CN115295465A - Wafer cleaning device for integrated circuit manufacturing and cleaning method thereof - Google Patents

Wafer cleaning device for integrated circuit manufacturing and cleaning method thereof Download PDF

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Publication number
CN115295465A
CN115295465A CN202210955598.4A CN202210955598A CN115295465A CN 115295465 A CN115295465 A CN 115295465A CN 202210955598 A CN202210955598 A CN 202210955598A CN 115295465 A CN115295465 A CN 115295465A
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China
Prior art keywords
cleaning
wafer
plate
clamping
discharging
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Withdrawn
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CN202210955598.4A
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Chinese (zh)
Inventor
刘波波
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Jiangsu Taixinyuan Technology Co ltd
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Jiangsu Taixinyuan Technology Co ltd
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Priority to CN202210955598.4A priority Critical patent/CN115295465A/en
Publication of CN115295465A publication Critical patent/CN115295465A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/14—Drying solid materials or objects by processes not involving the application of heat by applying pressure, e.g. wringing; by brushing; by wiping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention relates to a wafer cleaning device for manufacturing an integrated circuit and a cleaning method thereof, wherein the cleaning device comprises: the body is used for bearing and limiting each part, is concave and has preset accommodation; a transport assembly including a support post for supporting the transport assembly; the feeding plate is connected with the supporting columns and used for conveying wafers; the cleaning assembly comprises a driving motor arranged in the concave accommodating cavity of the body; the cleaning mechanism is connected with the driving motor; the discharging assembly comprises a positioning plate erected at the concave open through hole of the body; the discharging mechanism is connected with the positioning plate and is used for carrying out automatic discharging operation on the wafer; and a clamping mechanism is arranged at one side edge of the upper material plate and the cleaning mechanism. The invention can simultaneously clean the two sides of the wafer, and simultaneously perform drying wiping and discharging operations through the discharging component after the cleaning is finished, thereby ensuring the cleaning quality of the wafer and effectively improving the overall operation efficiency.

Description

Wafer cleaning device for integrated circuit manufacturing and cleaning method thereof
Technical Field
The invention relates to the field of integrated circuit manufacturing, in particular to a wafer cleaning device for integrated circuit manufacturing and a cleaning method thereof.
Background
An integrated circuit is a miniature electronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability. Most applications in the semiconductor industry today are silicon-based integrated circuits. The wafer is one of the vital components in the manufacturing process of the integrated circuit, and the cleanliness and purity of the surface of the wafer also directly affect the quality of the finished integrated circuit product in the production and processing process of the wafer, so that the cleaning of the wafer is an essential and very important link.
The traditional wafer cleaning device cleans the surface of a wafer in a water pressure flushing mode, the cleanliness and the quality of the wafer are difficult to control, and the wafer is not convenient to dry in time after being cleaned, so that the surface of the wafer is possibly polluted by impurities again.
Disclosure of Invention
The purpose of the invention is as follows: the invention provides a wafer cleaning device for manufacturing an integrated circuit, and further provides a cleaning method based on the wafer cleaning device for manufacturing the integrated circuit, so as to solve the problems in the prior art.
The technical scheme is as follows: a wafer cleaning device for manufacturing an integrated circuit comprises a body, a transmission assembly, a cleaning assembly and a discharging assembly.
The body is used for bearing and limiting each part, is concave and has preset accommodation performance;
the conveying assembly comprises a supporting column and a feeding plate; the supporting column is erected at one side of the body and used for supporting the transmission assembly; the feeding plate is connected with the supporting columns and used for conveying the wafers.
The cleaning assembly comprises a driving motor and a cleaning mechanism; the driving motor is arranged in the concave accommodating cavity of the body and is used for providing a preset driving force for the cleaning assembly; the cleaning mechanism is connected with the driving motor and used for cleaning the surface of the wafer.
The discharging assembly comprises a positioning plate and a discharging mechanism; the positioning plate is erected at the concave open through hole of the body and is used for supporting the discharging assembly; and the discharging mechanism is connected with the positioning plate and is used for carrying out autonomous discharging operation on the wafer.
And a clamping mechanism is arranged at one side of the upper material plate and the cleaning mechanism.
In a further embodiment, the cleaning mechanism includes three parts of a cleaning slot, an adjustment plate and a cleaning brush. The cleaning groove is arranged in the concave accommodating cavity of the body, is provided with an open through hole for feeding, has preset accommodation property and is used for bearing and storing cleaning solution; the adjusting plate is arranged in the accommodating cavity of the cleaning groove, and two ends of the adjusting plate are connected with the inner wall of the working surface of the cleaning groove in a sliding manner and can perform reciprocating sliding adjustment along the surface of the inner wall of the working surface of the cleaning groove; one end of the cleaning brush is connected with the driving motor, and the other end of the cleaning brush is connected with the adjusting plate and used for cleaning and brushing the surface of the wafer.
In a further embodiment, one end of the driving motor is connected with the inner wall of the concave accommodating chamber of the body in the working direction, and the other end of the driving motor is connected with the cleaning groove and penetrates through the cleaning groove to extend into the accommodating chamber of the cleaning groove; the driving motor is connected with one end of the cleaning brush through a telescopic cylinder, the telescopic cylinder is connected with the cleaning brush through a rolling bearing, and the cleaning brush can rotate in all directions around a connection point with the telescopic cylinder.
In a further embodiment, the number of the driving motors, the number of the cleaning brushes and the number of the adjusting plates are plural; the left side and the right side of the working direction of the cleaning tank are respectively provided with a driving motor, and the driving motors are horizontally arranged; the surface of the working surface of the adjusting plate is provided with a plurality of clamping holes, and the cleaning brush is clamped in the clamping holes on the surface of the working surface of the adjusting plate; a plurality of the regulating plates are arranged in a staggered manner, and the driving motors on the left side and the right side of the working direction of the cleaning tank are also arranged in a staggered manner and are aligned with the corresponding regulating plate in the working height.
In a further embodiment, the discharging mechanism comprises four parts, namely a support column, a beam column, an upper wiping plate and a lower wiping plate; the support is arranged on the surface of the working surface of the positioning plate and used for limiting the integral operation height of the discharging mechanism; and the number of the supporting columns is multiple; the beam column is arranged among the plurality of the support columns and is used for communicating the plurality of the support columns; both ends of the upper wiping plate are connected with the beam column in a sliding manner and can be adjusted in a reciprocating sliding manner along the working surface of the beam column; an upper wiping cloth for wiping the wafer is arranged on one surface, close to the cleaning groove, of the upper wiping plate; both ends of the lower wiping plate are connected with the beam column in a sliding manner, correspond to the upper wiping plate in position and can be adjusted in a reciprocating sliding manner along the working surface of the beam column; and one surface of the lower wiping plate, which is far away from the cleaning groove, is provided with a lower wiping cloth for wiping the wafer.
In a further embodiment, the clamping mechanism comprises four parts, namely a positioning block, a telescopic rod, a sliding column and a clamping plate; the positioning block is arranged on the working surface of the body and can be adjusted in a reciprocating sliding manner along the surface of the working surface of the body; the telescopic rod is connected with the positioning block in a sliding manner and can perform reciprocating sliding adjustment along the working surface of the positioning block; the sliding column is connected with the telescopic rod and is used for providing a preset operation space for the adjustment of the whole operation state of the clamping mechanism; the splint with sliding column sliding connection can follow sliding column working face surface carries out reciprocating sliding and adjusts, just splint are a plurality ofly.
In a further embodiment, a telescopic push plate is arranged on the surface of the working surface of the base corresponding to the discharging assembly and used for pushing and discharging the wafer; the conveying crawler belt for conveying the wafer is arranged on the surface of the working surface of the feeding plate, and the baffle plates are arranged on the two sides of the feeding plate, so that the wafer is prevented from sliding off due to the inertia of the wafer in the conveying process through the conveying crawler belt; and a preset distance is reserved between the baffle and the end point of the operation direction of the feeding plate, so that the clamping mechanism can conveniently clamp and fix the wafer.
In a further embodiment, a clamping mechanism is arranged on the surface of the base working target at the side corresponding to the feeding plate, and clamping mechanisms are also arranged on the two side wall surfaces of the cleaning groove in the direction perpendicular to the feeding plate; the cleaning groove and two side walls of the upper material plate in the horizontal direction are provided with slideways which are arranged on the surface of the working surface of the base, and the positioning blocks of the two clamping mechanisms which are horizontal to the operation direction of the upper material plate can slide and adjust in a reciprocating manner along the sliding.
A cleaning method of a wafer cleaning device for manufacturing an integrated circuit comprises the following steps:
s1, manually placing a wafer to be cleaned on the surface of a feeding plate and conveying the wafer through a conveying crawler; stopping conveying when the conveying is carried to a position corresponding to the clamping mechanism on the surface of the base, which is close to the feeding plate;
s2, starting a clamping mechanism close to the material feeding plate pair to clamp and fix the wafer; after the fixing is finished, the wafer is driven to rotate in the direction of the cleaning groove; starting a clamping mechanism corresponding to the clamping mechanism at the position, close to the feeding plate, on the surface of the base, and clamping and fixing the wafer in the same way;
s3, adjusting the positioning blocks of the two clamping mechanisms for clamping and fixing the wafer in a sliding manner along the surface of the base, and stopping sliding when the positioning blocks are adjusted to the positions corresponding to the slide ways; the wafer is moved to slide towards the direction close to the cleaning groove along the surface of the slideway, so that the wafer is placed in the accommodating chamber of the cleaning groove; when the wafer enters the accommodating cavity of the cleaning tank, the clamping mechanisms arranged on the two sides of the inner wall surface of the cleaning tank are started to clamp and fix the wafer;
s4, starting a cleaning mechanism to simultaneously clean the two sides of the wafer; after cleaning, cleaning the clamping mechanisms on the two sides of the inner wall surface of the tank to loosen the wafer; the positioning block in the slideway slides again to drive the wafer to slide towards the direction far away from the cleaning groove, and the wafer is sent out of the cleaning mechanism;
s5, after the positioning block slides to the surface of the base, the positioning block slides towards the direction close to the support column to drive the wafer to move towards the discharging mechanism; when the material is moved to the position corresponding to the discharging mechanism, the material stops moving; the telescopic push plate extends towards the direction close to the discharging mechanism to push the wafer to the discharging mechanism; wiping and drying the wafer through the mutual matching of the upper wiping plate and the lower wiping plate, and finishing the discharging operation of the wafer;
and S6, repeating the work from the S1 to the S5 in sequence by parity of reasoning until the system stops working. .
Has the advantages that: the invention relates to a wafer cleaning device for manufacturing an integrated circuit and a cleaning method thereof, wherein the cleaning device comprises: the body is used for bearing and limiting each part, is concave and has preset accommodation performance; a transport assembly including a support post for supporting the transport assembly; the feeding plate is connected with the supporting columns and used for conveying wafers; the cleaning assembly comprises a driving motor arranged in the concave accommodating cavity of the body; the cleaning mechanism is connected with the driving motor; the discharging assembly comprises a positioning plate erected at the concave open through hole of the body; the discharging mechanism is connected with the positioning plate and is used for carrying out automatic discharging operation on the wafer; and a clamping mechanism is arranged at one side of the upper material plate and the cleaning mechanism. The invention can simultaneously clean the two sides of the wafer, and simultaneously perform drying wiping and discharging operations through the discharging component after the cleaning is finished, thereby ensuring the cleaning quality of the wafer and effectively improving the overall operation efficiency.
Drawings
Fig. 1 is a schematic view of the present invention as a whole.
Fig. 2 is an overall schematic view of the clamping mechanism of the present invention.
Fig. 3 is an overall schematic view of the cleaning mechanism of the present invention.
Fig. 4 is an overall schematic view of the discharge mechanism of the present invention.
The figures are numbered: the device comprises a body 1, a support column 2, a feeding plate 3, a clamping mechanism 4, a positioning block 401, an expansion link 402, a sliding column 403, a clamping plate 404, a wiping disc 405, a support column 501, a beam column 502, a positioning plate 503, an upper wiping plate 504, a lower wiping plate 505, a discharging plate 6, a baffle 7, a cleaning groove 801, an adjusting plate 802, a cleaning brush 803, a driving motor 804 and a telescopic cylinder 805.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present invention.
The applicant believes that the traditional wafer cleaning device cleans the surface of the wafer in a water pressure flushing mode, the cleanliness and the quality of the wafer are difficult to control, and the wafer is inconvenient to dry in time after being cleaned, so that the surface of the wafer can be polluted by impurities again.
Therefore, the applicant designs a wafer cleaning device for integrated circuit manufacturing and a cleaning method thereof, which can simultaneously perform cleaning operation on two sides of a wafer, and simultaneously perform drying wiping and discharging operation through a discharging assembly after the cleaning is finished, thereby ensuring the cleaning quality of the wafer and effectively improving the overall operation efficiency.
The invention relates to a wafer cleaning device for manufacturing an integrated circuit, which mainly comprises a body 1, a transmission assembly, a cleaning assembly and a discharging assembly. The body 1 is used for bearing and limiting each part, is concave and has preset accommodation performance; the conveying assembly comprises a supporting column 2 and a feeding plate 3; the supporting column 2 is erected at one side of the body 1 and used for supporting the transmission assembly; the feeding plate 3 is connected with the supporting columns 2 and is used for conveying wafers. The washing component comprises a driving motor 804 and a cleaning mechanism; the driving motor 804 is arranged in the concave accommodating cavity of the body 1 and is used for providing a preset driving force for the cleaning assembly; the cleaning mechanism is connected with the driving motor 804 and is used for cleaning the surface of the wafer. The discharging assembly comprises a positioning plate 503 and a discharging mechanism; the positioning plate 503 is erected at the concave open through hole of the body 1 and is used for supporting the discharging assembly; the discharging mechanism is connected with the positioning plate 503 and is used for performing autonomous discharging operation of the wafer. And a clamping mechanism 4 is arranged at one side of the upper material plate 3 and the cleaning mechanism.
In a further preferred embodiment, the cleaning mechanism comprises three parts, namely a cleaning groove 801, a regulating plate 802 and a cleaning brush 803. The cleaning groove 801 is arranged in the concave accommodating cavity of the body 1, is provided with an open through hole for feeding, has preset accommodating performance and is used for bearing and storing cleaning liquid; the adjusting plate 802 is arranged in the accommodating cavity of the cleaning groove 801, and two ends of the adjusting plate are connected with the inner wall of the working surface of the cleaning groove 801 in a sliding manner and can perform reciprocating sliding adjustment along the surface of the inner wall of the working surface of the cleaning groove 801; one end of the cleaning brush 803 is connected with the driving motor 804, and the other end of the cleaning brush 803 is connected with the adjusting plate 802, so that the cleaning brush 803 can be used for cleaning the surface of the wafer. In view of the thin and fragile wafer, the cleaning brush 803 is preferably a fiber brush.
In a further preferred embodiment, one end of the driving motor 804 is connected to the inner wall of the concave receiving chamber of the body 1 in the working direction, and the other end is connected to the cleaning groove 801 and penetrates through the cleaning groove 801 to extend into the receiving chamber of the cleaning groove 801; the driving motor 804 is connected with one end of the cleaning brush 803 through a telescopic cylinder 805, the telescopic cylinder 805 is connected with the cleaning brush 803 through a rolling bearing, and the cleaning brush 803 can rotate around a connection point with the telescopic cylinder 805 in all directions.
In a further preferred embodiment, the number of the driving motors 804, the cleaning brushes 803 and the adjusting plate 802 is plural; the left side and the right side of the working direction of the cleaning groove 801 are both provided with a driving motor 804, and the driving motors 804 are horizontally arranged; the surface of the working surface of the adjusting plate 802 is provided with a plurality of clamping holes, and the cleaning brush 803 is clamped in the clamping holes on the surface of the working surface of the adjusting plate 802; a plurality of regulating plates 802 are arranged in a staggered manner, and the driving motors 804 on the left side and the right side of the working direction of the cleaning groove 801 are also arranged in a staggered manner and are flush with the corresponding regulating plates 802 in working height.
In a further preferred embodiment, the discharging mechanism comprises four parts, namely a support column 501, a beam column 502, an upper wiping plate 504 and a lower wiping plate 505; the support column 501 is arranged on the surface of the working surface of the positioning plate 503 and is used for limiting the overall operation height of the discharging mechanism; the number of the pillars 501 is plural; the beam column 502 is arranged among a plurality of the pillars 501 for the mutual communication among the pillars 501; both ends of the upper wiping plate 504 are slidably connected with the beam column 502 and can be adjusted in a reciprocating sliding manner along the working surface of the beam column 502; an upper wiping cloth for wiping the wafer is arranged on one surface of the upper wiping plate 504 close to the cleaning groove 801; the two ends of the lower wiping plate 505 are connected with the beam column 502 in a sliding way, correspond to the upper wiping plate 504 in position and can be adjusted in a reciprocating sliding way along the working surface of the beam column 502; and a lower wiping cloth for wiping the wafer is arranged on one surface of the lower wiping plate 505, which is far away from the cleaning groove 801.
In a further preferred embodiment, the clamping mechanism 4 comprises four parts, namely a positioning block 401, a telescopic rod 402, a sliding column 403 and a clamping plate 404; the positioning block 401 is arranged on the working surface of the body 1 and can slide and adjust along the working surface of the body 1 in a reciprocating manner; the telescopic rod 402 is connected with the positioning block 401 in a sliding manner and can perform reciprocating sliding adjustment along the working surface of the positioning block 401; the sliding column 403 is connected with the telescopic rod 402 and is used for providing a predetermined operation space for adjusting the overall operation state of the clamping mechanism 4; the clamping plates 404 are slidably connected with the sliding columns 403 and can be adjusted in a reciprocating sliding manner along the working surface of the sliding columns 403, and the number of the clamping plates 404 is multiple. The working surface of the clamping plate 404 is connected with a wiping disc 405 through a rotating bearing, and the wiping disc 405 can rotate around a connecting point of the wiping disc and the clamping plate 404, so that the wafer position of a clamping and fixing part is self-cleaned.
In a further preferred embodiment, a telescopic push plate is arranged on the surface of the working surface of the base corresponding to the discharging assembly and used for pushing and discharging the wafer; the conveying crawler belt for conveying the wafers is arranged on the surface of the working surface of the feeding plate 3, and the baffle plates 7 are arranged on the two sides of the feeding plate 3, so that the wafers are prevented from sliding down due to inertia of the wafers in the conveying process through the conveying crawler belt; the baffle 7 and the end point of the feeding plate 3 in the operation direction are away from each other by a preset distance, so that the clamping mechanism 4 can conveniently clamp and fix the wafer. The discharging side of the discharging assembly is provided with a discharging plate 6 used for discharging and conveying the wafer, and the surface of the working surface of the discharging plate 6 is provided with a discharging crawler belt used for discharging and conveying the wafer.
In a further preferred embodiment, a clamping mechanism 4 is arranged on a side edge of the surface of the base work target corresponding to the feeding plate 3, and clamping mechanisms 4 are also arranged on two side wall surfaces of the cleaning groove 801 in a direction perpendicular to the feeding plate 3; the cleaning groove 801 and two side walls of the upper material plate 3 in the horizontal direction are provided with slideways which are arranged on the surface of the working surface of the base, and the positioning blocks 401 of the two clamping mechanisms 4 which are horizontal to the operation direction of the upper material plate 3 can slide and adjust in a reciprocating manner along the sliding.
On the basis of the wafer cleaning device for manufacturing the integrated circuit, the invention provides a cleaning method of the wafer cleaning device for manufacturing the integrated circuit, which comprises the following specific steps:
firstly, manually placing a wafer to be cleaned on the surface of a feeding plate 3 and conveying the wafer through a conveying crawler; stopping conveying when the conveying is carried to a position corresponding to the clamping mechanism 4 of the base surface close to the feeding plate 3;
next, the clamping mechanism 4 which is close to the material feeding plate 3 is started to clamp and fix the wafer; after the fixing is finished, the wafer is driven to rotate in the direction of a cleaning groove 801; starting a clamping mechanism 4 corresponding to the clamping mechanism 4 at the position, close to the feeding plate 3, on the surface of the base, and clamping and fixing the wafer in the same way;
then, the positioning blocks 401 of the two clamping mechanisms 4 for clamping and fixing the wafer slide along the surface of the base, and stop sliding when the positions are adjusted to the positions corresponding to the slide ways; the wafer is moved to slide towards the direction close to the cleaning groove 801 along the surface of the slide way, so that the wafer is placed in the accommodating cavity of the cleaning groove 801; when the wafer enters the accommodating chamber of the cleaning tank 801, the clamping mechanisms 4 arranged on the two sides of the inner wall surface of the cleaning tank 801 are started to clamp and fix the wafer;
then, starting a cleaning mechanism to clean the two sides of the wafer simultaneously; after cleaning, the wafer is loosened by the clamping mechanisms 4 on the two sides of the inner wall surface of the cleaning tank 801; the positioning block 401 in the slide way slides again to drive the wafer to slide towards the direction far away from the cleaning groove 801, and the wafer is sent out of the cleaning mechanism;
finally, after the positioning block 401 slides to the surface of the base, the positioning block slides towards the direction close to the support column 501 to drive the wafer to move towards the discharging mechanism; when the material is moved to a position corresponding to the discharging mechanism, the movement is stopped; the telescopic push plate extends towards the direction close to the discharging mechanism to push the wafer towards the discharging mechanism; the wafer is wiped and dried by the mutual matching of the upper wiping plate 504 and the lower wiping plate 505, and the discharging operation of the wafer is completed;
and repeating the steps until the system stops working.
In the actual operation process, the body can be covered by the cover shell according to actual requirements under certain conditions, so that a good operation environment is formed.
As noted above, while the present invention has been shown and described with reference to certain preferred embodiments, it is not to be construed as limited thereto. Various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (9)

1. A wafer cleaning device for manufacturing integrated circuits is characterized by comprising:
the body is used for bearing and limiting each part, is concave and has preset accommodation performance;
the transmission assembly comprises a supporting column which is erected at one side of the body and used for supporting the transmission assembly; the feeding plate is connected with the supporting column and used for conveying the wafer;
the cleaning assembly comprises a driving motor which is arranged in the concave accommodating cavity of the body and is used for providing preset driving force for the cleaning assembly; the cleaning mechanism is connected with the driving motor and is used for cleaning the surface of the wafer;
the discharging assembly comprises a positioning plate which is erected at the concave open through hole of the body and used for supporting the discharging assembly; the discharging mechanism is connected with the positioning plate and used for carrying out automatic discharging operation on the wafer;
and a clamping mechanism is arranged at one side of the upper material plate and the cleaning mechanism.
2. The wafer cleaning apparatus as claimed in claim 1, wherein the cleaning mechanism comprises:
the cleaning tank is arranged in the concave accommodating cavity of the body, is provided with an open through hole for feeding, has preset accommodating performance and is used for bearing and storing cleaning liquid;
the adjusting plate is arranged in the accommodating cavity of the cleaning groove, two ends of the adjusting plate are connected with the inner wall of the working surface of the cleaning groove in a sliding manner, and the adjusting plate can perform reciprocating sliding adjustment along the surface of the inner wall of the working surface of the cleaning groove;
and one end of the cleaning brush is connected with the driving motor, and the other end of the cleaning brush is connected with the adjusting plate and used for cleaning and brushing the surface of the wafer.
3. The wafer cleaning apparatus as claimed in claim 2, wherein:
one end of the driving motor is connected with the inner wall of the concave accommodating chamber of the body in the working direction, and the other end of the driving motor is connected with the cleaning groove and penetrates through the cleaning groove to extend into the accommodating chamber of the cleaning groove;
the driving motor is connected with one end of the cleaning brush through a telescopic cylinder, the telescopic cylinder is connected with the cleaning brush through a rolling bearing, and the cleaning brush can rotate in all directions around a connection point with the telescopic cylinder.
4. The wafer cleaning apparatus as claimed in claim 3, wherein:
the number of the driving motors, the number of the cleaning brushes and the number of the adjusting plates are multiple; the left side and the right side of the working direction of the cleaning tank are both provided with driving motors, and the driving motors are horizontally arranged;
the surface of the working surface of the adjusting plate is provided with a plurality of clamping holes, and the cleaning brush is clamped in the clamping holes on the surface of the working surface of the adjusting plate;
a plurality of the regulating plates are arranged in a staggered manner, and the driving motors on the left side and the right side of the working direction of the cleaning tank are also arranged in a staggered manner and are aligned with the corresponding regulating plate in the working height.
5. The wafer cleaning apparatus as claimed in claim 3, wherein the discharging mechanism comprises:
the support column is arranged on the surface of the working surface of the positioning plate and used for limiting the integral operation height of the discharging mechanism; and the number of the supporting columns is multiple;
the beam column is arranged among the plurality of the support columns and is used for communicating the plurality of the support columns with each other;
the two ends of the upper wiping plate are connected with the beam column in a sliding mode and can slide and adjust along the working surface of the beam column in a reciprocating mode; an upper wiping cloth for wiping the wafer is arranged on one surface, close to the cleaning groove, of the upper wiping plate;
the two ends of the lower wiping plate are connected with the beam column in a sliding manner, correspond to the upper wiping plate in position and can perform reciprocating sliding adjustment along the working surface of the beam column; and one surface of the lower wiping plate, which is far away from the cleaning groove, is provided with a lower wiping cloth for wiping the wafer.
6. The wafer cleaning apparatus as claimed in claim 2, wherein the clamping mechanism comprises:
the positioning block is arranged on the working surface of the body and can slide and adjust along the working surface of the body in a reciprocating manner;
the telescopic rod is connected with the positioning block in a sliding manner and can perform reciprocating sliding adjustment along the working surface of the positioning block;
a sliding column connected with the telescopic rod and used for providing a predetermined operation space for the adjustment of the whole operation state of the clamping mechanism
The clamping plate is connected with the sliding column in a sliding mode and can slide along the surface of the working face of the sliding column in a reciprocating mode to be adjusted, the clamping plate is multiple, and the surface of the working face of the clamping plate is provided with a wiping disc.
7. The wafer cleaning apparatus as claimed in claim 6, wherein:
a telescopic push plate is arranged on the surface of the working surface of the base corresponding to the discharging assembly and used for pushing and discharging the wafer; go up flitch working face surface and be equipped with the conveying track that is used for carrying out the conveying to the wafer, just go up flitch both sides and all be equipped with the baffle.
