CN216174632U - Semiconductor silicon wafer cleaning device with water circulation mechanism - Google Patents

Semiconductor silicon wafer cleaning device with water circulation mechanism Download PDF

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Publication number
CN216174632U
CN216174632U CN202122355042.5U CN202122355042U CN216174632U CN 216174632 U CN216174632 U CN 216174632U CN 202122355042 U CN202122355042 U CN 202122355042U CN 216174632 U CN216174632 U CN 216174632U
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wall
silicon wafer
water
cleaning device
box
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CN202122355042.5U
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Chinese (zh)
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赵细海
韩忠良
李方良
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Conway Automation Technology Kunshan Co ltd
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Conway Automation Technology Kunshan Co ltd
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Abstract

The utility model discloses a semiconductor silicon wafer cleaning device with a water circulation mechanism, relates to the technical field of silicon wafer cleaning, and aims at the existing problems. The cleaning device can adsorb and filter cleaned water for secondary utilization, realizes water circulation and saves water resource consumption, can drive the silicon wafer to rotate by using the electric rotating table, and simultaneously drives the spray head to move back and forth by using the double-motor sliding table, so that the front and back surfaces of the silicon wafer are effectively washed, the cleaning effect is effectively improved, the silicon wafer can be dried after being heated by the electric heating wire by blowing by using the electric fan, and secondary pollution to the surface of the silicon wafer caused by manual cleaning is avoided.

Description

Semiconductor silicon wafer cleaning device with water circulation mechanism
Technical Field
The utility model relates to the technical field of silicon wafer cleaning, in particular to a semiconductor silicon wafer cleaning device with a water circulation mechanism.
Background
With the continuous development of large-scale integrated circuits, the requirement on the surface cleanliness of a polished silicon wafer is higher and higher, and particularly the cleanliness of the front side of the silicon wafer is very important for the processing of integrated circuits in the later stage, so that the cleaning of the silicon wafer is one of the key processes for processing the silicon wafer. At present, the cleaning process mainly cleans small-size silicon wafers, but for large-size silicon wafers, along with the increase of the area of the silicon wafers, water liquid sprayed by the existing spraying mode cannot completely cover the front surface of the silicon wafers.
Therefore, Chinese patent (application No. 202020774475.7) discloses a semiconductor silicon wafer cleaning and spraying device, which sprays by arranging two groups of spraying pipes corresponding to different positions on the front surface of a silicon wafer, so that the surface area of the front surface of the silicon wafer is considered, but the device does not have a water circulation function, so that water resource consumption is high, and meanwhile, the device does not have a drying function, and after the silicon wafer is cleaned, the silicon wafer is manually wiped, so that secondary pollution is easily caused on the surface of the silicon wafer.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a semiconductor silicon wafer cleaning device with a water circulation mechanism.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a semiconductor silicon chip belt cleaning device with hydrologic cycle mechanism, has all welded the box, stoving mechanism and the fixture of backup pad including bottom outer wall both ends, two motor sliding tables are installed to box top inner wall, and one of them slider bottom of two motor sliding tables is fixed with the shower nozzle, another slider bottom of two motor sliding tables is fixed with stoving mechanism, and the box below is equipped with the water tank, the inner wall welding of water tank one side has the baffle, and has placed the absorption box with a net on the baffle, the water pump is installed to box one side outer wall, and box one side outer wall pegs graft through the bearing and have fixture, box one side outer wall welding has the mounting panel, and mounting panel top outer wall installs electric rotary table, electric rotary table rotates the piece and is connected with fixture.
Preferably, the drying mechanism comprises a connecting pipe, an electric fan is mounted on the inner wall of the connecting pipe through a fixed rod, and heating wires distributed at equal intervals are fixed on the inner wall of the connecting pipe.
Preferably, the clamping mechanism comprises a rotating rod, an electric clamping jaw is welded on the outer wall of one side of the rotating rod, clamping plates are fixed on two clamping pieces of the electric clamping jaw, and an electric slip ring is installed on the outer wall of the rotating rod.
Preferably, the inner wall of the bottom of the box body is welded with a sewer pipe, and the adsorption net cage is filled with active carbon.
Preferably, the water inlet end of the water pump is communicated with the inside of the water tank through a water inlet pipe, the water outlet end of the water pump is communicated with the spray head through a water outlet pipe, cleaning water is contained in the water tank, and the liquid level of the cleaning water is two to three centimeters lower than the outer wall of the bottom of the baffle.
Preferably, the outer wall of the front surface of the box body is provided with a mounting opening, and the inner wall of the mounting opening is hinged with a door plate with a transparent observation window.
Preferably, the electric clamping jaw is connected with the electric slip ring through a wire, the electric slip ring, the double-motor sliding table, the water pump, the electric rotating table, the electric fan and the heating wire are all connected with a switch through wires, and the switch is connected with an external power supply through a power line.
The utility model has the beneficial effects that:
1. the cleaned water can be adsorbed and filtered through the activated carbon in the adsorption net cage for secondary utilization, so that water circulation is realized, and the consumption of water resources is saved;
2. after the silicon wafer is cleaned, the electric fan can be used for blowing air to be heated by the heating wire, the silicon wafer is dried, secondary pollution to the surface of the silicon wafer caused by manual wiping is avoided, and meanwhile, the transparent observation window on the door plate can be used for observing in the process of cleaning and drying the silicon wafer.
Drawings
FIG. 1 is a perspective sectional view of a semiconductor silicon wafer cleaning apparatus with a water circulation mechanism according to the present invention;
FIG. 2 is a first perspective view of a semiconductor wafer cleaning apparatus with a water circulation mechanism according to the present invention;
FIG. 3 is a second perspective view of the semiconductor wafer cleaning apparatus with a water circulation mechanism according to the present invention;
FIG. 4 is a perspective cross-sectional view of a connection pipe of a semiconductor silicon wafer cleaning apparatus having a water circulation mechanism according to the present invention.
In the figure: 1. a box body; 2. a support plate; 3. a double-motor sliding table; 4. a spray head; 5. a water tank; 6. a baffle plate; 7. adsorbing the net cage; 8. a water pump; 9. mounting a plate; 10. an electric rotating table; 11. a connecting pipe; 12. an electric fan; 13. an electric heating wire; 14. a rotating rod; 15. an electric jaw; 16. a splint; 17. a door panel; 18. an electrical slip ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a semiconductor silicon wafer cleaning device with a water circulation mechanism comprises a box body 1, a drying mechanism and a clamping mechanism, wherein supporting plates 2 are welded at two ends of the outer wall of the bottom of the box body 1, a mounting opening is formed in the outer wall of the front side of the box body 1, a door plate 17 with a transparent observation window is hinged to the inner wall of the mounting opening, a sewer pipe is welded to the inner wall of the bottom of the box body 1, activated carbon is filled in an adsorption net box 7, cleaned water can be adsorbed and filtered through the activated carbon in the adsorption net box 7 for secondary utilization, water circulation is achieved, and water resource consumption is saved;
the clamping mechanism comprises a rotating rod 14, an electric clamping jaw 15 is welded on the outer wall of one side of the rotating rod 14, the electric clamping jaw 15 is connected with an electric slip ring 18 through a lead, the electric slip ring 18, a double-motor sliding table 3, a water pump 8, an electric rotating table 10, an electric fan 12 and a heating wire 13 are connected with a switch through leads, the switch is connected with an external power supply through a power line, clamping plates 16 are fixed on two clamping pieces of the electric clamping jaw 15, the electric slip ring 18 is installed on the outer wall of the rotating rod 14, the drying mechanism comprises a connecting pipe 11, the inner wall of the connecting pipe 11 is provided with the electric fan 12 through a fixed rod, after the silicon wafer is cleaned, the silicon wafer is dried through the heating wire 13 by blowing with the electric fan 12, secondary pollution to the surface of the silicon wafer caused by manual cleaning is avoided, and meanwhile, observation can be carried out in the process of cleaning and drying the silicon wafer through a transparent observation window on a door panel 17;
heating wires 13 which are distributed equidistantly are fixed on the inner wall of the connecting pipe 11, a double-motor sliding table 3 is installed on the inner wall of the top of the box body 1, a spray nozzle 4 is fixed on the bottom of one sliding piece of the double-motor sliding table 3, a drying mechanism is fixed on the bottom of the other sliding piece of the double-motor sliding table 3, a water tank 5 is arranged below the box body 1, a baffle 6 is welded on the inner wall of one side of the water tank 5, an adsorption net cage 7 is placed on the baffle 6, a water pump 8 is installed on the outer wall of one side of the box body 1, the water inlet end of the water pump 8 is communicated with the inside of the water tank 5 through a water inlet pipe, the water outlet end of the water pump 8 is communicated with the spray nozzle 4 through a water outlet pipe, cleaning water is contained in the water tank 5, the liquid level of the cleaning water is two to three centimeters lower than the outer wall of the bottom of the baffle 6, a clamping mechanism is inserted through a bearing on the outer wall of one side of the box body 1, a mounting plate 9 is welded on the outer wall of one side of the box body, and an electric rotating table 10 is installed on the outer wall of the top of the mounting plate 9, the rotating member of the electric rotating table 10 is connected to the clamping mechanism.
The working principle is as follows: open door plant 17, put into box 1 with the silicon chip, utilize electronic clamping jaw 15 to fix its centre gripping, close door plant 17, take out the water in the water tank 5 to shower nozzle 4 department blowout through water pump 8, drive bull stick 14 through electronic revolving stage 10 and rotate, and then drive the silicon chip and rotate, drive shower nozzle 4 through two motor sliding table 3 simultaneously and carry out round trip movement, make the positive and negative of silicon chip all obtain effectual washing, the water that washes flows into in water tank 5 through the downcomer, flow into the bottom in the water tank 5 again after the active carbon absorption purification in the absorption box with a net 7, after washing the silicon chip, accessible two motor sliding table 3 move connecting pipe 11 to suitable position, utilize electric fan 12 to blow after heating wire 13 heats, dry the silicon chip.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims (7)

1. The utility model provides a semiconductor silicon wafer belt cleaning device with water circulation mechanism, includes that bottom outer wall both ends all weld box (1), stoving mechanism and fixture of backup pad (2), its characterized in that, two motor sliding tables (3) are installed to box (1) top inner wall, and is fixed with shower nozzle (4) bottom one of them slider of two motor sliding tables (3), another slider bottom of two motor sliding tables (3) is fixed with stoving mechanism, and is equipped with water tank (5) below box (1), the inner wall welding of water tank (5) one side has baffle (6), and has placed on baffle (6) and adsorb screen box (7), water pump (8) are installed to box (1) one side outer wall, and box (1) one side outer wall has inserted clamping mechanism through the bearing, box (1) one side outer wall welding has mounting panel (9), and mounting panel (9) top outer wall installs electronic revolving stage (10), the rotating piece of the electric rotating table (10) is connected with the clamping mechanism.
2. The semiconductor silicon wafer cleaning device with the water circulation mechanism as claimed in claim 1, wherein the drying mechanism comprises a connecting pipe (11), and an electric fan (12) is installed on the inner wall of the connecting pipe (11) through a fixing rod, and heating wires (13) are fixed on the inner wall of the connecting pipe (11) and distributed at equal intervals.
3. The semiconductor silicon wafer cleaning device with the water circulation mechanism is characterized in that the clamping mechanism comprises a rotating rod (14), a power-driven clamping jaw (15) is welded on the outer wall of one side of the rotating rod (14), clamping plates (16) are fixed on two clamping pieces of the power-driven clamping jaw (15), and an electric slip ring (18) is installed on the outer wall of the rotating rod (14).
4. The semiconductor silicon wafer cleaning device with the water circulation mechanism is characterized in that a sewer pipe is welded on the inner wall of the bottom of the box body (1), and the adsorption net cage (7) is filled with activated carbon.
5. The semiconductor silicon wafer cleaning device with the water circulation mechanism is characterized in that the water inlet end of the water pump (8) is communicated with the inside of the water tank (5) through a water inlet pipe, the water outlet end of the water pump (8) is communicated with the spray head (4) through a water outlet pipe, cleaning water is contained in the water tank (5), and the liquid level of the cleaning water is two to three centimeters lower than the outer wall of the bottom of the baffle plate (6).
6. The semiconductor silicon wafer cleaning device with the water circulation mechanism is characterized in that a mounting opening is formed in the outer wall of the front surface of the box body (1), and a door panel (17) with a transparent observation window is hinged to the inner wall of the mounting opening.
7. The semiconductor silicon wafer cleaning device with the water circulation mechanism is characterized in that the electric clamping jaw (15) is connected with the electric slip ring (18) through a lead, the electric slip ring (18), the double-motor sliding table (3), the water pump (8), the electric rotating table (10), the electric fan (12) and the heating wire (13) are all connected with a switch through leads, and the switch is connected with an external power supply through a power cord.
CN202122355042.5U 2021-09-28 2021-09-28 Semiconductor silicon wafer cleaning device with water circulation mechanism Active CN216174632U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122355042.5U CN216174632U (en) 2021-09-28 2021-09-28 Semiconductor silicon wafer cleaning device with water circulation mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122355042.5U CN216174632U (en) 2021-09-28 2021-09-28 Semiconductor silicon wafer cleaning device with water circulation mechanism

Publications (1)

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CN216174632U true CN216174632U (en) 2022-04-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115055429A (en) * 2022-06-22 2022-09-16 深圳净界科技有限公司 Can repeatedly glue resistant washing dust pelletizing system of gluing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115055429A (en) * 2022-06-22 2022-09-16 深圳净界科技有限公司 Can repeatedly glue resistant washing dust pelletizing system of gluing

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