CN218638081U

CN218638081U - High-efficient cleaning equipment of semiconductor wafer

Info

Publication number: CN218638081U
Application number: CN202222499386.8U
Authority: CN
Inventors: 韩五静; 王思远; 王晨
Original assignee: Anhui Fulede Changjiang Semiconductor Material Co ltd
Current assignee: Anhui Fulede Changjiang Semiconductor Material Co ltd
Priority date: 2022-09-21
Filing date: 2022-09-21
Publication date: 2023-03-17
Anticipated expiration: 2032-09-21

Abstract

The utility model discloses a high-efficient cleaning equipment of semiconductor wafer relates to semiconductor wafer and washs technical field, including the washing tank, the ultrasonic cleaning board is installed to the inner chamber bottom of washing tank, the equal fixedly connected with of right-hand member can carry out elevating movement's actuating lever about the washing tank, and two the equal fixedly connected with mounting panel of output of actuating lever, two install rotatable wafer rack between the mounting panel. The cleaning tank can drive the wafer placing rack to rotate by utilizing the driving motor, so that the end face of the wafer and the cleaning tank are arranged in parallel, and compared with the traditional mode that the wafer and the cleaning tank are vertically arranged, the contact area between bubbles and the wafer can be increased, and the cleaning efficiency of the wafer is improved.

Description

High-efficient cleaning equipment of semiconductor wafer

Technical Field

The utility model relates to a semiconductor wafer washs technical field, in particular to high-efficient cleaning equipment of semiconductor wafer.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, and various circuit element structures can be manufactured on the silicon wafer to form an IC product with a specific electric function.

The cleaning operation needs to be carried out on the existing wafer when the wafer is produced, the wafer is vertically inserted into a clamping groove of a flower basket, the flower basket is immersed into a cleaning tank filled with cleaning liquid, rising bubbles are generated in the cleaning liquid by utilizing an ultrasonic vibration plate arranged at the bottom of the cleaning tank, the bubbles collide with the outer surface of the wafer in a contact manner, and an explosion is generated, so that the wafer is cleaned, the wafer is vertically inserted into the flower basket (namely, the wafer and the cleaning tank are vertically arranged), the collision contact area of the wafer and the bubbles is smaller, most of the bubbles are broken when rising to the liquid level, and the generated bubbles cannot be fully utilized, so that the wafer cleaning efficiency is low.

SUMMERY OF THE UTILITY MODEL

An object of this application is to provide a high-efficient cleaning equipment of semiconductor wafer, and the usable driving motor of this washing tank can drive the wafer rack and rotate, can make the terminal surface and the washing tank parallel arrangement of wafer, compares the mode that traditional wafer and washing tank set up perpendicularly, can increase the area of contact of bubble and wafer, and then improves the cleaning efficiency to the wafer.

In order to achieve the above purpose, the present application provides the following technical solutions: the efficient cleaning equipment for the semiconductor wafer comprises a cleaning tank, wherein an ultrasonic cleaning plate is installed at the bottom of an inner cavity of the cleaning tank, driving rods capable of performing lifting motion are fixedly connected to the left end and the right end of the cleaning tank, mounting plates are fixedly connected to the output ends of the two driving rods, and a rotatable wafer placing frame is installed between the two mounting plates;

the wafer rack comprises a plurality of rings which are arranged in a straight line shape, and each ring is provided with four U-shaped clamping blocks with clamping grooves, wherein the number of the U-shaped clamping blocks is three, the number of the U-shaped clamping blocks is four, the clamping grooves are formed in the rings, the U-shaped clamping blocks are fixedly connected with the rings, one U-shaped clamping block is slidably sleeved on the rings, the U-shaped clamping blocks are slidably arranged, inner cavities of the U-shaped clamping blocks are provided with positioning units, adjacent two U-shaped clamping blocks are positioned in the clamping connection with the rings, the U-shaped clamping blocks on the rings are fixedly connected with connecting rods and are respectively close to two mounting plates, rotating shafts are fixed on the U-shaped clamping blocks and are respectively connected with the corresponding mounting plates in a rotating mode, a driving shaft is arranged at the upper end of the mounting plates in a rotating mode, one end of the driving shaft is fixed on an output shaft of a driving motor, gears are fixedly connected to the driving shaft and the left side of the driving shaft, and gears are fixedly connected to the rotating shafts, and the two corresponding gears are meshed with each other gears.

