ltd. Address before: No. 170 purple sea road, Minhang District, Shanghai Applicant before: PURE & CLEAN PROCESS SYSTEMS Co.,Ltd. |
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Denomination of invention: A semiconductor cleaning equipment Effective date of registration: 20230720 Granted publication date: 20220311 Pledgee: Changning Sub branch of Bank of Shanghai Co.,Ltd. Pledgor: PURE & CLEAN PROCESS SYSTEMS Co.,Ltd. Registration number: Y2023310000388 |