CN114042685A - Semiconductor wafer circulation belt cleaning device - Google Patents
Semiconductor wafer circulation belt cleaning device Download PDFInfo
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- CN114042685A CN114042685A CN202111199596.9A CN202111199596A CN114042685A CN 114042685 A CN114042685 A CN 114042685A CN 202111199596 A CN202111199596 A CN 202111199596A CN 114042685 A CN114042685 A CN 114042685A
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- pipe
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a semiconductor wafer circulating cleaning device, which comprises: the two sides of the rotating column are fixedly connected with supporting frames for supporting; the cleaning pipe assemblies are fixedly connected to the side edges of the rotating columns in an equidistant annular mode and comprise pipe bodies used for placing a plurality of wafers and pipe covers, and openings are formed in one sides of the pipe bodies; the clamping and fixing assembly comprises mounting blocks and clamping plates, the mounting blocks are fixedly mounted inside the pipe body at equal intervals, and the two clamping plates are positioned on two sides of the mounting blocks; the placing assembly is fixedly arranged between two adjacent clamping and fixing assemblies; the circulating water mechanism, the circulating water subassembly includes water inlet assembly and water outlet assembly for leading-in and deriving water in the body is inside. The invention cleans the wafer in a rotating mode, and can synchronously carry out operation on the putting in and taking out of the wafer, thereby improving the cleaning rate.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a semiconductor wafer circulating cleaning device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; the present invention relates to a method for manufacturing a semiconductor wafer, and more particularly to a method for manufacturing a semiconductor wafer, which can be used to manufacture a semiconductor wafer having a specific electrical function by processing various circuit device structures on the silicon wafer, wherein the conventional semiconductor wafer is easily contaminated by dust particles and metals during the manufacturing process, thereby causing the damage of the circuit function in the wafer, forming short circuit or open circuit, etc., leading to the failure of an integrated circuit and affecting the formation of geometric features, and therefore, the surface of the wafer needs to be cleaned during the manufacturing process, and impurities such as micro-dust, metal ions and organic matters remained on the wafer can be effectively removed.
The wafer is fixed between the existing cleaning devices mostly, and then is cleaned by water, but the direct washing mode can cause impact on the contact surface of the wafer and the fixing device, so that the wafer is deformed, the semiconductor cannot be normally used, and meanwhile, the steps are complicated in the use process of the fixed cleaning device, and the cleaning efficiency of the wafer is low.
Disclosure of Invention
The invention aims to solve the defects that the direct washing mode can impact the contact surface of a wafer and a fixing device to deform the wafer so as to cause abnormal use of a semiconductor, and meanwhile, the fixing and placing mode has complex steps in the use process and low cleaning efficiency of the wafer, so that the circular cleaning device for the semiconductor wafer is provided.
In order to achieve the purpose, the invention adopts the following technical scheme:
a semiconductor wafer circulation cleaning device comprises:
the two sides of the rotating column are fixedly connected with supporting frames for supporting;
the cleaning pipe assembly is fixedly connected to the side edge of the rotating column in an equidistant annular mode and comprises a pipe body and a pipe cover, the pipe body is used for placing a plurality of wafers, one side of the pipe body is provided with an opening, the inner wall of the pipe on one side far away from the opening is a plane, and one side of the pipe cover is rotatably connected with one side, close to the rotating column, of the opening;
the clamping and fixing assembly comprises mounting blocks and clamping plates, the mounting blocks are fixedly mounted inside the tube body at equal intervals, the two clamping plates are positioned on two sides of the mounting blocks and connected with the tube cover through adjusting assemblies, and a group of clamping plates opposite to each other on two adjacent mounting blocks are used for fixing wafers;
the placing component is fixedly arranged between two adjacent clamping and fixing components and is used for placing the wafer;
the circulating water mechanism, the circulating water subassembly includes water inlet assembly and water outlet assembly for leading-in and deriving water in the body is inside.
Preferably, one side of the clamping plate, which is far away from the mounting block, is provided with an arc shape, the side wall of the clamping plate is provided with a plurality of clamping grooves, and the clamping plate is made of an elastic material.
Preferably, the placing assembly comprises a telescopic rod and a crystal placing plate, the telescopic rod is vertically and fixedly connected between the two adjacent clamping and fixing assemblies, the crystal placing plate is a circular thin plate, and the crystal placing plate is fixedly connected to the top end of the telescopic rod.
