CN116533116B - Photovoltaic semiconductor processing device with cleaning and filtering functions - Google Patents
Photovoltaic semiconductor processing device with cleaning and filtering functions Download PDFInfo
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- CN116533116B CN116533116B CN202310468376.4A CN202310468376A CN116533116B CN 116533116 B CN116533116 B CN 116533116B CN 202310468376 A CN202310468376 A CN 202310468376A CN 116533116 B CN116533116 B CN 116533116B
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- balance rod
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- polishing
- shaped filter
- grinding table
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 106
- 238000001914 filtration Methods 0.000 title claims abstract description 17
- 238000004140 cleaning Methods 0.000 title claims abstract description 13
- 238000005498 polishing Methods 0.000 claims abstract description 66
- 235000012431 wafers Nutrition 0.000 claims abstract description 60
- 239000007788 liquid Substances 0.000 claims abstract description 39
- 239000000110 cooling liquid Substances 0.000 claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 230000007306 turnover Effects 0.000 claims abstract description 10
- 238000000227 grinding Methods 0.000 claims description 58
- 230000005540 biological transmission Effects 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 229910003460 diamond Inorganic materials 0.000 claims description 16
- 239000010432 diamond Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- 239000012535 impurity Substances 0.000 description 21
- 239000002826 coolant Substances 0.000 description 10
- 230000018044 dehydration Effects 0.000 description 9
- 238000006297 dehydration reaction Methods 0.000 description 9
- 230000033001 locomotion Effects 0.000 description 8
- 230000009471 action Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 3
- 235000017491 Bambusa tulda Nutrition 0.000 description 3
- 241001330002 Bambuseae Species 0.000 description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 3
- 239000011425 bamboo Substances 0.000 description 3
- 230000001413 cellular effect Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/04—Protective covers for the grinding wheel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a photovoltaic semiconductor processing device with a cleaning and filtering function, and belongs to the technical field of photovoltaic semiconductor processing. The semiconductor wafer polishing machine comprises a clean room and a plurality of semiconductor wafers to be polished, wherein a mechanical arm and a turnover mechanical arm are arranged in the clean room, the turnover mechanical arm performs loading and unloading and turnover on the semiconductor wafers, a polishing mechanism is arranged on the mechanical arm and comprises a polishing cover, the polishing cover is arranged at an execution end of the mechanical arm, an outer sleeve and a dewatering box are arranged in the clean room, a clamping mechanism is arranged in the outer sleeve, a liquid suction pipe is connected between the bottom of the outer sleeve and the dewatering box, a drum-shaped filter cylinder is arranged in the dewatering box, cooling liquid is stored in the dewatering box, the cooling liquid cools and cleans the semiconductor wafers, and two balance rods automatically level when rotating, so that the semiconductor wafers are in a horizontal state to be polished.
Description
Technical Field
The invention relates to the technical field of photovoltaic semiconductor processing, in particular to a photovoltaic semiconductor processing device with a cleaning and filtering function.
Background
The photovoltaic power generation system converts solar radiation energy into electric energy by utilizing the photovoltaic effect of semiconductor materials, the photovoltaic power generation energy is derived from the sun, the photovoltaic power generation system is a safe and renewable clean energy source, and is also the main development direction of the future clean energy market, the semiconductor materials are the cores of the photovoltaic power generation system, the processing and production process of semiconductors is gradually advanced, the processing environment of semiconductors is very harsh at present, the texture of semiconductor sheets is fragile, the semiconductors are extremely easy to damage due to polishing stress problems during processing, only the thickness of the semiconductor sheets can be sacrificed under the condition, the stress of the processing is balanced through more materials, the waste and loss of the materials are definitely caused, and a workbench is required to be kept at a level in the processing process, otherwise, the processed semiconductor sheets are inconvenient to transport and further process, and great trouble and problems are brought to the production process.
Disclosure of Invention
The present invention is directed to a photovoltaic semiconductor processing apparatus with a cleaning and filtering function, so as to solve the above-mentioned problems in the prior art.
In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides a photovoltaic semiconductor processingequipment with wash filtering capability, includes toilet, a plurality of semiconductor piece of waiting to polish, toilet is inside to be provided with arm, turn over manipulator goes up unloading and turn over to semiconductor piece, be provided with grinding machanism on the arm, grinding machanism includes the cover of polishing, the execution end at the arm is installed to the cover of polishing, toilet is inside to be provided with outer sleeve, dehydration box, the inside of outer sleeve is provided with fixture, is connected with the drawing liquid pipe between outer sleeve bottom and the dehydration box, dehydration box internally mounted has drum-shaped to strain a jar, and dehydration box internally stored has the coolant liquid, the coolant liquid cools down the washing to semiconductor piece.
Further, two grooves which are crossed are formed in the bottom of the polishing cover, one servo motor is slidably mounted in each groove, each servo motor is provided with a polishing wheel, a diamond block and a crank are arranged in the polishing cover, the diamond block is rotationally connected with the two servo motors, one end of the crank is rotationally connected with the diamond block, the other end of the crank is connected with a mechanical arm, the turning mechanical arm moves a photovoltaic semiconductor piece to be polished onto a polishing table from a raw material area, the semiconductor piece is attached to a sealing gasket, a small vacuum pump outwards withdraws air in a hollow part of the polishing cover, the hollow part of the polishing cover forms a vacuum negative pressure area, all hexagonal pins retract into the hollow part, and air pressure between the hexagonal pins and the semiconductor piece is reduced, so that the semiconductor piece is tightly attached to the polishing table.
Further, fixture includes the grinding table, the upper surface of grinding table is provided with the sealed pad of one deck, and the inside cavity of grinding table, the grinding table cavity position and the sealed position department between the pad slide and be provided with a plurality of hexagonal round pin, a plurality of the hexagonal round pin is cellular arrangement, and a plurality of hexagonal round pin runs through the sealed pad, and the bottom of every hexagonal round pin is provided with the spring, small-size vacuum pump is still installed to the grinding table bottom, small-size vacuum pump's pumping end and grinding table cavity position intercommunication, through setting up the hexagonal round pin that is cellular arrangement, after a plurality of hexagonal round pin removes, every installs the downthehole negative pressure state that all forms of hexagonal round pin for the grinding table adsorbs the centre gripping to the semiconductor piece, and the hole quantity of hexagonal round pin is many, the distributing position is even, guarantees that the atress of semiconductor piece is even under the state of absorption centre gripping, can not break because the atress change is too big when processing.
Further, the clamping mechanism comprises a central main shaft and a power motor, the central main shaft is rotatably arranged in the middle of the outer sleeve, the power motor is positioned at the bottom of the outer sleeve, a driving bevel gear is arranged on the power motor, a driven bevel gear is arranged on the central main shaft, the driving bevel gear and the driven bevel gear are in meshed transmission, the power motor is electrified to drive the driving bevel gear to rotate, the driving bevel gear drives the central main shaft to rotate through the driven bevel gear, the upper balance bar and the lower balance bar also rotate along with the central main shaft in a rapid rotating state, and weights at two ends of the upper balance bar and the lower balance bar are kept to swing on a radial profile under the action of centrifugal force, namely the upper balance bar and the lower balance bar are kept horizontal and are kept stable by virtue of rotating inertia, and the upper balance bar and the lower balance bar keep the grinding table in a horizontal state through four transmission arms.
Further, an upper balance rod and a lower balance rod are rotatably arranged in the central spindle, the upper balance rod is arranged above the lower balance rod, the upper balance rod is vertical to the lower balance rod in space, the two ends of the upper balance rod and the two ends of the lower balance rod are respectively connected with a heavy block, the two ends of the upper balance rod are symmetrically provided with a driving arm, a pair of driving arms are rotatably connected with the upper balance rod, and one end, far away from the upper balance rod, of the driving arm is connected with a bottom ball pair of the grinding table;
the lower balance rod is also provided with a pair of driving arms, the driving arms are arranged on the lower balance rod in the same mode as the driving arms on the upper balance rod, the heights of the driving arms on the lower balance rod are higher than those of the driving arms on the upper balance rod, the connecting positions of the driving arms and the grinding table are close to the outline edge, and the connecting positions of the driving arms, the upper balance rod and the lower balance rod are close to the central spindle, so that the force arm formed by the forces acting on the upper balance rod and the lower balance rod by the driving arms is very short, the upper balance rod and the lower balance rod are very sensitive and rapid in adjusting the grinding table by the driving arms, and when the grinding machine structure grinds a semiconductor wafer on the grinding table, the force exerted by the grinding machine structure on the semiconductor wafer is insufficient to change the balance state of the grinding table, and the semiconductor wafer is automatically leveled in a horizontal state by utilizing the two balance rods to receive grinding.
Further, the chute of slope has been seted up to the lower part of outer sleeve, the one end that the chute is low is connected with the drawing liquid pipe, the cover is equipped with the waterproof gum cover on the grinding table, the bottom of waterproof gum cover is arranged in the chute, the water pump circular telegram operation, coolant liquid in the dewatering box is drawn and spouted to the semiconductor piece from polishing cover department, the arm drives the polishing cover and is close to the semiconductor piece, servo motor drives the polishing wheel and rotates, the arm drive crank rotates, the crank drives diamond motion, diamond makes two servo motor round trip movement in the crossing inslot of twice, two polishing wheels follow the edge of semiconductor piece and move to the opposite side through the center of semiconductor piece, the rotation of cooperation semiconductor piece carries out comprehensive polishing to the semiconductor piece surface, because the motion trail of two polishing wheels is to and crisscross removal, the polishing force that the semiconductor piece received is dispersed in two directions, the polishing force concentration has been avoided for the polishing of semiconductor piece is more even.
Further, a water pump is arranged outside the dewatering box, a driving sprocket is coaxially connected to a rotor of the water pump, a driven sprocket is arranged outside a position, close to the liquid suction pipe, of the drum-shaped filter cylinder, a chain is connected between the driving sprocket and the driven sprocket, an impeller is mounted inside the position, close to the liquid suction pipe, of the drum-shaped filter cylinder, the impeller is rotatably arranged in the liquid suction pipe, the driving sprocket is simultaneously driven to rotate when the water pump operates, the driving sprocket drives the driven sprocket to rotate through the chain, the driven sprocket enables the drum-shaped filter cylinder to rotate, the impeller rotates at one end of the liquid suction pipe, the impeller sucks air in the liquid suction pipe into the drum-shaped filter cylinder, cooling liquid sprayed onto the semiconductor sheet is carried with polishing impurities and thrown onto the outer sleeve, then the cooling liquid flows into the diagonal flow groove along the inner wall of the outer sleeve, the water-proof rubber sleeve prevents cooling pollution from being caused to the position of the central spindle, and the cooling liquid carrying the impurities is finally sucked into the liquid suction pipe and enters the drum-shaped filter cylinder.
Further, the inside of drum-shaped filter cylinder is provided with the spatula, the spatula is in contact with the inner wall of the drum-shaped filter cylinder, is connected with the guide groove plate on the spatula, the guide groove plate stretches out from the one end of drum-shaped filter cylinder away from the liquid suction pipe, the guide groove plate is installed in the dewatering box outside, the guide groove plate stretches out drum-shaped filter cylinder's one end below and is provided with the dirt collecting barrel, the coolant liquid of entrained impurity enters into the drum-shaped filter cylinder, under drum-shaped filter cylinder rotation, the coolant liquid is thrown out to the dewatering box inside, the impurity then is trapped inside the drum-shaped filter cylinder, simultaneously the spatula scrapes the impurity down along the inner wall of the drum-shaped filter cylinder, the scraped impurity falls onto the guide groove plate, and falls into the dirt collecting barrel along the guide groove plate, utilize the coolant liquid to wash the semiconductor chip, the quick filtration and cyclic utilization of coolant liquid have been realized.
Further, a circulation port is formed in the bottom of the dewatering box, the circulation port is connected with a water pump extraction end through a pipeline, and a water outlet end of the water pump is connected to the polishing cover through a pipeline.
Compared with the prior art, the invention has the following beneficial effects:
1. through setting up the hexagonal round pin that is cellular arrangement, a plurality of hexagonal round pin removes the back, all forms the negative pressure state in every installation hexagonal round pin's the downthehole for the grinding bench adsorbs the centre gripping to the semiconductor wafer, and the hole quantity of hexagonal round pin is many, and the distributing position is even, guarantees under the state of absorption centre gripping that the atress of semiconductor wafer is even, can not cause the fracture because of the atress changes excessively when processing.
2. The weights at the two ends of the upper balance rod and the lower balance rod keep swinging on the radial profile under the action of centrifugal force, namely the upper balance rod and the lower balance rod keep horizontal and keep stable by virtue of rotating inertia, the upper balance rod and the lower balance rod keep a horizontal state of the grinding table through four transmission arms, and the two balance rods are utilized to automatically level when rotating, so that the semiconductor wafer is in a horizontal state to be ground.
