CN221057376U - Brushing device for wafer - Google Patents
Brushing device for wafer Download PDFInfo
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- CN221057376U CN221057376U CN202323075544.8U CN202323075544U CN221057376U CN 221057376 U CN221057376 U CN 221057376U CN 202323075544 U CN202323075544 U CN 202323075544U CN 221057376 U CN221057376 U CN 221057376U
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- wafer
- hundred
- brushing device
- support
- motor
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- 230000001680 brushing effect Effects 0.000 title claims abstract description 44
- 239000004744 fabric Substances 0.000 claims abstract description 47
- 238000004140 cleaning Methods 0.000 claims abstract description 44
- 239000011324 bead Substances 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 235000012431 wafers Nutrition 0.000 claims description 88
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 37
- 238000001125 extrusion Methods 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model relates to the field of semiconductor manufacturing, in particular to a brushing device for a wafer, and provides a brushing device for the wafer, wherein the edge of a brush head is not easy to deviate, and the brushing effect is not affected. The brushing device comprises a support and a plurality of sliding rods arranged on the support, wherein sliding blocks are connected between the sliding rods in a sliding mode, a first motor is arranged on the sliding blocks, and a first mounting plate is connected to an output shaft of the first motor. The first metal beads are arranged in the first hundred-level cleaning cloth in a filling manner, so that the first metal beads are not easy to deform in the long-time brushing process, the brush head formed by the first hundred-level cleaning cloth and the first metal beads is not easy to deform, the edge of the brush head cannot deviate, the brushing effect is not affected, and the brushing operation is more stable and comprehensive.
Description
Technical Field
The utility model relates to the field of semiconductor manufacturing, in particular to a brushing device for a wafer.
Background
The wafer is used as a main raw material of the LED, the surface cleanliness requirement is high, and if the residual dirt particles are too much, the qualification rate of the next chip manufacture can be seriously affected.
At present, in the manufacturing process of wafers, unnecessary residues left on the surfaces of the wafers during the processing process must be cleaned, and the rotation action of the cleaning brush and the pressure applied by the cleaning brush to the wafers are generally utilized to help remove the residual slurry from the surfaces of the wafers, but the conventional cleaning brush is usually a sponge brush head, and the edge position of the sponge brush head is increased during the brushing process, so that the brushing effect is affected.
Disclosure of utility model
Accordingly, the utility model aims to provide a wafer brushing device which is not easy to deviate at the edge of a brush head and does not influence the brushing effect.
The utility model provides a brushing device for wafer, is in including support and setting a plurality of slide bars on the support, sliding connection has the slider between the slide bar, be provided with first motor on the slider, be connected with first mounting panel on the output shaft of first motor, be provided with first hundred grades of clean cloth on the first mounting panel, first mounting panel with form first cavity between the clean cloth of first hundred grades, be provided with a plurality of first metal beads in the first cavity, first metal bead is full of in the first cavity, be provided with the roating seat on the support, the rotation is provided with vacuum chuck on the roating seat, vacuum chuck is located the below of the clean cloth of first hundred grades.
Further, the brushing device further comprises a driving mechanism, the driving mechanism comprises a first support arranged on the support and an electric push rod arranged on the first support, and a movable shaft of the electric push rod is connected with the sliding block.
Further, brushing device still includes bottom grinding machanism, bottom grinding machanism is including setting up the second motor on the slider, be provided with the second mounting panel on the output shaft of second motor, be provided with the clean cloth of second hundred grades on the second mounting panel, the clean cloth of second hundred grades with form the second cavity between the second mounting panel, be provided with a plurality of second metal beads in the second cavity, the second metal bead is full of in the second cavity, the clean cloth of second hundred grades is located the below of the clean cloth of first hundred grades.
Further, brushing device still includes wiper mechanism, wiper mechanism is including setting up second support and the setting on the slider are in water pump on the second support, be provided with the inlet tube that is used for external water source water pipe on the water pump, still set up two outlet pipes on the water pump, be connected with on the outlet pipe and be used for the abluent drain pipe to wafer positive and negative.
Further, the brushing device further comprises a centering mechanism, the centering mechanism comprises two third brackets symmetrically arranged on the support and a centering piece which is arranged on the third brackets in a sliding mode and is used for enabling the wafer and the vacuum chuck to be in the same axis, and a spring is arranged between the centering piece and the third brackets.
Further, brushing device still includes extrusion mechanism, extrusion mechanism is including two carriage that are in symmetry sets up on the slider, be provided with the extrusion piece on the carriage, be provided with the contact post on the centering piece, the contact post with close extrusion cooperation of extrusion piece.