Preferably, the adjusting component comprises a liquid pipe, a pressure lever and sliding rods, the liquid pipe is arranged inside the mounting block and is in an inverted T shape, one end of the pressure lever is fixedly connected with the inner wall of the pipe cover, the other end of the pressure lever slides in the vertical end of the liquid pipe in a sealing manner, one ends of the two sliding rods slide in the horizontal ends of the two sides of the liquid pipe in a sealing manner, and the other ends of the two sliding rods are fixedly connected with the side edges of the clamping plate in the side direction.
Preferably, the subassembly of intaking includes the water tank, advances water interface and inlet tube, water tank fixed connection is on one side support frame, the fixed intercommunication of inlet tube is on the water tank, it is close to one side of water tank at the body to advance water interface fixed mounting, and when the interface of just intaking keeps forward level, with advance water piping connection.
Preferably, the water outlet assembly comprises a water outlet pipe, a sewage treatment tank and a water outlet interface, the sewage treatment tank is fixedly mounted on the outer side of the support frame which supports the water inlet assembly and is far away from the water outlet pipe, the water outlet pipe is communicated with the sewage treatment tank, and the water outlet interface is fixedly communicated with the bottom of the pipe body and communicated with the water outlet pipe when the water outlet assembly keeps a forward level.
Preferably, be provided with sealed closed component between body and the tube cap, sealed closed component includes sealing strip, draw-in groove and connecting strip, sealing strip fixed connection is at the tube cap inner wall, connecting strip fixed connection is in the tube cap outside, draw-in groove fixed connection is at the draw-in groove side, the connecting strip card is established inside the draw-in groove.
Preferably, the bottom part of the pressure lever which is always positioned in the liquid pipe is made of hard materials and is connected with the pipe cover, and the bent part is made of elastic materials.
Preferably, the water outlet pipe and the water inlet pipe are respectively positioned on two sides of the rotating column and used for simultaneous water inlet and outlet treatment of the pipe bodies on two sides.
Compared with the prior art, the invention has the beneficial effects that:
when the tube body on one side is kept horizontal, the tube cover is opened under the action of the electric rotating shaft, wafers to be cleaned are placed on the plurality of placing components, the tube cover which is automatically closed drives the adjusting component to perform pressing action, the two clamping plates are moved, so that the wafers on the placing components are clamped, when the tube cover is completely closed, the interior of the tube body is subjected to water guide treatment through the water inlet component, the rotating column rotates to drive the tube body to rotate, so that the wafers in the tube body are cleaned in the rotating water, dust and impurities on the surface are separated, when the tube body rotates 180 degrees, sewage mixed with impurities is led out through the water outlet component, the tube cover is opened to take out the wafers which are cleaned in the interior, and the wafers to be cleaned are placed on the other side, the invention cleans the wafers in a rotating mode, the cleaning of the wafer is guaranteed, meanwhile, the wafer can be synchronously put in and taken out for operation, the wafer is conveniently put in and taken out, and the cleaning rate is improved.
Drawings
FIG. 1 is a right side view of a semiconductor wafer cleaning apparatus according to the present invention;
FIG. 2 is a schematic diagram of a left side of a semiconductor wafer cleaning apparatus according to the present invention;
FIG. 3 is a schematic front view of a semiconductor wafer cleaning apparatus according to the present invention;
FIG. 4 is a schematic view of a cleaning tube assembly of the semiconductor wafer circulation cleaning apparatus according to the present invention;
FIG. 5 is a schematic view of a clamping and fixing assembly of the semiconductor wafer circulation cleaning device according to the present invention.
In the figure: 1 rotation post, 2 support frames, 3 wash the pipe assembly, 31 body, 32 tube covers, 4 fixed subassemblies of centre gripping, 41 installation pieces, 42 grip blocks, 5 place the subassembly, 51 telescopic link, 52 put the brilliant board, 6 subassembly of intaking, 61 water tank, 62 interface of intaking, 63 inlet tubes, 7 play water components, 71 outlet pipe, 72 sewage treatment case, 73 play water connectors, 8 adjusting part, 81 liquid pipe, 82 depression bar, 83 slide bars, 9 sealed closed subassemblies, 91 sealing strip, 92 draw-in grooves, 93 connecting strip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 5, a semiconductor wafer circulation cleaning apparatus includes:
the device comprises a rotating column 1, wherein two sides of the rotating column 1 are fixedly connected with supporting frames 2 for supporting, and the rotating column 1 is driven by an internal motor to rotate between the two supporting frames 2;
the cleaning pipe assembly 3 is characterized in that a plurality of cleaning pipe assemblies 3 are fixedly connected to the side edge of the rotating column 1 in an equidistant annular mode, the cleaning pipe assembly 3 comprises a pipe body 31 used for placing a plurality of wafers and a pipe cover 32, one side of the pipe body 31 is provided with an opening, the inner wall of one side of the pipe far away from the opening is a plane, one side of the pipe cover 32 is rotatably connected with one side of the opening close to the rotating column 1, and the pipe cover 32 is rotated and sealed through an electric rotating shaft;
the clamping and fixing assembly 4 comprises mounting blocks 41 and clamping plates 42, the mounting blocks 41 are fixedly mounted inside the tube body 31 at equal intervals, the two clamping plates 42 are located on two sides of the mounting blocks 41 and connected with the tube cover 32 through the adjusting assembly 8, and a group of clamping plates 42 opposite to each other on two adjacent mounting blocks 41 are used for fixing a wafer;
the placing component 5 is fixedly arranged between two adjacent clamping and fixing components 4 and used for placing the wafer;
the circulating water mechanism, circulating water subassembly include into water subassembly 6 and play water subassembly 7 for leading in and exporting water inside body 31.
