CN217903084U - Full-automatic single wafer cleaning machine - Google Patents
Full-automatic single wafer cleaning machine Download PDFInfo
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- CN217903084U CN217903084U CN202222036591.0U CN202222036591U CN217903084U CN 217903084 U CN217903084 U CN 217903084U CN 202222036591 U CN202222036591 U CN 202222036591U CN 217903084 U CN217903084 U CN 217903084U
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- cleaning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 54
- 230000007246 mechanism Effects 0.000 claims abstract description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000012530 fluid Substances 0.000 claims abstract description 14
- 235000012431 wafers Nutrition 0.000 claims description 80
- 238000007605 air drying Methods 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 5
- 230000007723 transport mechanism Effects 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000000703 high-speed centrifugation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a full-automatic single crystal circle cleaning machine, including frame and mechanism mounting panel, the front side and the left side of frame all are equipped with a wafer loading port, and the upper end of frame is equipped with at least a set of fan filter unit, the inside of frame still is equipped with wafer transport mechanism and wafer aligning gear, be equipped with wafer centrifugal cleaning mechanism on the mechanism mounting panel, two fluid cleaning swing arms, water retaining ring and CDA air-dry swing arm, wafer transport mechanism includes the install bin, the removal module, both arms subassembly and vacuum plate, both arms subassembly includes the linking arm, mounting panel and a set of first mechanical arm and a set of second mechanical arm, wafer aligning gear includes a locating plate and at least three sets of three-jaw aligning gear that have the constant head tank, the wafer has been placed in the constant head tank, three-jaw aligning gear includes the rotating electrical machines, the guide rail, the rack, the slider, drive gear and locating piece, the fixed front end position department of locating the slider, slider and guide rail sliding fit simultaneously.
Description
Technical Field
The utility model relates to a wafer cleaning equipment technical field specifically is full-automatic single crystal round cleaning machine.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then doped into a silicon wafer seed crystal, the silicon wafer seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely the wafer;
in the manufacturing process of the wafer, surface cleaning is a necessary technical link, in the prior art, the process is mainly completed by using a wafer cleaning machine, and a conventional wafer cleaning machine adopts a water column with certain pressure to wash the surface of the wafer, however, the structure of the wafer cleaning machine in the traditional technology is too simple, water stains can be remained on the surface of a workpiece after the wafer is cleaned, and the practicability is poor.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a full-automatic single-wafer cleaning machine.
The utility model provides a technical scheme that its technical problem adopted is: the full-automatic single-wafer cleaning machine comprises a cleaning machine body, wherein the cleaning machine body comprises a rack and a mechanism mounting plate arranged in the rack, a wafer loading port is arranged on each of the front side and the left side of the rack, at least one group of fan filter units are arranged at the upper end of the rack, and a wafer carrying mechanism and a wafer correcting mechanism are arranged in the rack;
the wafer loading port is provided with a wafer box loading position and an automatic cover opening mechanism;
the mechanism mounting plate is provided with a wafer centrifugal cleaning mechanism, a two-fluid cleaning swing arm, a water retaining ring and a CDA air drying swing arm, the water retaining ring is arranged above the wafer centrifugal cleaning mechanism, the front end of the CDA air drying swing arm is provided with a CDA air outlet pipe, and the front end of the two-fluid cleaning swing arm is provided with a water outlet pipe;
the wafer carrying mechanism comprises an installation box, a moving module, a double-arm assembly and a vacuum disc plate, wherein the double-arm assembly comprises a connecting arm, an installation plate, a group of first mechanical arms and a group of second mechanical arms, the first mechanical arms are respectively and rotatably connected with the connecting arm, the first mechanical arms are rotatably connected with the second mechanical arms, the second mechanical arms are respectively and rotatably connected with the installation plate, and the vacuum disc plate is mutually connected with the installation plate;
the wafer correcting mechanism comprises a positioning plate with a positioning groove and at least three groups of three-jaw correcting assemblies, wherein wafers are placed in the positioning groove, each three-jaw correcting assembly comprises a rotating motor, a guide rail, a rack, a sliding block, a transmission gear and a positioning block, the positioning block is fixedly arranged at the front end of the sliding block, and the sliding block is in sliding fit with the guide rail.
