CN218194438U - Semiconductor double-side polishing device - Google Patents

Abstract

The utility model relates to a semiconductor processing technology field discloses a two-sided burnishing device of semiconductor, it includes the runner stone, lower mill, play piece part, first elevating system, second elevating system and controller, runner stone and lower mill set up relatively, when needs are polished to the wafer, it is in first state to play piece part, first bracing piece is located first holding tank and rotates along with lower mill, can not influence the lower surface polishing of wafer, when needs carry out the lifting washing to the wafer, a plurality of first bracing pieces of second elevating system drive rise in step, thereby it rises to the washing position to drive the wafer that is located the support position, this moment because there is the clearance between a plurality of first bracing pieces, can not influence washing of wafer lower surface, thereby need not to wash the wafer lower surface alone again, can wash the upper surface and the lower surface of wafer simultaneously, it is efficient to wash, avoid the damage of machinery class, the yield of wafer has been improved.

Description

Semiconductor double-side polishing device

Technical Field

The utility model relates to a semiconductor processing technology field especially relates to a two-sided burnishing device of semiconductor.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, and various circuit element structures can be manufactured on the silicon wafer to form an integrated circuit product with a specific electrical function. Polishing refers to a process of reducing the roughness of a workpiece surface by mechanical, chemical, or electrochemical actions to obtain a bright, flat surface. The method is to carry out modification processing on the surface of a workpiece by using a polishing tool and abrasive particles or other polishing media. At the moment of rapid advancement of semiconductor technology, the quality requirement of wafers is higher and higher, both surfaces of the wafers are usually required to be polished, and after polishing is completed, both surfaces of the wafers are usually required to be flushed, so that the defect of liquid medicine induction on any surface is prevented.

After the two sides of the wafer are polished by the conventional semiconductor double-side polishing device, the wafer is usually tightly attached to a lower grinding disc due to high flatness and is difficult to take out, so that the lower surface of the wafer is easy to be subjected to liquid medicine introduction, the lower surface needs to be polished independently, mechanical damage is easy to cause, and the yield of the wafer is low. Some operators will pick up the wafer with a screwdriver and then take out the wafer with a vacuum suction pen, but this method is liable to damage the edge of the wafer.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a semiconductor two-sided burnishing device.

In order to achieve the above object, the present invention provides a semiconductor double-side polishing apparatus, comprising:

an upper grinding disc;

the top surface of the lower grinding disc is provided with a plurality of first accommodating grooves with upward notches, and the first accommodating grooves are arranged at intervals;

the sheet lifting part comprises first supporting strips which are opposite to the first accommodating grooves in number and correspond to the first accommodating grooves one by one, and a plurality of first supporting strips jointly form supporting positions for placing wafers;

the first lifting mechanism is connected with the upper grinding disc and used for lifting the upper grinding disc;

the second lifting mechanism is connected with the piece lifting component and used for lifting the piece lifting component;

the controller is electrically connected with the upper grinding disc, the lower grinding disc, the first lifting mechanism and the second lifting mechanism;

the sheet lifting part can reach a first state and a second state, when the sheet lifting part is in the first state, the first supporting strip is located in the first accommodating groove, when the sheet lifting part is in the second state, the first supporting strip is located outside the first accommodating groove, and the supporting position is located above the top surface of the lower grinding disc.

In some embodiments of the present application, a distance between any adjacent two of the first receiving grooves is 8 to 14mm.

In some embodiments of the present application, the plurality of first receiving grooves are uniformly arranged along the first direction.

In some embodiments of this application, first holding tank is the annular, just first holding tank with the lower mill sets up with the axle center, from the axle center of lower mill to its marginal arrangement arrange the internal diameter of first holding tank increases in proper order.

In some embodiments of the present application, a plurality of second receiving grooves with upward notches are formed in the top surface of the lower grinding disc, the plurality of second receiving grooves are arranged at intervals and are uniformly arranged along a second direction, and the second receiving grooves and the first receiving grooves are arranged in a staggered manner and are communicated with each other;

the sheet lifting part comprises second supporting strips which are opposite to the second accommodating grooves in number and correspond to the second accommodating grooves one to one, the second supporting strips and the first supporting strips are arranged in a staggered mode and are connected with each other, and the supporting positions are formed by the first supporting strips and the second supporting strips;

when the piece-lifting part is in the first state, the second supporting strip is located in the second accommodating groove, and when the piece-lifting part is in the second state, the second supporting strip is located outside the second accommodating groove.

In some embodiments of the present application, the support ring is disposed on the first support bar and the second support bar, and the support ring is sleeved outside the lower grinding disc.

In some embodiments of the present application, the present invention further includes a wafer rotating mechanism, the wafer rotating mechanism includes a rotation driving device, a gear shaft, a rotating frame and a gear ring, the gear shaft is disposed at a central axis of the lower grinding disc, an inner wall of the gear ring has an inner tooth portion, an avoiding space is formed between the gear ring and an outer peripheral wall of the lower grinding disc, and the supporting ring and the second lifting mechanism are disposed in the avoiding space;

the rotating frame is arranged above the first accommodating groove and is provided with an external tooth part, the rotating frame is meshed with the gear shaft and the gear ring, and the rotating frame is provided with a plurality of placing holes for placing the wafers;

the rotary driving device is used for driving the gear shaft to rotate, the rotating direction of the gear shaft is opposite to that of the lower grinding disc, or,

the rotary driving device is used for driving the gear ring to rotate, and the rotating direction of the gear ring is opposite to that of the lower grinding disc.

In some embodiments of the present application, the second lifting mechanism includes a lifting cylinder and a lifting rod, the lifting cylinder is used for driving the lifting rod to extend into the space avoiding portion, and pushes the support ring.

In some embodiments of the application, the grinding wheel further comprises a spraying part, the spraying part comprises a spraying pipe and a control valve for controlling the opening and closing of the spraying pipe, the spraying pipe is provided with a first spraying port and a second spraying port, the first spraying port and the second spraying port are arranged up and down and are both positioned above the top surface of the lower grinding disc, the first spraying port is obliquely arranged towards the lower part, and the second spraying port is obliquely arranged towards the upper part;

the control valve is electrically connected with the controller.

The utility model provides a two-sided burnishing device of semiconductor, compared with the prior art, its beneficial effect lies in:

the utility model provides a semiconductor double-sided polishing device comprises an upper grinding disc, a lower grinding disc, a piece lifting part, a first lifting mechanism, a second lifting mechanism and a controller, wherein the upper grinding disc and the lower grinding disc are arranged oppositely, the top surface of the lower grinding disc is provided with a first accommodating groove with a plurality of notches upward, the first accommodating grooves are arranged at intervals, the piece lifting part comprises first supporting strips which are opposite to the first accommodating grooves in quantity and correspond to the first accommodating grooves in one-to-one manner, the first supporting strips jointly form supporting positions for placing wafers, the first lifting mechanism is connected with the upper grinding disc and used for lifting the upper grinding disc, the second lifting mechanism is connected with the piece lifting part and used for lifting the piece lifting part, and the controller is electrically connected with the upper grinding disc, the lower grinding disc, the first lifting mechanism and the second lifting mechanism; the sheet lifting part can reach a first state and a second state, when the sheet lifting part is in the first state, the first supporting strip is located in the first accommodating groove, when the sheet lifting part is in the second state, the first supporting strip is located outside the first accommodating groove, and the supporting position is located above the top surface of the lower grinding disc. Based on above-mentioned structure, when needs are polished to the wafer, it is in first state to play the piece part, first bracing piece is located first holding tank and rotates along with lower mill, can not influence the lower surface polishing of wafer, when needs carry out the lifting to the wafer and wash, a plurality of first bracing pieces of second elevating system drive rise in step, thereby it rises to the cleaning position to drive the wafer that is located the support position, because there is the clearance between a plurality of first bracing pieces this moment, can not influence washing of wafer lower surface, thereby need not to wash the wafer lower surface alone again, can wash the upper surface and the lower surface of wafer simultaneously, high flushing efficiency, avoid machinery class damage, the yield of wafer has been improved.