Preferably, the upper end of the positioning unit is fixedly connected with a positioning spring of the inner cavity of the U-shaped fixture block, the lower end of the positioning spring is fixedly connected with a positioning column of which the lower end is of a semicircular structure, and the lower end of the positioning column penetrates through the inner wall of the U-shaped fixture block and is inserted into a positioning groove formed in the circular ring.

Preferably, the positioning unit comprises an elastic positioning ring fixedly connected in the sliding cavity of the U-shaped clamping block, and the inner ring end of the elastic positioning ring is clamped in an annular clamping groove formed in the circular ring.

Preferably, the U-shaped clamping blocks are arranged in a linear shape in a sliding mode, the upper ends of the U-shaped clamping blocks are rotatably provided with rotating rods, and the upper ends of the rotating rods are fixedly connected with the handheld cross rod.

Preferably, the driving rod is any one of an electric push rod, a hydraulic rod or an air cylinder.

Preferably, the arc-shaped parts of the output ends of the two driving rods are fixedly connected with the lower end of the cover plate.

Preferably, the inner cavities of the cleaning tank and the cover plate are provided with vacuum cavities.

To sum up, the utility model discloses a technological effect and advantage:

1. the utility model has reasonable structure, the cleaning tank can drive the wafer placing rack to rotate by utilizing the driving motor, the end surface of the wafer and the cleaning tank can be arranged in parallel, compared with the traditional mode that the wafer and the cleaning tank are arranged vertically, the contact area between the bubbles and the wafer can be increased, and the cleaning efficiency of the wafer is further improved;

2. the utility model discloses in, be provided with the bull stick and hold the horizontal pole, when carrying out the material loading, can directly hold with the hand and hold the horizontal pole and make it drive a plurality of U-shaped fixture block simultaneously hard and remove, need not to remove one by one single U-shaped fixture block, improve material loading efficiency.

3. The utility model discloses in, be provided with the apron, and apron and washing tank inner chamber all are provided with the vacuum cavity, and its apron can live the upper end of washing tank is sealed, and when avoiding the bubble explosion, the washing liquid splashes, and can weaken the noise that sends when ultrasonic cleaning board washs, and the unable vacuum of sound is propagated simultaneously, can further weaken the noise that ultrasonic cleaning board sent when wasing.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic view of the three-dimensional splitting structure of the present invention;

FIG. 2 is a schematic view of a partial structure of the wafer holder shown in FIG. 1 according to the present invention;

fig. 3 is a schematic view of the U-shaped fixture block shown in fig. 2 according to the present invention;

fig. 4 is a schematic side view of a cross-sectional structure of a U-shaped fixture block according to an embodiment of the present invention;

fig. 5 is a schematic view of a partial front view cross-sectional structure of a U-shaped fixture block according to an embodiment of the present invention.

In the figure: 1. a cleaning tank; 2. cleaning the plate with ultrasonic waves; 3. a drive rod; 4. mounting a plate; 5. a circular ring; 6. a U-shaped fixture block; 7. holding the cross bar; 8. a rotating rod; 9. a connecting rod; 10. a rotating shaft; 11. a drive shaft; 12. a gear; 13. an annular neck; 14. a drive motor; 15. a cover plate; 16. a positioning spring; 17. a positioning column; 18. an elastic positioning ring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1: referring to fig. 1-4, an efficient cleaning apparatus for semiconductor wafers comprises a cleaning tank 1, an ultrasonic cleaning plate 2 is installed at the bottom of an inner cavity of the cleaning tank 1, driving rods 3 capable of performing lifting motion are fixedly connected to the left end and the right end of the cleaning tank 1, mounting plates 4 are fixedly connected to the output ends of the two driving rods 3, and a rotatable wafer placing frame is installed between the two mounting plates 4; the wafer placing rack comprises a plurality of groups of placing rods, wherein a plurality of circular rings 5 are arranged in a straight line shape on each placing rod, four U-shaped clamping blocks 6 with clamping grooves are arranged on the circumference of each circular ring 5, three U-shaped clamping blocks 6 are fixedly connected with the circular rings 5, one U-shaped clamping block 6 is sleeved on each circular ring 5 in a sliding manner, a positioning unit used for clamping and positioning the circular rings 5 is arranged in an inner cavity of each U-shaped clamping block 6 which is arranged in a sliding manner, the U-shaped clamping blocks 6 on two adjacent circular rings 5 are fixedly connected through a connecting rod 9, rotating shafts 10 are respectively fixed on the two U-shaped clamping blocks 6 close to the two mounting plates 4, the two rotating shafts 10 are respectively and rotatably connected with the corresponding mounting plates 4, a driving shaft 11 is rotatably arranged at the upper end of the mounting plate 4 on the left side, one end of the driving shaft 11 is fixed on an output shaft of a driving motor 14, gears 12 are fixedly connected on the driving shaft 11 and the rotating shafts 10 on the left side, when the wafer clamping device is used, the driving motor 14 can drive the circular rings 5 arranged in rows to rotate 90 degrees clockwise through the gears 12, at the moment, the circular rings 6 vertically downwards, the U-shaped clamping blocks 6 arranged in a sliding mode upwards move along the circular paths of the circular rings 5, so that the wafer edges can be inserted into the clamping grooves of the four U-shaped clamping blocks 6, after the insertion is finished, the U-shaped clamping blocks 6 are rotated to restore the original positions and are in positioning insertion connection with the circular rings 5 through positioning units arranged in the inner cavities of the U-shaped clamping blocks 6, the wafers are limited in limiting cavities surrounded by the four U-shaped clamping blocks 6, the driving motor 14 is controlled to drive the wafers to rotate, the circular rings 5 reversely rotate 90 degrees to restore the original positions as shown in figure 1, and at the moment, the driving rods 3 can drive the wafers to move downwards, the wafer is completely immersed in the cleaning solution, the wafer controls the ultrasonic cleaning plate 2 to work at the same time to clean the wafer, bubbles generated by the ultrasonic cleaning plate are contacted with the lower end face of the wafer and explode during cleaning, impurities on the wafer are cleaned and removed, after the lower end face is cleaned, the wafer can be driven by the driving motor 14 to rotate 180 degrees, the upper end face of the wafer faces downwards at the moment, gas cleaning is carried out on the upper end face, and after the cleaning is finished, the wafer is moved out of the cleaning solution through the driving rod 3 and is taken down.

It should be noted that the electric equipment on the cleaning tank 1 is electrically connected with the controller arranged on the outer wall thereof; the length of an arc line formed by the three fixedly arranged U-shaped clamping blocks 6 is less than half of the circumference of the ring 5, so that the arc line can be conveniently inserted into the clamping grooves of the U-shaped clamping blocks 6 in a large enough space; the rotation state of the wafer in the cleaning liquid can be programmed through a PLC module in the controller, so that the automatic timing turnover operation of the wafer is realized.

As a preferred implementation manner in this embodiment, as shown in fig. 4, the positioning unit includes a positioning spring 16 whose upper end is fixedly connected to an inner cavity of the U-shaped fixture block 6, a positioning column 17 whose lower end is in a semicircular structure is fixedly connected to a lower end of the positioning spring 16, a lower end of the positioning column 17 penetrates through an inner wall of the U-shaped fixture block 6 and is inserted into a positioning groove formed in the ring 5, and a lower end of the positioning column 17 is inserted into a positioning groove formed in the ring 51 by using an elastic force of the positioning spring 16, so as to fix the U-shaped fixture block 6 and the ring 5, and prevent the U-shaped block 6 from moving on the ring 5, and meanwhile, when the material is loaded, the U-shaped fixture block 6 can be directly and forcibly driven to move to change a position of the U-shaped fixture block 6 on the ring 5, so as to leave a space large enough to insert the wafer into the clamping groove, thereby facilitating positioning and moving of the U-shaped fixture block 6 and the ring 5.