Preferably, the bottom of the mechanism mounting plate is provided with a lifting cylinder, a first driving motor and a second driving motor, the lifting cylinder is in driving connection with the water retaining ring, a rotating shaft of the first driving motor is in driving connection with the CDA air drying swing arm, and a rotating shaft of the second driving motor is in driving connection with the two-fluid cleaning swing arm.
Preferably, the bottom of install bin is equipped with the slider, it is connected with the slider drive to remove the module, the inside of install bin is equipped with arm driving motor, arm driving motor's output shaft and linking arm drive are connected, and is a set of the left and right sides of linking arm is located respectively to first arm, and is a set of the left and right sides of mounting panel is located respectively to the second arm.
Preferably, the guide rail is fixedly arranged on the end face of the positioning plate, the rack is fixedly connected with the sliding block, a rotating shaft of the rotating motor penetrates through the positioning plate and then is in driving connection with the transmission gear, and the transmission gear is in meshing connection with the rack.
Compared with the prior art, the beneficial effects of the utility model are that:
the wafer conveying box is loaded, the second mechanical arm and the vacuum disc plate take out and place wafers inside the wafer conveying box in the positioning grooves, the three groups of three-jaw correcting assemblies operate, the sliding block moves forwards or backwards until the positioning step of the positioning block for the wafers is completed, the automatic cover opening mechanism starts and opens the lifting door, the second mechanical arm and the vacuum disc plate place the wafers in the wafer centrifugal cleaning mechanism and then withdraw, the automatic cover opening mechanism starts and closes the lifting door, the lifting cylinder drives the water retaining ring to ascend, the two-fluid cleaning swing arm and the water outlet pipe clean the wafers, the CDA air drying swing arm and the CDA air outlet pipe air dry the wafers after cleaning, the lifting cylinder drives the water retaining ring to descend after air drying, the automatic cover opening mechanism starts and opens the lifting door, the second mechanical arm and the vacuum disc plate take out the wafers from the wafer centrifugal cleaning mechanism, and meanwhile the wafers after cleaning and drying are placed in a finished product collecting area.
Drawings
FIG. 1 is a schematic view of the present invention;
fig. 2 is a schematic structural view of the inside of the rack of the present invention;
fig. 3 is another schematic structural view of the inside of the rack of the present invention;
FIG. 4 is a schematic structural view of the centrifugal cleaning mechanism for wafers according to the present invention;
FIG. 5 is a schematic structural view of the wafer handling mechanism of the present invention;
fig. 6 is a schematic structural view of the wafer alignment mechanism of the present invention;
fig. 7 is a schematic structural view of the automatic cover opening mechanism of the present invention;
FIG. 8 is a schematic structural view of the loading position of the wafer cassette of the present invention;
the reference numbers in the figures:
the device comprises a rack 1, a wafer loading port 2, a fan filter unit 3, a wafer centrifugal cleaning mechanism 4, a wafer carrying mechanism 5, a wafer correcting mechanism 6, a mechanism mounting plate 7, a first driving motor 8, a lifting cylinder 9, a water retaining ring 10, a CDA air drying swing arm 11, a wafer centrifugal cleaning mechanism 12, a two-fluid cleaning swing arm 13, a water outlet pipe 14, a CDA air outlet pipe 15, a moving module 16, a sliding block 17, a connecting arm 18, a vacuum disc plate 19, a mounting plate 20, a first mechanical arm 21, a second mechanical arm 22, a mounting box 23, a wafer 24, a transmission gear 25, a rack 26, a three-jaw correcting assembly 27, a sliding block 28, a guide rail 29, a rotating motor 30, a positioning plate 31, a positioning block 32, an automatic cover opening mechanism 33 and a wafer box loading position 34.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
