CN215844429U - Wafer cleaning and recycling machine - Google Patents
Wafer cleaning and recycling machine Download PDFInfo
- Publication number
- CN215844429U CN215844429U CN202121828612.1U CN202121828612U CN215844429U CN 215844429 U CN215844429 U CN 215844429U CN 202121828612 U CN202121828612 U CN 202121828612U CN 215844429 U CN215844429 U CN 215844429U
- Authority
- CN
- China
- Prior art keywords
- wall
- machine
- wafer
- slide rail
- slider
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 48
- 238000004064 recycling Methods 0.000 title claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 43
- 238000005406 washing Methods 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 17
- 229920000742 Cotton Polymers 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 13
- 238000011084 recovery Methods 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 abstract description 52
- 230000000694 effects Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model relates to the technical field of wafers, in particular to a wafer cleaning and recycling machine, which comprises a cleaning and recycling machine and a discharge mechanism, wherein a rotating mechanism penetrates through the top of the cleaning and recycling machine, sliding mechanisms capable of sliding left and right are respectively arranged on two sides of the outer wall of the cleaning and recycling machine, an electric slider in each sliding mechanism drives a sponge layer to slide on the same horizontal line on a first sliding rail, and a discharge mechanism capable of lifting up and down is arranged below each sliding mechanism. And can prevent the effect of falling damage to the wafer.
Description
Technical Field
The utility model relates to the technical field of wafers, in particular to a wafer cleaning and recycling machine.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then doped into a silicon crystal seed crystal, the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer, the surface of the wafer must have extremely high flatness, smoothness and cleanliness, chemical reagents are left on the surface of the wafer in the processing process, and the residual chemical solvents on the surface of the wafer need to be cleaned to ensure the cleanliness of the wafer and are recycled.
In the prior art, the following problems exist:
(1) the existing wafer cleaning and recycling machine is mostly inconvenient to concentrate and take out when in use, or is inconvenient to wash and put in, if the wafer is directly put in, the wafer can be collided with the inner wall of the cleaning and recycling machine, the surface of the wafer is scratched and damaged, and the wafer cannot be used.
(2) Present wafer washs and retrieves machine is not convenient for carry out the extrusion protection to the wafer mostly when using to can not make its all-round washing, can't carry out the adjusting position according to the big or small size of wafer, can lead to the wafer to wash incompletely, and can not play the buffering guard action to the wafer.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a wafer cleaning and recycling machine to solve the problems in the background technology.
The technical scheme of the utility model is as follows: the utility model provides a wafer washs and retrieves machine, includes washs and retrieves machine and discharge mechanism, it has rotary mechanism to wash the top of retrieving the machine to run through, but the outer wall both sides of wasing the machine of retrieving all install horizontal slip's slide mechanism, electronic slider drives the sponge layer and slides on first slide rail with water flat line in the slide mechanism, but the discharge mechanism of oscilaltion is installed to slide mechanism's below, the washing is retrieved the quick-witted inner wall and is installed detachable sealing mechanism, discharge mechanism's outer wall one side is connected with wiper mechanism.
Preferably, rotary mechanism includes servo motor, rotation axis and washing cotton, servo motor installs in the outer wall top of wasing the recovery machine, rotation axis fixed mounting is at servo motor's output, the outer wall at the rotation axis is established to the washing cotton cover.
Preferably, slide mechanism includes movable block, first slide rail, electronic slider, sponge layer and electrostatic chuck, the inner wall top at the machine is retrieved in the washing to the movable block, first slide rail is seted up on the outer wall below surface of movable block, electronic slider installs the inside both sides at first slide rail, the sponge layer sets up the outer wall below at electronic slider, the inside on sponge layer is provided with a plurality of electrostatic chuck.
Preferably, discharge mechanism includes second slide rail, slider, tray, electric lift loop bar and storing groove, the second slide rail is seted up and is being washd and retrieve quick-witted inner wall below surface, the inside at the second slide rail is installed to the slider, the tray welding is in the both sides of slider, the electric lift loop bar welding is in the outer wall below of tray, the welding of storing inslot wall below has electric lift loop bar.
Preferably, the slider is arranged on the central line of the tray, and the slider is matched with the tray to lift and descend in a balanced manner.
Preferably, sealing mechanism includes draw-in groove, fixture block and sealing washer, the inner wall at the washing machine of retrieving is seted up to the draw-in groove, the fixture block is installed in one side of draw-in groove, the sealing washer welding is in one side of fixture block.
Preferably, wiper mechanism includes water pump, water pipe, shunt tubes and water inlet, the water pump is connected in storing groove outer wall one side, water piping connection is at the other end of water pump, the end at the water pipe is connected to the shunt tubes, the inside welding of water inlet has the shunt tubes.
The utility model provides a wafer cleaning and recycling machine through improvement, and compared with the prior art, the wafer cleaning and recycling machine has the following improvements and advantages:
one is as follows: according to the utility model, the movable block, the first slide rail, the electric slide block, the sponge layer and the electrostatic chuck are arranged, so that a wafer can be adsorbed on one side of the sponge layer through the electrostatic chuck according to the thickness of the wafer to be cleaned, the sponge layer is driven by the electric slide block to slide on the first slide rail to the inner side to be tightened, the wafer is attached to cleaning cotton on the rotating shaft, the effect of simultaneously extruding and cleaning the two sides is achieved, and the wafer can be prevented from falling and being damaged;
the second step is as follows: according to the utility model, the second slide rail, the slide block, the tray, the electric lifting sleeve rod and the storage groove are arranged, after the wafer is cleaned, the electric lifting sleeve rod is started to drive the wafer on the cleaning cotton to descend to a proper position, the wafer is taken down and placed on the tray for discharging conveniently, and meanwhile, the wafer can be prevented from being damaged by being touched by external articles.
Drawings
The utility model is further explained below with reference to the figures and examples:
FIG. 1 is a schematic perspective sectional view of the present invention;
FIG. 2 is a schematic view of the front view of the present invention;
FIG. 3 is a schematic view of the sliding mechanism of the present invention;
FIG. 4 is an enlarged schematic view of the utility model at A in FIG. 1;
description of reference numerals: 1. cleaning a recycling machine; 2. a rotation mechanism; 201. a servo motor; 202. a rotating shaft; 203. cleaning cotton; 3. a sliding mechanism; 301. a movable block; 302. a first slide rail; 303. an electric slider; 304. a sponge layer; 305. an electrostatic chuck; 4. a discharging mechanism; 401. a second slide rail; 402. a slider; 403. a tray; 404. an electric lifting loop bar; 405. a storage tank; 5. a sealing mechanism; 501. a card slot; 502. a clamping block; 503. a seal ring; 6. a cleaning mechanism; 601. a water pump; 602. a water pipe; 603. a shunt tube; 604. a water inlet.
Detailed Description
The present invention is described in detail below, and technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the utility model provides a wafer cleaning and recycling machine through improvement, and the technical scheme of the utility model is as follows: the utility model provides a wafer washs and retrieves machine, including wasing and retrieving machine 1 and discharge mechanism 4, it has rotary mechanism 2 to wash the top of retrieving machine 1 to run through, but washing and retrieving machine 1's outer wall both sides all install horizontal slip mechanism 3, electronic slider 303 drives sponge layer 304 and slides on first slide rail 302 same water flat line in the slide mechanism 3, but the discharge mechanism 4 of oscilaltion is installed to slide mechanism 3's below, detachable sealing mechanism 5 is installed to washing and retrieving machine 1 inner wall, outer wall one side of discharge mechanism 4 is connected with wiper mechanism 6.