Drawings

Fig. 1 is a schematic view of a split structure of a semiconductor double-side polishing apparatus according to an embodiment of the present invention;

FIG. 2 is a partial schematic view of region A of FIG. 1;

fig. 3 is a schematic top view of a semiconductor double-side polishing apparatus according to an embodiment of the present invention;

FIG. 4 isbase:Sub>A schematic partial cross-sectional view taken along A-A of FIG. 3;

FIG. 5 is a schematic top view of a blade raising member according to an embodiment of the present invention;

FIG. 6 is a top schematic view of a slice initiating member according to another embodiment of the present invention;

fig. 7 is a schematic structural diagram of a semiconductor double-side polishing apparatus according to an embodiment of the present invention.

In the figure: 1. an upper grinding disc; 2. a lower grinding disc; 21. a first accommodating groove; 22. a second accommodating groove; 3. a sheet raising member; 31. a first support bar; 32. a second supporting strip; 33. a support ring; 331. positioning the boss; 4. a first lifting mechanism; 5. a second lifting mechanism; 51. a lifting cylinder; 511. a cylinder body; 512. a telescopic air bag; 513. abutting against the plate; 514. a return spring; 6. a controller; 71. a rotation driving device; 72. a gear shaft; 73. a rotating frame; 731. placing holes; 74. a gear ring; 741. a connecting wall; 8. a spray component; 81. a first spray port; 82. a second spray port; 83. a control valve; 9. a first driving device; 10. a second driving device; 100. a support position; 200. avoiding vacant positions; 300. and (5) a wafer.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

It will be understood that in the description of the present application, the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application. The terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, i.e. a feature defined as "first", "second" may explicitly or implicitly include one or more of such features. Further, unless otherwise specified, "a plurality" means two or more.

It should be noted that, in the description of the present application, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

As shown in fig. 1, an embodiment of the present invention provides a semiconductor double-side polishing apparatus, which includes an upper millstone 1, a lower millstone 2, a piece-lifting component 3, a first lifting mechanism 4, a second lifting mechanism 5 and a controller 6, wherein the upper millstone 1 and the lower millstone 2 are oppositely disposed, the top surface of the lower millstone 2 is provided with a plurality of first accommodating grooves 21 with upward notches, the plurality of first accommodating grooves 21 are alternately disposed, the piece-lifting component 3 includes first supporting bars 31 which are opposite to the first accommodating grooves 21 in number and are in one-to-one correspondence, the plurality of first supporting bars 31 jointly form supporting positions 100 for placing a wafer 300, the first lifting mechanism 4 is connected with the upper millstone 1 for lifting the upper millstone 1, the second lifting mechanism 5 is connected with the piece-lifting component 3 for lifting the piece-lifting component 3, the controller 6 is electrically connected with the upper millstone 1, the lower millstone 2, the first lifting mechanism 4 and the second lifting mechanism 5, specifically, the controller 6 is electrically connected with a first driving device 9 for controlling the rotation of the upper millstone 1, and the controller 6 is electrically connected with a second driving device 10 for controlling the rotation of the lower millstone 2; the sheet-lifting member 3 can reach a first state and a second state, when the sheet-lifting member 3 is in the first state, the first supporting bar 31 is located in the first receiving groove 21, when the sheet-lifting member 3 is in the second state, the first supporting bar 31 is located outside the first receiving groove 21, and the supporting position 100 is located above the top surface of the lower grinding disc 2. Specifically, the first support bar 31 may be a rod-shaped body, a strip-shaped body, a filament-shaped body, or a linear body having a small diameter, such as a steel wire, a thin rod, a string, a mesh wire, or the like.