Further, the brushing device further comprises a rotating mechanism, the rotating mechanism comprises a first gear arranged on an output shaft of the second motor and a second gear arranged on the vacuum chuck, the first gear is located below the second mounting plate, and the second gear is meshed with the first gear.
Further, a rubber pad is arranged on one side, close to the vacuum chuck, of the centering piece.
According to the wafer brushing device provided by the utility model, the first metal beads are fully arranged in the first hundred-grade cleaning cloth, so that the first metal beads are not easy to deform in the long-time brushing process, the brush head formed by the first hundred-grade cleaning cloth and the first metal beads is not easy to deform, the edge of the brush head is not offset, the brushing effect is not influenced, and the more stable and comprehensive brushing operation is realized.
The brush head composed of the first hundred-grade cleaning cloth and the first metal beads is arranged on the top surface of the wafer, and the brush head composed of the second hundred-grade cleaning cloth and the second metal beads is also arranged on the bottom surface of the wafer, so that the front surface and the back surface of the wafer are brushed simultaneously, and the working efficiency is improved.
Drawings
Fig. 1 is a schematic perspective view of the present utility model.
Fig. 2 is a schematic view of a partial perspective structure of the present utility model.
FIG. 3 is a schematic perspective view of the first hundred-grade cleaning cloth and the first metal beads of the present utility model.
Fig. 4 is a schematic perspective view of the driving mechanism of the present utility model.
Fig. 5 is a schematic perspective view of the bottom polishing mechanism of the present utility model.
Fig. 6 is a schematic view of a part of a bottom grinding mechanism according to the utility model.
Fig. 7 is a schematic perspective view of a cleaning mechanism according to the present utility model.
Fig. 8 is a schematic perspective view of the centering mechanism of the present utility model.
Fig. 9 is a schematic perspective view of the pressing mechanism of the present utility model.
Fig. 10 is a schematic perspective view of a rotary mechanism according to the present utility model.
Description of main reference numerals:
1. The cleaning device comprises a support, 2, a sliding rod, 3, a sliding block, 4, a first motor, 5, a first mounting plate, 6, a first hundred-grade cleaning cloth, 7, a rotating seat, 8, a vacuum chuck, 9, a wafer, 10, a first metal bead, 11, a driving mechanism, 111, a first support, 112, an electric push rod, 12, a bottom polishing mechanism, 121, a second motor, 122, a second mounting plate, 123, a second hundred-grade cleaning cloth, 124, a second metal bead, 13, a cleaning mechanism, 131, a second support, 132, a water pump, 133, a water outlet pipe, 134, a drain pipe, 135, a water inlet pipe, 14, a centering mechanism, 141, a third support, 142, a centering member, 143, a spring, 15, an extrusion mechanism, 151, a sliding frame, 152, an extrusion member 153, a contact column, 16, a rotating mechanism, 161, a first gear, 162, a second gear, 17 and a rubber pad.
The utility model will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
1-3, Including support 1 and two slide bars 2 of welding on the support 1, two slide bars 2 are the symmetry and are equipped with, be connected with slider 3 between the slide bar 2, be connected with first motor 4 through the bolted connection on the slider 3, be connected with first mounting panel 5 on the output shaft of first motor 4, be provided with first hundred grades of clean cloth 6 on the first mounting panel 5, first mounting panel 5 with form first cavity between the clean cloth 6 of first hundred grades, be provided with a plurality of first metal beads in the first cavity, first metal bead is full of in the first cavity, be connected with roating seat 7 through the bolt on the support 1, the rotation is provided with vacuum chuck 8 on the roating seat 7, vacuum chuck 8 is located the below of clean cloth 6 of first hundred grades.
When an operator needs to brush the wafer 9, the operator can place the wafer 9 on the vacuum chuck 8, so that the axis of the wafer 9 is at the same position as the axis of the vacuum chuck 8, then the vacuum chuck 8 is started to enable the vacuum chuck 8 to suck the wafer 9, then the sliding block 3 is slid to enable the sliding block 3 to move towards the wafer 9, the first motor 4, the first mounting plate 5, the first hundred-grade cleaning cloth 6 and the first metal beads 10 are driven to move towards the position close to the vacuum chuck 8 when the sliding block 3 moves, when the bottom surface of the first hundred-grade cleaning cloth 6 moves to be fully contacted with the wafer 9, the operator can stop moving the sliding block 3, then the first motor 4 is started, the output shaft of the first motor 4 rotates, the first mounting plate 5 is driven to rotate by the rotation of the output shaft of the first motor 4, the first mounting plate 5 is driven to rotate the first hundred-grade cleaning cloth 6 and the first metal beads 10, the first hundred-grade cleaning cloth 6 and the first metal beads 10 are used for rotating to brush the wafer 9, when the position close to the first hundred-grade cleaning cloth 6 is brushed, an operator can rotate the vacuum chuck 8, the rotation of the vacuum chuck 8 drives the wafer 9 to rotate, so that the upper surface of the wafer 9 can be brushed comprehensively, after the brushing is finished, the operator firstly closes the first motor 4, the first motor 4 closes the first mounting plate 5, the first hundred-grade cleaning cloth 6 and the first metal beads 10, then the operator can slide the sliding block 3 to move to the position far away from the wafer 9, so that the first hundred-grade cleaning cloth 6 is not contacted with the wafer 9 any more, the next work can be conveniently carried out, the wafer 9 to be brushed is placed on the vacuum chuck 8, then the vacuum chuck 8 is closed, the brushed wafer 9 is taken out,
It can be seen that the first metal beads 10 are fully arranged in the first hundred-grade cleaning cloth 6, so that the shape formed by the first hundred-grade cleaning cloth 6 and the first metal beads 10 is not deformed and the edge is not offset in the long-time brushing process, the brushing effect is not affected, and the more stable and comprehensive brushing operation is realized.
As shown in fig. 4, the device further comprises a driving mechanism 11, the driving mechanism 11 comprises a first bracket 111 welded on the support 1 and an electric push rod 112 connected on the first bracket 111 through a bolt, and a movable shaft of the electric push rod 112 is connected with the sliding block 3.
When the wafer 9 needs to be brushed to move the sliding block 3, an operator can start the electric push rod 112, an output shaft of the electric push rod 112 stretches, the output shaft of the electric push rod 112 stretches to drive the sliding block 3 to move to a position close to the wafer 9, when the electric push rod 112 is closed to be in a static state when the electric push rod 112 moves to a position far away from the wafer 9 after the brushing is finished, the operator can start the electric push rod 112 to retract the output shaft of the electric push rod 112, the output shaft of the electric push rod 112 retracts to drive the sliding block 3 to move to a direction far away from the wafer 9, and after the sliding block 3 moves to enable the first hundred-grade cleaning cloth 6 not to be contacted with the wafer 9, the operator can close the electric push rod 112 to be in the static state.
It can be seen that by providing the electric push rod 112, the sliding block 3 can be pushed to move without manual operation, thereby saving manpower and increasing the working efficiency.
As shown in fig. 5 and 6, the polishing device further comprises a bottom polishing mechanism 12, the bottom polishing mechanism 12 comprises a second motor 121 connected to the slider 3 through a bolt, a second mounting plate 122 is arranged on an output shaft of the second motor 121, a second hundred-grade cleaning cloth 123 is arranged on the second mounting plate 122, a second cavity is formed between the second hundred-grade cleaning cloth 123 and the second mounting plate 122, a plurality of second metal beads 124 are arranged in the second cavity, the second metal beads 124 are filled in the second cavity, and the second hundred-grade cleaning cloth 123 is located below the first hundred-grade cleaning cloth 6.
When the bottom surface of the wafer 9 needs to be brushed, firstly, the electric push rod 112 is started, the output shaft of the electric push rod 112 drives the sliding block 3 to move towards a position close to the wafer 9, the sliding block 3 moves to drive the bottom polishing mechanism 12 to move towards a position close to the wafer 9, after the top surface of the second hundred-grade cleaning cloth 123 is fully contacted with the wafer 9, an operator can close the electric push rod 112, then the second motor 121 is started, the output shaft of the second motor 121 rotates to drive the second mounting plate 122, the second hundred-grade cleaning cloth 123 and the second metal beads 124 to rotate, therefore, the bottom surface of the wafer 9 can be brushed through the rotation of the second hundred-grade cleaning cloth 123 and the second metal beads 124, after the brushing is finished, the operator can close the second motor 121, then the electric push rod 112 is started, the output shaft of the electric push rod 112 retracts to drive the sliding block 3 to move and reset in a direction away from the wafer 9, and the sliding block 3 moves in a direction away from the wafer 9, so that the second hundred-grade cleaning cloth 123 is not contacted with the wafer 9, and then the electric push rod 112 is closed.
It can be seen that the second hundred-level cleaning cloth 123 and the second metal beads 124 are rotated by starting the second motor 121, so that the bottom surface of the wafer 9 can be brushed, and thus the front brushing and the bottom surface brushing can be operated together, and the working efficiency is greatly improved.
As shown in fig. 7, the cleaning device further comprises a cleaning mechanism 13, the cleaning mechanism 13 comprises a second bracket 131 welded on the sliding block 3 and a water pump 132 connected to the second bracket 131 through bolts, a water inlet pipe 135 for externally connecting a water source pipe is arranged on the water pump 132, two water outlet pipes 133 are further arranged on the water pump 132, and a water outlet pipe 13 for cleaning the front and back surfaces of the wafer 9 is connected to the water outlet pipes 133.
The water inlet pipe 135 is externally connected with a water source by an operator, the water pump 132 is started when the operator brushes the wafer 9, the water pump 132 pumps the water in the water source into the water outlet pipe 13, the water is sprayed out of the water outlet pipe 13, the water sprayed out of the water outlet pipe 13 is sprayed onto the wafer 9, and the operator turns off the water pump 132 after the brushing is finished.
The cleaning device can be operated at the same position through brushing and spraying, so that the residual water drops are reduced to influence particles, the operation steps are reduced, and the productivity is increased.
As shown in fig. 8, the wafer handling device further comprises a centering mechanism 14, wherein the centering mechanism 14 comprises two third brackets 141 symmetrically arranged on the support 1, a centering piece 142 for enabling the wafer 9 and the vacuum chuck 8 to be in the same axis is slidably arranged on the third brackets 141, and a spring 143 is arranged between the centering piece 142 and the third brackets 141.
The operator can push the two centering pieces 142 to move towards the position far away from the vacuum chuck 8 at the same time, the springs 143 are stretched, then the wafer 9 is placed on the vacuum chuck 8, then the operator can loosen the two centering pieces 142, the springs 143 reset and drive the centering pieces 142 to move towards the position close to the vacuum chuck 8, and the centering pieces 142 move and push the axis of the wafer 9 to coincide with the axis of the vacuum chuck 8.
Therefore, by arranging the centering piece 142, an operator can more conveniently enable the axes of the wafer 9 and the vacuum chuck 8 to coincide, so that stable operation of brushing work is realized, and the phenomenon that some positions of the wafer 9 cannot be brushed due to the fact that the wafer 9 deviates from the axis of the vacuum chuck is prevented.
As shown in fig. 9, the device further comprises a pressing mechanism 15, the pressing mechanism 15 comprises two sliding frames 151 symmetrically arranged on the sliding block 3, pressing members 152 are welded on the sliding frames 151, contact columns 153 are welded on the centering piece 142, and the contact columns 153 are in press fit with the similar pressing members 152.
When the slider 3 moves to a position close to the wafer 9, the slider 151 is driven to move, the slider 151 moves to a position close to the wafer 9, the pressing member 152 is driven to move, the pressing member 152 moves to contact with the contact post 153 to press the contact post 153, the contact post 153 moves to a position far away from the wafer 9, the contact post 153 drives the centering piece 142 to move, the spring 143 is stretched, when the slider 3 moves to a position far away from the wafer 9, the slider 151 is driven to move, the slider 151 moves to be no longer contacted with the contact post 153, and the spring 143 resets to drive the centering piece 142 and the contact post 153 to move to a position close to the wafer 9.
It can be seen that by arranging the cooperation of the pressing member 152 and the contact column 153, the centering member 142 can be close to the wafer 9 when the slider 3 is far away from the wafer 9, and the centering member 142 is far away from the wafer 9 when the slider 3 is close to the wafer 9, that is, when the wafer 9 needs to be brushed, so that the centering member 142 is far away from the wafer 9 when the wafer 9 is brushed, and the wafer 9 can be driven to rotate by an operator more conveniently.
As shown in fig. 10, the vacuum chuck 8 further comprises a rotation mechanism 16, wherein the rotation mechanism 16 comprises a first gear 161 arranged on an output shaft of the second motor 121 and a second gear 162 arranged on the vacuum chuck 8, the first gear 161 is positioned below the second mounting plate 122, and the second gear 162 is meshed with the first gear 161.
When the slide block 3 drives the second motor 121 to move to a position close to the wafer 9, the second motor 121 drives the first gear 161 to move to a position close to the wafer 9, the first gear 161 moves to be meshed with the second gear 162, when an operator starts the second motor 121, the output shaft of the second motor 121 rotates forward to drive the first gear 161 to rotate forward, the first gear 161 rotates forward to drive the second gear 162 to rotate reversely, the second gear 162 rotates reversely to drive the vacuum chuck 8 to rotate reversely, the vacuum chuck 8 rotates reversely to drive the wafer 9 to rotate reversely, so that when the second motor 121 drives the second hundred-stage cleaning cloth 123 to rotate forward to brush the wafer 9, the wafer 9 rotates reversely at the moment,
Through the cooperation of the positive and negative rotation of the wafer 9 and the second hundred-grade cleaning cloth 123, the wafer 9 can be scrubbed more thoroughly, and the wafer 9 does not need to be manually driven to rotate, so that the effect of saving manpower is achieved, and the automatic operation of the device is realized.
As shown in fig. 1, a rubber pad 17 is disposed on a side of the centering member 142 adjacent to the vacuum chuck 8.
When the centering piece 142 moves to a position close to the wafer 9, the rubber pad 17 is driven to move, and the rubber pad 17 is contacted with the wafer 9, so that the rubber pad 17 can protect the wafer 9 and prevent the wafer 9 from being damaged.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (8)
1. A brushing device for wafers, which is characterized in that: including support and setting a plurality of slide bars on the support, sliding connection has the slider between the slide bar, be provided with first motor on the slider, be connected with first mounting panel on the output shaft of first motor, be provided with first hundred grades of clean cloth on the first mounting panel, first mounting panel with form first cavity between the clean cloth of first hundred grades, be provided with a plurality of first metal beads in the first cavity, first metal bead is full of in the first cavity, be provided with the roating seat on the support, the rotation is provided with vacuum chuck on the roating seat, vacuum chuck is located the below of the clean cloth of first hundred grades.
2. The brush unit for wafers as set forth in claim 1, wherein: the brushing device further comprises a driving mechanism, the driving mechanism comprises a first support arranged on the support and an electric push rod arranged on the first support, and a movable shaft of the electric push rod is connected with the sliding block.
3. The brush unit for wafers as set forth in claim 2, wherein: the brushing device further comprises a bottom polishing mechanism, the bottom polishing mechanism comprises a second motor arranged on the sliding block, a second mounting plate is arranged on an output shaft of the second motor, second hundred-grade clean cloth is arranged on the second mounting plate, a second cavity is formed between the second hundred-grade clean cloth and the second mounting plate, a plurality of second metal beads are arranged in the second cavity, the second cavity is filled with the second metal beads, and the second hundred-grade clean cloth is located below the first hundred-grade clean cloth.
4. A brushing device for a wafer as claimed in claim 3, wherein: the brushing device further comprises a cleaning mechanism, the cleaning mechanism comprises a second bracket arranged on the sliding block and a water pump arranged on the second bracket, a water inlet pipe used for externally connecting a water source pipe is arranged on the water pump, two water outlet pipes are further arranged on the water pump, and a water outlet pipe used for cleaning the front side and the back side of the wafer is connected to the water outlet pipe.
5. The brush unit for wafers as set forth in claim 4, wherein: the brushing device further comprises a centering mechanism, the centering mechanism comprises two third brackets symmetrically arranged on the support and a centering piece which is arranged on the third brackets in a sliding mode and used for enabling the wafer and the vacuum chuck to be in the same axis, and a spring is arranged between the centering piece and the third brackets.
6. The brush unit for wafers as set forth in claim 5, wherein: the brushing device further comprises an extrusion mechanism, the extrusion mechanism comprises two sliding frames which are symmetrically arranged on the sliding blocks, an extrusion part is arranged on each sliding frame, a contact column is arranged on the centering piece, and the contact columns are in extrusion fit with the similar extrusion parts.
7. The brush unit for wafers as set forth in claim 6, wherein: the brushing device further comprises a rotating mechanism, the rotating mechanism comprises a first gear arranged on an output shaft of the second motor and a second gear arranged on the vacuum chuck, the first gear is located below the second mounting plate, and the second gear is meshed with the first gear.
8. The brush unit for wafers as set forth in claim 7, wherein: and a rubber pad is arranged on one side of the centering piece, which is close to the vacuum chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323075544.8U CN221057376U (en) | 2023-11-14 | 2023-11-14 | Brushing device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323075544.8U CN221057376U (en) | 2023-11-14 | 2023-11-14 | Brushing device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221057376U true CN221057376U (en) | 2024-05-31 |
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ID=91224226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323075544.8U Active CN221057376U (en) | 2023-11-14 | 2023-11-14 | Brushing device for wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN221057376U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118635163A (en) * | 2024-08-14 | 2024-09-13 | 瑞智(青岛)精密机电有限公司 | A cleaning device for compressor end cover |
-
2023
- 2023-11-14 CN CN202323075544.8U patent/CN221057376U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118635163A (en) * | 2024-08-14 | 2024-09-13 | 瑞智(青岛)精密机电有限公司 | A cleaning device for compressor end cover |
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