As a preferred implementation manner in this embodiment, as shown in fig. 1 to 3, the upper ends of the U-shaped clamping blocks 6 that are in a straight shape and slidably disposed are all rotatably disposed with the rotating rods 8, and the upper ends of the rotating rods 8 are all fixed to the holding cross rod 7 to be connected, so that when loading is performed, the holding cross rod 7 can be directly held by hand and forced to simultaneously drive the U-shaped clamping blocks 6 to move, and it is not necessary to move the single U-shaped clamping blocks 6 one by one, thereby improving the loading efficiency.

As a preferable embodiment in this embodiment, the driving rod 3 is any one of an electric push rod, a hydraulic rod or an air cylinder, and the type of the driving rod 3 can be selected according to the requirement.

As a preferred embodiment in this embodiment, as shown in fig. 1, the arc-shaped portions of the output ends of the two driving rods 3 are fixedly connected to the lower end of the cover plate 15, and the cover plate 15 can seal the upper end of the cleaning tank 1, so as to prevent the cleaning liquid from splashing during the bubble explosion and reduce the noise generated during the cleaning of the ultrasonic cleaning plate 2.

In this embodiment, not shown in the figures, the inner cavities of the cleaning tank 1 and the cover plate 15 are provided with vacuum cavities, so that sound cannot be transmitted in vacuum, and noise generated when the ultrasonic cleaning plate 2 is cleaned can be further reduced.

Example 2: different from embodiment 1, in this embodiment, as shown in fig. 5, the positioning unit includes an elastic positioning ring 18 fixedly connected in the sliding cavity of the U-shaped fixture block 6, and an inner ring end of the elastic positioning ring 18 is clamped in the annular clamping groove 13 provided on the ring 5, so that the elastic action of the elastic positioning ring 18 can clamp itself in the annular clamping groove on the ring 5 to position the U-shaped fixture block 6, thereby facilitating the positioning and movement of the U-shaped block 6 and the ring 5.

This practical theory of operation: when the wafer positioning device is used, the driving motor 14 can drive the circular rings 5 arranged in rows to rotate clockwise by 90 degrees through the gear 12, at the moment, the circular rings 6 vertically downwards, the U-shaped clamping blocks 6 arranged in a sliding mode upwards move along the circular paths of the circular rings 5, so that a large enough space can be provided for inserting the edges of wafers into the clamping grooves of the four U-shaped clamping blocks 6, after the insertion is finished, the U-shaped clamping blocks 6 are rotated to restore the original positions and are in positioning insertion connection with the circular rings 5 through the positioning units arranged in the inner cavities of the U-shaped clamping blocks, the wafers are limited in the limiting cavities surrounded by the four U-shaped clamping blocks 6, the driving motor 14 is controlled to drive the wafers to rotate, so that the circular rings 5 reversely rotate by 90 degrees to restore the original positions as shown in figure 1, and at the moment, the driving rod 3 can drive the wafers to move downwards, the wafer is completely immersed in the cleaning solution, the wafer controls the ultrasonic cleaning plate 2 to work at the same time to clean the wafer, bubbles generated by the ultrasonic cleaning plate are contacted with the lower end face of the wafer and explode during cleaning, so that impurities on the wafer are cleaned and removed, after the lower end face is cleaned, the wafer can be driven by the driving motor 14 to rotate 180 degrees, the upper end face of the wafer faces downwards at the moment, the upper end face of the wafer is subjected to gas cleaning, and after the cleaning is finished, the wafer is moved out of the cleaning solution through the driving rod 3 and is taken down, the wafer placing frame of the cleaning tank can be rotated, so that the end face of the wafer is parallel to the cleaning tank 1, and compared with the traditional mode that the wafer is vertically arranged with the cleaning tank 1, the contact area between the bubbles and the wafer can be increased, and the cleaning efficiency of the wafer is improved;

the rotary rod 8 and the hand-held cross rod 7 are arranged, when the material is loaded, the hand-held cross rod 7 can be directly held by hands and is forced to simultaneously drive the plurality of U-shaped clamping blocks 6 to simultaneously move, the single U-shaped clamping blocks 6 do not need to be moved one by one, and the material loading efficiency is improved;

be provided with apron 15, and apron 15 and washing tank 1 inner chamber all are provided with the vacuum cavity, and its apron 15 can live the upper end seal of washing tank 1, and when avoiding the bubble explosion, the washing liquid splashes, and can weaken the noise that sends when ultrasonic cleaning board 2 washs, and the unable in vacuum of sound is propagated simultaneously, can further weaken the noise that sends when ultrasonic cleaning board 2 washs.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a high-efficient cleaning equipment of semiconductor wafer, includes washing tank (1), ultrasonic cleaning board (2), its characterized in that are installed to the inner chamber bottom of washing tank (1): the left end and the right end of the cleaning tank (1) are fixedly connected with driving rods (3) capable of performing lifting motion, the output ends of the two driving rods (3) are fixedly connected with mounting plates (4), and a rotatable wafer placing frame is arranged between the two mounting plates (4);

the wafer rack comprises a plurality of rings (5) arranged in a straight line shape, and each ring (5) is provided with four U-shaped clamping blocks (6) with clamping grooves, which are arranged in a sliding manner, at the periphery, and the rings (5) are provided with a plurality of groups of arranged rods, wherein the rods are three, the U-shaped clamping blocks (6) are fixedly connected with the rings (5), one U-shaped clamping blocks (6) are slidably sleeved on the rings (5) and are slidably arranged, inner cavities of the U-shaped clamping blocks (6) are provided with positioning units for clamping and positioning with the rings (5), the positioning units are adjacent to the rings (5), the U-shaped clamping blocks (6) are fixedly connected with each other through connecting rods (9) and are respectively close to two mounting plates (4), rotating shafts (10) are fixed on the U-shaped clamping blocks (6), the rotating shafts (10) are respectively connected with the corresponding mounting plates (4) in a rotating manner, and the left sides of the upper ends of the mounting plates (4) are rotatably provided with driving shafts (11), one ends of the driving shafts (11) are fixed on driving motors (14), and output shafts (11) are fixedly connected with gears (12) which are meshed with gears (12) and are corresponding left sides.

2. The efficient cleaning apparatus for semiconductor wafers as claimed in claim 1, wherein: the upper end of the positioning unit is fixedly connected with a positioning spring (16) in the inner cavity of the U-shaped clamping block (6), the lower end of the positioning spring (16) is fixedly connected with a positioning column (17) with the lower end of a semicircular structure, and the lower end of the positioning column (17) penetrates through the inner wall of the U-shaped clamping block (6) and is connected with a positioning groove formed in the circular ring (5) in an inserting mode.

3. The efficient cleaning apparatus for semiconductor wafers as claimed in claim 1, wherein: the positioning unit comprises an elastic positioning ring (18) fixedly connected in a sliding cavity of the U-shaped clamping block (6), and the inner ring end of the elastic positioning ring (18) is clamped in an annular clamping groove (13) formed in the circular ring (5).

4. The efficient cleaning device for semiconductor wafers as claimed in any one of claims 1 to 3, wherein: the upper ends of the U-shaped clamping blocks (6) which are in a straight line shape and are arranged in a sliding mode are all rotatably provided with rotating rods (8), and the upper ends of the rotating rods (8) are all fixedly connected with the handheld cross rod (7).

5. The efficient cleaning device for semiconductor wafers as claimed in any one of claims 1 to 3, wherein: the driving rod (3) is any one of an electric push rod, a hydraulic rod or an air cylinder.

6. The efficient cleaning device for semiconductor wafers as claimed in any one of claims 1 to 3, wherein: the arc-shaped parts of the output ends of the two driving rods (3) are fixedly connected with the lower end of the cover plate (15).

7. The efficient semiconductor wafer cleaning apparatus as claimed in claim 6, wherein: the inner cavities of the cleaning tank (1) and the cover plate (15) are provided with vacuum cavities.