In the invention, when the tube 31 on one side is kept horizontal, the tube cover 32 is opened under the action of the electric rotating shaft, the wafer to be cleaned is placed on the plurality of placing components 5, the tube cover 32 which is automatically closed drives the adjusting component 8 to perform pressing action, the two clamping plates 42 are moved, so that the wafer on the placing components 5 is clamped, after the tube cover 32 is completely closed, the inside of the tube 31 is subjected to water guide treatment through the water inlet component 6, the rotating column 1 rotates to drive the tube 31 to rotate, so that the wafer inside the tube 31 is cleaned in the rotating water, dust and impurities on the surface are separated, after the tube 31 rotates 180 degrees, sewage mixed with impurities is led out through the water outlet component 7, the tube cover 32 is opened to take out the wafer which is cleaned inside, and the wafer to be cleaned is placed on the other side, the invention cleans the wafer in a rotating mode, ensures the cleaning of the wafer, can synchronously carry out the operation of putting in and taking out the wafer, is convenient for putting in and taking out the wafer and improves the cleaning speed.
According to the preferred technical scheme in the embodiment, one side of the clamping plate 42, which is far away from the mounting block 41, is provided with an arc shape, the side wall of the clamping plate 42 is provided with a plurality of clamping grooves, the clamping plate 42 is made of elastic materials, the clamping plate 42 which moves towards the middle from two sides is used for clamping and fixing the wafer placed on the placing component 5, the side edge of the wafer is fixed through the clamping grooves, and meanwhile, the clamping plate 42 is elastic, so that the clamping effect can be performed on wafers with different diameters, and the cleaning of the wafers with different specifications is facilitated;
the placing component 5 comprises an expansion link 51 and a wafer placing plate 52, the expansion link 51 is vertically and fixedly connected between two adjacent clamping and fixing components 4, the expansion link 51 is controlled by a motor and is contracted up and down under the control of data, the wafer placing plate 52 is a circular thin plate and is fixedly connected to the top end of the expansion link 51, the diameter of the wafer placing plate 52 is smaller than the diameter of a common wafer, the distance between the two opposite clamping plates 42 is larger than the diameter of the wafer, so that the wafer is relatively and limitedly placed on the wafer placing plate 52, when the wafer is required to be cleaned, the wafer placed on the wafer placing plate 52 is fixed by the clamping plates 42 from two sides, and the expansion link 51 drives the wafer placing plate 52 to move downwards to be separated from the wafer, so that the upper surface and the lower surface of the wafer can be cleaned uniformly;
the adjusting assembly 8 comprises a liquid pipe 81, a pressure lever 82 and sliding rods 83, the liquid pipe 81 is arranged inside the mounting block 41 and is in an inverted T shape, liquid is filled inside the liquid pipe 81, one end of the pressure lever 82 is fixedly connected with the inner wall of the pipe cover 32, the other end of the pressure lever is hermetically slid at the vertical end of the liquid pipe 81, one ends of the two sliding rods 83 are hermetically slid inside the horizontal ends at the two sides of the liquid pipe 81, the other end of the two sliding rods 83 is fixedly connected with the side edge of the clamping plate 42, the pressure lever 82 is driven to move up and down through the rotation of the pipe cover 32, when the pipe cover 32 is closed, the pressure lever 82 moves inside the liquid pipe 81, so that the sliding rods 83 at the two sides are pushed outwards to drive the clamping plate 42 to move, so as to clamp a wafer, when the pipe cover 32 moves upwards, the pressure lever 82 moves upwards, and the two sliding rods 83 are driven to move inwards due to the hydraulic action, so that the fixed wafer is loosened;
the water inlet assembly 6 comprises a water tank 61, a water inlet interface 62 and a water inlet pipe 63, the water tank 61 is fixedly connected to the supporting frame 2 on one side, the water inlet pipe 63 is fixedly communicated with the water tank 61, the water inlet interface 62 is fixedly installed on one side, close to the water tank 61, of the pipe body 31, and when the water inlet interface 62 keeps a forward horizontal direction, the water inlet interface 62 is connected with the water inlet pipe 63, water in the water tank 61 is guided into the water inlet interface 62 from the water inlet pipe 63 through a water pump, and when the pipe body 31 keeps the forward horizontal direction upwards, the water inlet pipe 63 moves to the water inlet interface 62 to be connected, and water is guided into the pipe body 31;
the water outlet assembly 7 comprises a water outlet pipe 71, a sewage treatment tank 72 and water outlet ports 73, the sewage treatment tank 72 is fixedly mounted on the outer side of the support frame 2 which supports the water inlet assembly 6 and is far away from the water inlet assembly, the water outlet pipe 71 is communicated with the sewage treatment tank 72, a plurality of water outlet ports 73 are fixedly communicated with the bottom of the pipe body 31 and are communicated with the water outlet pipe 71 when the water outlet pipe 71 keeps a forward level, after the water outlet pipe is rotationally cleaned, the water outlet ports 73 on the pipe body 31 in the reverse level are in contact connection with the water outlet pipe 71, and sewage in the pipe body 31 is extracted and led out through a water suction pump in the sewage treatment tank 72, so that the sewage is cleaned and recycled;
a sealing closing component 9 is arranged between the pipe body 31 and the pipe cover 32, the sealing closing component 9 comprises a sealing strip 91, a clamping groove 92 and a connecting strip 93, the sealing strip 91 is fixedly connected to the inner wall of the pipe cover 32, the connecting strip 93 is fixedly connected to the outer side of the pipe cover 32, the clamping groove 92 is fixedly connected to the side edge of the clamping groove 92, the connecting strip 93 is clamped inside the clamping groove 92, as the pipe body 31 can rotate along with the rotating column 1, in order to ensure that water inside the pipe body 31 cannot seep out, the sealing performance of the pipe body 31 and the pipe cover 32 is enhanced through the sealing closing component 9, the training grade of the pipe body 31 and the pipe cover 32 is enhanced through the sealing strip 91, and the connecting strip 93 moving into the clamping groove 92 is clamped through an electric clamping lock inside the clamping groove 92, so that the sealing connection performance of the pipe body 31 and the pipe cover 32 is ensured;
the bottom end part of the pressure lever 82, which is always positioned inside the liquid pipe 81, is made of a rigid material and is connected with the pipe cover 32, and the bent part is made of an elastic material, so that the upper part of the pressure lever 82 can deviate along with the pipe cover 32 and needs to have bending elasticity, and the normal use of the adjusting assembly 8 is realized;
the water outlet pipe 71 and the water inlet pipe 63 are respectively positioned at two sides of the rotating column 1 and are used for simultaneously carrying out water inlet and water outlet treatment on the pipe bodies 31 at two sides, when one pipe body 31 is kept horizontal, the pipe body 31 at the other side is also kept horizontal, so that the water conveying and water outlet effects can be simultaneously carried out on the pipe bodies 31 at two sides, and wafers at two sides can be placed and taken out.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. A semiconductor wafer circulation cleaning device is characterized by comprising:
the device comprises a rotating column (1), wherein two sides of the rotating column (1) are fixedly connected with a supporting frame (2) for supporting;
the cleaning pipe assembly (3) is fixedly connected to the side edge of the rotating column (1) in an equidistant annular mode, the cleaning pipe assembly (3) comprises a pipe body (31) used for placing a plurality of wafers and a pipe cover (32), one side of the pipe body (31) is provided with an opening, the inner wall of one side pipe far away from the opening is a plane, and one side of the pipe cover (32) is rotatably connected with one side, close to the rotating column (1), of the opening;
the clamping and fixing assembly (4) comprises mounting blocks (41) and clamping plates (42), the mounting blocks (41) are fixedly mounted inside the tube body (31) at equal intervals, the two clamping plates (42) are located on two sides of the mounting blocks (41) and connected with the tube cover (32) through adjusting assemblies (8), and one group of clamping plates (42) opposite to each other on the two adjacent mounting blocks (41) are used for fixing a wafer;
the placing component (5) is fixedly arranged between two adjacent clamping and fixing components (4) and used for placing a wafer;
the circulating water mechanism, the circulating water subassembly includes into water subassembly (6) and goes out water subassembly (7) for with water leading-in and deriving in body (31) inside.
2. The semiconductor wafer circulation cleaning device as claimed in claim 1, wherein the side of the clamping plate (42) away from the mounting block (41) is provided with an arc shape, and a plurality of clamping grooves are formed on the side wall of the clamping plate (42), and the clamping plate (42) is made of elastic material.
3. The semiconductor wafer circulating cleaning device as claimed in claim 1, wherein the placing module (5) comprises a telescopic rod (51) and a wafer placing plate (52), the telescopic rod (51) is vertically and fixedly connected between two adjacent clamping and fixing modules (4), and the wafer placing plate (52) is a circular thin plate and is fixedly connected to the top end of the telescopic rod (51).
4. The semiconductor wafer circulating cleaning device as claimed in claim 1, wherein the adjusting assembly (8) comprises a liquid pipe (81), a pressure rod (82) and a sliding rod (83), the liquid pipe (81) is opened inside the mounting block (41) and is in an inverted T shape, one end of the pressure rod (82) is fixedly connected with the inner wall of the pipe cover (32), the other end of the pressure rod is sealed and slid at the vertical end of the liquid pipe (81), one end of the two sliding rods (83) is sealed and slid inside the horizontal ends at the two sides of the liquid pipe (81), and the other end of the two sliding rods is fixedly connected with the side edge of the clamping plate (42).
5. The semiconductor wafer circulating cleaning device as claimed in claim 1, wherein the water inlet assembly (6) comprises a water tank (61), a water inlet port (62) and a water inlet pipe (63), the water tank (61) is fixedly connected to the supporting frame (2) on one side, the water inlet pipe (63) is fixedly communicated with the water tank (61), the water inlet port (62) is fixedly installed on one side of the pipe body (31) close to the water tank (61), and the water inlet port (62) is connected with the water inlet pipe (63) when the water inlet port (62) maintains a forward level.
6. The semiconductor wafer circulating cleaning device according to claim 1, wherein the water outlet assembly (7) comprises a water outlet pipe (71), a sewage treatment tank (72) and water outlet ports (73), the sewage treatment tank (72) is fixedly installed at the outer side of the support frame (2) which supports the water inlet assembly (6) far away, the water outlet pipe (71) is communicated with the sewage treatment tank (72), and the water outlet ports (73) are fixedly communicated with the bottom of the tube body (31) and are communicated with the water outlet pipe (71) when the water outlet pipe maintains the forward level.
7. The semiconductor wafer circulating cleaning device according to claim 1, wherein a sealing and closing assembly (9) is arranged between the tube body (31) and the tube cover (32), the sealing and closing assembly (9) comprises a sealing strip (91), a clamping groove (92) and a connecting strip (93), the sealing strip (91) is fixedly connected to the inner wall of the tube cover (32), the connecting strip (93) is fixedly connected to the outer side of the tube cover (32), the clamping groove (92) is fixedly connected to the side edge of the clamping groove (92), and the connecting strip (93) is clamped inside the clamping groove (92).
8. A semiconductor wafer circulation cleaning device as claimed in claim 1, characterized in that the bottom end portion of the pressure rod (82) always located inside the liquid pipe (81) is made of rigid material and connected with the pipe cover (32), and the bending portion is made of elastic material.
9. The semiconductor wafer circulation cleaning device as claimed in claim 1, wherein the water outlet pipe (71) and the water inlet pipe (63) are respectively located at two sides of the rotary column (1) for performing water inlet and outlet treatment on the pipe bodies (31) at two sides simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111199596.9A CN114042685A (en) | 2021-10-14 | 2021-10-14 | Semiconductor wafer circulation belt cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111199596.9A CN114042685A (en) | 2021-10-14 | 2021-10-14 | Semiconductor wafer circulation belt cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114042685A true CN114042685A (en) | 2022-02-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111199596.9A Withdrawn CN114042685A (en) | 2021-10-14 | 2021-10-14 | Semiconductor wafer circulation belt cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114042685A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116741666A (en) * | 2023-06-01 | 2023-09-12 | 浙江精瓷半导体有限责任公司 | Aqueous cleaning apparatus and compositions for semiconductor copper processing |
-
2021
- 2021-10-14 CN CN202111199596.9A patent/CN114042685A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116741666A (en) * | 2023-06-01 | 2023-09-12 | 浙江精瓷半导体有限责任公司 | Aqueous cleaning apparatus and compositions for semiconductor copper processing |
| CN116741666B (en) * | 2023-06-01 | 2024-03-01 | 浙江精瓷半导体有限责任公司 | Aqueous cleaning apparatus and compositions for semiconductor copper processing |
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