CN109904094B

CN109904094B - Polycrystalline silicon ingot silicon chip cleaning equipment

Info

Publication number: CN109904094B
Application number: CN201910042065.5A
Authority: CN
Inventors: 李广森
Original assignee: Anhui Huashun Semiconductor Development Co ltd
Current assignee: Anhui Huashun Semiconductor Development Co ltd
Priority date: 2019-01-17
Filing date: 2019-01-17
Publication date: 2021-02-19
Anticipated expiration: 2039-01-17
Also published as: CN109904094A

Abstract

The invention relates to a cleaning device for polysilicon cast ingot silicon wafers, which comprises a processing box body, a polished rod, a driving machine, a rotating shaft, an inner box, a water collecting tank, a pump body, a first motor, pulleys, a transmission shaft, a rope, a second motor, a bracket, a high-pressure spray head, a slide block, a rack, a gear and an installation shaft, wherein the rotating shaft is rotatably connected inside the processing box body and is in transmission connection with the output end of the driving machine, the polished rod is arranged on the rotating shaft, the inner box is positioned above the water collecting tank, the two pulleys are symmetrically and rotatably connected on the transmission shaft, the pulleys are fixedly connected with the inner box through the rope, the transmission shaft is in transmission connection with the output end of the first motor, the rack is slidably connected inside the processing box body through the slide block, the gear is rotatably connected inside the processing box body through the installation, the polishing and cleaning are integrated, and the polishing and cleaning integrated machine has wide application prospect and strong creativity.

Description

Polycrystalline silicon ingot silicon chip cleaning equipment

Technical Field

The invention relates to the field of silicon wafer cleaning equipment, in particular to polysilicon ingot silicon wafer cleaning equipment.

Background

Silicon wafers are subjected to rigorous cleaning in the production of semiconductor devices. Trace contamination can also lead to device failure. The cleaning is intended to remove surface contaminating impurities, including organic and inorganic substances. Some of these impurities exist in an atomic state or an ionic state, and some exist in a thin film form or a particle form on the surface of the silicon wafer. Various defects may result. The method for removing the pollution includes two methods of physical cleaning and chemical cleaning.

The physical cleaning belongs to one of cleaning modes, and the physical cleaning usually utilizes high-pressure spray heads to clean silicon wafers, but traditional silicon wafer processing, cleaning equipment and polishing equipment belong to two kinds of equipment, and processing is in order, has prolonged the time of processing, and the degree of cooperation between equipment is lower, and in the polishing process, processing box position is fixed, and the polishing can leave the dead angle, leads to the polishing incomplete, to sum up, the problem that above-mentioned appearance is solved to the urgent need for a polycrystalline silicon ingot silicon wafer cleaning equipment now.

Disclosure of Invention

The invention aims to provide cleaning equipment for a polysilicon ingot silicon wafer, which solves the problems that the traditional silicon wafer processing, cleaning equipment and polishing equipment provided in the background technology belong to two types of equipment, the processing is carried out successively, the processing time is prolonged, the matching degree between the equipment is low, and in the polishing process, the position of a processing box body is fixed, dead corners are left in polishing, and the polishing is not thorough.

In order to achieve the purpose, the invention provides the following technical scheme: the cleaning equipment for the polysilicon ingot casting silicon wafers comprises a device main body, two lifting mechanisms and a cleaning mechanism, wherein the device main body comprises a processing box body, a polished rod, a driving machine, a rotating shaft, an inner box, a water collecting tank, a pump body and supporting legs, the supporting legs are arranged on the lower end face of the processing box body, the driving machine is arranged in the middle of the top end face of the processing box body, the rotating shaft is rotatably connected inside the processing box body and is in transmission connection with the output end of the driving machine, the polished rod is arranged on the rotating shaft, the water collecting tank is arranged on the bottom end face inside the processing box body, the inner box is positioned above the water collecting tank, the lifting mechanism is arranged on the upper side inside the processing box body and comprises a motor I, pulleys, a transmission shaft and a rope, the transmission shaft is rotatably connected inside the processing box body and leans on, the pulley passes through rope and inner box fixed connection, the transmission shaft is connected with the output transmission of motor one, wiper mechanism is including supplementary clean subassembly and motor two, motor two sets up at processing box bottom end face, supplementary clean subassembly is equipped with two, two supplementary clean subassembly symmetry sets up inside processing the box, supplementary clean subassembly includes support, high pressure nozzle, slider, rack, gear and installation axle, the rack passes through slider sliding connection inside processing the box, the gear passes through the installation hub rotation and connects inside processing the box, the tooth's socket of gear and the tooth's socket of rack mesh mutually, high pressure nozzle passes through support and rack fixed connection.

Furthermore, the landing leg is equipped with four, four the landing leg sets up four edges and corners on the terminal surface respectively under the processing box.

Furthermore, the front end face of the processing box body is hinged with a box door, a transparent observation window is arranged at the middle position of the box door, and a handle is arranged on the upper side of the front end face of the box door.