Based on the structure, when 300 wafers are required to be polished, the piece lifting part 3 is in the first state, the first supporting strips 31 are located in the first accommodating groove 21 and rotate along with the lower grinding disc 2, polishing of the lower surfaces of the 300 wafers is not affected, when the 300 wafers are required to be lifted and cleaned, the second lifting mechanism 5 drives the first supporting strips 31 to ascend synchronously, so that the 300 wafers on the supporting positions 100 are driven to ascend to the cleaning positions, at the moment, because gaps exist among the first supporting strips 31, flushing of the lower surfaces of the 300 wafers is not affected, so that the lower surfaces of the 300 wafers do not need to be flushed independently, the upper surfaces and the lower surfaces of the 300 wafers can be flushed simultaneously, the flushing efficiency is high, mechanical damage is avoided, and the yield of the wafers 300 is improved.

Alternatively, as shown in fig. 1, in the present embodiment, the distance between any two adjacent first accommodation grooves 21 is 8 to 14mm. In this regard, support can be provided for the major gauge size wafers 300 on the market.

Alternatively, as shown in fig. 1, in the present embodiment, the plurality of first receiving grooves 21 are uniformly arranged along the first direction. The first direction may be any direction, and may also be the circumferential direction or the radial direction of the lower grinding disc 2, as long as the distance between any two adjacent first receiving grooves 21 does not exceed 15mm at most.

Alternatively, in another embodiment, the first receiving groove 21 is annular, and the first receiving groove 21 is coaxially disposed with the lower grinding disc 2, and the inner diameters of the first receiving grooves 21 arranged from the axial center of the lower grinding disc 2 to the edge thereof increase in sequence.

Optionally, as shown in fig. 1, in the present embodiment, the top surface of the lower grinding disc 2 is provided with a plurality of second receiving grooves 22 with upward notches, the plurality of second receiving grooves 22 are arranged at intervals, and the second receiving grooves 22 and the first receiving grooves 21 are arranged in a staggered manner and are communicated with each other;

the sheet lifting part 3 comprises second supporting strips 32 which are opposite to the second accommodating grooves 22 in number and correspond to each other one by one, the second supporting strips 32 and the first supporting strips 31 are arranged in a staggered mode and are connected with each other, and a supporting position 100 is formed by the first supporting strips 31 and the second supporting strips 32 together;

when the sheet raising member 3 is in the first state, the second supporting bar 32 is located in the second receiving groove 22, and when the sheet raising member 3 is in the second state, the second supporting bar 32 is located outside the second receiving groove 22. Based on this, the first supporting strip 31 and the second supporting strip 32 form a net-shaped supporting position 100, so as to ensure that enough support can be provided for the wafer 300 at any position on the lower grinding disc 2; in addition, when the sheet lifting member 3 is in the first state, the first supporting bars 31 and the second supporting bars 32 are both located in the grooves, and the polishing of the wafer 300 is not affected.

Optionally, as shown in fig. 1, in the present embodiment, the sheet lifting member 3 further includes a support ring 33, the first support bar 31 and the second support bar 32 are both disposed on the support ring 33, and the support ring 33 is sleeved outside the lower grinding disc 2. The arrangement is convenient for the connection and installation of the first supporting strips 31 and the second supporting strips 32 on the one hand, and is convenient for the second lifting mechanism 5 to lift the wafer 300 by lifting the supporting ring 33 on the other hand; in addition, the support ring 33 is sleeved outside the lower grinding disc 2, so as to play a role in assisting positioning and fixing, and prevent the first support bar 31 and the second support bar 32 from loosening. Of course, the support ring 33 may not be provided, the first support bar 31 and the second support bar 32 may be directly fixedly connected by welding or the like, and the second lifting mechanism 5 may directly lift the first support bar 31 and the second support bar 32.

Alternatively, the wafer 300 generally needs to be disposed in a placement position of the support to ensure that no slippage occurs during the polishing process, and in order to further optimize the polishing effect, as shown in fig. 1, in the present embodiment, the semiconductor polishing apparatus further includes a wafer 300 rotating mechanism, the wafer 300 rotating mechanism includes a rotating driving device 71, a gear shaft 72, a rotating frame 73 and a gear ring 74, the gear shaft 72 is disposed at the central axis of the lower grinding disc 2, it should be understood that there is a predetermined gap between the gear shaft 72 and the lower grinding disc 2, and the sheet lifting member 3 has a through hole for the gear shaft 72 to pass through; the inner wall of the gear ring 74 is provided with an inner tooth part, a clearance space 200 is formed between the gear ring 74 and the outer peripheral wall of the lower grinding disc 2, and a support ring 33 and a second lifting mechanism 5 are arranged in the clearance space 200;

the rotary rack 73 is disposed above the first receiving groove 21, the rotary rack 73 has an outer toothed portion, the rotary rack 73 is engaged with both the gear shaft 72 and the gear ring 74, the rotary rack 73 has a plurality of placing holes 731, the placing holes 731 are used for placing the wafer 300, the rotary driving device 71 is used for driving the gear shaft 72 to rotate, and the rotation direction of the gear shaft 72 is opposite to the rotation direction of the lower millstone 2. Preferably, the rotating frame 73 is provided in a plurality, and the plurality of rotating frames 73 are distributed along the circumferential direction of the gear shaft 72. Based on this, the wafer 300 is placed in the placing position to ensure the working position during the polishing process, and the rotating frame 73 is arranged between the gear shaft 72 and the gear ring 74 and can rotate around the gear shaft 72, so that the wafer 300 rotates around the gear shaft 72 during the polishing process, and the polishing effect is further optimized. Of course, the rotary drive 71 may be used to drive the gear ring 74 to rotate, and the rotation direction of the gear ring 74 is opposite to the rotation direction of the lower grinding disc 2.

Alternatively, considering that the lower grinding disc 2, the gear shaft 72 or the gear ring 74 are all rotating components, the lifting of the support ring 33 needs to be realized in a way that the lifting does not interfere with the operation of the lower grinding disc 2, the gear shaft 72 or the gear ring 74, as shown in fig. 1, in the present embodiment, the second lifting mechanism 5 comprises a lifting cylinder 51 and a lifting rod, and the lifting cylinder 51 is used for driving the lifting rod to extend into the clearance 200 and push the support ring 33. Specifically, the second lifting mechanism 5 includes a lifting component for lifting the gear ring 74, which may be a worm gear, a cylinder push rod, a mechanical clamping arm, or other components capable of lifting, the lifting component is electrically connected to the controller 6, a connecting wall 741 is disposed at the bottom of the gear ring 74, the connecting wall 741 has a connecting hole, the lifting cylinders 51 are disposed in plural and distributed along the axial direction of the lower grinding disc 2, the lifting cylinders 51 include a cylinder body 511 and a telescopic air bag 512 connected to the cylinder body 511, the cylinder body 511 is fixedly connected to the connecting wall 741 and extends into the gear ring 74 through the connecting hole, the lifting rod is slidably disposed in the cylinder body 511 and extends into the avoiding space 200 to push the support ring 33; the air bag is located outside the bottom of the connecting wall 741 and is communicated with the cylinder body 511, the bottom of the air bag is provided with a butt plate 513, and the butt plate 513 is used for butting against the ground or a supporting platform. The outer cover of the air bag is provided with a return spring 514, one end of the return spring 514 is connected with the connecting wall 741, and the other end of the return spring 514 is connected with the abutting plate 513 and used for applying downward elastic force to the abutting plate 513 so that the abutting plate 513 drives the air bag to inflate and reset. Based on this, the second lifting mechanism 5 of the semiconductor polishing device does not need an external air pipe, and does not interfere with the operation of the lower grinding disc 2, the gear shaft 72 or the gear ring 74, in the polishing process, the lifting cylinder 51 and the lifting rod can rotate along with the gear ring 74, and the rotation of the lower grinding disc 2, the gear shaft 72 or the gear ring 74 can not be influenced, after the polishing is finished, the lifting component controls the gear ring 74 to descend, and extrudes the telescopic airbag 512 and the abutting plate 513, the abutting plate 513 abuts against the ground or the supporting platform, so that the telescopic airbag 512 is compressed, the pressure in the cylinder 511 is increased, and the lifting rod is pushed to ascend and pushes the supporting ring 33, so that the sheet lifting component 3 reaches the second state, and the top surface and the ground of the wafer 300 can be conveniently washed; after the flushing is finished, the lifting component controls the gear ring 74 to ascend, so that the abutting plate 513 is separated from the ground or the supporting platform, at this time, the return spring 514 pushes the abutting plate 513, so that the telescopic airbag 512 is stretched and inflated and is reset, the pressure in the cylinder 511 is reduced, the lifting rod is pushed to descend, and the sheet lifting component 3 is enabled to reach the first state. Because the diameter of the support ring 33 is close to that of the lower grinding disc 2, the two are attached to each other, which may cause the problem of accuracy in pushing, preferably, the outer wall of the support ring 33 is provided with an annular positioning boss 331 protruding outward, the outer diameter of the annular positioning boss 331 is smaller than the inner diameter of the gear ring 74, and the lifting rod is abutted against the bottom surface of the annular positioning boss 331 in the processes of ascending and descending, so that pushing is more accurate.

Alternatively, as shown in fig. 1, in the present embodiment, the semiconductor polishing apparatus further includes a shower part 8, the shower part 8 includes a shower pipe and a control valve 83 for controlling the opening and closing of the shower pipe, the shower pipe has a first shower port 81 and a second shower port 82, the first shower port 81 and the second shower port 82 are disposed above and below the top surface of the lower grinding disc 2, the first shower port 81 is disposed to be inclined downward, the second shower port 82 is disposed to be inclined upward, and the control valve 83 is electrically connected to the controller 6. Based on this, the first spray port 81 can rinse the top surface of the wafer 300, and the second spray port 82 can rinse the bottom surface of the wafer 300, thereby achieving simultaneous rinsing of the top surface and the bottom surface of the wafer 300.

To sum up, the embodiment of the present invention provides a semiconductor double-side polishing device, which mainly comprises an upper millstone 1, a lower millstone 2, a piece lifting component 3, a first lifting mechanism 4, a second lifting mechanism 5 and a controller 6, wherein the upper millstone 1 and the lower millstone 2 are arranged oppositely, the top surface of the lower millstone 2 is provided with a first accommodating tank 21 with a plurality of upward notches, the first accommodating tanks 21 are arranged at intervals, the piece lifting component 3 comprises first supporting strips 31 which are opposite to the first accommodating tanks 21 in number and are in one-to-one correspondence, the first supporting strips 31 are jointly formed with a supporting position 100 for placing a wafer 300, the first lifting mechanism 4 is connected with the upper millstone 1 for lifting the upper millstone 1, the second lifting mechanism 5 is connected with the piece lifting component 3 for lifting the piece lifting component 3, and the controller 6 is electrically connected with the upper millstone 1, the lower millstone 2, the first lifting mechanism 4 and the second lifting mechanism 5; the sheet-lifting member 3 can reach a first state and a second state, when the sheet-lifting member 3 is in the first state, the first supporting bar 31 is located in the first accommodating groove 21, when the sheet-lifting member 3 is in the second state, the first supporting bar 31 is located outside the first accommodating groove 21, and the supporting position 100 is located above the top surface of the lower grinding disc 2. Compared with the prior art, the semiconductor double-side polishing device has the advantages of good polishing effect, high washing efficiency, high wafer yield and the like.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be considered as the protection scope of the present invention.

Claims (10)

1. A semiconductor double-side polishing apparatus, comprising:

an upper grinding disc;

the upper grinding disc and the lower grinding disc are oppositely arranged, a plurality of first accommodating grooves with upward notches are formed in the top surface of the lower grinding disc, and the first accommodating grooves are arranged at intervals;

the sheet lifting part comprises first supporting strips which are opposite to the first accommodating grooves in number and correspond to the first accommodating grooves one by one, and a plurality of first supporting strips jointly form supporting positions for placing wafers;

the first lifting mechanism is connected with the upper grinding disc and used for lifting the upper grinding disc;

the second lifting mechanism is connected with the piece lifting component and used for lifting the piece lifting component;

the controller is electrically connected with the upper grinding disc, the lower grinding disc, the first lifting mechanism and the second lifting mechanism;

the sheet lifting part can reach a first state and a second state, when the sheet lifting part is in the first state, the first supporting strip is located in the first accommodating groove, when the sheet lifting part is in the second state, the first supporting strip is located outside the first accommodating groove, and the supporting position is located above the top surface of the lower grinding disc.

2. A semiconductor double-side polishing apparatus according to claim 1, wherein:

the distance between any two adjacent first accommodating grooves is 8-14mm.

3. A semiconductor double-side polishing apparatus as claimed in claim 2, wherein:

the first accommodating grooves are arranged along a first direction.

4. A semiconductor double-side polishing apparatus according to claim 2, wherein:

the first holding tank is annular, just first holding tank with the lower mill sets up with the axle center, certainly the axle center of lower mill to its marginal arrangement arrange the internal diameter of first holding tank increases gradually.

5. A semiconductor double-side polishing apparatus according to claim 3 or 4, wherein:

the top surface of the lower grinding disc is provided with a plurality of second accommodating grooves with upward notches, the plurality of second accommodating grooves are arranged at intervals and along a second direction, and the second accommodating grooves and the first accommodating grooves are arranged in a staggered mode and communicated with each other;

the sheet lifting parts comprise second supporting strips which are opposite to the second accommodating grooves in number and correspond to the second accommodating grooves one to one, the second supporting strips and the first supporting strips are arranged in a staggered mode and connected with each other, and the supporting positions are formed by the first supporting strips and the second supporting strips together;

when the piece-lifting part is in the first state, the second supporting strip is located in the second accommodating groove, and when the piece-lifting part is in the second state, the second supporting strip is located outside the second accommodating groove.

6. A semiconductor double-side polishing apparatus as set forth in claim 5, wherein:

the piece-lifting part further comprises a support ring, the first support bar and the second support bar are arranged on the support ring, the support ring is sleeved outside the lower grinding disc, and the second lifting mechanism is used for pushing the support ring.

7. A semiconductor double-side polishing apparatus as claimed in claim 6, wherein:

the wafer rotating mechanism comprises a rotating driving device, a gear shaft, a rotating frame and a gear ring, the gear shaft is arranged at the central axis of the lower grinding disc, the inner wall of the gear ring is provided with an inner tooth part, a clearance avoiding position is formed between the gear ring and the outer peripheral wall of the lower grinding disc, and the support ring and the second lifting mechanism are arranged in the clearance avoiding position;

the rotating frame is arranged above the first accommodating groove, the rotating frame is provided with an external tooth part, the rotating frame is meshed with the gear shaft and the gear ring, and the rotating frame is provided with a plurality of placing holes for placing the wafers;

the rotary driving device is used for driving the gear shaft to rotate, the rotating direction of the gear shaft is opposite to that of the lower grinding disc, or,

the rotary driving device is used for driving the gear ring to rotate, and the rotating direction of the gear ring is opposite to that of the lower grinding disc.

8. A semiconductor double-side polishing apparatus according to claim 7, wherein:

the second lifting mechanism comprises a lifting cylinder and a lifting rod, the lifting cylinder is used for driving the lifting rod to extend into the vacancy avoiding position and push the support ring.

9. A semiconductor double-side polishing apparatus as set forth in claim 8, wherein:

the outer wall of support ring is equipped with outside convex annular location boss, the external diameter of location boss is less than the internal diameter of gear ring, the location boss is used for supplying the lifter top pushes away.

10. A semiconductor double-side polishing apparatus according to claim 1, wherein:

the spraying part comprises a spraying pipe and a control valve for controlling the spraying pipe to open and close, the spraying pipe is provided with a first spraying port and a second spraying port, the first spraying port and the second spraying port are arranged up and down and are both positioned above the top surface of the lower grinding disc, the first spraying port is obliquely arranged towards the lower part, and the second spraying port is obliquely arranged towards the upper part;

the control valve is electrically connected with the controller.

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