CN109904094A - A kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment - Google Patents
A kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment Download PDFInfo
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- CN109904094A CN109904094A CN201910042065.5A CN201910042065A CN109904094A CN 109904094 A CN109904094 A CN 109904094A CN 201910042065 A CN201910042065 A CN 201910042065A CN 109904094 A CN109904094 A CN 109904094A
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- machining box
- silicon wafer
- ingot casting
- cleaning equipment
- wafer cleaning
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Abstract
The present invention relates to a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipments, including machining box, buff spindle, driving machine, shaft, interior case, catch basin, the pump housing, motor one, pulley, transmission shaft, rope, motor two, bracket, high-pressure nozzle, sliding block, rack gear, gear and installation axle, shaft is rotatably connected on inside machining box, and it is sequentially connected with the output end of driving machine, buff spindle is arranged in shaft, interior case is located above catch basin, two pulleys are symmetrically rotatably connected on transmission shaft, pulley is fixedly connected by rope with interior case, the output end of transmission shaft and motor one is sequentially connected, rack gear is slidably connected inside machining box by sliding block, gear is rotatably connected on inside machining box by installation axle, high-pressure nozzle bronze drum bracket is fixedly connected with rack gear, structure of the invention is excellent, design is reasonable, it is easy to operate, it is dead to eliminate polishing Angle, polished and cleaned is two-in-one, has widely application prospect, creative strong.
Description
Technical field
The present invention relates to Wafer Cleaning apparatus field, specially a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment.
Background technique
Silicon wafer must be cleaned strictly in semiconductor devices production.Micropollution also results in component failure.The purpose of cleaning
It is to remove surface contamination impurity, including organic matter and inorganic matter.These impurity some have with state of atom or ionic condition
In the form of a film or particle form is present in silicon chip surface.It will lead to various defects.Remove pollution method have physical cleaning and
Two kinds of chemical cleaning.
Physical cleaning belongs to one kind of cleaning way, and physical cleaning often utilizes high-pressure nozzle, cleans to silicon wafer, but passes
The silicon wafer of system is processed, and cleaning equipment and polissoir belong to two kinds of equipment, and first post-processing extends the time of processing, equipment room
Fitness it is lower, and in polishing process, machining box position is fixed, and polishing can cause polishing to be not thorough, to sum up there are dead angle
It is described, it is badly in need of a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment now to solve the above-mentioned problem.
Summary of the invention
It is mentioned above in the background art to solve it is an object of the present invention to provide a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment
Traditional silicon wafer processing, cleaning equipment and polissoir belong to two kinds of equipment, and first post-processing extends the time of processing, equipment
Between fitness it is lower, and in polishing process, machining box position is fixed, and polishing can cause to polish halfway there are dead angle
Problem.
To achieve the above object, the invention provides the following technical scheme: a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment, including
Apparatus main body, elevating mechanism and wiper mechanism, described device main body include machining box, buff spindle, driving machine, shaft, interior case,
Catch basin, the pump housing and supporting leg, in machining box lower end surface, the driving machine is arranged in machining box top end face for the supporting leg setting
Middle position, the shaft are rotatably connected on inside machining box, and are sequentially connected with the output end of driving machine, the buff spindle
It is arranged in shaft, the catch basin is arranged in machining box inner bottom end face, and the interior case is located above catch basin, the liter
Descending mechanism is arranged in machining box upper inside, and the elevating mechanism includes motor one, pulley, transmission shaft and rope, the biography
Moving axis is rotatably connected on inside machining box by upper bit, and there are two the pulley is set, two pulleys are symmetrically rotatably connected on biography
On moving axis, the pulley is fixedly connected by rope with interior case, and the output end of the transmission shaft and motor one is sequentially connected, described
Wiper mechanism includes secondary component and motor two, and the motor two is arranged in machining box bottom face, the secondary
There are two component is set, two secondary components are symmetricly set on inside machining box, and the secondary component includes
Bracket, high-pressure nozzle, sliding block, rack gear, gear and installation axle, the rack gear are slidably connected inside machining box by sliding block,
The gear is rotatably connected on inside machining box by installation axle, and the tooth socket of the gear is meshed with the tooth socket of rack gear, institute
High-pressure nozzle bronze drum bracket is stated to be fixedly connected with rack gear.
Further, there are four the supporting leg is set, four supporting legs are separately positioned on the rib of machining box lower end surface four
At angle.
Further, the machining box front end face is hinged with chamber door, and chamber door middle position is provided with transparent windows, case
Handle is provided on the upside of end face in front of the door.
Further, the pump housing is connect by hose with high-pressure nozzle.
Further, the interior bottom end face offers leak hole.
Further, the catch basin is internally provided with filter screen, and filter screen is double-layer structure.
Further, it is connected between two installation axles by toothed belt transmission, and the output of installation axle and motor two
End transmission connection.
Further, the buff spindle is equipped with several, several described buff spindles are equidistantly arranged in shaft ring in a ring
Shape side.
Compared with prior art, the beneficial effects of the present invention are: the present invention passes through motor one, pulley, transmission shaft and rope,
The design achieves the liftings of interior case, on the one hand move up and down material, increase polishing contact area, are on the other hand subsequent
Clean operation provides steric requirements；The present invention passes through motor two, bracket, high-pressure nozzle, sliding block, rack gear, gear and installation axle,
The design drives spray head to move inside machining box, carries out physical cleaning to the material after polishing, while utilizing the collection of bottom
Sink and the pump housing are recycled after extra water filtering；Structure of the invention is excellent, and design is rationally, easy to operate, disappears
Except polishing dead angle, polished and cleaned is two-in-one, has widely application prospect, creative strong.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is external structure schematic diagram of the invention；
Fig. 3 is the structural schematic diagram of elevating mechanism in the present invention；
Fig. 4 is the structural schematic diagram that wiper mechanism is risen in the present invention.
In appended drawing reference: 1. machining boxes；2. elevating mechanism；3. buff spindle；4. driving machine；5. shaft；Case in 6.；7. collection
Sink；8. the pump housing；9. wiper mechanism；10. supporting leg；11. chamber door；12. handle；13. transparent windows；21. motor one；22. sliding
Wheel；23. transmission shaft；24. rope；91. secondary component；92. motor two；911. bracket；912. high-pressure nozzle；913. sliding
Block；914. rack gear；915. gear；916. installation axle.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-4 is please referred to, the present invention provides a kind of technical solution: a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment, including dress
Main body, elevating mechanism 2 and wiper mechanism 9 are set, apparatus main body includes machining box 1, buff spindle 3, driving machine 4, shaft 5, interior case
6, catch basin 7, the pump housing 8 and supporting leg 10, the setting of supporting leg 10 are pushed up in 1 lower end surface of machining box, the setting of driving machine 4 in machining box 1
End face middle position, shaft 5 are rotatably connected on inside machining box 1, and are sequentially connected with the output end of driving machine 4, buff spindle 3
It is arranged in shaft 5, catch basin 7 is arranged in 1 inner bottom end face of machining box, and interior case 6 is located at 7 top of catch basin.
For the setting of elevating mechanism 2 in 1 upper inside of machining box, elevating mechanism 2 includes motor 1, pulley 22, transmission shaft
23 and rope 24, transmission shaft 23 is rotatably connected on inside machining box 1 by upper bit, there are two pulley 22 is set, two pulleys 22
It is symmetrically rotatably connected on transmission shaft 23, pulley 22 is fixedly connected by rope 24 with interior case 6, transmission shaft 23 and motor 1
Output end transmission connection.
Wiper mechanism 9 includes secondary component 91 and motor 2 92, and motor 2 92 is arranged in 1 bottom face of machining box,
There are two secondary component 91 is set, two secondary components 91 are symmetricly set on inside machining box 1, secondary component
91 include bracket 911, high-pressure nozzle 912, sliding block 913, rack gear 914, gear 915 and installation axle 916, and rack gear 914 passes through sliding block
913 are slidably connected inside machining box 1, and gear 915 is rotatably connected on inside machining box 1 by installation axle 916, gear
915 tooth socket is meshed with the tooth socket of rack gear 914, and 912 bronze drum bracket 911 of high-pressure nozzle is fixedly connected with rack gear 914, the present invention
Structure is excellent, and design is rationally, easy to operate, eliminates polishing dead angle, and polished and cleaned is two-in-one, has widely application prospect, wound
The property made is strong.
There are four supporting leg 10 is set, four supporting legs 10 are separately positioned on machining box 1 lower end surface four edges and corners, machining box
1 front end face is hinged with chamber door 11, and 11 middle position of chamber door is provided with transparent windows 13, is provided with handle on the upside of 11 front end face of chamber door
Hand 12, the pump housing 8 are connect by hose with high-pressure nozzle 912, and interior 6 bottom face of case offers leak hole a, and catch basin 7 is internally provided with
Filter screen, and filter screen is double-layer structure, is connected between two installation axles 916 by toothed belt transmission, and installation axle 916 and electricity
The output end of machine 2 92 is sequentially connected, and buff spindle 3 is equipped with several, several buff spindles 3 are equidistantly arranged in 5 ring of shaft in a ring
Shape side.
The present invention is at work: by silicon wafer material put into case 6, run motor 1, the output end rotation of motor 1
Transmission shaft 23 is driven to rotate, transmission shaft 23 is rotated with movable pulley 22, and pulley 22 pulls interior case 6 to move up by rope 24, is made
Buff spindle 3 enters inside interior case 6, runs driving machine 4, and the output end rotation of driving machine 4 drives shaft 5 to rotate, and shaft 5, which drives, throws
Optical axis 3 rotates, and buff spindle 3 carries out polishing operation to silicon wafer material, and after polishing, inverted running motor 1 similarly makes interior
Case 6 moves down in machining box 1, and is in contact with catch basin 7, runs motor 2 92, the output end rotation of motor 2 92
Installation axle 916 is driven to rotate, installation axle 916 is rotated with moving gear 915, and gear 915 is mobile with carry-over bar 914, two rack gears 914
It moves toward one another, spray head is driven to be moved to interior 6 upside of case to introversion, water is delivered to high-pressure nozzle 912, high-pressure nozzle by the pump housing 8
912 pairs of silicon wafer materials carry out cleaning operations, and extra water flows downward by leak hole a, and after filtering, into 7 bottom of catch basin,
For recycling, water resource is saved, to solve traditional silicon wafer processing, cleaning equipment and polissoir belong to two kinds and set
Standby, first post-processing extends the time of processing, and the fitness of equipment room is lower, and in polishing process, and 1 position of machining box is solid
Fixed, polishing can cause to polish halfway problem there are dead angle.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention, for this field skill
For art personnel, it is clear that invention is not limited to the details of the above exemplary embodiments, and without departing substantially from spirit of the invention or
In the case where essential characteristic, the present invention can be realized in other specific forms.Therefore, in all respects, should all incite somebody to action
Embodiment regards exemplary as, and is non-limiting, the scope of the present invention by appended claims rather than on state
Bright restriction, it is intended that including all changes that fall within the meaning and scope of the equivalent elements of the claims in the present invention
It is interior.Any reference signs in the claims should not be construed as limiting the involved claims.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (8)
1. a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment, including apparatus main body, elevating mechanism (2) and wiper mechanism (9), feature
Be: described device main body includes machining box (1), buff spindle (3), driving machine (4), shaft (5), interior case (6), catch basin
(7), the pump housing (8) and supporting leg (10), supporting leg (10) setting exist in machining box (1) lower end surface, driving machine (4) setting
Machining box (1) top end face middle position, it is internal that the shaft (5) is rotatably connected on machining box (1), and with driving machine (4)
Output end transmission connection, the buff spindle (3) is arranged on shaft (5), and the catch basin (7) is arranged in machining box (1)
Inner bottom end face, the interior case (6) are located above catch basin (7)；
The elevating mechanism (2) is arranged in machining box (1) upper inside, and the elevating mechanism (2) includes motor one (21), slides
(22), transmission shaft (23) and rope (24) are taken turns, the transmission shaft (23) is rotatably connected on inside machining box (1) by upper bit,
There are two the pulley (22) sets, two pulleys (22) are symmetrically rotatably connected on transmission shaft (23), and the pulley (22) passes through
Rope (24) is fixedly connected with interior case (6), and the output end of the transmission shaft (23) and motor one (21) is sequentially connected；
The wiper mechanism (9) includes secondary component (91) and motor two (92), and motor two (92) setting is being processed
Cabinet (1) bottom face, there are two the secondary component (91) sets, two secondary components (91) are symmetricly set on
Machining box (1) is internal, and the secondary component (91) includes bracket (911), high-pressure nozzle (912), sliding block (913), tooth
Item (914), gear (915) and installation axle (916), the rack gear (914) are slidably connected at machining box by sliding block (913)
(1) internal, the gear (915) is rotatably connected on machining box (1) inside by installation axle (916), the gear (915)
Tooth socket is meshed with the tooth socket of rack gear (914), high-pressure nozzle (912) the bronze drum bracket (911) and rack gear (914) fixed company
It connects.
2. a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment according to claim 1, it is characterised in that: the supporting leg (10) sets
There are four, four supporting legs (10) are separately positioned on machining box (1) lower end surface four edges and corners.
3. a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment according to claim 1, it is characterised in that: the machining box
(1) front end face is hinged with chamber door (11), and chamber door (11) middle position is provided with transparent windows (13), on chamber door (11) front end face
Side is provided with handle (12).
4. a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment according to claim 1, it is characterised in that: the pump housing (8) is logical
Hose is crossed to connect with high-pressure nozzle (912).
5. a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment according to claim 1, it is characterised in that: interior case (6) bottom
End face offers leak hole (a).
6. a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment according to claim 1, it is characterised in that: the catch basin (7)
It is internally provided with filter screen, and filter screen is double-layer structure.
7. a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment according to claim 1, it is characterised in that: two installation axles
(916) it is connected between by toothed belt transmission, and the output end of installation axle (916) and motor two (92) is sequentially connected.
8. a kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment according to claim 1, it is characterised in that: the buff spindle (3)
Equipped with several, several described buff spindles (3) are equidistantly arranged in shaft (5) annular side in a ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910042065.5A CN109904094B (en) | 2019-01-17 | 2019-01-17 | Polycrystalline silicon ingot silicon chip cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910042065.5A CN109904094B (en) | 2019-01-17 | 2019-01-17 | Polycrystalline silicon ingot silicon chip cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109904094A true CN109904094A (en) | 2019-06-18 |
| CN109904094B CN109904094B (en) | 2021-02-19 |
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ID=66943866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910042065.5A Active CN109904094B (en) | 2019-01-17 | 2019-01-17 | Polycrystalline silicon ingot silicon chip cleaning equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN109904094B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022000703A1 (en) * | 2020-06-30 | 2022-01-06 | 东莞宇宙电路板设备有限公司 | Surface treatment device |
| GB2601472A (en) * | 2020-06-30 | 2022-06-08 | Universal Circuit Board Equipment Co Ltd | Surface treatment device |
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Patent Citations (8)
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| JP2008300668A (en) * | 2007-05-31 | 2008-12-11 | Disco Abrasive Syst Ltd | Cleaning device, grinder and holding method of wafer |
| CN101817160A (en) * | 2010-04-13 | 2010-09-01 | 王敬 | Silicon ingot polishing method, system and polishing plate |
| CN101885161A (en) * | 2010-07-02 | 2010-11-17 | 王敬 | Polishing system used for square silicon ingot for solar cell |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022000703A1 (en) * | 2020-06-30 | 2022-01-06 | 东莞宇宙电路板设备有限公司 | Surface treatment device |
| GB2601472A (en) * | 2020-06-30 | 2022-06-08 | Universal Circuit Board Equipment Co Ltd | Surface treatment device |
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| Publication number | Publication date |
|---|---|
| CN109904094B (en) | 2021-02-19 |
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