Specifically, the method comprises the following steps: the rotating mechanism 2 comprises a servo motor 201, a rotating shaft 202 and cleaning cotton 203, the servo motor 201 is installed above the outer wall of the cleaning recycling machine 1, the rotating shaft 202 is fixedly installed at the output end of the servo motor 201, the cleaning cotton 203 is sleeved on the outer wall of the rotating shaft 202, through the arrangement of the servo motor 201, the rotating shaft 202 and the cleaning cotton 203, the servo motor 201 is started to drive the rotating shaft 202 and the cleaning cotton 203 to rotate, the cleaning cotton 203 is cleaned in a friction mode on the outer wall of a wafer, meanwhile, the other side of the wafer is cleaned in an extrusion mode on the outer wall of a sponge layer 304, and the purpose of cleaning the two sides simultaneously is achieved.
Specifically, the method comprises the following steps: the sliding mechanism 3 comprises a movable block 301, a first slide rail 302, an electric slider 303, a sponge layer 304 and electrostatic chucks 305, wherein the movable block 301 is arranged above the inner wall of the cleaning and recycling machine 1, the first slide rail 302 is arranged on the surface below the outer wall of the movable block 301, the electric sliders 303 are arranged on two sides inside the first slide rail 302, the sponge layer 304 is arranged below the outer wall of the electric slider 303, a plurality of electrostatic chucks 305 are arranged inside the sponge layer 304, the movable block 301, the first slide rail 302, the electric slider 303, the sponge layer 304 and the electrostatic chucks 305 can be arranged according to the thickness of a wafer to be cleaned so as to adsorb the wafer on one side of the sponge layer 304 through the electrostatic chucks 305, the sponge layer 304 is driven by the electric slider 303 to slide to the inner side on the first slide rail 302 so that the wafer is attached to the cleaning cotton 203 on the rotating shaft 202, and the effect of squeezing and cleaning on two sides is achieved, and can prevent the effect of falling damage to the wafer.
Specifically, the method comprises the following steps: discharge mechanism 4 includes second slide rail 401, slider 402, tray 403, electric lift loop bar 404 and storing groove 405, second slide rail 401 is seted up and is being washd 1 inner wall below surface of retrieving machine, slider 402 is installed in the inside of second slide rail 401, tray 403 welding is in the both sides of slider 402, electric lift loop bar 404 welding is in the outer wall below of tray 403, storing groove 405 inner wall below welding has electric lift loop bar 404, through tray 403, electric lift loop bar 404 and storing groove 405's setting, after the washing finishes, start electric lift loop bar 404 and drive and descend sponge layer 304 and tray 403, be convenient for take away the wafer that finishes with the washing this moment.
Specifically, the method comprises the following steps: the slider 402 is at the central line of tray 403, and slider 402 cooperation tray 403 balanced lift, through the setting of slider 402 with second slide rail 401, the slider 402 of tray 403 both sides descends steadily in second slide rail 401, reaches the balanced effect to supporting tray 403.
Specifically, the method comprises the following steps: the sealing mechanism 5 comprises a clamping groove 501, a clamping block 502 and a sealing ring 503, the clamping groove 501 is formed in the inner wall of the cleaning recycling machine 1, the clamping block 502 is installed on one side of the clamping groove 501, the sealing ring 503 is welded on one side of the clamping block 502, the sealing ring 503 is installed on the inner wall of the cleaning recycling machine 1 through the arrangement of the clamping groove 501, the clamping block 502 and the sealing ring 503, and the clamping block 502 is clamped into the clamping groove 501 to be fixed through pressing forcibly, so that the sealing effect on the cleaning recycling machine 1 is achieved.
Specifically, the method comprises the following steps: cleaning mechanism 6 includes water pump 601, water pipe 602, shunt tubes 603 and water inlet 604, water pump 601 is connected in storing groove 405 outer wall one side, the other end at water pump 601 is connected to water pipe 602, shunt tubes 603 are connected at the end of water pipe 602, the inside welding of water inlet 604 has shunt tubes 603, through water pump 601, water pipe 602, the setting of shunt tubes 603 and water inlet 604, after washing recovery machine 1 finishes using, pour into the inside of storing groove 405 with water, start water pump 601 with the inside water suction of storing groove 405, discharge to washing recovery machine 1 inside in water pipe 602 and shunt tubes 603, wash the inside chemical residue of washing recovery machine 1.
As shown in fig. 1-4, a wafer cleaning recycling machine,
the working principle is as follows: firstly, an external power supply is switched on, a sealing ring 503 is installed on the inner wall of the cleaning and recycling machine 1, the clamping block 502 is clamped into the clamping groove 501 to be fixed by pressing hard, so that the cleaning and recycling machine 1 can be conveniently sealed, then an electric lifting loop bar 404 is started to drive the tray 403 and the sponge layer 304 to descend to a proper position, a wafer to be cleaned is placed on one side of the outer wall of the sponge layer 304 to be adsorbed and fixed through the electrostatic chuck 305, then the wafer is lifted and returned to a proper position, the electric slider 303 is started to drive the sponge layer 304 to slide on the first slide rail 302 to a proper position, water is injected into the cleaning and recycling machine 1, at the moment, the servo motor 201 is started to drive the rotating shaft 202 and the cleaning cotton 203 to rotate, so that the cleaning cotton 203 is cleaned on the outer wall of the wafer by friction, meanwhile, the other side of the wafer is cleaned on the outer wall of the sponge layer 304 by extrusion, the purpose of cleaning on the two sides simultaneously is achieved, after the cleaning is finished, it descends sponge layer 304 and tray 403 to start electric lift loop bar 404 to drive, at the in-process that descends, the slider 402 of tray 403 both sides descends steadily in second slide rail 401 is inside, reach the balanced effect to supporting tray 403, take away the wafer that finishes of washing this moment, finally, pour into water inside storing groove 405, start water pump 601 with the inside water suction of storing groove 405, discharge to washing in water pipe 602 and the shunt tubes 603 and retrieve machine 1 inside, wash the inside chemical residue of machine 1 of retrieving to the washing, wherein, servo motor 201's model is: YE2-132S-4, the model number of electric slider 303 is: RXP45, the model of electric lift loop bar 404 is: YS-NZ100-12A, the model of the water pump 601 is as follows: PW-175 EAH.
The previous description is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. The utility model provides a wafer washs and retrieves machine which characterized in that: including wasing recovery machine (1) and discharge mechanism (4), the top of wasing recovery machine (1) is run through and is had rotary mechanism (2), but wasing recovery machine's (1) outer wall both sides all install horizontal slip's slide mechanism (3), electric slider (303) drive sponge layer (304) and slide on first slide rail (302) same water flat line in slide mechanism (3), but discharge mechanism (4) of oscilaltion are installed to the below of slide mechanism (3), detachable sealing mechanism (5) are installed to washing recovery machine (1) inner wall, outer wall one side of discharge mechanism (4) is connected with wiper mechanism (6).
2. The wafer cleaning and recycling machine of claim 1, wherein: rotary mechanism (2) include servo motor (201), rotation axis (202) and wash cotton (203), install in the outer wall top of wasing recovery machine (1) servo motor (201), rotation axis (202) fixed mounting is at the output of servo motor (201), wash the outer wall at rotation axis (202) is established in cotton (203) cover.
3. The wafer cleaning and recycling machine of claim 1, wherein: slide mechanism (3) are including movable block (301), first slide rail (302), electronic slider (303) sponge layer (304) and electrostatic chuck (305), the inner wall top of retrieving machine (1) is installed in washing in movable block (301), the outer wall below surface at movable block (301) is seted up in first slide rail (302), the inside both sides at first slide rail (302) are installed in electronic slider (303), sponge layer (304) set up the outer wall below at electronic slider (303), the inside on sponge layer (304) is provided with a plurality of electrostatic chuck (305).
4. The wafer cleaning and recycling machine of claim 1, wherein: discharge mechanism (4) include second slide rail (401), slider (402), tray (403), electric lift loop bar (404) and storing groove (405), set up at washing and retrieve machine (1) inner wall below surface second slide rail (401), the inside at second slide rail (401) is installed in slider (402), tray (403) welding is in the both sides of slider (402), electric lift loop bar (404) welding is in the outer wall below of tray (403), storing groove (405) inner wall below welding has electric lift loop bar (404).
5. The wafer cleaning and recycling machine of claim 4, wherein: the sliding block (402) is arranged on the central line of the tray (403), and the sliding block (402) is matched with the tray (403) to lift in a balanced mode.
6. The wafer cleaning and recycling machine of claim 1, wherein: the sealing mechanism (5) comprises a clamping groove (501), a clamping block (502) and a sealing ring (503), the clamping groove (501) is formed in the inner wall of the cleaning recycling machine (1), the clamping block (502) is installed on one side of the clamping groove (501), and the sealing ring (503) is welded on one side of the clamping block (502).
7. The wafer cleaning and recycling machine of claim 1, wherein: wiper mechanism (6) include water pump (601), water pipe (602), shunt tubes (603) and water inlet (604), water pump (601) are connected in storing groove (405) outer wall one side, the other end at water pump (601) is connected in water pipe (602), the end at water pipe (602) is connected in shunt tubes (603), the inside welding of water inlet (604) has shunt tubes (603).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121828612.1U CN215844429U (en) | 2021-08-06 | 2021-08-06 | Wafer cleaning and recycling machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121828612.1U CN215844429U (en) | 2021-08-06 | 2021-08-06 | Wafer cleaning and recycling machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215844429U true CN215844429U (en) | 2022-02-18 |
Family
ID=80326446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121828612.1U Active CN215844429U (en) | 2021-08-06 | 2021-08-06 | Wafer cleaning and recycling machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215844429U (en) |
-
2021
- 2021-08-06 CN CN202121828612.1U patent/CN215844429U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215844496U (en) | Wafer cleaning brush and wafer cleaning device | |
| CN215183901U (en) | Clamping equipment for semiconductor wafer production | |
| CN101740324B (en) | Silicon wafer cleaner and silicon wafer cleaning method | |
| CN215844429U (en) | Wafer cleaning and recycling machine | |
| CN117697617A (en) | Semiconductor chip polishing mechanism | |
| CN219255015U (en) | Gear shaft grinding equipment for automatic production | |
| CN112820627A (en) | Efficient wafer cleaning method | |
| CN111916376A (en) | Silicon wafer etching equipment | |
| CN219112305U (en) | Automatic chip cleaning machine | |
| CN218194438U (en) | Semiconductor double-side polishing device | |
| CN216026437U (en) | Workbench cleaning device for non-standard part machining | |
| CN112916458A (en) | Method for preparing electronic element wafer | |
| CN113927446B (en) | Processing device for preventing surface rust of neodymium iron boron | |
| CN214923343U (en) | Sweep ray apparatus that glass apron was used | |
| CN210546501U (en) | High efficiency two-sided brush dish washs frock | |
| CN213378176U (en) | Full-automatic wafer cleaning machine | |
| CN217903084U (en) | Full-automatic single wafer cleaning machine | |
| CN216137830U (en) | Cleaning device for semiconductor production | |
| CN216054593U (en) | Processing device for integrated circuit wafer regeneration process | |
| CN213197148U (en) | Cell-phone screen processing aligning device | |
| CN211545542U (en) | Rewinding machine pay off rack | |
| CN221668788U (en) | Wafer surface drying and blowing equipment | |
| CN216504060U (en) | Polishing and cleaning device for harmful light resistant lens | |
| CN220547363U (en) | Photovoltaic board crystalline silicon raw materials belt cleaning device | |
| CN220426128U (en) | Single wafer cleaning machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230706 Address after: No. 21, Nanhai Road, Yi'an District, Tongling City, Anhui Province 244151 Patentee after: Anhui fulede Changjiang semiconductor material Co.,Ltd. Address before: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Patentee before: Shanghai Shenhe Investment Co.,Ltd. |
|
| TR01 | Transfer of patent right |