CN217411651U - MEMS wafer spraying device - Google Patents
MEMS wafer spraying device Download PDFInfo
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- CN217411651U CN217411651U CN202220776705.2U CN202220776705U CN217411651U CN 217411651 U CN217411651 U CN 217411651U CN 202220776705 U CN202220776705 U CN 202220776705U CN 217411651 U CN217411651 U CN 217411651U
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- storage tank
- liquid storage
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Abstract
The utility model relates to a MEMS wafer's spray set, its characterized in that: the cleaning device comprises a shell (1), wherein an autorotation wafer rack (2) is installed in the shell (1), the autorotation wafer rack (2) comprises a rotary table (21) and a plurality of supporting rods (22), the supporting rods (22) are perpendicular to the disc surface of the rotary table (21), each supporting rod (22) is formed by connecting a plurality of column sections (221), one of the adjacent column sections (211) extends to form an external thread section (2211), the other opposite column section is provided with a threaded hole (2212) matched with the external thread section, the external thread section (2211) of each column section is in threaded connection with the threaded hole (2212) of the adjacent column section (221), an elastic gasket (222) is embedded between the adjacent end parts of each column section (221), and a pump body is connected with a nozzle (4) through a pipeline to extract cleaning liquid.
Description
Technical Field
The utility model belongs to the wafer washs the field, concretely relates to but spray set of self-cleaning MEMS wafer.
Background
In the manufacturing process of the 3D MEMS semiconductor probe card, processes such as photoetching, etching, micro-electroforming, chemical mechanical polishing and the like need to be carried out, and for the photoetching process, processes such as preparing a wafer, cleaning, drying, spin coating, pre-drying, aligning, polishing, developing, corroding, removing photoresist and the like need to be carried out. Wafer cleaning and drying are the most common process steps in MEMS fabrication processes.
The surface of the wafer is contaminated with particles, metals, organic matters, moisture molecules, natural oxide films and the like deposited on the surface. At present, the main cleaning process is manual washing, and the defects are that the efficiency is low, the flow rate and the temperature of cleaning liquid are difficult to control, and the cleaning is not clean. The wafer is dried immediately after being cleaned, the hot nitrogen can dry the surface liquid after being cleaned, the main drying mode is similar to the cleaning mode at present, the wafer is placed on an operation table for manual operation drying, and the efficiency is low.
With the rapid development of the 3D MEMS probe card, the requirement for surface quality is higher and higher, and cleaning and drying are more important as an important process, and a spray device capable of automatically cleaning the MEMS wafer is urgently needed to improve the cleaning quality and efficiency.
Disclosure of Invention
The utility model aims at providing a but spray set of self-cleaning MEMS wafer.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a spraying device of an MEMS wafer comprises a shell, a cleaning space is arranged in the shell, an autorotation wafer rack is arranged in the cleaning space and comprises a rotary table and a plurality of support rods, the rotary table is rotatably supported relative to the shell, the support rods are perpendicular to the disc surface of the rotary table, each support rod is formed by connecting a plurality of column sections, one of the column sections extends to form an external thread section on the end part of each pair of adjacent column sections, the other opposite column section is provided with a threaded hole matched with the external thread section, the external thread section of each column section is in threaded connection with the threaded hole of the adjacent column section, an elastic gasket is embedded between the adjacent end parts of each column section, a circle of wafer positioning grooves are circumferentially arranged on the elastic gasket, and the wafer positioning grooves of the elastic gaskets on the support rods correspond to each other to form a multilayer wafer positioning structure; the turntable is driven to rotate by a rotary driving device; a nozzle is arranged on the shell or in the shell opposite to the self-rotating wafer frame and is connected with a pump body through a pipeline so as to extract the cleaning liquid.
In the scheme, the disc surface of the turntable of the autorotation wafer rack is arranged along the horizontal direction, and each support rod is downwards arranged along the vertical line direction; the nozzles are disposed on one or more side walls of the housing in a horizontal circumferential direction.
In the above scheme, the turntable is movably arranged along the length direction of the supporting rod relative to the shell, and a linear driving device is further acted on the turntable to drive the turntable to perform translational reciprocating motion.
In the scheme, the middle part of the shell is provided with a partition plate so as to divide the inner space of the shell into the cleaning space at the upper part and the pump body installation space at the lower part; the pump body is arranged in the pump body installation space.
Further, a liquid storage tank is arranged at the middle part or one side of the partition plate, the upper surface of the partition plate is an inclined plane converging to the liquid storage tank, and the pump body is connected with the liquid storage tank through a pipeline to extract the cleaning liquid in the liquid storage tank for recycling.
And furthermore, a liquid adding opening is formed in the shell corresponding to the liquid storage tank. An electric heater is arranged in the liquid storage tank, and a temperature control device is connected to the electric heater.
In the above scheme, the shell is made of transparent material or is provided with an observation window locally.
The utility model discloses beneficial effect:
1. the utility model discloses replace staff, liberation manpower, realize automatic atomizing and spray.
2. The utility model discloses can once the multi-disc wash, raise the efficiency productivity, and owing to it sprays to be rotatory form, reach comprehensive abluent effect.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a schematic view of the present invention in full section;
fig. 3 is a schematic diagram of the rotation driving device 36 connected to the rotation wafer rack according to the embodiment of the present invention;
fig. 4 is an exploded view of a support rod of a self-rotating wafer carrier according to an embodiment of the present invention;
fig. 5 is a schematic front view of a support rod of a self-rotating wafer carrier according to an embodiment of the present invention;
FIG. 6 is an enlarged schematic view of FIG. 5 at A;
fig. 7 is a schematic view of a partition board in a housing 11 according to the present invention.
In the above drawings:
1. a housing; 11. cleaning the space; 12. a pump body installation space; 13. a partition plate; 14. a liquid storage tank; 15. a liquid filling port;
2. rotating the wafer holder; 21. a turntable; 22. a support bar; 221. a column section; 2211. an external threaded section; 2212. a threaded hole; 222. an elastic washer; 2221. a wafer positioning groove;
3. a rotation driving device;
4. a nozzle;
5. a temperature control device;
6. and (5) a wafer.
Detailed Description
The invention will be further described with reference to the following drawings and examples:
example (b): referring to figures 1-7:
a spraying device for MEMS wafers comprises a shell 1, a cleaning space 11 is arranged in the shell 1, and a self-rotating wafer rack 2 is arranged in the cleaning space 11.
Referring to fig. 3-6, the self-rotating wafer rack 2 includes a rotating disk 21 and a plurality of supporting rods 22, the rotating disk 2 is rotatably supported relative to the housing 1, the supporting rods 22 are disposed perpendicular to the disk surface of the rotating disk 21, each supporting rod 22 is formed by connecting a plurality of column segments 221, one of the ends of each pair of adjacent column segments 211 extends to form an external threaded segment 2211, the other opposite end is provided with a threaded hole 2212 matching with the external threaded segment 2211, the external threaded segment 2211 of each column segment is in threaded connection with the threaded hole 2212 of the adjacent column segment 221, and an elastic washer 222 is further embedded between the adjacent ends of each column segment 221, the elastic washer 222 is provided with a circle of wafer positioning slots 2221 around the circumferential direction, and the wafer positioning slots 2221 of the elastic washer 222 on each supporting rod 22 correspond to each other to form a multi-layer wafer positioning structure; the turntable 21 is driven to rotate by a rotation driving device 3.
The rotary drive 3 is preferably an electric motor, although other drives may be used.
The housing 1 or the inside of the housing 1 is provided with a nozzle 4 facing the spinning wafer carrier 2, and the nozzle 4 is connected to a pump body (not shown) through a pipeline to pump the cleaning liquid.
Specifically, the surface of the turntable 21 of the spinning wafer rack 2 is arranged along the horizontal direction, and each support rod 22 is arranged downwards along the vertical line direction; the nozzles 4 are arranged on one or more side walls of the housing 1 in the horizontal circumferential direction.
Specifically, as shown in fig. 1, 2 and 7, a partition plate 13 is disposed in the middle of the housing 1 to divide the space in the housing 1 into the cleaning space 12 at the upper part and the pump body installation space 12 at the lower part; the pump body is mounted in the pump body mounting space 12.
A liquid storage tank 14 is arranged in the middle or on one side of the partition plate 13, the upper surface of the partition plate 13 is an inclined surface which is obliquely converged towards the liquid storage tank 14, and the pump body is connected with the liquid storage tank 14 through a pipeline so as to extract the cleaning liquid in the liquid storage tank 14 for recycling. Namely, the function of recycling the cleaning liquid is realized, and the cleaning liquid automatically flows into a liquid storage tank below after being sprayed, so that recycling is realized.
A liquid filling opening 15 is formed in the shell 1 corresponding to the liquid storage tank 14, and new cleaning liquid can be replenished through the liquid filling opening 15.
An electric heater is further arranged in the liquid storage tank 14, the electric heater is connected with a temperature control device 5, the functions of heating the cleaning liquid and controlling the temperature are added, the impurities on the surface of the sample cannot be cleaned by the liquid at normal temperature, therefore, the cleaning liquid in the liquid storage tank is heated by the electric heater, the temperature of the liquid is controlled by the temperature control device, when the cleaning liquid is heated to a set temperature, the power is automatically cut off, and then the spraying and cleaning are carried out.
The shell 1 is made of transparent material or is provided with an observation window locally, so that the cleanliness of the wafer and the cleaning liquid can be observed in the cleaning process.
In the working process of the embodiment, a plurality of wafers 6 are clamped on the autorotation wafer rack 2, then the shell 1 is closed, the rotary driving device 3 is started, the wafers 6 autorotate along with the autorotation wafer rack 2, then the pump body is started, and the nozzles 4 automatically spray and clean the wafers 6 on the autorotation wafer rack 2.
In practice, the nozzle 4 may be connected to a tee joint, a first path of the tee joint is connected to the pump body through a pipeline to extract the cleaning liquid, a second path of the tee joint is connected to the nozzle through air to form a spraying state, and a third path of the tee joint is connected to nitrogen through a valve to blow nitrogen to the wafer after spraying to realize a blowing and drying function.
In practice, in order to clean more completely, the turntable 21 may be movably arranged along the length direction of the support rod 22 relative to the housing 1, and a linear driving device is further applied on the turntable 21 to drive the turntable to perform translational reciprocating motion, that is, the turntable 21 can rotate and can move up and down, which is the best solution. The linear driving device is not shown in the drawings, and a reciprocating linear power device such as an air cylinder may be used as the linear driving device.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (8)
1. The utility model provides a MEMS wafer's spray set which characterized in that: comprises a shell (1), a cleaning space (11) is arranged in the shell (1), a self-rotating wafer rack (2) is arranged in the cleaning space (11), the self-rotating wafer rack (2) comprises a rotating disc (21) and a plurality of supporting rods (22), the rotating disc (21) is rotatably supported relative to the shell (1), the supporting rods (22) are arranged perpendicular to the disc surface of the rotating disc (21), each supporting rod (22) is formed by connecting a plurality of column sections (221), an external thread section (2211) extends on one end of each pair of adjacent column sections (221), a thread hole (2212) matched with the external thread section is arranged on the other opposite end of each pair of adjacent column sections (221), the external thread section (2211) of each column section is in threaded connection with the thread hole (2212) of the adjacent column section (221), an elastic washer (222) is also embedded between the adjacent end parts of each column section (221), a circle of wafer positioning groove (2221) is arranged on the elastic washer (222) in the circumferential direction, the wafer positioning grooves (2221) of the elastic washers (222) on the support rods (22) correspond to each other to form a multi-layer wafer positioning structure; the rotary disc (21) is driven to rotate by a rotary driving device (3); and a nozzle (4) is arranged on the shell (1) or in the shell (1) opposite to the rotation wafer rack (2), and the nozzle (4) is connected with a pump body through a pipeline so as to extract the cleaning liquid.
2. The MEMS wafer shower apparatus of claim 1, further comprising: the surface of the turntable (21) of the autorotation wafer rack (2) is arranged along the horizontal direction, and each support rod (22) is arranged downwards along the vertical line direction; the nozzles (4) are arranged on one or more side walls of the housing (1) in the horizontal circumferential direction.
3. The MEMS wafer shower apparatus of claim 1 or 2, further comprising: the rotary table (21) is movably arranged along the length direction of the supporting rod (22) relative to the shell (1), and a linear driving device is further acted on the rotary table (21) to drive the rotary table to do translational reciprocating motion.
4. The MEMS wafer shower apparatus of claim 1 or 2, further comprising: a partition plate (13) is arranged in the middle of the shell (1) to divide the space in the shell (1) into the cleaning space (11) at the upper part and the pump body mounting space (12) at the lower part; the pump body is arranged in the pump body installation space (12).
5. The MEMS wafer shower device of claim 4, wherein: a liquid storage tank (14) is arranged in the middle or on one side of the partition plate (13), the upper surface of the partition plate (13) is an inclined surface which is inclined and converged towards the liquid storage tank (14), and the pump body is connected with the liquid storage tank (14) through a pipeline so as to extract cleaning liquid in the liquid storage tank (14) for recycling.
6. The MEMS wafer shower device of claim 5, wherein: and a liquid filling port (15) is arranged on the shell (1) corresponding to the liquid storage tank (14).
7. The MEMS wafer shower device of claim 5, wherein: an electric heater is arranged in the liquid storage tank (14), and a temperature control device (5) is connected to the electric heater.
8. The MEMS wafer shower apparatus of claim 1 or 2, further comprising: the shell (1) is made of transparent materials or is provided with an observation window locally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220776705.2U CN217411651U (en) | 2022-04-06 | 2022-04-06 | MEMS wafer spraying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220776705.2U CN217411651U (en) | 2022-04-06 | 2022-04-06 | MEMS wafer spraying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217411651U true CN217411651U (en) | 2022-09-13 |
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ID=83180476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220776705.2U Active CN217411651U (en) | 2022-04-06 | 2022-04-06 | MEMS wafer spraying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217411651U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2615659A (en) * | 2022-08-08 | 2023-08-16 | Sinomach Sensing Tech Co Ltd | Automatically controlled cleaning apparatus and controlled cleaning method for MEMS chip |
-
2022
- 2022-04-06 CN CN202220776705.2U patent/CN217411651U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2615659A (en) * | 2022-08-08 | 2023-08-16 | Sinomach Sensing Tech Co Ltd | Automatically controlled cleaning apparatus and controlled cleaning method for MEMS chip |
| GB2615659B (en) * | 2022-08-08 | 2024-03-06 | Sinomach Sensing Tech Co Ltd | Automatically controlled cleaning apparatus and controlled cleaning method for MEMS chip |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000, floor 2, building 39, No. 18, Dongchang Road, Suzhou Industrial Park, Jiangsu Province Patentee after: Strong Half Conductor (Suzhou) Co.,Ltd. Address before: 215000, floor 2, building 39, No. 18, Dongchang Road, Suzhou Industrial Park, Jiangsu Province Patentee before: MAXONE SEMICONDUCTOR (SUZHOU) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |