TWI653103B - Device for cleaning wafer container - Google Patents
Device for cleaning wafer container Download PDFInfo
- Publication number
- TWI653103B TWI653103B TW105118117A TW105118117A TWI653103B TW I653103 B TWI653103 B TW I653103B TW 105118117 A TW105118117 A TW 105118117A TW 105118117 A TW105118117 A TW 105118117A TW I653103 B TWI653103 B TW I653103B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer cassette
- base
- upper cover
- wafer
- cleaning
- Prior art date
Links
Abstract
一種晶圓盒清洗裝置用於清洗一晶圓盒，該晶圓盒包括一本體以及一蓋體，該晶圓盒清洗裝置包括一基座以及一上蓋部。該晶圓盒固定於該基座上。該上蓋部設置於該基座上方之側邊，該基座以及該上蓋部共同形成一腔體，該腔體用於容納該晶圓盒，該上蓋部用於分離該本體以及該蓋體。該晶圓盒清洗裝置能增進清洗晶圓盒之效率。 A wafer cassette cleaning device is used for cleaning a wafer cassette. The wafer cassette includes a body and a cover. The wafer cassette cleaning device includes a base and an upper cover. The wafer cassette is fixed to the base. The upper cover portion is disposed on a side of the upper portion of the base. The base and the upper cover portion together form a cavity for receiving the wafer cassette, and the upper cover portion is configured to separate the body and the cover. The cassette cleaning device can increase the efficiency of cleaning the wafer cassette.
Description
本發明關於晶圓領域，特別是關於一種晶圓盒清洗裝置。 The present invention relates to the field of wafers, and more particularly to a wafer cassette cleaning apparatus.
晶圓在製程中需要經過多次運送，目前用於運送晶圓的晶圓盒稱為前開式晶圓傳送盒(Front Opening Unified Pod；FOUP，或稱為前開口一體盒)，前開式晶圓傳送盒主要用於運送及儲存複數片晶圓的一種容器。 The wafer needs to be transported multiple times during the process. The wafer cassette used to transport the wafer is called the Front Opening Unified Pod (FOUP), and the front opening wafer. A transfer box is primarily used to transport and store a plurality of wafers of a container.
前開式晶圓傳送盒主要包括一本體以及一蓋體，而前開式晶圓傳送盒在使用一段時間後需要清洗，更明確地說，用於清洗前開式晶圓傳送盒的裝置需要分別將本體及蓋體進行清洗，然而現有用於清洗前開式晶圓傳送盒的裝置不能方便地將本體及蓋體分離，使得清洗前開式晶圓傳送盒的效率受到影響。 The front open wafer transfer box mainly comprises a body and a cover, and the front open wafer transfer box needs to be cleaned after being used for a period of time. More specifically, the device for cleaning the front open wafer transfer box needs to separately separate the body The cover is cleaned. However, the existing device for cleaning the front open wafer transfer cassette cannot easily separate the body and the cover, so that the efficiency of cleaning the front open wafer transfer box is affected.
因此需要針對習知技術中不能方便地將前開式晶圓傳送盒之本體及蓋體分離的問題提出解決方法。 Therefore, it is necessary to propose a solution to the problem that the body and the cover of the front opening wafer transfer cassette cannot be conveniently separated in the prior art.
本發明提供一種晶圓盒清洗裝置，其能解決習知技術中不能方便地將前開式晶圓傳送盒之本體及蓋體分離的問題。 The present invention provides a wafer cassette cleaning apparatus which can solve the problem that the body and the cover of the front opening wafer transfer cassette cannot be easily separated in the prior art.
本發明之晶圓盒清洗裝置用於清洗一晶圓盒，該晶圓盒包括一本體以及一蓋體，該晶圓盒清洗裝置包括一基座以及一上蓋部。該晶圓盒固定於該基座上。該上蓋部設置於該基座上方之側邊，該基座以及該上蓋部共同形成一腔體，該腔體用於容納該晶圓盒，該上蓋部用於分離該本體以及該蓋體。 The wafer cassette cleaning device of the present invention is used for cleaning a wafer cassette, the wafer cassette comprising a body and a cover, the wafer cassette cleaning device comprising a base and an upper cover portion. The wafer cassette is fixed to the base. The upper cover portion is disposed on a side of the upper portion of the base. The base and the upper cover portion together form a cavity for receiving the wafer cassette, and the upper cover portion is configured to separate the body and the cover.
在一較佳實施例中，該上蓋部透過吸附該蓋體來分離該本體以及該蓋體。 In a preferred embodiment, the upper cover portion separates the body and the cover by adsorbing the cover.
在一較佳實施例中，該基座包括一固定部，該固定部設置於該基座上方之側邊。 In a preferred embodiment, the base includes a fixing portion disposed on a side of the base.
在一較佳實施例中，該上蓋部包括一樞轉部，該樞轉部設置於該上蓋部之周圍，該樞轉部樞轉地連接至該固定部。 In a preferred embodiment, the upper cover portion includes a pivoting portion disposed around the upper cover portion, the pivot portion being pivotally coupled to the fixed portion.
在一較佳實施例中，該基座包括一底部，該晶圓盒固定於該底部。 In a preferred embodiment, the base includes a bottom to which the wafer cassette is secured.
在一較佳實施例中，該上蓋部包括一吸附部，該吸附部包括至少一吸盤，該至少一吸盤用於吸附該晶圓盒。 In a preferred embodiment, the upper cover portion includes an adsorption portion, and the adsorption portion includes at least one suction cup for adsorbing the wafer cassette.
本發明之晶圓盒清洗裝置能方便地將晶圓盒之本體以及蓋體分離，藉此增進清洗晶圓盒之效率。 The wafer cassette cleaning device of the present invention can conveniently separate the body of the wafer cassette and the cover body, thereby improving the efficiency of cleaning the wafer cassette.
1‧‧‧晶圓盒清洗裝置 1‧‧‧Facsimile cleaning device
10‧‧‧基座 10‧‧‧ Pedestal
12‧‧‧上蓋部 12‧‧‧Upper Department
14‧‧‧腔體 14‧‧‧ cavity
30‧‧‧晶圓盒 30‧‧‧wafer box
100‧‧‧固定部 100‧‧‧Fixed Department
102‧‧‧底部 102‧‧‧ bottom
120‧‧‧樞轉部 120‧‧‧ pivoting department
122‧‧‧吸附部 122‧‧‧Adsorption Department
300‧‧‧本體 300‧‧‧ body
302‧‧‧蓋體 302‧‧‧ cover
1220‧‧‧吸盤 1220‧‧‧Sucker
第1圖顯示根據本發明一實施例之晶圓盒清洗裝置容納一晶圓盒之立體圖；以及第2圖顯示該晶圓盒清洗裝置及該晶圓盒之分解圖。 1 is a perspective view showing a wafer cassette cleaning apparatus accommodating a wafer cassette according to an embodiment of the present invention; and FIG. 2 is an exploded view showing the wafer cassette cleaning apparatus and the wafer cassette.
請參閱第1圖至第2圖，第1圖顯示根據本發明一實施例之晶圓盒清洗裝置1容納一晶圓盒30之立體圖，第2圖顯示該晶圓盒清洗裝置1及該晶圓盒30之分解圖。 Referring to FIG. 1 to FIG. 2, FIG. 1 is a perspective view showing a wafer cassette cleaning apparatus 1 accommodating a wafer cassette 30 according to an embodiment of the present invention, and FIG. 2 is a view showing the wafer cassette cleaning apparatus 1 and the crystal. An exploded view of the round box 30.
該晶圓盒清洗裝置1用於清洗該晶圓盒30。該晶圓盒30可以但不限於為一前開式晶圓傳送盒，該晶圓盒30主要包括一本體300以及一蓋體302。該本體300以及該蓋體302共同形成一容置空間以容納複數片晶圓。當該晶圓盒30需要清洗時，該晶圓盒30內之容置空間將不會容納晶圓，一自動運送裝置(例如一機械手臂)將該晶圓盒30放入該晶圓盒清洗裝置1中 並等待後續之作動(將於稍後詳述)。 The cassette cleaning apparatus 1 is for cleaning the wafer cassette 30. The wafer cassette 30 can be, but is not limited to, a front-opening wafer transfer cassette. The wafer cassette 30 mainly includes a body 300 and a cover 302. The body 300 and the cover 302 together form an accommodating space for accommodating a plurality of wafers. When the wafer cassette 30 needs to be cleaned, the accommodating space in the wafer cassette 30 will not accommodate the wafer, and an automatic transport device (such as a robot arm) puts the wafer cassette 30 into the wafer cassette for cleaning. Device 1 And wait for the follow-up action (more on this later).
該晶圓盒清洗裝置1包括一基座10以及一上蓋部12。該基座10以及該上蓋部12共同形成一腔體14。該腔體14用於容納該晶圓盒30。該晶圓盒30固定於該基座10上。 The pod cleaning device 1 includes a base 10 and an upper cover portion 12. The base 10 and the upper cover portion 12 together form a cavity 14. The cavity 14 is for accommodating the wafer cassette 30. The wafer cassette 30 is fixed to the base 10.
於本實施例中，該基座10大致呈一圓柱狀，該圓柱狀之側邊鄰接一矩形之空間，然而本發明之基座10可以為其他適當之形狀，並不限於如第1圖所示之形狀。 In this embodiment, the base 10 has a substantially cylindrical shape, and the sides of the column are adjacent to a rectangular space. However, the base 10 of the present invention may have other suitable shapes, and is not limited to the one shown in FIG. The shape of the show.
該上蓋部12設置於該基座10上方之側邊且相對於該基座10可進行打開或關閉之作動。由於該上蓋部12相對於該基座10可進行打開或關閉之作動，因此該上蓋部12之形狀對應於該基座10之形狀。該上蓋部12用於透過吸附該蓋體302來分離該本體300以及該蓋體302。 The upper cover portion 12 is disposed on a side of the base 10 and can be opened or closed relative to the base 10. Since the upper cover portion 12 can be opened or closed relative to the base 10, the shape of the upper cover portion 12 corresponds to the shape of the base 10. The upper cover portion 12 is configured to separate the body 300 and the cover 302 by adsorbing the cover 302.
於本實施例中，該基座10包括一固定部100，該固定部100設置於該基座10上方之側邊，該上蓋部12包括一樞轉部120，該樞轉部120設置於該上蓋部12之周圍，該樞轉部120樞轉地連接至該固定部100，該上蓋部12可以透過該樞轉部120達到相對於該基座10進行打開或關閉之作動。 In this embodiment, the base 10 includes a fixing portion 100. The fixing portion 100 is disposed at a side of the base 10. The upper cover portion 12 includes a pivoting portion 120. The pivoting portion 120 is disposed on the side. The pivoting portion 120 is pivotally connected to the fixing portion 100 around the upper cover portion 12, and the upper cover portion 12 can be opened or closed relative to the base 10 through the pivoting portion 120.
該基座10進一步包括一底部102，該底部102設置於該腔體14之下方，該晶圓盒30固定於該底部102。 The susceptor 10 further includes a bottom portion 102 disposed below the cavity 14 , and the wafer cassette 30 is fixed to the bottom portion 102 .
該上蓋部12進一步包括一吸附部122，該吸附部122設置於該上蓋部12的內部，該吸附部122包括至少一吸盤1220，該至少一吸盤1220用於吸附該晶圓盒30之該蓋體302，以使該本體300以及該蓋體302達到分離之效果，並藉此增進清洗該晶圓盒30之效率。 The upper cover portion 12 further includes an adsorption portion 122 disposed inside the upper cover portion 12, the adsorption portion 122 includes at least one suction cup 1220, and the at least one suction cup 1220 is configured to adsorb the cover of the wafer cassette 30. The body 302 is used to achieve the separation effect of the body 300 and the cover 302, thereby improving the efficiency of cleaning the wafer cassette 30.
以下將描述該晶圓盒30之清洗過程，當該晶圓盒30需要清洗時，首先由一自動運送裝置(例如一機械手臂)將該晶圓盒30放入該晶圓盒清洗裝置1中，更明確地說，該自動運送裝置將該晶圓盒30固定在該底部102上，接著該上蓋部12之該吸附部122吸附該晶圓盒30之該蓋體302，以使該本體300以及該蓋體302分離，最後該本體300以及該蓋體302分別透過各 自之清洗機構(未圖示)進行清洗。 The cleaning process of the wafer cassette 30 will be described below. When the wafer cassette 30 needs to be cleaned, the wafer cassette 30 is first placed in the wafer cassette cleaning apparatus 1 by an automatic transport device (for example, a robot arm). More specifically, the automatic transport device fixes the wafer cassette 30 to the bottom portion 102, and then the adsorption portion 122 of the upper cover portion 12 adsorbs the cover 302 of the wafer cassette 30, so that the body 300 And the cover 302 is separated, and finally the body 300 and the cover 302 respectively pass through the respective bodies The cleaning mechanism (not shown) is used for cleaning.
綜上所述，本發明之晶圓盒清洗裝置能方便地將晶圓盒之本體以及蓋體分離，藉此增進清洗晶圓盒之效率。 In summary, the wafer cassette cleaning apparatus of the present invention can easily separate the body of the wafer cassette and the cover body, thereby improving the efficiency of cleaning the wafer cassette.
雖然本發明已用較佳實施例揭露如上，然其並非用以限定本發明，本發明所屬技術領域中具有通常知識者在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the invention has been described above by way of a preferred embodiment, the invention is not intended to be limited thereto, and the invention may be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105118117A TWI653103B (en) | 2016-06-08 | 2016-06-08 | Device for cleaning wafer container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105118117A TWI653103B (en) | 2016-06-08 | 2016-06-08 | Device for cleaning wafer container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201742680A TW201742680A (en) | 2017-12-16 |
| TWI653103B true TWI653103B (en) | 2019-03-11 |
Family
ID=61230344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105118117A TWI653103B (en) | 2016-06-08 | 2016-06-08 | Device for cleaning wafer container |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI653103B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115020302B (en) * | 2022-07-15 | 2022-10-14 | 江苏芯梦半导体设备有限公司 | Cleaning and drying equipment and cleaning and drying method for wafer storage box |
| CN117161031B (en) * | 2023-11-02 | 2024-02-02 | 江苏芯梦半导体设备有限公司 | Semiconductor workpiece box cleaning device, equipment and cleaning method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI322044B (en) | 2002-11-01 | 2010-03-21 | Semitool Inc | Wafer container cleaning system |
| TWI327747B (en) | 2006-01-27 | 2010-07-21 | Dainippon Screen Mfg | Substrate processing apparatus |
| CN102194730A (en) | 2010-03-15 | 2011-09-21 | 三星电子株式会社 | Substrate transfer container, gas purge monitoring tool, and semiconductor manufacturing equipment with the same |
| TW201400199A (en) | 2012-02-03 | 2014-01-01 | Tokyo Electron Ltd | Purging device and purging method for substrate storage container |
| CN103846262A (en) | 2012-12-06 | 2014-06-11 | 台湾积体电路制造股份有限公司 | System and method of cleaning foup |
| TWM506805U (en) | 2015-04-24 | 2015-08-11 | Gudeng Prec Ind Co Ltd | Transmission box |
| CN102658270B (en) | 2012-05-09 | 2016-05-11 | 上海华虹宏力半导体制造有限公司 | A kind of wafer cassette cleaning device and cleaning method thereof |
-
2016
- 2016-06-08 TW TW105118117A patent/TWI653103B/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI322044B (en) | 2002-11-01 | 2010-03-21 | Semitool Inc | Wafer container cleaning system |
| TWI327747B (en) | 2006-01-27 | 2010-07-21 | Dainippon Screen Mfg | Substrate processing apparatus |
| CN102194730A (en) | 2010-03-15 | 2011-09-21 | 三星电子株式会社 | Substrate transfer container, gas purge monitoring tool, and semiconductor manufacturing equipment with the same |
| TW201400199A (en) | 2012-02-03 | 2014-01-01 | Tokyo Electron Ltd | Purging device and purging method for substrate storage container |
| CN102658270B (en) | 2012-05-09 | 2016-05-11 | 上海华虹宏力半导体制造有限公司 | A kind of wafer cassette cleaning device and cleaning method thereof |
| CN103846262A (en) | 2012-12-06 | 2014-06-11 | 台湾积体电路制造股份有限公司 | System and method of cleaning foup |
| TWM506805U (en) | 2015-04-24 | 2015-08-11 | Gudeng Prec Ind Co Ltd | Transmission box |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201742680A (en) | 2017-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6535187B2 (en) | Substrate transfer hand | |
| KR101670594B1 (en) | Wafer carrier | |
| TWI685056B (en) | Substrate holder and plating device | |
| TWI653103B (en) | Device for cleaning wafer container | |
| JP4681485B2 (en) | Wafer case operation method, wafer case transfer method, and wafer case transfer holding part | |
| TW200404349A (en) | Container body for accommodating the processed object | |
| TWI596349B (en) | Probe card housing and probe card transport method | |
| TWM532314U (en) | Device for cleaning wafer container | |
| JP2014067744A5 (en) | ||
| TWI630161B (en) | Substrate transfer chamber and container connection mechanism | |
| KR100460309B1 (en) | Sheet support container | |
| TWI578431B (en) | Substrate container, a load port apparatus, and a substrate treating apparatus | |
| TW201738995A (en) | Substrate transfer apparatus, substrate processing apparatus, and substrate processing method | |
| CN107866426A (en) | wafer cassette cleaning device | |
| JP6232253B2 (en) | Wafer cassette | |
| US10043695B1 (en) | Apparatus for carrying and shielding wafers | |
| WO2014136247A1 (en) | Substrate storage receptacle | |
| JP2017069370A (en) | Transfer mechanism | |
| JPWO2021095295A5 (en) | ||
| JP2014165438A (en) | Substrate position correction method, substrate position correction device, and substrate processing system | |
| JP2008010567A (en) | Pod for carrying article for use in clean room and article carrying system adopting it | |
| KR101533914B1 (en) | Wafer carrier container cleaning for purging apparatus | |
| KR101601600B1 (en) | Wafer carrier container cleaning for purging apparatus | |
| JP6340928B2 (en) | Wafer loading device | |
| JPS6054449A (en) | Conveying jig for semiconductor wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |