CN214371497U - Drying device for cleaning silicon wafer - Google Patents
Drying device for cleaning silicon wafer Download PDFInfo
- Publication number
- CN214371497U CN214371497U CN202022837822.9U CN202022837822U CN214371497U CN 214371497 U CN214371497 U CN 214371497U CN 202022837822 U CN202022837822 U CN 202022837822U CN 214371497 U CN214371497 U CN 214371497U
- Authority
- CN
- China
- Prior art keywords
- machine body
- cleaning
- hole
- drying device
- silicon chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 61
- 239000010703 silicon Substances 0.000 title claims abstract description 61
- 238000001035 drying Methods 0.000 title claims abstract description 43
- 238000004140 cleaning Methods 0.000 title claims description 34
- 238000005406 washing Methods 0.000 claims abstract description 6
- 235000012431 wafers Nutrition 0.000 claims description 36
- 238000005192 partition Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to a silicon chip technology field just discloses a be used for abluent drying device of silicon chip, which comprises a bod, the inner diapire of organism is provided with the washing tank, the inside wall fixedly connected with baffle of organism, the interior roof fixed mounting of organism has the drying apparatus, the inside wall swing joint of organism has the pivot, two discs of side surface fixedly connected with of pivot, two splint have been cup jointed in the side surface activity of pivot. This a drying device for silicon chip washing through mutually supporting between pivot, disc, splint, double-layered groove, through-hole, spacing hole, gag lever post, spring and the servo motor to can carry out the centre gripping to the silicon chip and fix, then drive the silicon chip through servo motor and rotate, can spin-dry the water mark on the silicon chip earlier before drying, then dry the silicon chip through the drying apparatus, saved the time, improved drying efficiency.
Description
Technical Field
The utility model relates to a silicon chip technology field specifically is a be used for abluent drying device of silicon chip.
Background
The silicon chip is an important substrate material in the field of semiconductors; in the production of semiconductor devices, silicon wafers are strictly cleaned, the devices are also disabled due to trace pollution, and the cleaning aims to remove the polluted impurities on the surfaces of the silicon wafers, including organic matters and inorganic matters.
After the silicon wafer is cleaned, the silicon wafer needs to be dried, however, after the silicon wafer is cleaned, a large amount of water stains are remained on the surface of the silicon wafer, the silicon wafer is directly placed into a drying device to be dried, the drying efficiency can be reduced, more drying time is wasted, and therefore the problem that the drying device for cleaning the silicon wafer needs to be solved.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a be used for abluent drying device of silicon chip possesses and is convenient for dry to the silicon chip, saves time, improves advantages such as drying efficiency, has solved the silicon chip and has washd the back, and a large amount of water marks can be remained on the surface, and the inside of drying device is put into directly with the silicon chip easily and is dried, can reduce drying efficiency to extravagant more stoving time's problem.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: a drying device for cleaning silicon wafers comprises a machine body, wherein a cleaning groove is arranged on the inner bottom wall of the machine body, the inner side wall of the machine body is fixedly connected with a clapboard, the inner top wall of the machine body is fixedly provided with a dryer, the inner side wall of the machine body is movably connected with a rotating shaft, the side surface of the rotating shaft is fixedly connected with two discs, two clamping plates are movably sleeved on the side surface of the rotating shaft, clamping grooves are formed in the opposite sides of the two clamping plates, through holes are formed in the opposite sides of the two clamping plates, limiting rods are fixedly connected to the opposite sides of the two discs, springs are fixedly connected to the opposite sides of the two discs, the right side fixed mounting of organism has servo motor, the inside in double-layered groove is provided with the silicon chip, the front of organism is provided with the washing door, the front of organism is provided with the stoving door.
Preferably, the right side wall of the machine body is movably connected with a baffle, the left side of the machine body is fixedly connected with a fixing strip, a connecting hole which penetrates through the baffle in the left and right directions is formed in the baffle, a positioning hole is formed in the right side wall of the machine body, and a positioning pin is movably inserted in the connecting hole.
Preferably, the baffle is located above the clamping plate, the connecting holes correspond to the positioning holes in position, and the right end of the positioning pin is movably inserted into the positioning holes.
Preferably, the partition plate is located right above the cleaning tank, the partition plate is located right below the clamping plate, the cleaning door corresponds to the cleaning tank, and the drying door is located right above the cleaning door.
Preferably, the through hole is communicated with the clamping groove, the output end of the servo motor penetrates through the right side of the machine body and extends to the right side wall of the machine body, and the output end of the servo motor is fixedly connected with the right end of the rotating shaft.
Preferably, the one end that the disc was kept away from to the gag lever post is pegged graft with the inside activity in spacing hole, the one end that the disc was kept away from to the spring is connected with the inner wall fixed connection in spacing hole, the spring cup joints with the gag lever post activity.
Compared with the prior art, the utility model provides a be used for abluent drying device of silicon chip possesses following beneficial effect:
1. this a drying device for silicon chip washing through mutually supporting between pivot, disc, splint, double-layered groove, through-hole, spacing hole, gag lever post, spring and the servo motor to can carry out the centre gripping to the silicon chip and fix, then drive the silicon chip through servo motor and rotate, can spin-dry the water mark on the silicon chip earlier before drying, then dry the silicon chip through the drying apparatus, saved the time, improved drying efficiency.
2. This a drying device for silicon chip is abluent, through the mutually supporting between baffle, fixed strip, connecting hole, locating hole and the locating pin, extract the locating pin from the locating hole, then rotate the baffle downwards for the top overlap joint of baffle and fixed strip, then can prevent that the water stain that produces from splashing to the drying apparatus when the silicon chip rotates, cause the influence to the drying apparatus, thereby improved the life of drying apparatus.
Drawings
FIG. 1 is a front sectional view of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a sectional view of the structure of the splint of the present invention;
fig. 4 is an enlarged view of a structure in fig. 3 according to the present invention.
Wherein: 1. a body; 2. a cleaning tank; 3. a partition plate; 4. a dryer; 5. a rotating shaft; 6. a disc; 7. a splint; 8. a clamping groove; 9. a through hole; 10. a limiting hole; 11. a limiting rod; 12. a spring; 13. a servo motor; 14. a silicon wafer; 15. cleaning the door; 16. a drying door; 17. a baffle plate; 18. a fixing strip; 19. connecting holes; 20. positioning holes; 21. and a positioning pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a drying device for cleaning silicon wafers comprises a machine body 1, a cleaning tank 2 is disposed on an inner bottom wall of the machine body 1, the bottom of the cleaning tank 2 is overlapped with the inner bottom wall of the machine body 1, a partition plate 3 is fixedly connected to an inner side wall of the machine body 1, front and rear sides of the partition plate 3 are respectively fixed to front and rear inner walls of the machine body 1, left and right sides of the partition plate 3 are respectively fixed to left and right sides of the machine body 1, a dryer 4 is fixedly mounted on an inner top wall of the machine body 1, the interior of the machine body 1 is heated by the dryer 4, and silicon wafers 14 inside the machine body 1 can be dried, a rotating shaft 5 is movably connected to the inner side wall of the machine body 1, left and right ends of the rotating shaft 5 are respectively movably connected to the left and right inner walls of the machine body 1, two discs 6 are fixedly connected to side surfaces of the rotating shaft 5, the two discs 6 are symmetrical to the left and right of a central axis of the rotating shaft 5, two clamping plates 7 are movably sleeved on the side surface of the rotating shaft 5, the two clamping plates 7 are respectively positioned at the left side and the right side of the two discs 6, clamping grooves 8 are respectively arranged at the opposite sides of the two clamping plates 7, six clamping grooves 8 are respectively arranged on each clamping plate 7, through holes 9 are respectively arranged at the back sides of the two clamping plates 7, six through holes 9 are respectively arranged on each clamping plate 7, limiting holes 10 are respectively arranged at the opposite sides of the two clamping plates 7, four limiting holes 10 are respectively arranged on each clamping plate 7, a limiting rod 11 is fixedly connected at the back side of each disc 6, four limiting rods 11 are fixedly connected at each disc 6, springs 12 are fixedly connected at the back side of each disc 6, four springs 12 are fixedly connected at each disc 6, one end of each limiting rod 11, far away from the disc 6, is movably inserted in the limiting holes 10, and one end of each spring 12, far away from the disc 6, is fixedly connected with the inner wall of each limiting hole 10, the spring 12 is movably sleeved with a limiting rod 11, a servo motor 13 is fixedly installed on the right side of the machine body 1, a through hole 9 is communicated with the clamping groove 8, the output end of the servo motor 13 penetrates through the right side of the machine body 1 and extends to the right side wall of the machine body 1, the output end of the servo motor 13 is fixedly connected with the right end of the rotating shaft 5, the rotating shaft 5 is driven to rotate through the servo motor 13, the disc 6 rotates together, the limiting rod 11 on the disc 6 is movably inserted into a limiting hole 10 on the clamping plate 7, the clamping plate 7 can be driven to rotate, the silicon wafer 14 is driven to rotate, water marks on the silicon wafer 14 can be dried, then the silicon wafer is dried through the dryer 4, the silicon wafer 14 is arranged inside the clamping groove 8, the cleaning door 15 is arranged on the front side of the machine body 1, the drying door 16 is arranged on the front side of the machine body 1, the partition plate 3 is positioned right above the cleaning groove 2, the partition plate 3 is positioned right below the clamping plate 7, the cleaning door 15 corresponds to the cleaning tank 2, the drying door 16 is positioned right above the cleaning door 15, the drying area and the cleaning area can be separated by arranging the partition plate 3, the right side wall of the machine body 1 is movably connected with the baffle plate 17, the left side of the machine body 1 is fixedly connected with the fixing strip 18, after the baffle plate 17 is rotated downwards, the baffle plate 17 is lapped with the top of the fixing strip 18, thereby preventing water marks generated when the silicon wafer 14 rotates from splashing on the dryer 4, protecting the dryer 4, the inside of the baffle plate 17 is provided with a connecting hole 19 which penetrates left and right, the right side wall of the machine body 1 is provided with a positioning hole 20, the inside of the connecting hole 19 is movably inserted with a positioning pin 21, the baffle plate 17 is positioned above the clamping plate 7, the connecting hole 19 corresponds to the positioning hole 20, the right end of the positioning pin 21 is movably inserted with the inside of the positioning hole 20, the positioning pin 21 is sequentially movably inserted with the connecting hole 19 and the positioning hole 20, therefore, the baffle 17 can be prevented from rotating, and when the baffle 17 is lapped with the right side wall of the machine body 1, the dryer 4 is convenient to dry the silicon wafers 14.
When the silicon wafer cleaning device is used, a silicon wafer 14 is firstly placed in the cleaning groove 2 for cleaning, after the cleaning is finished, the cleaning door 15 is opened, the silicon wafer is taken out of the cleaning groove 2, then the drying door 16 is opened, the cleaned silicon wafer 14 is placed above the partition plate 3, then the clamping plate 7 on the right side is moved rightwards, the spring 12 is made to lengthen, the distance between the two clamping plates 7 is made to lengthen, so that one side of the cleaned silicon wafer 14 can be placed in the clamping groove 8 on the clamping plate 7 on the left side, after the silicon wafer 14 is fully placed in the six clamping grooves 8, the clamping plate 7 on the right side is released, the clamping plate 7 on the right side is restored by the spring 12 under the action of the spring 12 and drives the clamping plate 7 on the right side to move leftwards, so that the clamping groove 8 on the clamping plate 7 on the right side is sleeved with the right side of the silicon wafer 14, the silicon wafer can be clamped and fixed by the two clamping plates 7, and then the positioning pin 21 is pulled out of the positioning hole 20, the baffle 17 can rotate downwards, the baffle 17 is in lap joint with the top of the fixing strip 18, the drying door 16 is closed, the servo motor 13 is opened, the rotating shaft 5 is driven to rotate through the servo motor 13, the disc 6 rotates together, the clamping plate 7 can be driven to rotate together through the rotation of the disc 6, water marks on the silicon wafer 14 can be dried, the water marks inside the clamping groove 8 can be discharged from the through hole 9, after the water marks are dried, the baffle 17 rotates upwards, the positioning pin 21 is sequentially inserted into the connecting hole 19 and the positioning hole 20, the baffle 17 is prevented from rotating, the drying door 16 is closed finally, and the dryer 4 is opened to dry the silicon wafer 14.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a drying device for silicon chip washs, includes organism (1), its characterized in that: the inner bottom wall of the machine body (1) is provided with a cleaning groove (2), the inner side wall of the machine body (1) is fixedly connected with a partition plate (3), the inner top wall of the machine body (1) is fixedly provided with a dryer (4), the inner side wall of the machine body (1) is movably connected with a rotating shaft (5), the side surface of the rotating shaft (5) is fixedly connected with two discs (6), the side surface of the rotating shaft (5) is movably sleeved with two clamping plates (7), one sides of the two clamping plates (7) opposite to each other are respectively provided with a clamping groove (8), one sides of the two clamping plates (7) opposite to each other are respectively provided with a through hole (9), one sides of the two clamping plates (7) opposite to each other are respectively provided with a limiting hole (10), one sides of the two discs (6) opposite to each other are fixedly connected with a limiting rod (11), and one sides of the two discs (6) opposite to each other are fixedly connected with a spring (12), the silicon wafer clamping device is characterized in that a servo motor (13) is fixedly mounted on the right side of the machine body (1), a silicon wafer (14) is arranged inside the clamping groove (8), a cleaning door (15) is arranged on the front side of the machine body (1), and a drying door (16) is arranged on the front side of the machine body (1).
2. The drying device for cleaning the silicon wafers as claimed in claim 1, wherein: the right side wall of the machine body (1) is movably connected with a baffle (17), the left side of the machine body (1) is fixedly connected with a fixing strip (18), a connecting hole (19) which penetrates through the left side and the right side is formed in the baffle (17), a positioning hole (20) is formed in the right side wall of the machine body (1), and a positioning pin (21) is movably inserted in the connecting hole (19).
3. The drying device for cleaning the silicon wafers as claimed in claim 2, wherein: the baffle (17) is positioned above the clamping plate (7), the connecting hole (19) corresponds to the positioning hole (20), and the right end of the positioning pin (21) is movably inserted into the positioning hole (20).
4. The drying device for cleaning the silicon wafers as claimed in claim 1, wherein: baffle (3) are located washing tank (2) directly over, baffle (3) are located splint (7) directly under, it is corresponding with the position of washing tank (2) to wash door (15), stoving door (16) are located and wash door (15) directly over.
5. The drying device for cleaning the silicon wafers as claimed in claim 1, wherein: through-hole (9) and clamp groove (8) intercommunication each other, the right side of organism (1) is run through to the output of servo motor (13) to extend to the right side wall of organism (1), the output of servo motor (13) and the right-hand member fixed connection of pivot (5).
6. The drying device for cleaning the silicon wafers as claimed in claim 1, wherein: one end of the limiting rod (11) far away from the disc (6) is movably connected with the inside of the limiting hole (10) in an inserting mode, one end of the spring (12) far away from the disc (6) is fixedly connected with the inner wall of the limiting hole (10), and the spring (12) is movably connected with the limiting rod (11) in an inserting mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022837822.9U CN214371497U (en) | 2020-12-01 | 2020-12-01 | Drying device for cleaning silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022837822.9U CN214371497U (en) | 2020-12-01 | 2020-12-01 | Drying device for cleaning silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214371497U true CN214371497U (en) | 2021-10-08 |
Family
ID=77980371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022837822.9U Expired - Fee Related CN214371497U (en) | 2020-12-01 | 2020-12-01 | Drying device for cleaning silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214371497U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114308865A (en) * | 2021-12-28 | 2022-04-12 | 江苏英思特半导体科技有限公司 | Be used for abluent rotatory basket of flowers of silicon core |
-
2020
- 2020-12-01 CN CN202022837822.9U patent/CN214371497U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114308865A (en) * | 2021-12-28 | 2022-04-12 | 江苏英思特半导体科技有限公司 | Be used for abluent rotatory basket of flowers of silicon core |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211008 |