3. The cooling liquid is thrown out into the dewatering box by utilizing the rotation of the drum-shaped filter cylinder, impurities are trapped in the drum-shaped filter cylinder, meanwhile, the scraping shovel scrapes the impurities along the inner wall of the drum-shaped filter cylinder, the scraped impurities fall onto the guide groove plate and fall into the dirt collecting barrel along the guide groove plate, the cooling liquid is utilized to clean the semiconductor wafer, and the rapid filtration and the cyclic utilization of the cooling liquid are realized.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the construction of a polishing pad portion of the present invention;
FIG. 3 is a schematic top view of the interior of the polishing pad of the present invention;
FIG. 4 is a schematic view of the construction of the interior of the outer sleeve of the present invention;
FIG. 5 is a schematic view of the construction of the interior of the outer sleeve of the present invention;
FIG. 6 is a schematic top view of the center spindle of the present invention;
FIG. 7 is a schematic view showing the internal structure of the dewatering box of the present invention;
FIG. 8 is a schematic top view of the polishing platen of the present invention;
FIG. 9 is a schematic view of the cross-sectional structure A-A of FIG. 8 in accordance with the present invention;
in the figure: 1. a clean room; 2. a mechanical arm; 3. polishing the cover; 4. a servo motor; 5. grinding wheel; 6. diamond-shaped blocks; 7. a crank; 8. an outer sleeve; 9. a power motor; 10. a central spindle; 11. an upper balance bar; 12. a lower balance bar; 13. a transmission arm; 14. a grinding table; 15. a hexagonal pin; 16. a liquid suction pipe; 17. a water pump; 18. a dewatering box; 19. a drum-shaped filter cartridge; 20. a chain; 21. an impeller; 22. a spatula; 23. a guide groove plate; 24. a circulation port; 25. a waterproof rubber sleeve; 26. and a sealing gasket.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 9, the present invention provides the following technical solutions: the utility model provides a photovoltaic semiconductor processingequipment with wash filtering capability, including toilet 1, a plurality of semiconductor piece of waiting to polish, toilet 1 inside is provided with arm 2, turn over the manipulator and go up unloading and turn over to the semiconductor piece, be provided with grinding machanism on the arm 2, grinding machanism includes polishing cover 3, polishing cover 3 installs the execution end at arm 2, toilet 1 inside is provided with outer sleeve 8, the dehydration tank 18, the inside of outer sleeve 8 is provided with fixture, be connected with the drawing liquid pipe 16 between outer sleeve 8 bottom and the dehydration tank 18, dehydration tank 18 internally mounted has drum type to strain a jar 19, the inside storage of dehydration tank 18 has the coolant liquid, the coolant liquid is cooled down and is washd the semiconductor piece, circulation mouth 24 has been seted up to the bottom of dehydration tank 18, circulation mouth 24 is connected through the pipeline with the water pump 17 extraction end, the water outlet end of water pump 17 passes through the pipeline connection to on the polishing cover 3.
Two crossed grooves are formed in the bottom of the polishing cover 3, one servo motor 4 is slidably mounted in each groove, a polishing wheel 5 is mounted on each servo motor 4, a diamond 6 and a crank 7 are arranged in the polishing cover 3, the diamond 6 is rotationally connected with the two servo motors 4, one end of the crank 7 is rotationally connected with the diamond 6, the other end of the crank 7 is connected with the mechanical arm 2, the turning manipulator moves a photovoltaic semiconductor wafer to be polished onto the polishing table 14 from a raw material area, the semiconductor wafer is attached to the sealing pad 26, a small vacuum pump pumps out air in the hollow part of the polishing cover 3, a vacuum negative pressure area is formed in the hollow part of the polishing cover 3, all hexagonal pins 15 retract into the hollow part, and air pressure between the plurality of hexagonal pins 15 and the semiconductor wafer is reduced, so that the semiconductor wafer is tightly attached to the polishing table 14.
The fixture comprises a grinding table 14, a layer of sealing gasket 26 is arranged on the upper surface of the grinding table 14, the grinding table 14 is hollow, a plurality of hexagonal pins 15 are slidably arranged at the position between the hollow part of the grinding table 14 and the sealing gasket 26, the plurality of hexagonal pins 15 are arranged in a honeycomb shape, the plurality of hexagonal pins 15 penetrate through the sealing gasket 26, a spring is arranged at the bottom of each hexagonal pin 15, a small vacuum pump is further arranged at the bottom of the grinding table 14, the air extraction end of the small vacuum pump is communicated with the hollow part of the grinding table 14, through the arrangement of the hexagonal pins 15 in a honeycomb arrangement, after the plurality of hexagonal pins 15 move, negative pressure is formed in holes of each hexagonal pins 15, so that the grinding table 14 can absorb and clamp a semiconductor wafer, the number of holes of the hexagonal pins 15 is large, the distribution positions are uniform, the uniform stress of the semiconductor wafer is ensured under the state of absorbing and the clamping is not broken due to overlarge stress change during processing.
The clamping mechanism comprises a center main shaft 10 and a power motor 9, wherein the center main shaft 10 is rotatably arranged in the middle of the outer sleeve 8, the power motor 9 is positioned at the bottom of the outer sleeve 8, a driving bevel gear is arranged on the power motor 9, a driven bevel gear is arranged on the center main shaft 10, the driving bevel gear is in meshed transmission with the driven bevel gear, an upper balance rod 11 and a lower balance rod 12 are rotatably arranged in the center main shaft 10, the upper balance rod 11 is arranged above the lower balance rod 12, the upper balance rod 11 is spatially perpendicular to the lower balance rod 12, weight blocks are respectively connected to two ends of the upper balance rod 11 and the lower balance rod 12, driving arms 13 are symmetrically arranged at two ends of the upper balance rod 11, one end of each driving arm 13, far away from the upper balance rod 11, is connected with a bottom ball pair of a grinding table 14, a pair of driving arms 13 are also arranged on the lower balance rod 12, the pair of driving arms 13 are arranged on the lower balance rod 12 in the same manner as the upper balance rod 11, and the pair of driving arms 13 are arranged on the lower balance rod 12, and the height of the driving arms 13 is higher than that of the upper balance rod 11.
The power motor 9 is electrified to drive the drive bevel gear to rotate, the drive bevel gear drives the central spindle 10 to rotate through the driven bevel gear, the central spindle 10 also rotates along with the central spindle 10 in a rapid rotating state, the weights at two ends of the upper balance bar 11 and the lower balance bar 12 keep swinging on the radial profile under the action of centrifugal force, namely the upper balance bar 11 and the lower balance bar 12 keep horizontal, and keep stable by virtue of rotating inertia, the upper balance bar 11 and the lower balance bar 12 keep the grinding table 14 in a horizontal state through four transmission arms 13, the connecting position of the transmission arms 13 and the grinding table 14 is close to the edge of the profile, and the connecting position of the transmission arms 13 and the upper balance bar 11 and the lower balance bar 12 is close to the central spindle 10, so that the force arm formed by the forces acting on the upper balance bar 11 and the lower balance bar 12 by the transmission arms 13 is very short, the adjustment of the upper balance bar 11 and the lower balance bar 12 on the grinding table 14 is very sensitive and rapid through the transmission arms 13, when the semiconductor wafers on the grinding table 14 are ground, the semiconductor wafers on the grinding table 14 are not ground, and the automatic balance wafers applied by the transmission arms are not enough to change the grinding state when the grinding table is in a horizontal state, and the grinding table is in a horizontal state.
The lower part of outer sleeve 8 has been seted up the chute of slope, the low one end of chute is connected with the drawing liquid pipe 16, the cover of grinding table 14 is equipped with waterproof gum cover 25, the bottom of waterproof gum cover 25 is arranged in the chute, the outside of dewatering box 18 is provided with water pump 17, coaxial coupling has driving sprocket on the rotor of water pump 17, drum-shaped section of thick bamboo 19 is provided with driven sprocket in the outside near drawing liquid pipe 16 position department, be connected with chain 20 between driving sprocket and the driven sprocket, drum-shaped section of thick bamboo 19 is close to drawing liquid pipe 16 position department internally mounted has an impeller 21, impeller 21 rotates and sets up in drawing liquid pipe 16, the operation of water pump 17 circular telegram, coolant liquid in dewatering box 18 is drawn and spouted on the semiconductor wafer from the cover 3 department of polishing, arm 2 drives the cover 3 and is close to the semiconductor wafer, servo motor 4 drives the rotation of polishing wheel 5, crank 7 rotates, diamond 6 motion is driven to diamond 6, diamond 6 makes two servo motor 4 make round trip movement in the crossing groove, be connected with chain 20 between driving sprocket, drum-shaped section of thick bamboo 19 is moved from the edge of semiconductor wafer to the centre of semiconductor wafer, the semiconductor wafer is moved to the opposite side of semiconductor wafer that the motion is more evenly, the semiconductor wafer is polished to the power is concentrated because of the motion to the semiconductor wafer is polished, the surface is more evenly is polished to the surface to the semiconductor wafer is guaranteed, the polishing power is concentrated, the surface is guaranteed to the semiconductor wafer is polished.
A spatula 22 is arranged in the drum-shaped filter cylinder 19, the spatula 22 is contacted with the inner wall of the drum-shaped filter cylinder 19, a guide groove plate 23 is connected to the spatula 22, the guide groove plate 23 extends out from one end of the drum-shaped filter cylinder 19 far away from the liquid suction pipe 16, the guide groove plate 23 is arranged on the outer side of the dewatering box 18, a dirt collecting barrel is arranged below one end of the guide groove plate 23 extending out of the drum-shaped filter cylinder 19, a water pump 17 drives a driving sprocket to rotate during operation, the driving sprocket drives a driven sprocket to rotate through a chain 20, the driven sprocket enables the drum-shaped filter cylinder 19 to rotate, an impeller 21 rotates at one end of the liquid suction pipe 16 while the impeller 21 sucks air in the liquid suction pipe 16 into the drum-shaped filter cylinder 19, cooling liquid sprayed onto a semiconductor chip is thrown onto the outer sleeve 8 along with polishing impurities, and then the cooling liquid flows into a chute along the inner wall of the outer sleeve 8, the water-proof rubber sleeve 25 prevents cooling pollution to the position of the central spindle 10, the cooling liquid with the impurities is finally sucked into the liquid suction pipe 16 and enters the drum-shaped filter drum 19, the cooling liquid with the impurities enters the drum-shaped filter drum 19, the cooling liquid is thrown out into the dewatering box 18 under the rotation of the drum-shaped filter drum 19, the impurities are trapped in the drum-shaped filter drum 19, meanwhile, the scraping shovel 22 scrapes the impurities along the inner wall of the drum-shaped filter drum 19, the scraped impurities fall onto the guide groove plate 23 and fall into the dirt collection barrel along the guide groove plate 23, the cooling liquid is used for cleaning the semiconductor wafer, the rapid filtration and the cyclic utilization of the cooling liquid are realized, after one side of the semiconductor wafer is polished, the turning manipulator turns over the semiconductor wafer, the other side of the semiconductor wafer is polished, and after the two sides of the semiconductor wafer are polished, the turning manipulator performs blanking.
The working principle of the invention is as follows: before polishing a semiconductor wafer by using the processing device, a turning manipulator moves the photovoltaic semiconductor wafer to be polished onto a polishing table 14 from a raw material area, the semiconductor wafer is attached to a sealing pad 26, a small vacuum pump pumps out air in the hollow part of a polishing cover 3, the hollow part of the polishing cover 3 forms a vacuum negative pressure area, all hexagonal pins 15 retract into the hollow part, the air pressure between a plurality of hexagonal pins 15 and the semiconductor wafer is reduced, the semiconductor wafer is tightly attached to the polishing table 14, and through arranging the hexagonal pins 15 in a honeycomb arrangement, after the hexagonal pins 15 move, a negative pressure state is formed in holes of each hexagonal pin 15, so that the polishing table 14 adsorbs and clamps the semiconductor wafer, the number of holes of the hexagonal pins 15 is large, the distribution positions are uniform, the uniformity of stress of the semiconductor wafer is ensured under the adsorption and clamping state, and the breakage caused by overlarge stress variation during processing is avoided.
The power motor 9 is electrified to drive the drive bevel gear to rotate, the drive bevel gear drives the central spindle 10 to rotate through the driven bevel gear, the central spindle 10 also rotates along with the central spindle 10 in a rapid rotating state, the weights at two ends of the upper balance bar 11 and the lower balance bar 12 keep swinging on the radial profile under the action of centrifugal force, namely the upper balance bar 11 and the lower balance bar 12 keep horizontal, and keep stable by virtue of rotating inertia, the upper balance bar 11 and the lower balance bar 12 keep the grinding table 14 in a horizontal state through four transmission arms 13, the connecting position of the transmission arms 13 and the grinding table 14 is close to the edge of the profile, and the connecting position of the transmission arms 13 and the upper balance bar 11 and the lower balance bar 12 is close to the central spindle 10, so that the force arm formed by the forces acting on the upper balance bar 11 and the lower balance bar 12 by the transmission arms 13 is very short, the adjustment of the upper balance bar 11 and the lower balance bar 12 on the grinding table 14 is very sensitive and rapid through the transmission arms 13, when the semiconductor wafers on the grinding table 14 are ground, the semiconductor wafers on the grinding table 14 are not ground, and the automatic balance wafers applied by the transmission arms are not enough to change the grinding state when the grinding table is in a horizontal state, and the grinding table is in a horizontal state.
The water pump 17 is electrified to run, the cooling liquid in the dewatering box 18 is pumped and sprayed onto the semiconductor wafer from the polishing cover 3, the mechanical arm 2 drives the polishing cover 3 to be close to the semiconductor wafer, the servo motor 4 drives the polishing wheel 5 to rotate, the mechanical arm 2 drives the crank 7 to rotate, the crank 7 drives the diamond 6 to move, the diamond 6 enables the two servo motors 4 to move back and forth in two intersecting grooves, the two polishing wheels 5 move to the other side from the edge of the semiconductor wafer through the center of the semiconductor wafer, the semiconductor wafer surface is comprehensively polished in cooperation with the rotation of the semiconductor wafer, and the polishing force applied to the semiconductor wafer is dispersed in two directions due to the movement tracks of the two polishing wheels 5 to be staggered, so that the polishing force concentration is avoided, and the polishing of the semiconductor wafer is more uniform.
The water pump 17 drives the driving sprocket to rotate simultaneously when running, the driving sprocket drives the driven sprocket to rotate through the chain 20, the driven sprocket enables the drum-shaped filter drum 19 to rotate, the drum-shaped filter drum 19 rotates and enables the impeller 21 to rotate at one end of the liquid suction pipe 16, the impeller 21 sucks air in the liquid suction pipe 16 towards the drum-shaped filter drum 19, cooling liquid sprayed onto the semiconductor wafers is carried with polishing impurities and is thrown onto the outer sleeve 8, then the cooling liquid flows into the inclined groove along the inner wall of the outer sleeve 8, the water-proof rubber sleeve 25 prevents cooling pollution to the position of the central spindle 10, the cooling liquid carrying impurities is finally sucked into the liquid suction pipe 16, enters the drum-shaped filter drum 19, the cooling liquid carrying impurities enters the drum-shaped filter drum 19, under the rotation of the drum-shaped filter drum 19, the cooling liquid is thrown into the dewatering box 18, the impurities are trapped in the drum-shaped filter drum 19, the scraped off impurities along the inner wall of the drum-shaped filter drum 19, the scraped off impurities fall onto the guide groove plate 23, then fall into the dirt collecting barrel along the guide groove plate 23, the cooling liquid flows down into the inclined groove along the inner wall of the outer sleeve 8, the cooling liquid is used for cleaning the semiconductor wafers, the two faces of the semiconductor wafers are polished, the two faces of the machine is turned down, and the semiconductor wafers are polished, and the machine is turned down, and the faces of the faces are polished, and the faces of the faces are polished.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a photovoltaic semiconductor processingequipment with wash filtering capability, includes toilet (1), a plurality of semiconductor piece of waiting to polish, toilet (1) inside is provided with arm (2), turn-over manipulator, its characterized in that: the turnover manipulator is used for feeding and discharging semiconductor wafers and turnover, a polishing mechanism is arranged on the mechanical arm (2), the polishing mechanism comprises a polishing cover (3), the polishing cover (3) is arranged at the execution end of the mechanical arm (2), an outer sleeve (8) and a dewatering box (18) are arranged in the clean room (1), a clamping mechanism is arranged in the outer sleeve (8), a liquid suction pipe (16) is connected between the bottom of the outer sleeve (8) and the dewatering box (18), a drum-shaped filter cylinder (19) is arranged in the dewatering box (18), cooling liquid is stored in the dewatering box (18), and the cooling liquid cools and washes the semiconductor wafers;
two crossed grooves are formed in the bottom of the polishing cover (3), one servo motor (4) is slidably mounted in each groove, a polishing wheel (5) is mounted on each servo motor (4), a diamond block (6) and a crank (7) are arranged in the polishing cover (3), the diamond block (6) is rotationally connected with the two servo motors (4), one end of the crank (7) is rotationally connected with the diamond block (6), and the other end of the crank (7) is connected with the mechanical arm (2);
the clamping mechanism comprises a central main shaft (10), an upper balance rod (11) and a lower balance rod (12) are rotatably arranged in the central main shaft (10), the upper balance rod (11) is arranged above the lower balance rod (12), the upper balance rod (11) is vertical to the lower balance rod (12) in space, the two ends of the upper balance rod (11) and the two ends of the lower balance rod (12) are respectively connected with a weight, the two ends of the upper balance rod (11) are symmetrically provided with a driving arm (13), a pair of driving arms (13) are rotatably connected with the upper balance rod (11), and one end, far away from the upper balance rod (11), of the driving arm (13) is connected with a bottom ball pair of a grinding table (14);
the lower balance rod (12) is also provided with a pair of transmission arms (13), the arrangement mode of the pair of transmission arms (13) on the lower balance rod (12) is the same as that of the transmission arms (13) on the upper balance rod (11), and the height of the pair of transmission arms (13) on the lower balance rod (12) is higher than that of the transmission arms (13) on the upper balance rod (11).
2. The photovoltaic semiconductor processing apparatus with cleaning and filtering function according to claim 1, wherein: the clamping mechanism comprises a grinding table (14), a layer of sealing gasket (26) is arranged on the upper surface of the grinding table (14), the grinding table (14) is hollow, a plurality of hexagonal pins (15) are slidably arranged at positions between the hollow parts of the grinding table (14) and the sealing gasket (26), the hexagonal pins (15) are arranged in a honeycomb mode, the hexagonal pins (15) penetrate through the sealing gasket (26), springs are arranged at the bottom of each hexagonal pin (15), and a small vacuum pump is further arranged at the bottom of the grinding table (14) and communicated with the hollow parts of the grinding table (14) at the air extraction ends of the small vacuum pump.
3. A photovoltaic semiconductor processing apparatus with cleaning and filtering function according to claim 2, characterized in that: the clamping mechanism further comprises a power motor (9), the center main shaft (10) is rotatably arranged in the middle of the outer sleeve (8), the power motor (9) is located at the bottom of the outer sleeve (8), a driving bevel gear is arranged on the power motor (9), a driven bevel gear is arranged on the center main shaft (10), and the driving bevel gear and the driven bevel gear are in meshed transmission.
4. The photovoltaic semiconductor processing apparatus with cleaning and filtering function according to claim 1, wherein: the lower part of the outer sleeve (8) is provided with an inclined launder, one end of which is low is connected with a liquid suction pipe (16), the upper sleeve of the grinding table (14) is provided with a waterproof rubber sleeve (25), and the bottom of the waterproof rubber sleeve (25) is positioned in the launder.
5. The photovoltaic semiconductor processing apparatus with cleaning and filtering function according to claim 1, wherein: the outside of dewatering box (18) is provided with water pump (17), coaxial coupling has driving sprocket on the rotor of water pump (17), drum-shaped filter cylinder (19) are close to the position outside of drawing liquid pipe (16) and are provided with driven sprocket, be connected with chain (20) between driving sprocket and the driven sprocket, drum-shaped filter cylinder (19) are close to drawing liquid pipe (16) position internally mounted has an impeller (21), impeller (21) rotate and set up in drawing liquid pipe (16).
6. The photovoltaic semiconductor processing apparatus with cleaning and filtering function according to claim 5, wherein: the inside of drum-shaped filter cylinder (19) is provided with spatula (22), spatula (22) and drum-shaped filter cylinder (19) inner wall contact are connected with guide slot board (23) on spatula (22), guide slot board (23) are kept away from the one end of drawing liquid pipe (16) from drum-shaped filter cylinder (19), and guide slot board (23) are installed in dewatering box (18) outside, and guide slot board (23) stretch out drum-shaped filter cylinder (19) one end below and are provided with the dirt collection bucket.
7. The photovoltaic semiconductor processing apparatus with cleaning and filtering function according to claim 5, wherein: the bottom of the dewatering box (18) is provided with a circulating port (24), the circulating port (24) is connected with the extraction end of the water pump (17) through a pipeline, and the water outlet end of the water pump (17) is connected to the polishing cover (3) through a pipeline.
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| CN116533116A (en) | 2023-08-04 |
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