As shown in fig. 1-8, the utility model provides a full-automatic single-wafer cleaning machine, including the cleaning machine body, the cleaning machine body includes frame 1 and locates its inside mechanism mounting panel 7, the front side and the left side of frame 1 all are equipped with a wafer loading port 2, and the upper end of frame 1 is equipped with at least a set of fan filter unit 3, and the inside of frame 1 still is equipped with wafer handling mechanism 5 and wafer aligning gear 6 simultaneously, and frame 1 has a washing cavity inside, and frame 1 and washing cavity all adopt 304 stainless steel to make;
the wafer loading port 2 is provided with a wafer box loading position 34 and an automatic uncovering mechanism 33;
the mechanism mounting plate 7 is provided with a wafer centrifugal cleaning mechanism 12, a two-fluid cleaning swing arm 13, a water retaining ring 10 and a CDA air drying swing arm 11, the water retaining ring 10 is arranged above the wafer centrifugal cleaning mechanism 12, the front end of the CDA air drying swing arm 11 is provided with a CDA air outlet pipe 15, the front end of the two-fluid cleaning swing arm 13 is provided with a water outlet pipe 14, the two fluids are a combination of high-pressure DI water and clean XCAD (N2), the surface of a workpiece is free of residual water marks by high-speed centrifugation and matched use of CDA air drying after cleaning, and an air filtering system consisting of a fan filter unit 3 is arranged at the same time, so that the cleanness of compressed air is ensured, and the wafer 24 is prevented from being polluted in the cleaning process;
the wafer carrying mechanism 5 comprises a mounting box 23, a moving module 16, a double-arm assembly and a vacuum plate 19, wherein the double-arm assembly comprises a connecting arm 18, a mounting plate 20, a group of first mechanical arms 21 and a group of second mechanical arms 22, the first mechanical arms 21 are respectively and rotatably connected with the connecting arm 18, the first mechanical arms 21 are rotatably connected with the second mechanical arms 22, the second mechanical arms 22 are respectively and rotatably connected with the mounting plate 20, and the vacuum plate 19 is connected with the mounting plate 20;
wafer aligning gear 6 includes a locating plate 31 and at least three-jaw of group correction subassembly 27 that have the constant head tank, wafer 24 has been placed in the constant head tank, three-jaw correction subassembly 27 includes rotating electrical machines 30, guide rail 29, rack 26, slider 28, drive gear 25 and locating piece 32, the fixed front end position department of locating slider 28 of locating piece 32, slider 28 and guide rail 29 sliding fit simultaneously.
The bottom of mechanism mounting panel 7 is equipped with lift cylinder 9, first driving motor 8 and second driving motor, lift cylinder 9 is connected with manger plate circle 10 drive, first driving motor 8's rotation axis with CDA air-dries swing arm 11 drive and is connected, second driving motor's rotation axis with two fluid cleaning swing arm 13 drive is connected.
The bottom of install bin 23 is equipped with slider 28, it is connected with slider 28 drive to remove the module 16, the inside of install bin 23 is equipped with arm driving motor, arm driving motor's output shaft and linking arm 18 drive are connected, and a set of first arm 21 locates the left and right sides of linking arm 18 respectively, and a set of second arm 22 locates the left and right sides of mounting panel 20 respectively.
The guide rail 29 is fixedly arranged on the end face of the positioning plate 31, the rack 26 is fixedly connected with the slider 28, the rotating shaft of the rotating motor 30 penetrates through the positioning plate 31 and then is in driving connection with the transmission gear 25, and the transmission gear 25 is in meshing connection with the rack 26.
