CN218014487U - Silicon chip production processing belt cleaning device - Google Patents
Silicon chip production processing belt cleaning device Download PDFInfo
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- CN218014487U CN218014487U CN202221850671.3U CN202221850671U CN218014487U CN 218014487 U CN218014487 U CN 218014487U CN 202221850671 U CN202221850671 U CN 202221850671U CN 218014487 U CN218014487 U CN 218014487U
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- Prior art keywords
- cleaning
- push rod
- electric push
- frame
- cleaning device
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- 238000004140 cleaning Methods 0.000 title claims abstract description 90
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 72
- 239000010703 silicon Substances 0.000 title claims abstract description 72
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000012545 processing Methods 0.000 title claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 239000002253 acid Substances 0.000 claims abstract description 14
- 229910021642 ultra pure water Inorganic materials 0.000 claims abstract description 14
- 239000012498 ultrapure water Substances 0.000 claims abstract description 14
- 235000012431 wafers Nutrition 0.000 claims description 45
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000005406 washing Methods 0.000 abstract description 21
- 238000002791 soaking Methods 0.000 abstract description 3
- 239000007921 spray Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to a belt cleaning device especially relates to a silicon chip production processing belt cleaning device. The utility model aims at providing a can carry out abluent silicon chip production processing belt cleaning device many times to the silicon chip. The utility model provides a such silicon chip production processing belt cleaning device, including base, washing pond, charging box, leading truck and motor etc, base top right side is connected with the washing pond that is used for placing ultrapure water, is connected with two charging boxes that are used for placing acid cleaning liquid and alkaline cleaning liquid on the washing pond, and base top left side also is connected with the charging box, and the leading truck has been placed to one side of base, and the leading truck right side is connected with the motor. The utility model discloses an electric putter is as drive power, can drive the silicon chip and wash in getting into acid cleaning liquid, ultrapure water and alkaline cleaning liquid in proper order down to can carry out a lot of soaking the washing to the silicon chip through acid cleaning liquid, alkaline cleaning liquid and ultrapure water, the cleaning performance is better.
Description
Technical Field
The utility model relates to a belt cleaning device especially relates to a silicon chip production processing belt cleaning device.
Background
In the production of semiconductor devices, silicon wafers are strictly cleaned, trace pollution can also cause device failure, and cleaning aims to remove surface pollution impurities, including organic matters and inorganic matters, wherein the impurities exist on the surfaces of the silicon wafers in an atomic state or an ionic state, and the impurities exist in a thin film form or a particle form, so that various defects can be caused.
Patent application CN110773505A, published as 20200211, discloses a silicon wafer cleaning device and method, relating to the field of semiconductor silicon wafers. The device comprises: the cleaning tank is used for containing cleaning fluid for cleaning the silicon wafer to be cleaned; the cleaning device comprises a plurality of cleaning lines arranged inside a cleaning tank, wherein a certain distance is formed between every two adjacent cleaning lines, and two ends of each cleaning line are respectively connected with the inner side wall of the cleaning tank or a device arranged on the inner side wall; the clamping structure is arranged above the opening of the cleaning tank and used for fixing a plurality of silicon wafers to be cleaned and driving the silicon wafers to move along the vertical direction, the silicon wafers are formed by cutting crystal bars, and gaps among the silicon wafers correspond to the cleaning lines. The embodiment of the patent effectively solves the problems that the prior art cannot effectively clean the opposite surfaces of the adjacent silicon wafers and the cleaning quality is low. Although the above patent can clean silicon wafers, the cleaning effect is poor because the silicon wafers can be cleaned only once.
Aiming at the problem that the silicon wafer can only be cleaned once and the cleaning effect is poor, a silicon wafer production, processing and cleaning device capable of cleaning the silicon wafer for multiple times is urgently needed at present and is used for solving the problem.
SUMMERY OF THE UTILITY MODEL
In order to overcome the shortcoming that the existing silicon wafer cleaning device can only clean the silicon wafer once, the cleaning effect is relatively poor, the utility model aims at providing a can carry out abluent silicon wafer production and processing belt cleaning device many times to the silicon wafer.
The utility model discloses a following technical approach realizes:
the utility model provides a silicon chip production processing belt cleaning device, which comprises a base, wash the pond, the charging box, the leading truck, including a motor, an end cap, a controller, and a cover plate, the lead screw, first electric putter, remove the frame, second electric putter, the fixed block, rack and drain valve, base top right side is connected with the washing pond that is used for placing ultrapure water, be connected with two charging boxes that are used for placing acidic cleaning liquid and alkaline cleaning liquid on the washing pond, base top left side also is connected with the charging box, the leading truck has been placed to one side of base, the leading truck right side is connected with the motor, leading truck upper portion rotary type is provided with the lead screw, the lead screw right-hand member is with the output shaft of motor, a side screw thread formula of lead screw is provided with first electric putter, first electric putter's telescopic link top is connected with removes the frame, both sides all are connected with second electric putter around removing the frame lower part, two second electric putter's telescopic link inboard all is connected with the fixed block, place the rack that is used for placing the silicon chip between two fixed block inboards, the rack is located left charging box, it all is connected with the drain valve and communicates to wash pond charging box bottom.
Further, still including the mount, the electric fan heater, a slide rail, a slide, third electric putter and push pedal, one side of keeping away from first electric putter on the washing pond on right side is connected with the mount, the inside left side of mount is connected with and is used for carrying out the electric fan heater of drying to the silicon chip that washs, both sides all are connected with the slide rail around the bottom in the mount, slidingtype is provided with the slide between two slide rail upper portions, the slide is located the top of electric fan heater, the washing pond right side on right side is connected with third electric putter, third electric putter is located the below of slide, third electric putter's telescopic link right side is connected with the push pedal, push pedal upper portion and slide connection.
Furthermore, the sliding type sliding plate fixing device further comprises a baffle plate, and the upper part of the fixing frame is provided with the baffle plate in a sliding mode, wherein the baffle plate is used for blocking the upper part of the sliding plate.
Furthermore, round holes are uniformly arranged at the top of the sliding plate at intervals.
Further, still including high pressure nozzle, the washing pond left side sub-unit connection on right side has the high pressure nozzle who is used for wasing the pond and communicates.
Further, the rack is made of iron.
Compared with the prior art, the utility model, possess following advantage:
1. the utility model discloses an electric putter is as drive power, can drive the silicon chip and wash in getting into acid cleaning liquid, ultrapure water and alkaline cleaning liquid in proper order down to can carry out a lot of soaking the washing to the silicon chip through acid cleaning liquid, alkaline cleaning liquid and ultrapure water, the cleaning performance is better.
2. The utility model discloses a start the electric fan heater, the electric fan heater can up blow hot-blastly to can dry the silicon chip that washs.
3. The utility model discloses a turn left the promotion with the baffle and close for the baffle blocks mount upper portion, and the baffle can block hot-blastly, thereby can avoid the heat to give off too fast, and then can be better dry the silicon chip that washs.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic view of the three-dimensional structure of the screw rod, the movable frame, the placing frame and other parts of the present invention.
Fig. 3 is a schematic view of the three-dimensional structure of the moving frame, the placing frame, the fixing block and other parts of the present invention.
Fig. 4 is a schematic view of the three-dimensional structure of the fixing frame, the fan heater, the sliding plate and other parts of the present invention.
Fig. 5 is a schematic view of the three-dimensional structure of the slide rail, slide plate and push plate of the present invention.
Reference numbers: 1_ base, 101_ washing pool, 2_ charging box, 3_ guide frame, 301_ motor, 4_ lead screw, 5_ first electric putter, 6_ moving frame, 7_ second electric putter, 8_ fixed block, 9_ rack, 10_ fixed frame, 11_ warm air blower, 12_ slide rail, 13_ slide plate, 14_ third electric putter, 15_ push pedal, 16_ baffle, 17_ drain valve, 18_ high pressure nozzle.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.
Example 1
A silicon wafer production processing cleaning device is shown in figures 1, 2, 3 and 5 and comprises a base 1, a cleaning pool 101, charging boxes 2, a guide frame 3, a motor 301, a screw rod 4, a first electric push rod 5, a moving frame 6, a second electric push rod 7, a fixed block 8, a placing frame 9 and a drain valve 17, wherein the right side of the top of the base 1 is connected with the cleaning pool 101, people can pour a proper amount of ultrapure water into the cleaning pool 101, the cleaning pool 101 is connected with two charging boxes 2, the charging boxes 2 are welded on the left side of the top of the base 1, people can pour a proper amount of acidic cleaning solution into the charging boxes 2 on the left side and the right side, the guide frame 3 is placed behind the base 1, the motor 301 is bolted on the right side of the guide frame 3, the screw rod 4 is rotatably arranged on the upper portion of the guide frame 3, and the right end of the screw rod 4 is connected with an output shaft of the motor 301, 4 left part screw threads of lead screw are provided with first electric putter 5, first electric putter 5's telescopic link shortens and to drive the silicon chip down motion, make the silicon chip get into 2 inside and acid cleaning liquid full contact of left charging box, thereby can wash through acid cleaning liquid, first electric putter 5's telescopic link top is connected with removes frame 6, both sides all are connected with second electric putter 7 around removing frame 6 lower part, two second electric putter 7's telescopic link inboard all is connected with fixed block 8, rack 9 has been placed between two fixed block 8 inboards, rack 9's material is iron, people can put the silicon chip on rack 9 in proper order, rack 9 is located left charging box 2, 2 bottoms of washing pond 101 charging box all are connected with drain valve 17 and communicate.
When the device needs to be used, people firstly place the device at an appointed position, then pour a proper amount of acid cleaning liquid into the charging boxes 2 at the left side and the right side, then pour a proper amount of alkaline cleaning liquid into the middle charging box 2, then pour a proper amount of ultrapure water into the cleaning pool 101, then sequentially place the silicon wafers on the placing frame 9, then start the first electric push rod 5, control the telescopic rod of the first electric push rod 5 to shorten, drive the moving frame 6 to move downwards, the moving frame 6 moves downwards to drive the fixing block 8, the placing frame 9 and the silicon wafers to move downwards, so that the placing frame 9 and the silicon wafers enter the charging box 2 at the left side to fully contact with the acid cleaning liquid, then control the telescopic rod of the first electric push rod 5 to stop moving, thereby soaking and cleaning the silicon wafers through the acid cleaning liquid, and after cleaning, control the telescopic rod of the first electric push rod 5 to extend, driving the moving frame 6 to move upwards, driving the moving frame 6 to move upwards to drive the fixed block 8, the placing frame 9 and the silicon wafer to move upwards for resetting, separating the placing frame 9 and the silicon wafer from the acid cleaning solution, then controlling the telescopic rod of the first electric push rod 5 to stop moving, then starting the motor 301, controlling the output shaft of the motor 301 to rotate forwards to drive the screw rod 4 to rotate forwards, driving the first electric push rod 5 to move rightwards by the screw rod 4 to rotate forwards, driving the moving frame 6, the placing frame 9 and the silicon wafer to move rightwards by the first electric push rod 5 to move, when the placing frame 9 and the silicon wafer move right above the cleaning pool 101, closing the motor 301, controlling the telescopic rod of the first electric push rod 5 to shorten, driving the moving frame 6 to move downwards to drive the fixed block 8, the placing frame 9 and the silicon wafer to move downwards, and enabling the placing frame 9 and the silicon wafer to enter the cleaning pool 101 to fully contact with ultrapure water, then control the telescopic link of first electric putter 5 and stop motion, thereby can rinse the silicon chip once more through ultrapure water, after the washing is accomplished, repeat above-mentioned operation, can make the silicon chip in proper order with alkaline cleaning solution, ultrapure water, acid cleaning solution and ultrapure water contact, thereby accomplish the washing of six times to the silicon chip, then close first electric putter 5, take away the silicon chip that washs in proper order again, then start motor 301, the output shaft reversal of control motor 301 drives lead screw 4 reversal, lead screw 4 reversal drives first electric putter 5 to left movement, first electric putter 5 moves left and drives moving frame 6 and rack 9 and move left and reset, then people close motor 301, open drain valve 17 again, make the acid cleaning solution, alkaline cleaning solution and ultrapure water in washing pond 101 and the charging box 2 can be through drain valve 17 down discharge, after all discharges, close drain valve 17.
Example 2
On the basis of embodiment 1, refer to fig. 4 and 5, the silicon wafer cleaning device further comprises a fixing frame 10, an air heater 11, slide rails 12, a sliding plate 13, a third electric push rod 14 and a push plate 15, the right side of the cleaning pool 101 on the right side is connected with the fixing frame 10, the air heater 11 is welded on the left side inside the fixing frame 10, the air heater 11 is started, the air heater 11 can blow hot air upwards, so that cleaned silicon wafers can be dried, the slide rails 12 are welded on the front side and the rear side of the bottom inside the fixing frame 10, the sliding plate 13 is arranged between the upper portions of the two slide rails 12 in a sliding mode, the sliding plate 13 is located above the air heater 11, round holes are uniformly formed in the top of the sliding plate 13 at intervals, the right side of the cleaning pool 101 on the right side is bolted with the third electric push rod 14, the third electric push rod 14 is located below the sliding plate 13, the right side of a telescopic rod of the third electric push rod 14 is connected with the push plate 15, and the upper portion of the push plate 15 is connected with the sliding plate 13.
After the silicon wafer is cleaned for six times, people can place the placing frame 9 on the top of the sliding plate 13 through the first electric push rod 5, then the second electric push rod 7 is started, the telescopic rod of the second electric push rod 7 is controlled to shorten, the fixing block 8 is driven to move towards the outer side, the placing frame 9 is loosened by the fixing block 8, then the telescopic rod of the second electric push rod 7 is controlled to stop moving, at the moment, people start the fan heater 11, the fan heater 11 can blow hot air upwards, the cleaned silicon wafer can be dried, after drying is completed, people close the fan heater 11, then the third electric push rod 14 is started, the telescopic rod of the third electric push rod 14 is controlled to extend, the push plate 15 is driven to move to the right, the push plate 15 moves to drive the sliding plate 13 to move to the right, the placing frame 9 and the silicon wafer move to the right, the sliding rail 12 plays a guiding role, then people can take the placing frame 9 away, then the telescopic rod of the third electric push rod 14 is controlled to shorten, the push plate 15 and the push rod 13 is driven to move to the left to reset, then the third electric push rod 14 is closed, the dried silicon wafer is taken away, the placing frame 9 is taken away, the placing frame 8 is driven to move towards the fixing block 8, and the fixing block 7 can be clamped, and the fixing block 7 can be closed, and the fixing block 7 can be fixed.
Referring to fig. 5, the silicon wafer drying device further comprises a baffle 16, the baffle 16 is slidably disposed on the upper portion of the fixing frame 10, and the baffle 16 is pushed to the left to close to block the upper portion of the fixing frame 10, so that heat dissipation can be prevented from being too fast, and the cleaned silicon wafer can be dried better.
When needs are dried to the good silicon chip of washing, at first open baffle 16 to the right pulling, make baffle 16 no longer block the top of slide 13, then can place rack 9 at slide 13 top through first electric putter 5, push baffle 16 to the left again and close, make baffle 16 block mount 10 upper portion, then start electric fan heater 11, electric fan heater 11 can up blow hot-blastly, thereby can dry the good silicon chip of washing, baffle 16 can block hot-blastly, thereby can avoid the heat to give off too fast, and then can be better dry the good silicon chip of washing, after the stoving is accomplished, close electric fan heater 11, it can to take away the good silicon chip of drying again.
Referring to fig. 2, the cleaning device further comprises a high-pressure spray head 18, the high-pressure spray head 18 is welded to and communicated with the lower portion of the left side of the right cleaning pool 101, and the high-pressure spray head 18 can spray water into the cleaning pool 101, so that the cleaning pool 101 is cleaned.
When needs are washd inside washing pond 101, people can go up external water pipe on high pressure nozzle 18, then start high pressure nozzle 18, and high pressure nozzle 18 can be injected water inside washing pond 101 to wash washing pond 101, wash the completion back, people close high pressure nozzle 18, extract external water pipe again.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. The silicon wafer production, processing and cleaning device is characterized by comprising a base (1), a cleaning pool (101), a charging box (2), a guide frame (3), a motor (301), a screw rod (4), a first electric push rod (5), a moving frame (6), a second electric push rod (7), a fixed block (8), a placing frame (9) and a drain valve (17), wherein the right side of the top of the base (1) is connected with the cleaning pool (101) for placing ultrapure water, the cleaning pool (101) is connected with the two charging boxes (2) for placing acid cleaning liquid and alkaline cleaning liquid, the left side of the top of the base (1) is also connected with the charging box (2), one side of the base (1) is placed with the guide frame (3), the right side of the guide frame (3) is connected with the motor (301), the upper part of the guide frame (3) is rotatably provided with the screw rod (4), the right end of the screw rod (4) is connected with an output shaft of the motor (301), one side of the screw rod (4) is provided with the first electric push rod (5) in a threaded manner, the top of the first electric push rod (5) is connected with the moving frame (5), the moving frame (6), the front side and the rear side of the moving frame (6) is connected with the second electric push rod (7), the inner side and the inner side of the two fixing frame (8) for placing frame, the placing rack (9) is positioned in the charging box (2) on the left side, and the bottoms of the charging box (2) of the cleaning pool (101) are connected with drain valves (17) and communicated with each other.
2. The silicon wafer production, processing and cleaning device according to claim 1, further comprising a fixing frame (10), a fan heater (11), slide rails (12), a sliding plate (13), a third electric push rod (14) and a push plate (15), wherein the fixing frame (10) is connected to one side, away from the first electric push rod (5), of the cleaning pool (101) on the right side, the fan heater (11) used for drying cleaned silicon wafers is connected to the left side inside the fixing frame (10), the slide rails (12) are connected to the front side and the rear side of the bottom inside the fixing frame (10), the sliding plate (13) is arranged between the upper portions of the two slide rails (12) in a sliding mode, the sliding plate (13) is located above the fan heater (11), the third electric push rod (14) is connected to the right side of the cleaning pool (101) on the right side, the third electric push rod (14) is located below the sliding plate (13), the push plate (15) is connected to the right side of a telescopic rod of the third electric push rod (14), and the upper portion of the push plate (15) is connected with the sliding plate (13).
3. The silicon wafer production, processing and cleaning device according to claim 2, further comprising a baffle (16), wherein the baffle (16) is slidably arranged on the upper portion of the fixing frame (10) and used for blocking the upper portion of the sliding plate (13).
4. The silicon wafer production processing cleaning device as claimed in claim 3, wherein the top of the sliding plate (13) is evenly spaced with round holes.
5. The silicon wafer production processing cleaning device according to claim 4, further comprising a high pressure nozzle (18), wherein the left lower part of the right cleaning tank (101) is connected and communicated with the high pressure nozzle (18) for cleaning the cleaning tank (101).
6. The silicon wafer production, processing and cleaning device as claimed in claim 1, wherein the rack (9) is made of iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221850671.3U CN218014487U (en) | 2022-07-19 | 2022-07-19 | Silicon chip production processing belt cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221850671.3U CN218014487U (en) | 2022-07-19 | 2022-07-19 | Silicon chip production processing belt cleaning device |
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| Publication Number | Publication Date |
|---|---|
| CN218014487U true CN218014487U (en) | 2022-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221850671.3U Active CN218014487U (en) | 2022-07-19 | 2022-07-19 | Silicon chip production processing belt cleaning device |
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| Country | Link |
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| CN (1) | CN218014487U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115945431A (en) * | 2022-12-15 | 2023-04-11 | 无锡升滕半导体技术有限公司 | Special semiconductor equipment spare part belt cleaning device |
-
2022
- 2022-07-19 CN CN202221850671.3U patent/CN218014487U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115945431A (en) * | 2022-12-15 | 2023-04-11 | 无锡升滕半导体技术有限公司 | Special semiconductor equipment spare part belt cleaning device |
| CN115945431B (en) * | 2022-12-15 | 2024-02-02 | 无锡升滕半导体技术有限公司 | Special semiconductor device spare part belt cleaning device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240913 Address after: No. 718 Xingfu Road, Nantong City, Jiangsu Province, 226000 Patentee after: Jiangsu Kilby New Materials Technology Co.,Ltd. Country or region after: China Patentee after: Rugao compound semiconductor industry Research Institute Address before: 226500 2nd floor, building 3, electronic information industrial park, No. 2, Haiyang South Road, Chengnan street, Rugao City, Nantong City, Jiangsu Province Patentee before: Nantong Fudian semiconductor material technology Co.,Ltd. Country or region before: China Patentee before: Rugao compound semiconductor industry Research Institute |
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| TR01 | Transfer of patent right |