CN115472544A - Device for cleaning semiconductor silicon wafer - Google Patents
Device for cleaning semiconductor silicon wafer Download PDFInfo
- Publication number
- CN115472544A CN115472544A CN202211242674.3A CN202211242674A CN115472544A CN 115472544 A CN115472544 A CN 115472544A CN 202211242674 A CN202211242674 A CN 202211242674A CN 115472544 A CN115472544 A CN 115472544A
- Authority
- CN
- China
- Prior art keywords
- frame
- frames
- cleaning
- fixed mounting
- partition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 120
- 239000004065 semiconductor Substances 0.000 title claims abstract description 107
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 80
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 79
- 239000010703 silicon Substances 0.000 title claims abstract description 79
- 230000007246 mechanism Effects 0.000 claims abstract description 49
- 125000006850 spacer group Chemical group 0.000 claims abstract description 33
- 238000009434 installation Methods 0.000 claims abstract description 14
- 238000005192 partition Methods 0.000 claims description 46
- 239000007788 liquid Substances 0.000 claims description 35
- 238000007789 sealing Methods 0.000 claims description 22
- 230000007723 transport mechanism Effects 0.000 claims description 19
- 239000004744 fabric Substances 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000011324 bead Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 79
- 238000003860 storage Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000007921 spray Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000012864 cross contamination Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B08B1/12—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Abstract
The invention discloses a device for cleaning semiconductor silicon wafers, and particularly relates to the technical field of semiconductor silicon wafer cleaning, which comprises an installation top frame and a support bottom frame, wherein a spacer mechanism is fixedly arranged at the top end of the support bottom frame, and a first conveying mechanism is fixedly arranged at the bottom end of the installation top frame.
Description
Technical Field
The invention relates to the technical field of semiconductor silicon wafer cleaning, in particular to a device for cleaning a semiconductor silicon wafer.
Background
The silicon chip is also called as a silicon wafer and is an important material for manufacturing an integrated circuit, the integrated circuit and various semiconductor devices can be manufactured by means of photoetching, ion implantation and the like on the silicon chip, and the silicon chip is a sheet-shaped object manufactured by taking silicon as a material; in the production of semiconductor devices, silicon wafers need to be strictly cleaned, and the devices can be failed due to trace pollution; the cleaning aims at removing surface pollution impurities, including organic matters and inorganic matters, wherein the impurities exist on the surface of the silicon wafer in an atomic state or an ionic state, and in a film form or a particle form, so that various defects can be caused;
most of traditional semiconductor silicon wafer cleaning processes are that a plurality of semiconductor silicon wafers are orderly arranged in a storage rack in sequence, and then the plurality of semiconductor silicon wafers are uniformly placed in a cleaning machine with cleaning liquid for centralized cleaning.
Disclosure of Invention
The present invention is directed to an apparatus for cleaning a semiconductor wafer to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a wash device of semiconductor silicon chip, is including installation roof-rack and support underframe, the top fixed mounting who supports the underframe has a spacer mechanism, the bottom fixed mounting of installation roof-rack has first transport mechanism, the bottom fixed mounting of first transport mechanism has the thing mechanism of putting that uses with the cooperation of spacer mechanism, one side intermediate position fixed mounting that installation roof-rack bottom is close to the support underframe has first lifter, the drive end fixed mounting of first lifter has with spacer mechanism, puts the washing subassembly that thing mechanism cooperation was used, one side fixed mounting who supports the underframe has second transport mechanism, the clearance subassembly is installed on the top of second transport mechanism.
Preferably, the partition mechanism includes partition card frame, partition card frame fixed mounting is on the top of supporting the underframe, the last fixing clip of partition card frame is equipped with four that the equidistance distributes and separates the article, it includes the buffer underframe to separate the article, the fixed joint of buffer underframe is on partition card frame, the top fixed mounting of buffer underframe has two first partition side frames of symmetric distribution, two first support frame, two of first partition side frame's opposite side bottom fixed mounting has first support frame, two the equal integrated shaping of opposite side of first support frame has the card strip, two it is equipped with the thing chassis to rotate the card between the first support frame, it rotates the joint on the card strip to put the thing chassis, the last fixed surface on putting the thing chassis is connected with the protective washer, two the equal fixed card in top of partition card frame is equipped with the first telescopic link that the slope set up, the equal fixed mounting of drive end of first telescopic link has the locating piece, the bottom roll card of locating piece is equipped with the rubber ball.
Preferably, the bottom middle part fixed mounting who puts the thing chassis has the drive shaft, the drive shaft rotates through sealed rotation piece and installs the middle part at the buffer underframe, the lower surface of buffer underframe is all passed to the bottom of drive shaft, and is a plurality of the outside of drive shaft is all fixed the cover and is equipped with belt pulley transmission group, support underframe inner lower wall fixed mounting has driving motor, driving motor's drive end and the bottom fixed mounting of one of them drive shaft.
Preferably, a liquid discharge groove is formed in one side of the bottom end of the slow liquid bottom frame, liquid discharge branch pipes are fixedly clamped in the liquid discharge groove, a plurality of liquid discharge branch pipes are fixedly mounted at the end portions of the liquid discharge branch pipes, and the end portions of the liquid discharge branch pipes penetrate through the supporting bottom frame.
Preferably, the first transportation mechanism comprises two horizontally arranged linear electric cylinders, the two linear electric cylinders are fixedly installed at the bottom end of the installation top frame, the driving ends of the linear electric cylinders are fixedly installed with a connecting frame, and the two sides of the bottom end of the connecting frame are fixedly installed with second lifting rods; the article placing mechanism comprises two article placing side frames which are symmetrically distributed, the article placing side frames are fixedly installed at the driving ends of the corresponding second lifting rods, article placing pieces which correspond to the article placing side frames in number are fixedly installed between the article placing side frames, the article placing pieces comprise two second spacer side frames which are symmetrically distributed, the second spacer side frames are respectively fixedly installed on the corresponding article placing side frames, the second spacer side frames are movably clamped between the two first spacer side frames respectively, the first spacer side frames and the second spacer side frames are combined into a complete annular spacer frame, the second spacer side frames are fixedly installed at the bottoms of the opposite sides of the second spacer side frames respectively, the second support frames are movably clamped between the two first support frames respectively, the first support frames and the second support frames are combined into a complete annular support frame, a second telescopic rod is fixedly clamped at the bottom of the second spacer side frames, the driving ends of the second telescopic rods and the middle parts of the corresponding second support frames are fixedly installed, and accommodating grooves corresponding to the bottoms of the opposite sides of the two second spacer side frames are respectively provided with accommodating grooves corresponding to the second support frames.
Preferably, the cleaning assembly comprises a cleaning clamp frame, the cleaning clamp frame is fixedly arranged at the driving end of the first lifting rod, cleaning pieces in the number corresponding to that of the spacers are fixedly clamped on the cleaning clamp frame, each cleaning piece comprises a cleaning outer cover, the cleaning outer cover is fixedly clamped on the cleaning clamp frame, an observation window is arranged in the middle of the cleaning outer cover, a sealing ring is fixedly arranged at the bottom end of the cleaning outer cover, a sealing groove corresponding to the cleaning outer cover is formed in the top end of the annular spacer frame, the bottom of the cleaning outer cover is movably clamped in the sealing groove, and the sealing ring is in contact with the inner wall of the sealing groove; wash the middle part fixing clip of dustcoat and be equipped with the feed liquor pipe, the bottom of feed liquor pipe extends to and washs in the dustcoat and be equipped with the wide face shower nozzle, the equal fixing clip in top of feed liquor pipe is equipped with the connector, and is a plurality of one side fixed mounting of connector has first house steward and second house steward.
Preferably, the second transportation mechanism comprises two transportation side frames which are symmetrically distributed, the two transportation side frames are fixedly arranged on one side of the supporting bottom frame, a plurality of transportation motorized rollers which are uniformly distributed are arranged between the transportation side frames, and a transportation belt is movably sleeved on the outer sides of the transportation motorized rollers; clearance subassembly includes U type frame, U type frame fixed joint is in one of them the top middle part of transportation side bearer, the top both sides of U type frame are equipped with the electronic roller of feeding respectively and receive the electronic roller of material, the cover can be dismantled in the outside of the electronic roller of feeding is equipped with the tube-shape and cleans cloth, the cover can be dismantled in the outside of receiving the electronic roller of material is equipped with and receives the feed cylinder, the bottom both sides of U type frame are all rotated and are installed and dredge the deflector roll, the intermediate position fixed mounting of U type frame has the clearance support, the middle part fixed mounting of clearance support has high frequency telescopic link, the drive end of high frequency telescopic link passes clearance support and fixed mounting flange, the bottom fixed mounting of flange has the pressure dish, the guiding axle is all installed to the top four corners department of mounting flange, the guiding axle activity runs through the clearance support.
Compared with the prior art, the invention has the beneficial effects that:
through setting up the spacer mechanism, put thing mechanism and washing subassembly and cooperation use first transport mechanism, can move a plurality of semiconductor silicon chips to solitary washing space automatically respectively in step, carry out the washing of independent high-speed rotation to every semiconductor silicon chip, prevent to appear cross contamination between every semiconductor silicon chip, thereby promote the cleaning quality of semiconductor silicon chip, and use the clearance subassembly through setting up the cooperation of second transport mechanism, carry out automatic physics to automatic driven semiconductor silicon chip and clean the clearance, further promoted the cleaning performance of semiconductor silicon chip.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the structure of the present invention.
FIG. 2 is a schematic view showing the structural connection of the separating mechanism, the placing mechanism and the cleaning assembly according to the present invention.
FIG. 3 is a schematic view showing the connection of the partition mechanism, the placement mechanism and the cleaning assembly.
Fig. 4 is an enlarged view of the invention at a in fig. 3.
Fig. 5 is an enlarged view of the invention at B in fig. 3.
Fig. 6 is an enlarged view of the invention at C in fig. 3.
FIG. 7 is a schematic view of the connection of the partition structure of the present invention.
Fig. 8 is an enlarged view of fig. 7 at D according to the present invention.
FIG. 9 is a schematic view of a cleaning assembly according to the present invention.
Fig. 10 is a schematic view of the structural connection of the second transport mechanism and the cleaning assembly of the present invention.
In the figure: 1, mounting a top frame; 2-supporting the bottom frame; 3-a spacer mechanism; 4-a first transport mechanism; 5-a placement mechanism; 6-a first lifting rod; 7-cleaning the component; 8-a second transport mechanism; 9-a cleaning assembly; 10-a drive motor; 31-spacer clip rack; a 32-spacer; 33-buffer underframe; 34-a first spacer side frame; 35-a first support; 351-card bar; 36-a storage chassis; 361-protective gasket; 37-a drive shaft; 371-a pulley drive group; 38-a first telescoping pole; 39-a positioning block; 391-rubber beads; 331-a drain tank; 310-a liquid discharge branch pipe; 311-drainage header pipe; 51-a storage side frame; 52-placing the object; 53-second spacer side frame; 54-a second support; 541-a receiving groove; 55-a second telescoping rod; 71-cleaning the card frame; 72-a cleaning member; 73-cleaning the outer cover; 732-sealing rings; 731-sealing groove; 74-a viewing window; 75-a liquid inlet pipe; 76-wide face spray head; 77-a connector; 78-a first manifold; 79-a second manifold; 81-transport sideframe; 82-transport motorized roller; 83-a conveyor belt; 91-U-shaped frame; 92-a feed motorized roller; 921-cylindrical cleaning cloth; 93-receiving electric roller; 931-collecting the barrel; 94-a dredging roller; 95-cleaning the support; 96-high frequency telescopic rods; 97-mounting a disc; 98-a pressing plate; 971-guide shaft.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: as shown in fig. 1-10, the present invention provides a device for cleaning a semiconductor silicon wafer, which includes an installation top frame 1 and a support bottom frame 2, wherein a spacer mechanism 3 is fixedly installed on the top end of the support bottom frame 2, a first transport mechanism 4 is fixedly installed on the bottom end of the installation top frame 1, an object placing mechanism 5 used in cooperation with the spacer mechanism 3 is fixedly installed on the bottom end of the first transport mechanism 4, two first lifting rods 6 are fixedly installed at the middle position of one side of the bottom end of the installation top frame 1, which is close to the support bottom frame 2, a cleaning assembly 7 used in cooperation with the spacer mechanism 3 and the object placing mechanism 5 is fixedly installed on the driving ends of the two first lifting rods 6, a second transport mechanism 8 is fixedly installed on one side of the support bottom frame 2, and a cleaning assembly 9 is installed on the top end of the second transport mechanism 8.
The partition mechanism 3 comprises a partition clamping frame 31, the partition clamping frame 31 is fixedly arranged at the top end of the supporting bottom frame 2, four partition objects 32 which are distributed equidistantly are fixedly clamped on the partition clamping frame 31, the partition objects 32 comprise a buffer bottom frame 33, the buffer bottom frame 33 is fixedly clamped on the partition clamping frame 31, two first partition side frames 34 which are distributed symmetrically are fixedly arranged at the top end of the buffer bottom frame 33, first supporting frames 35 are fixedly arranged at the bottoms of the opposite sides of the two first partition side frames 34, clamping strips 351 are integrally formed at the opposite sides of the two first supporting frames 35, an object placing base plate 36 is arranged between the two first supporting frames 35 in a rotating and clamping mode, the object placing base plate 36 is rotatably clamped on the clamping strips 351, through the arrangement of the clamping strip 351, the storage chassis 36 can stably rotate at high speed between the two first support frames 35, the middle part of the bottom end of the storage chassis 36 is fixedly provided with the driving shaft 37, the driving shaft 37 is rotatably arranged in the middle part of the buffer bottom frame 33 through a sealing rotating part, the bottom of the driving shaft 37 penetrates through the lower surface of the buffer bottom frame 33, the outer sides of the driving shafts 37 are fixedly sleeved with the belt pulley transmission group 371, wherein, the pulley transmission group 371 comprises a plurality of pulleys and a transmission belt movably sleeved outside the pulleys, the pulleys are respectively and fixedly sleeved at the bottom of the driving shaft 37, the lower wall in the supporting bottom frame 2 is fixedly provided with the driving motor 10, the driving end of the driving motor 10 and the bottom end of one of the driving shafts 37 are fixedly arranged, when in use, the driving motor 10 is controlled and started to drive one of the driving shafts 37 to stably rotate at a high speed, the belt pulley transmission group 371 is used cooperatively to drive a plurality of driving shafts 37 to synchronously and stably rotate at a high speed, thereby driving the article placing chassis 36 to stably rotate at high speed between the two corresponding first supporting frames 35;
the upper surface of the storage chassis 36 is fixedly connected with a protective gasket 361, when a plurality of semiconductor silicon wafers are placed on the corresponding storage chassis 36, the lower surfaces of the semiconductor silicon wafers are in contact with the protective gasket 361 to support the lower surfaces of the semiconductor silicon wafers, the top parts of the two partition clamping frames 31 are fixedly clamped with obliquely arranged first telescopic rods 38, the driving ends of the first telescopic rods 38 are fixedly provided with positioning blocks 39, the bottom ends of the positioning blocks 39 are provided with rubber ball beads 391 in a rolling mode, after the semiconductor silicon wafers are placed on the corresponding storage chassis 36, the first telescopic rods 38 are opened to drive the positioning blocks 39 and the rubber ball beads 391 to move towards the upper surfaces of the semiconductor silicon wafers until the surfaces of the rubber ball beads 391 are in contact with the upper surfaces of the semiconductor silicon wafers, the ball bead type positioning is carried out on the upper surfaces of the semiconductor silicon wafers, the stability of the semiconductor silicon wafers is improved, the high-speed rotation of the semiconductor silicon wafers is not affected, and when the storage chassis 36 rotates stably at a high speed, the semiconductor silicon wafers are driven to rotate synchronously, stably and at a high speed.