8. The wafer cleaning apparatus as claimed in claim 6, wherein:
the side edge of the working target surface of the base corresponding to the feeding plate is provided with a clamping mechanism, and the side wall surfaces of the cleaning groove and the feeding plate in the vertical direction are also provided with clamping mechanisms;
the cleaning groove and two side walls of the feeding plate in the horizontal direction are provided with slideways which are arranged on the surface of the working surface of the base, and the positioning blocks of the two clamping mechanisms which are horizontal to the operation direction of the feeding plate can slide and adjust in a reciprocating manner along the sliding; and a positioning block of the clamping mechanism close to the feeding plate is connected with the base in a sliding mode through a rolling bearing and can rotate around a connecting point of the positioning block and the base.
9. The method as claimed in any one of claims 1 to 8, characterized in that it comprises the following steps:
s1, manually placing a wafer to be cleaned on the surface of a feeding plate and conveying the wafer through a conveying crawler; stopping conveying when the conveying is carried to a position corresponding to the clamping mechanism on the surface of the base, which is close to the feeding plate;
s2, starting a clamping mechanism close to the material feeding plate pair to clamp and fix the wafer; after the fixing is finished, the wafer is driven to rotate in the direction of the cleaning groove; starting a clamping mechanism corresponding to the clamping mechanism at the position, close to the feeding plate, on the surface of the base, and clamping and fixing the wafer in the same way;
s3, adjusting the positioning blocks of the two clamping mechanisms for clamping and fixing the wafer in a sliding manner along the surface of the base, and stopping sliding when the positioning blocks are adjusted to the positions corresponding to the slide ways; the wafer is moved to slide towards the direction close to the cleaning groove along the surface of the slide way, so that the wafer is placed in the accommodating cavity of the cleaning groove; when the wafer enters the accommodating chamber of the cleaning tank, the clamping mechanisms arranged on the two sides of the inner wall surface of the cleaning tank are started to clamp and fix the wafer;
s4, starting a cleaning mechanism to simultaneously clean the two sides of the wafer; after cleaning, cleaning the clamping mechanisms on the two sides of the inner wall surface of the tank to loosen the wafer; the positioning block in the slideway slides again to drive the wafer to slide towards the direction far away from the cleaning groove, and the wafer is sent out of the cleaning mechanism;
s5, after the positioning block slides to the surface of the base, the positioning block slides towards the direction close to the support column to drive the wafer to move towards the discharging mechanism; when the material is moved to the position corresponding to the discharging mechanism, the material stops moving; the telescopic push plate extends towards the direction close to the discharging mechanism to push the wafer to the discharging mechanism; wiping and drying the wafer through the mutual matching of the upper wiping plate and the lower wiping plate, and finishing the discharging operation of the wafer;
and S6, repeating the work from S1 to S5 in sequence by analogy until the system stops working.
CN202210955598.4A 2022-08-10 2022-08-10 Wafer cleaning device for integrated circuit manufacturing and cleaning method thereof Withdrawn CN115295465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210955598.4A CN115295465A (en) 2022-08-10 2022-08-10 Wafer cleaning device for integrated circuit manufacturing and cleaning method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210955598.4A CN115295465A (en) 2022-08-10 2022-08-10 Wafer cleaning device for integrated circuit manufacturing and cleaning method thereof

Publications (1)

Publication Number Publication Date
CN115295465A true CN115295465A (en) 2022-11-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115716065A (en) * 2022-12-03 2023-02-28 深圳市超快激光科技有限公司 Polycrystalline silicon surface cleaning device
CN116435230A (en) * 2023-06-15 2023-07-14 常州比太科技有限公司 Silicon wafer plate conveying and cleaning equipment and working method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115716065A (en) * 2022-12-03 2023-02-28 深圳市超快激光科技有限公司 Polycrystalline silicon surface cleaning device
CN116435230A (en) * 2023-06-15 2023-07-14 常州比太科技有限公司 Silicon wafer plate conveying and cleaning equipment and working method
CN116435230B (en) * 2023-06-15 2023-08-11 常州比太科技有限公司 Silicon wafer plate conveying and cleaning equipment and working method

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Application publication date: 20221104