CN116598234A - Wafer self-rotating brush piece cleaning device - Google Patents
Wafer self-rotating brush piece cleaning device Download PDFInfo
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- CN116598234A CN116598234A CN202310869511.6A CN202310869511A CN116598234A CN 116598234 A CN116598234 A CN 116598234A CN 202310869511 A CN202310869511 A CN 202310869511A CN 116598234 A CN116598234 A CN 116598234A
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- Prior art keywords
- brush
- wafer
- group
- driving device
- hairbrush
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- 238000004140 cleaning Methods 0.000 title claims abstract description 38
- 239000007788 liquid Substances 0.000 claims description 43
- 238000005507 spraying Methods 0.000 claims description 28
- 238000005406 washing Methods 0.000 claims description 8
- 239000002699 waste material Substances 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000001680 brushing effect Effects 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 120
- 239000004372 Polyvinyl alcohol Substances 0.000 description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 description 6
- 239000003814 drug Substances 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910001867 inorganic solvent Inorganic materials 0.000 description 1
- 239000003049 inorganic solvent Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B08B1/12—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides a wafer self-rotating brush piece cleaning device, and relates to the technical field of semiconductors. Comprising the following steps: the inner cavity of the shell is a wafer brush piece cavity; the brush piece assembly comprises an upper brush group, a lower brush group, a fixing plate, a first driving device and a wafer bearing platform; the upper hairbrush group comprises a second driving device and an upper hairbrush, and the lower hairbrush group comprises a third driving device and a lower hairbrush; the fixed plate is fixed on the inner wall of the shell, and the upper hairbrush group and the lower hairbrush group are fixed on the fixed plate; the wafer bearing platform comprises a left side plate and a right side plate, and the upper side brush and the lower side brush are positioned at the interval position between the left side plate and the right side plate and are respectively positioned above and below a wafer to be cleaned; the first driving device is connected with the upper hairbrush group and the lower hairbrush group and is used for driving the hairbrush group to move in the vertical direction so as to clamp or loosen the wafer to be cleaned. The application can ensure that the wafer is uniformly stressed in the process of brushing the wafer, has stable brushing effect and avoids the wafer from being damaged.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a wafer self-rotating brush piece cleaning device.
Background
Chemical Mechanical Polishing (CMP) is the only high precision global planarization technique currently in widespread use. The cleaning quality of the polished surface is directly related to the level of CMP technology. The qualification rate of electronic device products is reduced, which is about 50% of defective rate due to unclean surface after polishing, and the quality of cleaning has seriously affected the performance, reliability and stability of advanced electronic products. Surface defects and stains must occur during the CMP process, which are physical or chemical. Particle defects are mainly caused by adhesion of particles generated during polishing to the wafer surface, and these particles originate from the polishing pad, wafer or slurry.
Most of the conventional CMP process cleaning is to vertically place a wafer, drive a brush to rotate through a brush motor, keep the liquid medicine spraying brush piece moist, synchronize the wafer rotating device and the wafer to rotate in a matching way, and finish the brush piece. According to the brushing method, the edge of the wafer is stressed unevenly, particularly when the second-generation and third-generation semiconductors are fragile or the wafer is tilted and warped, the rotating roller easily causes the wafer to receive side force, so that the wafer is broken, or when the wafer brush is changed, the wafer is broken due to the fact that parameters are not matched easily because of complex matching relation in transmission, and secondary pollution is caused after the breakage. Or the brush and the wafer have a certain inclination angle, and the wafer is rotated by utilizing torque, so that the brushing effect of the wafer is unstable due to uneven stress of a brushing area of the wafer. Moreover, the hairbrush is wetted only through the spraying system, so that the condition of dryness and non-wetting is easy to occur, and the wafer is scratched.
Disclosure of Invention
Therefore, the embodiment of the application provides a wafer self-rotating brush piece cleaning device, which is used for ensuring that the wafer is uniformly stressed in the process of brushing the wafer, and has stable brushing effect, so that the wafer is prevented from being scratched or cracked.
The embodiment of the application provides the following technical scheme: a wafer self-rotating brush piece cleaning device, comprising:
the inner cavity of the shell is a wafer brush piece cavity;
the brush piece assembly comprises an upper brush group and a lower brush group which are identical in structure, a fixing plate, a first driving device and a wafer bearing platform; the upper side brush group comprises a second driving device and an upper side brush, the driving end of the second driving device is connected with the upper side brush and used for driving the upper side brush to rotate around the central shaft of the brush, the lower side brush group comprises a third driving device and a lower side brush, and the driving end of the third driving device is connected with the lower side brush and used for driving the lower side brush to rotate around the central shaft of the brush; wherein the upper brush and the lower brush rotate in opposite directions;
the upper side hairbrush group and the lower side hairbrush group respectively penetrate through the fixing plate and are fixedly connected with the fixing plate, so that the second driving device and the third driving device are positioned on the outer wall of the shell, and the upper side hairbrush and the lower side hairbrush are positioned in the wafer brush sheet cavity;
the wafer carrying platform comprises a left side plate and a right side plate, wherein the left side plate and the right side plate are respectively fixed on the same height position of the two opposite side walls of the shell, so that when a wafer to be cleaned is placed on the wafer carrying platform, the surface of the wafer is in a horizontal state, a space is arranged between the left side plate and the right side plate, so that the upper side brush and the lower side brush are positioned at the space positions and are respectively positioned above and below the wafer to be cleaned, and the upper surface and the lower surface of the wafer to be cleaned are respectively brushed;
the first driving device is respectively connected with the upper hairbrush group and the lower hairbrush group and is used for driving the upper hairbrush group and the lower hairbrush group to move in the vertical direction so as to clamp or loosen the wafer to be cleaned.
According to one embodiment of the application, the upper brush and the lower brush are each located at a position of 3/4 of the diameter of the wafer to be cleaned.
According to one embodiment of the application, the first driving device is an air cylinder, a driving output end of the air cylinder is connected with a rack, gears are respectively arranged in the upper side brush group and the lower side brush group, and the rack is matched with the gears so as to drive the upper side brush group and the lower side brush group to move in the vertical direction through the matching of the gears and the racks.
According to one embodiment of the application, the left side plate and the right side plate of the wafer carrying platform are respectively provided with a support used for limiting the edge of the wafer to be cleaned, and a rotating bearing is arranged outside the support.
According to one embodiment of the application, the cleaning device further comprises a spraying assembly, wherein the spraying assembly comprises a spraying pipe fixed on the shell, a plurality of spraying holes are uniformly formed in the spraying pipe at intervals, and the spraying pipe is positioned above the wafer to be cleaned and is used for spraying cleaning liquid on the surface of the wafer to be cleaned.
According to one embodiment of the application, the brush liquid supply assembly further comprises a brush liquid supply pipe;
the upper side brush with the downside brush all includes outer sleeve pipe and is located the inside multilayer sleeve pipe of outer sleeve pipe inner chamber, inside multilayer sleeve pipe with brush liquid supply union coupling, just evenly set up a plurality of liquid outlet holes on the inside multilayer sleeve pipe, make the washing liquid pass through liquid outlet hole inflow inside multilayer sleeve pipe with between the outer sleeve pipe, outer sheathed tube surface evenly fixes the brush, just evenly offer the leakage fluid dram around the brush for make the washing liquid pass through evenly soak after the leakage fluid dram flows on the brush.
According to one embodiment of the application, the bottom wall of the shell protrudes upwards from the middle to form a roof shape, and the side wall of the shell is provided with a waste discharge port.
According to one embodiment of the application, a lifting cavity door assembly is arranged on the side wall of the shell, the lifting cavity door assembly comprises a cavity door and a telescopic cylinder, and the end part of a guide rod of the telescopic cylinder is connected with the cavity door in a matched manner through a rotary bearing group so as to drive the cavity door to be opened or closed.
According to one embodiment of the application, the brush cleaning device further comprises a control system and a sensor, wherein the sensors are respectively arranged on the upper side brush and the lower side brush, the sensor is connected with the control system, and the control system is respectively connected with the second driving device and the third driving device and is used for collecting the rotating speed of the brush through the sensors and controlling and adjusting the rotating speed through the control system.
According to one embodiment of the application, the top surface of the housing is provided as transparent explosion-proof glass.
Compared with the prior art, the beneficial effects that above-mentioned at least one technical scheme that this description embodiment adopted can reach include at least: according to the embodiment of the application, the wafer to be cleaned is horizontally placed, the brush is controlled to rotate, so that friction force is generated between the brush and the surface of the wafer, and the brush contacts with the surface of the wafer at the position of 3/4 of the diameter of the surface of the wafer, so that the friction force between the contact side and the non-contact side of the brush on the surface of the wafer is different, the brush is driven to rotate due to the action of torque, the wafer is driven to rotate without additional power, the rotating speed is stable, the stress on the contact position of the brush and the wafer is uniform, the cleaning effect of the brush is uniform, and the wafer breakage caused by the fact that a driving roller driving the wafer to rotate applies side force to the wafer when oblique warping occurs in the vertical brushing process is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a device structure according to an embodiment of the present application;
FIG. 2 is a schematic view of a brush assembly according to an embodiment of the present application;
FIG. 3 is a schematic view of a wafer carrier according to an embodiment of the application;
FIG. 4 is a schematic view of a brush structure according to an embodiment of the present application;
FIG. 5 is a schematic view of a wafer brush cavity according to an embodiment of the present application;
FIG. 6 is a schematic view of a lifting cavity door assembly according to an embodiment of the present application;
FIG. 7 is a diagram illustrating rotation of a wafer under force according to an embodiment of the present application;
the device comprises a 1-shell, a 2-fixed plate, a 3-cylinder, a 4-wafer carrying platform, a 5-rotating motor, a 6-upper side brush, a 7-lower side brush, an 8-wafer to be cleaned, a 9-pillar, a 10-rotating bearing, an 11-spraying pipe, a 12-brush liquid supply pipe, a 13-outer sleeve, a 14-liquid discharge port, a 15-waste discharge port, a 16-cavity door, a 17-telescopic cylinder, a 18-guide rod, a 19-rotating bearing group, a 20-brush liquid supply port and a 21-wafer inlet and outlet.
Detailed Description
Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
As shown in fig. 1-2, an embodiment of the present application provides a wafer self-rotating brush cleaning device, including:
the inner cavity of the shell 1 is a wafer brush piece cavity;
the brush piece assembly comprises an upper brush group and a lower brush group which are identical in structure, a fixing plate 2, a first driving device and a wafer bearing platform 4; the upper brush group comprises a second driving device and an upper brush 6, the driving end of the second driving device is connected with the upper brush 6 and used for driving the upper brush 6 to rotate around the central shaft of the brush, the lower brush group comprises a third driving device and a lower brush 7, and the driving end of the third driving device is connected with the lower brush 7 and used for driving the lower brush 7 to rotate around the central shaft of the brush; wherein the upper brush 6 and the lower brush 7 are rotated in opposite directions;
the fixing plate 2 is fixedly arranged on the inner wall of the shell 1, the upper side hairbrush group and the lower side hairbrush group respectively penetrate through the fixing plate 2 and are fixedly connected with the fixing plate 2, so that the second driving device and the third driving device are positioned on the outer wall of the shell 1, and the upper side hairbrush 6 and the lower side hairbrush 7 are positioned in the wafer brush cavity;
the wafer carrying platform 4 comprises a left side plate and a right side plate, the left side plate and the right side plate are respectively fixed on the same height positions of two opposite side walls in the shell 1, so that when a wafer 8 to be cleaned is placed on the wafer carrying platform 4, the surface of the wafer is in a horizontal state, a space is arranged between the left side plate and the right side plate, the upper hairbrush 6 and the lower hairbrush 7 are positioned at the space positions and are respectively positioned above and below the wafer 8 to be cleaned, and the upper hairbrush and the lower hairbrush are respectively used for brushing the upper surface and the lower surface of the wafer 8 to be cleaned;
the first driving device is respectively connected with the upper hairbrush group and the lower hairbrush group and is used for driving the upper hairbrush group and the lower hairbrush group to move in the vertical direction so as to clamp or unclamp the wafer 8 to be cleaned.
In the embodiment of the application, the upper brush 6 and the lower brush 7 are positioned at the position of 3/4 of the diameter of the wafer 8 to be cleaned. The second driving device and the third driving device are rotating motors 5, and the brush rotating motors provided with encoders drive the upper side brushes 6 and the lower side brushes 7 to synchronously rotate through rotating bearings, wherein the brushes, the rotating bearings and the motor bearings are concentric circles. The rotating motor 5 is arranged outside the shell 1 and is connected with the brush through a rotating bearing, and the rotating bearing and the brush are synchronously fixed on the fixed plate 2. In this embodiment, as shown in fig. 1 and 7, the upper and lower brushes are horizontally placed in parallel with the wafer, the brushes and the motor are vertically placed at the center of the wafer, the upper brush 6 rotates counterclockwise from the side of the rotating motor 5, the lower brush 7 rotates clockwise, and the brushes contact with the 3/4 of the diameter of the wafer surface, so that the friction force between the contact side and the non-contact side of the brushes is different, the brushes drive the wafer to rotate counterclockwise due to the moment action, the wafer rotates under the action of the counterclockwise force from the rotating bearing at the edge of the wafer when rotating, the additional wafer rotation driving is not needed, the hairless brush driving and the wafer rotation driving are not needed, and the wafer rotation is simply driven to rotate through the brush driving, the rotation speed is stable, the stress of the contact position of the brushes and the wafer is uniform, the cleaning effect of the brush is uniform, and the wafer breakage caused by the application of the side force to the wafer by the driving roller driving the wafer to rotate when the wafer is inclined and warped in the cleaning process of the vertical wafer is avoided. And the sealing ring is arranged at the outer side of the shell 1 to prevent the motor from being polluted by liquid medicine.
In addition, the embodiment of the application is not only suitable for single-sided brushing of the wafer, but also suitable for double-sided brushing of the wafer, and the liquid supply and rotating systems are arranged on the upper surface and the lower surface of the wafer in the same way, so that the autorotation and self wetting of the wafer after brushing can be realized.
In the embodiment of the application, the first driving device is an air cylinder 3, the driving output end of the air cylinder 3 is connected with a rack, gears are respectively arranged in the upper side brush group and the lower side brush group, and the rack is matched with the gears so as to drive the upper side brush group and the lower side brush group to move in the vertical direction through the matching of the gears and the racks. The interval between the brushes at the upper side and the lower side and the wafer is lifted or lowered through the air cylinder 3, so that the process parameters are convenient to control, and the wafer with various thickness sizes can be adapted. In the specific implementation, the position of the brush moving up and down can be limited by arranging a limiting groove on the fixed plate 2. In other embodiments, the inductor may be designed synchronously at the swivel bearing, facilitating the monitoring and adjustment of the brush position by the control system.
In the embodiment of the present application, as shown in fig. 3, the left side plate and the right side plate of the wafer carrying platform 4 are respectively provided with a support post 9 for limiting the edge of the wafer 8 to be cleaned, and a rotating bearing 10 is arranged outside the support post 9. In particular, the wafer carrying platform 4 may be made of PTFE (polytetrafluoroethylene), and since the cleaning solution used in the apparatus is generally SC1 (GB/T5213-2001) or other acid-base inorganic solvents, the cavity and other parts contacting the cleaning solution are generally made of corrosion-resistant materials such as PTFE (polytetrafluoroethylene), PFA (soluble polytetrafluoroethylene), and halar (polyethylene chlorotrifluoroethylene), and are resistant to acid and alkali, and to various organic solvents, and corrosion of the cleaning solution is prevented.
The support column 9 and the rotary bearing 10 have obvious gaps, and the wafer drives the rotary bearing 10 to rotate around the periphery when the wafer rotates under the action of torque. In this embodiment, the upper portion of the rotary bearing 10 is tapered, the bottom is in a shape of a beveled column, the bearing surface is flat and smooth, and the distance between the tapered bottom of the rotary bearing and the tapered bottom of the adjacent bearing is +1.5mm of the wafer size. Four rotary bearings 10 are uniformly distributed around the wafer, and the rotary bearings 10 are sleeved on the support posts 9. The wafer is rotated around the support post 9 by the bearing when being driven to rotate by the rotating motor 5, and the friction force on the edge when the wafer rotates can be reduced by arranging the rotating bearing 10. And meanwhile, sensors can be arranged beside the rotating motor 5 and on the wafer carrying platform 4 and used for monitoring the rotating speed and feeding back software adjustment.
In the embodiment of the application, the cleaning device further comprises a spraying assembly, wherein the spraying assembly comprises a spraying pipe 11 fixed on the shell 1, a plurality of spraying holes are uniformly formed in the spraying pipe 11 at intervals, and the spraying pipe 11 is positioned above the wafer 8 to be cleaned and is used for spraying cleaning liquid on the surface of the wafer 8 to be cleaned.
In the embodiment of the application, the brush liquid supply assembly also comprises a brush liquid supply pipe 12; the upper side brush 6 with downside brush 7 all includes outer sleeve pipe 13 and is located the inside multilayer sleeve pipe of outer sleeve pipe 13 inner chamber, inside multilayer sleeve pipe's tip is equipped with brush liquid feed port 20, brush liquid feed port 20 with brush liquid feed pipe 12 is connected, just evenly set up a plurality of liquid outlet holes on the inside multilayer sleeve pipe, make the washing liquid pass through the liquid outlet hole flows in inside multilayer sleeve pipe with between the outer sleeve pipe 13, the surface of outer sleeve pipe 13 evenly fixes PVA (polyvinyl alcohol) brush, just evenly offer leakage fluid dram 14 around the PVA brush for make the washing liquid pass through evenly soak after the leakage fluid dram 14 flows out on the PVA brush, as shown in fig. 4. The PVA hairbrush is hard in texture in a dry state and becomes soft after absorbing water, so that the hairbrush is kept moist, and wafer scratch caused by the hardness of the hairbrush can be reduced. In the wafer brushing process, the hairbrush liquid supply assembly, the spraying assembly and the brushing sheet assembly work simultaneously, and the spraying assembly only aims at the area beside the hairbrush, so that the wettability of the surface of the whole wafer is ensured.
As shown in fig. 5, in the embodiment of the present application, in order to ensure that the cleaning waste liquid dropped on the bottom of the casing 1 can be smoothly discharged, the bottom wall of the casing 1 protrudes upward from the middle to form a roof shape, and the side wall of the casing 1 is provided with a waste discharge port 15, so that the cleaning waste liquid can flow to two sides of the bottom of the casing 1 and be discharged from the waste discharge port 15.
As shown in fig. 6, in the embodiment of the present application, a wafer inlet and outlet 21 is formed on a side wall of the housing 1, and a lifting cavity door assembly is disposed at the wafer inlet and outlet 21, where the lifting cavity door assembly includes a cavity door 16 and a telescopic cylinder 17, and an end portion of a guide rod 18 of the telescopic cylinder 17 is cooperatively connected with the cavity door 16 through a rotating bearing group 19, so as to drive the cavity door 16 to open or close. In specific implementation, before placing a wafer in the cavity, the cavity door 16 is opened, after placing the wafer on the wafer carrying platform 4, the lifting cavity door assembly pushes the guide rod 18 through the telescopic cylinder 17, drives the cavity door 16 to vertically place along the guide rod 18, and closes the cavity door 16 to avoid liquid medicine splashing. Meanwhile, transparent explosion-proof glass is arranged above the cavity, so that operators or shooting equipment can observe the operation condition in the cavity conveniently.
In the embodiment of the application, the brush cleaning device further comprises a control system and a sensor, wherein the sensors are respectively arranged on the upper side brush 6 and the lower side brush 7, the sensor is connected with the control system, and the control system is respectively connected with the second driving device and the third driving device and is used for collecting the rotating speed of the brush through the sensor and controlling and adjusting the rotating speed through the control system. In addition, the control system can also be connected with the first driving device, namely the cylinder 3 in a control way, and is used for controlling the cylinder 3 to work.
When the device is specifically used, cleaning liquid is provided for the hairbrush and the wafer through the hairbrush liquid supply assembly and the spraying assembly, after the hairbrush is wet and softened, the cylinder 3 moves the rotating motor 5 to a designated position through the movement of the gear rack, and the rotating motor 5 starts to move and drives the wafer to rotate. After the process requires the brushing time or the number of rotations, the rotation is stopped and the rotary motor 5 is moved up or down by the cylinder 3. The lifting cavity door assembly is synchronously stretched to horizontally place the cavity door 16, and after the wafer is taken out, the cavity door 16 is contracted to be closed.
The specific operation process of the device is as follows: the brush adopts PVA material, and the material can become soft after soaking. Before operation, the brush liquid supply assembly is opened, and the machine starts to act after the brush becomes soft. The lifting cylinder bearing of the lifting cavity door assembly extends, and the cavity door is opened; the manipulator places the wafer on the wafer load-bearing platform, and the cylinder of lift cavity door subassembly contracts, closes the cavity door, and the cylinder action is adjusted upper and lower brush to the assigned position back, sprays subassembly, brush liquid feed subassembly and opens and spray the washings liquid medicine, generally SC-1 liquid medicine. Meanwhile, the brush rotating motor rotates at a set rotating speed, generally 50-500R/min, and drives the brush to move through the transmission bearing. The wafer rotates due to the difference in torque caused by the friction force between the brush and the wafer. And synchronously, feeding back the induction rotation speed to the computer by the rotating motor and a sensor arranged under the wafer, and adjusting the rotation speed according to a set value.
After the brush is rotated for a set time, generally 1-3min, the brush rotating motor is stopped, and the spraying assembly and the brush liquid supply assembly are synchronously stopped. The upper hairbrush and the lower hairbrush are separated to the appointed position by the air cylinder, the cavity door is opened by extending the air cylinder of the lifting cavity door assembly, and the wafer on the wafer carrying platform is taken out by the mechanical arm entering the cavity. And after the wafer is taken out, the cavity door is closed after the cylinder of the lifting cavity door assembly is retracted. And then the wafer enters other cavities, single-chip spray SC1-1 megasonic cleaning, water washing, blow drying and other steps are carried out, and finally the wafer is placed in a cassette (wafer box) of the wafer, so that the brushing and cleaning actions are completed.
It should be noted that, although the brushing device in the embodiment shown in the drawings is a horizontal type brushing device for brushing wafers, the brushing device in the vertical direction can also be designed in a reversible direction according to the system of the present application.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present application should be included in the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (10)
1. Wafer autogyration brush piece belt cleaning device, its characterized in that includes:
the inner cavity of the shell is a wafer brush piece cavity;
the brush piece assembly comprises an upper brush group and a lower brush group which are identical in structure, a fixing plate, a first driving device and a wafer bearing platform; the upper side brush group comprises a second driving device and an upper side brush, the driving end of the second driving device is connected with the upper side brush and used for driving the upper side brush to rotate around the central shaft of the brush, the lower side brush group comprises a third driving device and a lower side brush, and the driving end of the third driving device is connected with the lower side brush and used for driving the lower side brush to rotate around the central shaft of the brush; wherein the upper brush and the lower brush rotate in opposite directions;
the upper side hairbrush group and the lower side hairbrush group respectively penetrate through the fixing plate and are fixedly connected with the fixing plate, so that the second driving device and the third driving device are positioned on the outer wall of the shell, and the upper side hairbrush and the lower side hairbrush are positioned in the wafer brush sheet cavity;
the wafer carrying platform comprises a left side plate and a right side plate, wherein the left side plate and the right side plate are respectively fixed on the same height position of the two opposite side walls of the shell, so that when a wafer to be cleaned is placed on the wafer carrying platform, the surface of the wafer is in a horizontal state, a space is arranged between the left side plate and the right side plate, so that the upper side brush and the lower side brush are positioned at the space positions and are respectively positioned above and below the wafer to be cleaned, and the upper surface and the lower surface of the wafer to be cleaned are respectively brushed;
the first driving device is respectively connected with the upper hairbrush group and the lower hairbrush group and is used for driving the upper hairbrush group and the lower hairbrush group to move in the vertical direction so as to clamp or loosen the wafer to be cleaned.
2. The wafer self-rotating brush wafer cleaning apparatus of claim 1, wherein the upper brush and the lower brush are each located at a position of 3/4 of a diameter of the wafer to be cleaned.
3. The wafer self-rotating brush piece cleaning device according to claim 1, wherein the first driving device is a cylinder, a driving output end of the cylinder is connected with a rack, gears are respectively arranged in the upper side brush group and the lower side brush group, and the rack is matched with the gears so as to drive the upper side brush group and the lower side brush group to move in a vertical direction through the matching of the gears and the racks.
4. The wafer self-rotating brush cleaning device according to claim 1, wherein the left side plate and the right side plate of the wafer carrying platform are respectively provided with a support for limiting the edge of the wafer to be cleaned, and a rotating bearing is arranged outside the support.
5. The wafer self-rotating brush wafer cleaning device according to claim 1, further comprising a spraying assembly, wherein the spraying assembly comprises a spraying pipe fixed on the shell, a plurality of spraying holes are uniformly formed in the spraying pipe at intervals, the spraying pipe is located above a wafer to be cleaned and is used for spraying cleaning liquid on the surface of the wafer to be cleaned.
6. The wafer self-rotating brush wafer cleaning device of claim 1, further comprising a brush liquid supply assembly comprising a brush liquid supply tube;
the upper side brush with the downside brush all includes outer sleeve pipe and is located the inside multilayer sleeve pipe of outer sleeve pipe inner chamber, inside multilayer sleeve pipe with brush liquid supply union coupling, just evenly set up a plurality of liquid outlet holes on the inside multilayer sleeve pipe, make the washing liquid pass through liquid outlet hole inflow inside multilayer sleeve pipe with between the outer sleeve pipe, outer sheathed tube surface evenly fixes the brush, just evenly offer the leakage fluid dram around the brush for make the washing liquid pass through evenly soak after the leakage fluid dram flows on the brush.
7. The wafer self-rotating brush cleaning device according to claim 1, wherein the bottom wall of the housing protrudes upward from the middle to form a roof shape, and the side wall of the housing is provided with a waste outlet.
8. The wafer self-rotating brush cleaning device according to claim 1, wherein a lifting cavity door assembly is arranged on the side wall of the shell, the lifting cavity door assembly comprises a cavity door and a telescopic cylinder, and the end part of a guide rod of the telescopic cylinder is connected with the cavity door in a matched manner through a rotating bearing group so as to drive the cavity door to open or close.
9. The wafer self-rotating brush piece cleaning device according to claim 1, further comprising a control system and a sensor, wherein the sensors are respectively arranged on the upper side brush and the lower side brush, the sensor is connected with the control system, and the control system is respectively connected with the second driving device and the third driving device and is used for collecting the rotating speed of the brush through the sensors and controlling and adjusting the rotating speed through the control system.
10. The wafer self-rotating brush cleaning device of claim 1, wherein the top surface of the housing is provided as transparent explosion-proof glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310869511.6A CN116598234A (en) | 2023-07-17 | 2023-07-17 | Wafer self-rotating brush piece cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310869511.6A CN116598234A (en) | 2023-07-17 | 2023-07-17 | Wafer self-rotating brush piece cleaning device |
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| Publication Number | Publication Date |
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| CN116598234A true CN116598234A (en) | 2023-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310869511.6A Pending CN116598234A (en) | 2023-07-17 | 2023-07-17 | Wafer self-rotating brush piece cleaning device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116765077A (en) * | 2023-08-18 | 2023-09-19 | 菏泽明钰光电科技有限公司 | Optical lens cleaning equipment and using method thereof |
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| JP2001237209A (en) * | 2000-02-22 | 2001-08-31 | Nisso Engineering Co Ltd | Scrub cleaning device |
| KR20050082323A (en) * | 2004-02-18 | 2005-08-23 | 두산디앤디 주식회사 | Semiconductor wafer cleaning system |
| KR101151652B1 (en) * | 2011-03-14 | 2012-06-08 | 지앤피테크놀로지 주식회사 | Wafer cleaning apparatus |
| CN212967650U (en) * | 2020-08-07 | 2021-04-13 | 智程半导体设备科技(昆山)有限公司 | Wafer cleaning machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237209A (en) * | 2000-02-22 | 2001-08-31 | Nisso Engineering Co Ltd | Scrub cleaning device |
| KR20050082323A (en) * | 2004-02-18 | 2005-08-23 | 두산디앤디 주식회사 | Semiconductor wafer cleaning system |
| KR101151652B1 (en) * | 2011-03-14 | 2012-06-08 | 지앤피테크놀로지 주식회사 | Wafer cleaning apparatus |
| CN212967650U (en) * | 2020-08-07 | 2021-04-13 | 智程半导体设备科技(昆山)有限公司 | Wafer cleaning machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116765077A (en) * | 2023-08-18 | 2023-09-19 | 菏泽明钰光电科技有限公司 | Optical lens cleaning equipment and using method thereof |
| CN116765077B (en) * | 2023-08-18 | 2023-11-17 | 菏泽明钰光电科技有限公司 | Optical lens cleaning equipment and using method thereof |
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