Example 2: as shown in fig. 1-8, the first transportation mechanism 4 includes two horizontally arranged linear electric cylinders, the two linear electric cylinders are fixedly installed at the bottom end of the installation top frame 1, the driving ends of the linear electric cylinders are both fixedly installed with a connecting frame, and both sides of the bottom end of the connecting frame are both fixedly installed with a second lifting rod; the object placing mechanism 5 comprises two object placing side frames 51 which are symmetrically distributed, the object placing side frames 51 are fixedly arranged at the driving ends corresponding to the second lifting rods, when the silicon wafer cleaning device is used, a linear electric cylinder is started to drive the object placing mechanism 5 to horizontally move, the second lifting rods are started to drive the object placing mechanism 5 to vertically move, object placing pieces 52 which correspond to the object spacing pieces 32 are fixedly arranged between the two object placing side frames 51, the object placing pieces 52 comprise two second object spacing side frames 53 which are symmetrically distributed, the second object spacing frames 53 are respectively and fixedly arranged on the corresponding object placing frames 51, the second object spacing frames 53 are respectively and movably clamped between the two first object spacing side frames 34, the first object spacing frames 34 and the second object spacing frames 53 are combined into a complete annular object spacing frame, the second supporting frames 54 are respectively arranged at the bottoms of the opposite sides of the two second object spacing frames 53, the second supporting frames 54 are respectively and movably clamped between the two first supporting frames 35, the first supporting frames 35 and the second supporting frames 54 are combined into a complete annular supporting frame, when the semiconductor silicon wafer is required to be cleaned, a plurality of semiconductor wafers are respectively arranged between the corresponding two second object spacing frames 53, the two second object spacing frames 53 and the semiconductor spacing frames 53, the semiconductor spacing frames 34 are respectively and the semiconductor spacing frames 34 are respectively driven to horizontally move, the four semiconductor spacing frames 34, the semiconductor spacing frames are respectively, the semiconductor spacing frames 34, the semiconductor wafer synchronously moved horizontally, the semiconductor spacing frames 53, the semiconductor wafer spacing frames 34, the semiconductor wafer spacing frames are respectively, the semiconductor wafer spacing frames 53 and the semiconductor wafer spacing frames 34, the semiconductor wafer spacing frames are respectively, the semiconductor wafer spacing frames 53, the semiconductor wafer spacing frames 34, the semiconductor wafer cleaning device is driven to move horizontally, the first support frame 35 and the second support frame 54 are combined to form a complete annular support frame, and at this time, the four semiconductor silicon wafers are respectively arranged on the corresponding object placing chassis 36.
The cleaning assembly 7 comprises a cleaning clamp frame 71, the cleaning clamp frame 71 is fixedly installed at the driving end of the first lifting rod 6, cleaning pieces 72 corresponding to the spacer pieces 32 are fixedly clamped on the cleaning clamp frame 71, each cleaning piece 72 comprises a cleaning outer cover 73, the cleaning outer covers 73 are fixedly clamped on the cleaning clamp frame 71, an observation window 74 is arranged in the middle of each cleaning outer cover 73, sealing rings 732 are fixedly installed at the bottom ends of the cleaning outer covers 73, sealing grooves 731 corresponding to the cleaning outer covers 73 are formed in the top ends of the annular spacer frames, the bottoms of the cleaning outer covers 73 are movably clamped in the sealing grooves 731, the sealing rings 732 are in contact with the inner walls of the sealing grooves 731, when the cleaning assembly is used, after the four semiconductor silicon wafers are respectively placed on the corresponding placing base plates 36, the first lifting rod 6 is opened to drive the cleaning clamp frame 71 and the cleaning pieces 72 to move downwards, at the moment, the bottoms of the cleaning outer covers 73 are movably clamped in the sealing grooves 731, the sealing rings 732 are in contact with the inner walls of the sealing grooves, the cleaning outer spaces of the cleaning outer portions of the semiconductor wafers are isolated and sealed, and during subsequent cleaning, each semiconductor wafer can be cleaned independently, and each semiconductor wafer can be prevented from cross contamination between the semiconductor wafers, and the quality of the semiconductor wafers is improved.
The middle fixing clamp of the cleaning outer cover 73 is provided with a liquid inlet pipe 75, the bottom of the liquid inlet pipe 75 extends into the cleaning outer cover 73 and is provided with a wide-area spray head 76, the top ends of the liquid inlet pipe 75 are fixedly clamped with connectors 77, one side of each connector 77 is fixedly provided with a first header pipe 78 and a second header pipe 79, wherein the end parts of the first header pipes 78 and the second header pipes 79 are respectively connected with the output ends of the cleaning liquid input mechanism and the cleaning water input mechanism, when in use, the cleaning liquid input mechanism is firstly started, cleaning liquid enters the connectors 77 through the first header pipes 78 and then enters the liquid inlet pipe 75, the cleaning liquid is sprayed on the upper surface of the corresponding semiconductor silicon wafer through the corresponding wide-area spray head 76, each semiconductor silicon wafer is cleaned independently, after cleaning, the cleaning water input mechanism is started, the cleaning water enters the connectors 77 through the first header pipes 78 and then enters the liquid inlet pipe 75, and is sprayed on the upper surface of the corresponding semiconductor silicon wafer through the corresponding wide-area spray head 76, the cleaning liquid on the upper surface of the semiconductor wafer is removed, and the cleaning liquid is collected in the buffer bottom frame 33 through the buffer storage chassis 36.
The bottom of the second spacer side frame 53 is fixedly clamped with a second telescopic rod 55, the driving end of the second telescopic rod 55 and the middle of the corresponding second supporting frame 54 are fixedly installed, the bottom of the opposite side of the two second spacer side frames 53 is provided with a containing groove 541 corresponding to the second supporting frame 54, after the four semiconductor silicon wafers are cleaned, the cleaning parts 72 are moved upwards to reset the cleaning parts, the placing parts 52 are moved upwards to reset the cleaning parts, at the moment, each semiconductor silicon wafer is supported on the corresponding second supporting frame 54 again to be separated from the corresponding spacer 32, and then the cleaned four semiconductor silicon wafers are moved to the second transportation mechanism 8.
Example 3: as shown in fig. 9 to 10, the second transportation mechanism 8 includes two transportation side frames 81 symmetrically distributed, the two transportation side frames 81 are fixedly installed at one side of the support bottom frame 2, a plurality of transportation electric rollers 82 are uniformly distributed between the transportation side frames 81, a transportation belt 83 is movably sleeved outside the transportation electric rollers 82, four semiconductor silicon wafers moved to the second transportation mechanism 8 are moved to the upper surface of the transportation belt 83, then, the second telescopic rod 55 is opened, the second support frame 54 is moved and accommodated in the corresponding accommodation groove 541, the four semiconductor silicon wafers are separated from the support and uniformly fall on the upper surface of the transportation belt 83, the transportation electric rollers 82 are opened to drive the transportation belt 83 to drive the four semiconductor silicon wafers to drive.
The cleaning assembly 9 comprises a U-shaped frame 91, the U-shaped frame 91 is fixedly clamped in the middle of the top end of one of the conveying side frames 81, a feeding electric roller 92 and a receiving electric roller 93 are respectively arranged on two sides of the top of the U-shaped frame 91, a cylindrical cleaning cloth 921 is detachably sleeved on the outer side of the feeding electric roller 92, a receiving barrel 931 is detachably sleeved on the outer side of the receiving electric roller 93, a dredging roller 94 is rotatably arranged on two sides of the bottom of the U-shaped frame 91, when in use, a cleaning cloth belt at the end part of the cylindrical cleaning cloth 921 is arranged below the two dredging rollers 94 and wound on the receiving barrel 931, the feeding electric roller 92 is started, the receiving electric roller 93 is dredged by the two dredging rollers 94, a clean cloth belt is continuously arranged below the two dredging rollers 94, and a cleaning support 95 is fixedly arranged in the middle of the U-shaped frame 91, clearance support 95's middle part fixed mounting has high frequency telescopic link 96, clearance support 95 and fixed mounting disc 97 are passed to high frequency telescopic link 96's drive end, the bottom fixed mounting of mounting disc 97 presses pressure dish 98, it is located the top of clean strap to press pressure dish 98, guiding axle 971 is all installed to the top four corners department of mounting disc 97, guiding axle 971 activity runs through clearance support 95, in use, drive the transmission of semiconductor silicon chip, transport in proper order in two sparse deflector roll 94 below, open high frequency telescopic link 96 drive mounting disc 97, press down the high frequency of dish 98 and go up and down, it constantly contacts with driven semiconductor silicon chip upper surface to drive the clean strap in two sparse deflector roll 94 below, carry out automatic physics to clean clearance semiconductor silicon chip, the cleaning performance of semiconductor silicon chip has further been promoted.
The working principle is as follows: before use, the cleaning cloth belt at the end part of the cylindrical cleaning cloth 921 is arranged below the two thinning and guiding rollers 94 and wound on the material collecting barrel 931, the feeding electric roller 92 and the material collecting electric roller 93 are started, and through thinning of the two thinning and guiding rollers 94, the clean cloth belt is continuously arranged below the two thinning and guiding rollers 94;
when the semiconductor silicon wafer needs to be cleaned, the plurality of semiconductor silicon wafers are respectively arranged between the two corresponding second spacer side frames 53, the lower surfaces of the semiconductor silicon wafers are in contact with the second support frames 54, and the second support frames 54 support the semiconductor silicon wafers;
starting a linear electric cylinder to drive the object placing mechanism 5 to move horizontally, starting a second lifting rod to drive the object placing mechanism 5 to move vertically, driving four semiconductor silicon wafers to move horizontally and move vertically, moving the four semiconductor silicon wafers to be above four partition objects 32 respectively, then moving the four semiconductor silicon wafers downwards, at the moment, movably clamping and connecting the second partition side frames 53 between the two first partition side frames 34 respectively, combining the first partition side frames 34 and the second partition side frames 53 into a complete annular partition frame, simultaneously movably clamping and connecting the second support frames 54 between the two first support frames 35 respectively, combining the first support frames 35 and the second support frames 54 into a complete annular support frame, and at the moment, respectively placing the four semiconductor silicon wafers on the corresponding object placing base plates 36;
then, the plurality of first telescopic rods 38 are opened, the positioning blocks 39 and the rubber ball 391 are driven to move towards the upper surface of the semiconductor silicon wafer until the surface of the rubber ball 391 is contacted with the upper surface of the semiconductor silicon wafer, and the upper surface of the semiconductor silicon wafer is positioned in a ball type manner, so that the stability of the semiconductor silicon wafer is improved, and the high-speed rotation of the semiconductor silicon wafer is not influenced;
then, the first lifting rod 6 is opened to drive the cleaning clamp frame 71 and the cleaning piece 72 to move downwards, at the moment, the bottom of the cleaning outer cover 73 is movably clamped in the sealing groove 731, the sealing ring 732 is contacted with the inner wall of the sealing groove 731, and the cleaning outer cover 73 is used for isolating and sealing the outer space of each semiconductor silicon chip;
then, the driving motor 10 is controlled and started to drive one of the driving shafts 37 to stably rotate at a high speed, and the belt pulley transmission group 371 is used in a matched manner to drive the plurality of driving shafts 37 to synchronously and stably rotate at a high speed, so that the object placing chassis 36 is driven to stably rotate at a high speed between the two corresponding first supporting frames 35, and the semiconductor silicon wafer is driven to synchronously and stably rotate at a high speed;
meanwhile, the cleaning liquid input mechanism is started, cleaning liquid enters the plurality of connectors 77 through the first header pipe 78, then enters the liquid inlet pipe 75, is sprayed on the upper surfaces of the corresponding semiconductor silicon wafers through the corresponding wide-face spray heads 76, and is independently rotated and cleaned at a high speed, after cleaning, the cleaning water input mechanism is started, cleaning water enters the plurality of connectors 77 through the first header pipe 78, then enters the liquid inlet pipe 75, is sprayed on the upper surfaces of the corresponding semiconductor silicon wafers through the corresponding wide-face spray heads 76, so that the cleaning liquid on the upper surfaces of the semiconductor silicon wafers is removed, the waste cleaning liquid and the cleaning water flow into the corresponding buffer bottom frame 33 through the storage chassis 36 to be collected and cached in a centralized manner, and the waste cleaning liquid and the cleaning water which are collected and cached in a centralized manner are discharged through the plurality of liquid discharge branch pipes 310 and the liquid discharge header pipe 311 so as to be treated;
after the four semiconductor silicon wafers are cleaned, moving upwards to reset the plurality of cleaning parts 72, and moving upwards to reset the plurality of placing objects 52, at this time, each semiconductor silicon wafer is supported on the corresponding second supporting frame 54 again to be separated from the corresponding separating object 32, and then, moving the four cleaned semiconductor silicon wafers to the second transportation mechanism 8, and moving the four semiconductor silicon wafers to the second transportation mechanism 8 to the upper surface of the transportation belt 83;
then, the second telescopic rod 55 is opened, the second support frame 54 is movably accommodated in the corresponding accommodating groove 541, the four semiconductor silicon wafers are separated from the support and uniformly fall on the upper surface of the conveying belt 83, and the plurality of conveying electric rollers 82 are opened to drive the conveying belt 83 to transmit, so that the four semiconductor silicon wafers are driven to transmit;
the semiconductor silicon wafer cleaning device is sequentially transported below the two thinning guide rollers 94, the high-frequency telescopic rod 96 is opened to drive the mounting disc 97 and the pressing disc 98 to ascend and descend at high frequency, the clean cleaning cloth belts below the two thinning guide rollers 94 are driven to continuously contact with the upper surface of the driven semiconductor silicon wafer, automatic physical wiping cleaning is conducted on the semiconductor silicon wafer, and the cleaning effect of the semiconductor silicon wafer is further improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a wash device of semiconductor silicon chip, includes installation roof-rack (1) and support underframe (2), its characterized in that: the utility model discloses a cleaning assembly, including support underframe (2), top fixed mounting that supports underframe (2) has spacer mechanism (3), the bottom fixed mounting of installation roof-rack (1) has first transport mechanism (4), the bottom fixed mounting of first transport mechanism (4) has and puts thing mechanism (5) with spacer mechanism (3) cooperation use, one side intermediate position fixed mounting that installation roof-rack (1) bottom is close to support underframe (2) has first lifter (6), the drive end fixed mounting of first lifter (6) has and separates thing mechanism (3), puts cleaning assembly (7) that thing mechanism (5) cooperation was used, one side fixed mounting that supports underframe (2) has second transport mechanism (8), cleaning assembly (9) are installed on the top of second transport mechanism (8).
2. An apparatus for cleaning a semiconductor wafer according to claim 1, wherein: the partition mechanism (3) comprises partition clamping frames (31), the partition clamping frames (31) are fixedly mounted at the top ends of the supporting bottom frames (2), four partition objects (32) distributed equidistantly are fixedly clamped on the partition clamping frames (31), each partition object (32) comprises a buffer bottom frame (33), the buffer bottom frame (33) is fixedly clamped on the partition clamping frames (31), two first partition side frames (34) distributed symmetrically are fixedly mounted at the top ends of the buffer bottom frames (33), first supporting frames (35) are fixedly mounted at the bottoms of the opposite sides of the two first partition side frames (34), clamping strips (351) are formed at the opposite sides of the two first supporting frames (35) in an integrated mode, an object placing chassis (36) is arranged between the two first supporting frames (35) in a rotating and clamping mode, the object placing chassis (36) is rotatably clamped on the clamping strips (351), gaskets (361) are fixedly connected to the upper surfaces of the object placing chassis (36), driving ends of the two protection object clamping frames (31) are fixedly provided with first clamping beads (38) which are arranged at the tops of the two protection object clamping frames, and rubber positioning blocks (38) are fixedly arranged at the bottoms of the first partition clamping beads (391), and rubber positioning rods (39) are arranged at the bottoms of the positioning blocks (38).
3. An apparatus for cleaning a semiconductor wafer according to claim 2, wherein: the bottom middle part fixed mounting who puts thing chassis (36) has drive shaft (37), drive shaft (37) are installed at the middle part of buffer bottom frame (33) through sealed rotation piece rotation, the lower surface of buffer bottom frame (33) is all passed to the bottom of drive shaft (37), and is a plurality of the outside of drive shaft (37) is all fixed the cover and is equipped with belt pulley transmission group (371), it has driving motor (10) to support lower wall fixed mounting in underframe (2), the drive end of driving motor (10) and the bottom fixed mounting of one of them drive shaft (37).
4. An apparatus for cleaning a semiconductor wafer according to claim 2, wherein: liquid discharge tank (331) have all been seted up to the bottom one side of buffer underframe (33), all the fixing clip is equipped with flowing back branch pipe (310) in liquid discharge tank (331), and is a plurality of the tip fixed mounting of flowing back branch pipe (310) has flowing back house steward (311), the tip of flowing back house steward (311) runs through and supports underframe (2).
5. An apparatus for cleaning a semiconductor wafer according to claim 2, wherein: first transport mechanism (4) are including the sharp electric jar of two levels settings, two sharp electric jar fixed mounting is in the bottom of installation roof-rack (1), the equal fixed mounting of drive end of sharp electric jar has the link, the equal fixed mounting in bottom both sides of link has the second lifter.
6. An apparatus for cleaning a semiconductor wafer according to claim 5, wherein: the article placing mechanism (5) comprises two article placing side frames (51) which are symmetrically distributed, the article placing side frames (51) are fixedly arranged at the driving ends corresponding to the second lifting rods, article placing pieces (52) with the number corresponding to that of the article separating pieces (32) are fixedly arranged between the two article placing side frames (51), the object placing piece (52) comprises two second partition side frames (53) which are symmetrically distributed, the second partition side frames (53) are respectively and fixedly arranged on the corresponding object side frames (51), the second partition side frames (53) are respectively and movably clamped between the two first partition side frames (34), the first partition side frame (34) and the second partition side frame (53) are combined into a complete annular partition frame, the bottoms of the opposite sides of the two second partition side frames (53) are respectively provided with a second supporting frame (54), the second support frames (54) are respectively movably clamped between the two first support frames (35), the first support frame (35) and the second support frame (54) are combined into a complete annular support frame, a second telescopic rod (55) is fixedly clamped at the bottom of the second partition side frame (53), the driving end of the second telescopic rod (55) and the middle part of the corresponding second supporting frame (54) are fixedly installed, and the bottom parts of the opposite sides of the two second partition side frames (53) are respectively provided with an accommodating groove (541) corresponding to the second supporting frame (54).
7. An apparatus for cleaning a semiconductor wafer according to claim 6, wherein: cleaning assembly (7) is including wasing card frame (71), wash card frame (71) fixed mounting at the drive end of first lifter (6), the fixing clip is equipped with and separates washing piece (72) that thing piece (32) correspond quantity on wasing card frame (71), wash piece (72) including wasing dustcoat (73), wash dustcoat (73) fixed joint on wasing card frame (71), the middle part of wasing dustcoat (73) is equipped with observation window (74), the bottom fixed mounting who washs dustcoat (73) has sealing washer (732), seal groove (731) that correspond with wasing dustcoat (73) are seted up on the top of cyclic annular spacer frame, the bottom activity joint that washs dustcoat (73) is in seal groove (731), the inner wall contact of sealing washer (732) and seal groove (731).