The working principle is as follows: the wafer conveying box is loaded, the wafer positioned in the wafer conveying box is taken out and placed in the positioning groove by the second mechanical arm and the vacuum plate, the three groups of three-jaw correcting assemblies operate, the sliding block moves forwards or backwards until the positioning step of the positioning block on the wafer is completed, the automatic uncovering mechanism starts and opens the lifting door, the wafer is placed on the wafer centrifugal cleaning mechanism by the second mechanical arm and the vacuum plate and then is withdrawn, the automatic uncovering mechanism starts and closes the lifting door, the lifting cylinder drives the water retaining ring to ascend, the two-fluid cleaning swing arm and the water outlet pipe clean the wafer, the CDA air drying swing arm and the CDA air outlet pipe air-dry the wafer after cleaning is completed, the lifting cylinder drives the water retaining ring to descend after air drying is completed, the lifting door is started and opened by the automatic uncovering mechanism, the wafer is taken out of the wafer centrifugal cleaning mechanism by the second mechanical arm and the vacuum plate, and the cleaned and dried wafer is placed in a finished product collecting area.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (4)
1. The full-automatic single-wafer cleaning machine comprises a cleaning machine body, wherein the cleaning machine body comprises a rack and a mechanism mounting plate arranged in the rack, and the cleaning machine is characterized in that a wafer loading port is arranged on each of the front side and the left side of the rack, at least one group of fan filter units are arranged at the upper end of the rack, and a wafer carrying mechanism and a wafer correcting mechanism are arranged in the rack;
the wafer loading port is provided with a wafer box loading position and an automatic cover opening mechanism;
the mechanism mounting plate is provided with a wafer centrifugal cleaning mechanism, a two-fluid cleaning swing arm, a water retaining ring and a CDA air drying swing arm, the water retaining ring is arranged above the wafer centrifugal cleaning mechanism, the front end of the CDA air drying swing arm is provided with a CDA air outlet pipe, and the front end of the two-fluid cleaning swing arm is provided with a water outlet pipe;
the wafer carrying mechanism comprises an installation box, a moving module, a double-arm assembly and a vacuum disc plate, wherein the double-arm assembly comprises a connecting arm, an installation plate, a group of first mechanical arms and a group of second mechanical arms, the first mechanical arms are respectively and rotatably connected with the connecting arm, the first mechanical arms are rotatably connected with the second mechanical arms, the second mechanical arms are respectively and rotatably connected with the installation plate, and the vacuum disc plate is mutually connected with the installation plate;
the wafer correcting mechanism comprises a positioning plate with a positioning groove and at least three groups of three-jaw correcting assemblies, wherein wafers are placed in the positioning groove, each three-jaw correcting assembly comprises a rotating motor, a guide rail, a rack, a sliding block, a transmission gear and a positioning block, the positioning block is fixedly arranged at the front end of the sliding block, and the sliding block is in sliding fit with the guide rail.
2. The automatic single wafer cleaning machine of claim 1, wherein a lifting cylinder, a first driving motor and a second driving motor are provided at the bottom of the mechanism mounting plate, the lifting cylinder is drivingly connected to the splash ring, the rotating shaft of the first driving motor is drivingly connected to the CDA drying swing arm, and the rotating shaft of the second driving motor is drivingly connected to the two fluid cleaning swing arm.
3. The machine of claim 1, wherein the bottom of the mounting box is provided with a slide block, the moving module is drivingly connected to the slide block, the interior of the mounting box is provided with a robot driving motor, an output shaft of the robot driving motor is drivingly connected to a connecting arm, a set of the first robot arms are respectively disposed on left and right sides of the connecting arm, and a set of the second robot arms are respectively disposed on left and right sides of the mounting plate.
4. The automatic single-wafer cleaning machine according to claim 1, wherein the guide rail is fixedly disposed on an end surface of the positioning plate, the rack is fixedly connected to the slider, the rotating shaft of the rotating motor is drivingly connected to the transmission gear after penetrating through the positioning plate, and the transmission gear is engaged with the rack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222036591.0U CN217903084U (en) | 2022-08-03 | 2022-08-03 | Full-automatic single wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222036591.0U CN217903084U (en) | 2022-08-03 | 2022-08-03 | Full-automatic single wafer cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217903084U true CN217903084U (en) | 2022-11-25 |
Family
ID=84139294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222036591.0U Active CN217903084U (en) | 2022-08-03 | 2022-08-03 | Full-automatic single wafer cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217903084U (en) |
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2022
- 2022-08-03 CN CN202222036591.0U patent/CN217903084U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523000 Room 302, 3rd floor, building A1, 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Patentee after: Guangdong Kaidi Micro Intelligent Equipment Co.,Ltd. Address before: 523000 Room 302, 3rd floor, building A1, 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Patentee before: Dongguan Kaidi Micro Intelligent Equipment Co.,Ltd. |