Further, the pump body is connected with the high-pressure spray head through a hose.

Furthermore, the bottom end face of the inner box is provided with a leakage hole.

Further, the inside filter screen that is provided with of water catch bowl, and the filter screen is bilayer structure.

And furthermore, the two installation shafts are connected through a synchronous belt, and the installation shafts are in transmission connection with the output end of the second motor.

Furthermore, the polished rods are provided with a plurality of polished rods which are arranged on the annular side surface of the rotating shaft in an annular equidistant manner.

Compared with the prior art, the invention has the beneficial effects that: according to the invention, through the first motor, the pulley, the transmission shaft and the rope, the lifting of the inner box is realized, on one hand, materials move up and down, the polishing contact area is increased, and on the other hand, space conditions are provided for subsequent cleaning operation; according to the invention, through the motor II, the bracket, the high-pressure spray head, the slide block, the rack, the gear and the mounting shaft, the design drives the spray head to move in the processing box body, the polished material is physically cleaned, and meanwhile, the water collecting tank and the pump body at the bottom are utilized to filter redundant water for recycling; the polishing and cleaning integrated machine has the advantages of excellent structure, reasonable design, simplicity and convenience in operation, capability of eliminating polishing dead angles, integration of polishing and cleaning, wide application prospect and strong creativity.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the external structure of the present invention;

FIG. 3 is a schematic structural view of the lifting mechanism of the present invention;

fig. 4 is a schematic structural view of the lifting cleaning mechanism of the present invention.

In the reference symbols: 1. processing the box body; 2. a lifting mechanism; 3. polishing the rod; 4. a driver; 5. a rotating shaft; 6. an inner box; 7. a water collection tank; 8. a pump body; 9. a cleaning mechanism; 10. a support leg; 11. a box door; 12. a handle; 13. a transparent viewing window; 21. a first motor; 22. a pulley; 23. a drive shaft; 24. a rope; 91. an auxiliary cleaning component; 92. a second motor; 911. a support; 912. a high pressure spray head; 913. a slider; 914. a rack; 915. a gear; 916. and (4) installing a shaft.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a polycrystalline silicon ingot silicon chip cleaning equipment, the device comprises a device main part, elevating system 2 and wiper mechanism 9, the device main part is including processing box 1, polishing pole 3, driving machine 4, pivot 5, inner box 6, water catch bowl 7, the pump body 8 and landing leg 10, landing leg 10 sets up terminal surface under processing box 1, driving machine 4 sets up at 1 top end face intermediate position of processing box, pivot 5 rotates to be connected inside processing box 1, and be connected with the output transmission of driving machine 4, polishing pole 3 sets up in pivot 5, water catch bowl 7 sets up at the inside bottom face of processing box 1, inner box 6 is located water catch bowl 7 top.

Elevating system 2 sets up at the inside upside of processing box 1, and elevating system 2 includes motor 21, pulley 22, transmission shaft 23 and rope 24, and transmission shaft 23 rotates to be connected and leans on upper portion position in processing box 1 is inside, and pulley 22 is equipped with two, and two pulley 22 symmetries rotate to be connected on transmission shaft 23, and pulley 22 passes through

rope

24 and 6 fixed connection of inner box, and transmission shaft 23 is connected with the output transmission of motor 21.

The cleaning mechanism 9 comprises two auxiliary cleaning assemblies 91 and a second motor 92, the second motor 92 is arranged on the bottom end face of the processing box body 1, the two auxiliary cleaning assemblies 91 are symmetrically arranged inside the processing box body 1, each auxiliary cleaning assembly 91 comprises a support 911, a high-pressure spray head 912, a sliding block 913, a rack 914, a gear 915 and a mounting shaft 916, the rack 914 is connected inside the processing box body 1 in a sliding mode through the sliding block 913, the gear 915 is connected inside the processing box body 1 in a rotating mode through the mounting shaft 916, a tooth groove of the gear 915 is meshed with a tooth groove of the rack 914, and the high-pressure spray head 912 is fixedly connected with the rack 914 through the support 911.

Landing leg 10 is equipped with four, four landing legs 10 set up respectively and are being processed four edges and corners of terminal surface under 1 of box, the terminal surface articulates there is chamber door 11 before 1 of processing box, 11 intermediate positions of chamber door are provided with transparent observation window 13, the terminal surface upside is provided with handle 12 before 11 of chamber door, pump body 8 passes through the hose and is connected with high pressure nozzle 912, small opening a has been seted up to 6 bottom faces of inner box, the inside filter screen that is provided with of water catch bowl 7, and the filter screen is bilayer structure, connect through synchronous belt drive between two installation axles 916, and install the output transmission of axle 916 and motor two 92 and be connected, polishing pole 3 is equipped with a plurality of, a plurality of polishing pole 3 is annular equidistance and. The invention is in operation: silicon wafer materials are put into an inner box 6, a motor I21 is operated, the output end of the motor I21 rotates to drive a transmission shaft 23 to rotate, the transmission shaft 23 drives a pulley 22 to rotate, the pulley 22 pulls the inner box 6 to move upwards through a rope 24, a polishing rod 3 enters the inner box 6, a driver 4 is operated, the output end of the driver 4 rotates to drive a rotating shaft 5 to rotate, the rotating shaft 5 drives the polishing rod 3 to rotate, the polishing rod 3 polishes the silicon wafer materials, after polishing is finished, the motor I21 is operated in a reverse direction, the inner box 6 moves downwards in a processing box body 1 and is contacted with a water collecting tank 7, a motor II 92 is operated, the output end of the motor II 92 rotates to drive a mounting shaft 916 to rotate, the mounting shaft 916 drives a gear to rotate, the gear 915 drives a rack 914 to move, the two racks 914 move in a reverse direction, the spray head is driven to move inwards to the upper side of the inner box 6, the high-pressure sprayer 912 cleans silicon wafer materials, excessive water flows downwards through the leakage hole a and enters the bottom of the water collecting tank 7 after being filtered, so that the water is recycled, and the water resource is saved, so that the problem that the traditional silicon wafer processing is solved, the cleaning equipment and the polishing equipment belong to two kinds of equipment, the processing is carried out successively, the processing time is prolonged, the matching degree between the equipment is low, in the polishing process, the position of the processing box body 1 is fixed, dead corners can be left in the polishing process, and the polishing is incomplete is caused.

While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a polycrystalline silicon ingot silicon chip cleaning equipment, includes device main part, elevating system (2) and wiper mechanism (9), its characterized in that: the device main body comprises a processing box body (1), a polished rod (3), a driving machine (4), a rotating shaft (5), an inner box (6), a water collecting tank (7), a pump body (8) and supporting legs (10), wherein the supporting legs (10) are arranged on the lower end face of the processing box body (1), the driving machine (4) is arranged in the middle of the top end face of the processing box body (1), the rotating shaft (5) is rotatably connected inside the processing box body (1) and is in transmission connection with the output end of the driving machine (4), the polished rod (3) is arranged on the rotating shaft (5), the water collecting tank (7) is arranged on the bottom end face inside the processing box body (1), and the inner box (6) is located above the water collecting tank (7);

the lifting mechanism (2) is arranged on the upper side inside the processing box body (1), the lifting mechanism (2) comprises a first motor (21), pulleys (22), transmission shafts (23) and ropes (24), the transmission shafts (23) are rotatably connected to the upper portion inside the processing box body (1), the number of the pulleys (22) is two, the two pulleys (22) are symmetrically and rotatably connected to the transmission shafts (23), the pulleys (22) are fixedly connected with the inner box (6) through the ropes (24), and the transmission shafts (23) are in transmission connection with the output end of the first motor (21);

the cleaning mechanism (9) comprises a second auxiliary cleaning component (91) and a second motor (92), the second motor (92) is arranged on the bottom end face of the processing box body (1), the second auxiliary cleaning component (91) is provided with two auxiliary cleaning components (91) which are symmetrically arranged inside the processing box body (1), each auxiliary cleaning component (91) comprises a support (911), a high-pressure spray head (912), a sliding block (913), a rack (914), a gear (915) and a mounting shaft (916), the rack (914) is connected inside the processing box body (1) in a sliding mode through the sliding block (913), the gear (915) is connected inside the processing box body (1) in a rotating mode through the mounting shaft (916), a tooth groove of the gear (915) is meshed with a tooth groove of the rack (914), and the high-pressure spray head (912) is fixedly connected with the rack (914) through the support (911).

2. The cleaning equipment for the polysilicon ingot silicon wafer according to claim 1, which is characterized in that: the four supporting legs (10) are arranged and are respectively arranged at four edges of the lower end face of the processing box body (1).

3. The cleaning equipment for the polysilicon ingot silicon wafer according to claim 1, which is characterized in that: the front end face of the processing box body (1) is hinged with a box door (11), a transparent observation window (13) is arranged at the middle position of the box door (11), and a handle (12) is arranged on the upper side of the front end face of the box door (11).

4. The cleaning equipment for the polysilicon ingot silicon wafer according to claim 1, which is characterized in that: the pump body (8) is connected with the high-pressure spray head (912) through a hose.

5. The cleaning equipment for the polysilicon ingot silicon wafer according to claim 1, which is characterized in that: the bottom end surface of the inner box (6) is provided with a leak hole (a).

6. The cleaning equipment for the polysilicon ingot silicon wafer according to claim 1, which is characterized in that: the filter screen is arranged in the water collecting tank (7) and is of a double-layer structure.

7. The cleaning equipment for the polysilicon ingot silicon wafer according to claim 1, which is characterized in that: two install the axle (916) between connect through synchronous belt drive, and install the output transmission connection of axle (916) and motor two (92).

8. The cleaning equipment for the polysilicon ingot silicon wafer according to claim 1, which is characterized in that: the polishing rod (3) is provided with a plurality of polishing rods, and the polishing rods (3) are arranged on the annular side surface of the rotating shaft (5) in an annular equidistance mode.