8. An apparatus for cleaning a semiconductor wafer according to claim 7, wherein: wash the middle part fixing clip of dustcoat (73) and be equipped with feed liquor pipe (75), the bottom of feed liquor pipe (75) extends to and is equipped with wide shower nozzle (76) in wasing dustcoat (73), the equal fixing clip in top of feed liquor pipe (75) is equipped with connector (77), and is a plurality of one side fixed mounting of connector (77) has first total pipe (78) and second total pipe (79).
9. An apparatus for cleaning a semiconductor wafer according to claim 1, wherein: second transport mechanism (8) are including two transportation side frame (81) of symmetric distribution, two transportation side frame (81) fixed mounting is in the one side of supporting underframe (2), be equipped with a plurality of transportation electric roller (82) of evenly distributed between transportation side frame (81), it is a plurality of the outside activity cover of transportation electric roller (82) is equipped with transportation belt (83).
10. An apparatus for cleaning a semiconductor wafer according to claim 9, wherein: clearance subassembly (9) are including U type frame (91), U type frame (91) fixed joint is in one of them the top middle part of transportation side bearer (81), the top both sides of U type frame (91) are equipped with feeding electric roller (92) respectively and receive material electric roller (93), the cover can be dismantled in the outside of feeding electric roller (92) and be equipped with tube-shape cleaning cloth (921), the cover can be dismantled in the outside of receiving material electric roller (93) and be equipped with receipts feed cylinder (931), the bottom both sides of U type frame (91) are all rotated and are installed and are dredged deflector roll (94), the intermediate position fixed mounting of U type frame (91) has clearance support (95), the middle part fixed mounting of clearance support (95) has high frequency telescopic link (96), the drive end of high frequency telescopic link (96) passes clearance support (95) and fixed mounting dish (97), the bottom fixed mounting of mounting dish (97) has and presses pressure dish (98), the top four corners department of mounting dish (97) all installs guide axle (971), guide axle (971) activity runs through clearance support (95).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211242674.3A CN115472544A (en) | 2022-10-11 | 2022-10-11 | Device for cleaning semiconductor silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211242674.3A CN115472544A (en) | 2022-10-11 | 2022-10-11 | Device for cleaning semiconductor silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115472544A true CN115472544A (en) | 2022-12-13 |
Family
ID=84337531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211242674.3A Pending CN115472544A (en) | 2022-10-11 | 2022-10-11 | Device for cleaning semiconductor silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115472544A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116093010A (en) * | 2022-12-24 | 2023-05-09 | 芯朋半导体科技(如东)有限公司 | Self-locking self-cleaning workbench for copper clamp chip mounting chip production |
-
2022
- 2022-10-11 CN CN202211242674.3A patent/CN115472544A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116093010A (en) * | 2022-12-24 | 2023-05-09 | 芯朋半导体科技(如东)有限公司 | Self-locking self-cleaning workbench for copper clamp chip mounting chip production |
| CN116093010B (en) * | 2022-12-24 | 2023-10-10 | 芯朋半导体科技(如东)有限公司 | Self-locking self-cleaning workbench for copper clamp chip mounting chip production |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108202066B (en) | A kind of can cleaning device in can processing equipment | |
| CN112170386B (en) | Lid cleaning machine behind cell-phone back to back | |
| CN115472544A (en) | Device for cleaning semiconductor silicon wafer | |
| CN208370869U (en) | A kind of efficient Kiwi berry cleaning machine | |
| CN211412844U (en) | Inferior gram force board plane abluent equipment | |
| CN106169521A (en) | What a kind of crystal silicon solar energy battery was processed removes phosphorosilicate glass machining production line | |
| CN115090591A (en) | Self-circulation type environment-friendly semiconductor wafer cleaning device | |
| CN113275348B (en) | Gas-liquid double-effect bottle washing machine for food and medicine packaging bottles and control method thereof | |
| CN211488969U (en) | Water-saving glass substrate belt cleaning device | |
| CN219112305U (en) | Automatic chip cleaning machine | |
| CN205920986U (en) | Dephosphorization silicon glass processing production line of crystalline silicon solar cells processing | |
| CN215328946U (en) | Clothing material piece collection device for finished clothing in tailoring | |
| CN215394548U (en) | Cleaning machine is ground to dysmorphism | |
| CN211305928U (en) | Piece-uncovering and draining device of glass polishing machine | |
| CN115476263A (en) | Special-shaped grinding cleaning machine and cleaning process thereof | |
| CN207270842U (en) | Apply the belt vacuum filter in high pure alcohol production | |
| CN112704949A (en) | Spirulina stock solution vacuum filtering device and method thereof | |
| CN215649160U (en) | Automatic change and wash beans device | |
| CN211420666U (en) | Dust removal device for printing and dyeing cloth | |
| CN111687102A (en) | Automatic machine of washing of water planting leaf dish floating plate | |
| CN212397446U (en) | Clamping device for cleaning line | |
| CN212329049U (en) | Cleaning device for automobile part machining | |
| CN209260207U (en) | Miniature workpiece automatic phosphating device | |
| CN217963857U (en) | Flaked silicon wafer cleaning device | |
| CN214723198U (en) | Copper surface treatment device for integrated circuit board processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |