CN212967650U

CN212967650U - Wafer cleaning machine

Info

Publication number: CN212967650U
Application number: CN202021624574.3U
Authority: CN
Inventors: 杨仕品
Original assignee: Zhicheng Semiconductor Equipment Technology Kunshan Co Ltd
Current assignee: Suzhou Zhicheng Semiconductor Technology Co ltd
Priority date: 2020-08-07
Filing date: 2020-08-07
Publication date: 2021-04-13
Anticipated expiration: 2030-08-07

Abstract

The utility model provides a wafer cleaning machine, which comprises a worktable, be equipped with the washing chamber on the board, be equipped with on the board and rotate clamping device, it is equipped with washing arm and brush arm respectively to rotate the clamping device both sides, wash arm and brush arm sub-unit connection jacking slewing mechanism, be equipped with on the board and wash the cup and arrange waste mechanism, when this cleaning machine used, through having set up rotation clamping device, can fix a position products such as mask version to the megasonic head has been set up, can high-efficient washing, and can guarantee through waste discharge device and washing cup that the washing intracavity portion is clean and tidy, do not cause secondary pollution.

Description

Wafer cleaning machine

Technical Field

The utility model relates to a wafer washs the field, especially relates to wafer cleaning machine.

Background

Wafer (Wafer) refers to a silicon Wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a Wafer because it has a circular shape. In the wafer processing process, organic matter, particles, metal impurities, natural oxide layers, quartz, plastics and other pollutants on the surface of the wafer need to be removed according to needs, and in a common semiconductor process, for example: deposition, plasma etching, spin-on resist, photolithography, electroplating, etc. may introduce contamination and/or particles on the wafer surface, which may reduce the cleanliness of the wafer surface and result in low yield of the manufactured semiconductor device, so that the wafer cleaning process is very important, and the prior art, such as patent publication nos: the invention patent of CN 105983546a discloses a wafer cleaning device, which fixes a wafer by adsorption, needs to add a negative pressure device, and results in a complex structure, and when in use, the water volume in the whole environment is large, and water can be sucked in when not paying attention to the wafer cleaning device, and for some products which are not easy to adsorb, such as a mask, etc., the wafer cleaning device cannot be positioned, the operation of the equipment is affected, and the cleaning effect is common.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a wafer cleaning machine, which comprises a machine table, wherein a cleaning cavity is arranged on the machine table, a rotating clamping device is arranged on the machine table, a cleaning arm and a brush arm are respectively arranged at two sides of the rotating clamping device, the lower parts of the cleaning arm and the brush arm are connected with a jacking rotating mechanism, and a cleaning cup and a waste discharge mechanism are arranged on the machine table;

rotate clamping device including being located the board lower part is equipped with driving motor, the driving motor output is connected with the pivot, be connected with the supporting disk in the pivot, be equipped with two sets of support columns that are square range setting on the supporting disk, be equipped with the fixture block on the support column, it is connected with the briquetting to rotate on the fixture block.

Preferably, the jacking slewing mechanism includes servo motor, the servo motor output is connected with the main shaft, the servo motor output with be equipped with the mounting bracket between the main shaft, the mounting bracket side is equipped with the lead screw drive mechanism of vertical setting.

Preferably, the cleaning arm comprises a first upright column connected with the main shaft, the top of the first upright column is connected with a first horizontal frame, and the end part of the first horizontal frame is provided with a high-pressure nozzle and a megasonic head.

Preferably, the brush arm comprises a second upright post connected with the main shaft, the top of the second upright post is connected with a second horizontal frame, and the end part of the second horizontal frame is provided with a brush head.

Preferably, the cleaning cavity comprises an annular shell, and an arc-shaped edge is arranged at the top of the annular shell.

Preferably, the waste discharge mechanism comprises a material receiving port positioned on the machine table, the lower part of the material receiving port is connected with a waste material box, and the lower part of the waste material box is connected with a negative pressure device.

The utility model provides a wafer cleaning machine has following beneficial effect: when the cleaning machine is used, the rotary clamping device is arranged, products such as a mask plate can be positioned, the megasonic head is arranged, high-efficiency cleaning can be achieved, the inside of the cleaning cavity can be ensured to be clean and tidy through the waste discharge device and the cleaning cup, and secondary pollution is avoided.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the inside of the cleaning chamber of the present invention;

FIG. 3 is a schematic view of a cleaning chamber of the present invention;

fig. 4 is a schematic view of the rotary elevating mechanism of the present invention;

fig. 5 is a schematic view of the internal structure of the present invention;

FIG. 6 is a schematic view of the rotary clamping device of the present invention;

wherein, 1, a machine table; 2. a cleaning chamber; 3. rotating the clamping device; 4. cleaning the arm; 5. a brush arm; 6. cleaning the cup; 7. a drive motor; 8. a screw drive mechanism; 9. a servo motor; 10. a main shaft; 11. a mounting frame; 12. a first upright post; 13. a second upright post; 14. a high pressure nozzle; 15. a megasonic head; 16. a first horizontal shelf; 17. a second horizontal shelf; 18. a bristle head; 19. an annular housing; 20. an arc-shaped edge; 21. a material receiving port; 22. A waste material box; 23. a support disc; 24. a support pillar; 25. a clamping block; 26. and (7) briquetting.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

As shown in fig. 1 and 2, the utility model provides a wafer cleaning machine, including board 1, be equipped with on board 1 and wash chamber 2, be equipped with on board 1 and rotate clamping device 3, it is equipped with washing arm 4 and brush arm 5 respectively to rotate 3 both sides of clamping device, wash arm 4 and brush arm 5 sub-unit connection jacking slewing mechanism, the jacking slewing mechanism's of washing arm 4 and brush arm 5 lower part structure is the same, can drive and wash arm 4 and brush arm 5 and rotate to washing chamber 2 positions on to stretch out and draw back from top to bottom and realize being close to or keeping away from cleaning element, specific theory: the cleaning arm 4 comprises a first upright post 12 connected with the main shaft 10, the top of the first upright post 12 is connected with a first horizontal frame 16, the end part of the first horizontal frame 16 is provided with a high-pressure nozzle 14 and a megasonic head 15, the high-pressure nozzle 14 can spray water at a high speed, a better cleaning effect is achieved, the megasonic head 15 matched with the side edge generates high-frequency vibration effect, the high-frequency vibration effect can be greatly improved, the brush arm 5 comprises a second upright post 13 connected with the main shaft 10, the top of the second upright post 13 is connected with a second horizontal frame 17, the end part of the second horizontal frame 17 is provided with a brush head 18, a jacking rotating mechanism arranged at the lower part comprises a servo motor 9, the output end of the servo motor 9 is connected with the main shaft 10, an installation frame 11 is arranged between the output end of the servo motor 9 and the main shaft 10, the side edge of the installation frame 11 is provided, rinse the first stand 12 of 4 lower parts of arm and be connected rather than the main shaft 10 that corresponds, and the second stand 13 of brush arm 5 is connected with the main shaft 10 that corresponds, and the last mounting bracket 11 of main shaft 10 then is connected with lead screw drive 8's slider, can drive both from top to bottom through lead screw drive 8 and stretch out and draw back, and servo motor 9 can drive both respectively and rotate, can realize going up and down to rotate both, be equipped with on the board and rinse cup 6 and waste discharge mechanism, the effect of wasing cup 6 is: after washing 4 and brush arm 5 work, the end stretches in washing 6 upper portions of cup for accept unnecessary water, prevent to fall to the platform on, treat abluent product and cause secondary pollution, and waste discharge mechanism is including being located the material receiving opening 21 on board 1, material receiving opening 21 sub-unit connection has waste material box 22, waste material box 22 sub-unit connection has negative pressure device, through connecting negative pressure device, the circular telegram back can produce the negative pressure, adsorbs the waste liquid in the course of working to material receiving opening 21 and advance waste material box 22 in, and material receiving opening 21 also is in washing chamber 2, can guarantee the cleanliness factor of whole washing chamber 2.

It should be noted that, as shown in fig. 5 and fig. 6, different products need to have corresponding rotating clamping devices 3 for positioning, as shown in fig. 4, the rotating clamping devices 3 include a driving motor 7 located at the lower portion of the machine table 1, an output end of the driving motor 7 is connected with a rotating shaft, the rotating shaft is connected with a supporting plate 23, two groups of supporting columns 24 arranged in a square shape are arranged on the supporting plate 23, clamping blocks 25 are arranged on the supporting columns 24, pressing blocks 26 are rotatably connected to the clamping blocks 25, the entire supporting plate 23 is driven to rotate at high speed by the driving motor 7, clamping grooves are arranged on the clamping blocks 25, the products are clamped in the clamping grooves of the four clamping blocks 25 and pressed down by the pressing blocks 26 on the upper portion, four corners of the products are pressed tightly to realize fixation, the two groups of supporting columns 24 are arranged to be, the cleaning efficiency in the high-speed rotation is high, and the cleaning water on the surface can be thrown out to ensure the surface cleanliness, and the following is to be mentioned: as shown in fig. 3, the cleaning chamber 2 includes an annular housing 19, an arc-shaped edge 20 is disposed on the top of the annular housing 19, the bottom of the annular housing 19 is sealed with the platform, and a support plate 23 penetrates through the bottom of the annular housing 19 and is provided with a sealing strip for placing waste liquid in the cleaning chamber 2 to enter below the platform.

Various modifications to the embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer cleaning machine is characterized by comprising a machine table, wherein a cleaning cavity is arranged on the machine table, a rotating clamping device is arranged on the machine table, a cleaning arm and a brush arm are respectively arranged on two sides of the rotating clamping device, the lower parts of the cleaning arm and the brush arm are connected with a jacking rotating mechanism, and a cleaning cup and a waste discharge mechanism are arranged on the machine table;

2. The wafer cleaning machine according to claim 1, wherein the lifting rotation mechanism comprises a servo motor, a spindle is connected to an output end of the servo motor, a mounting frame is arranged between the output end of the servo motor and the spindle, and a vertically arranged screw rod transmission mechanism is arranged on a side edge of the mounting frame.

3. The wafer cleaning machine of claim 2, wherein the cleaning arm comprises a first upright column connected with the main shaft, a first horizontal frame is connected with the top of the first upright column, and a high-pressure nozzle and a megasonic head are arranged at the end part of the first horizontal frame.

4. The wafer cleaning machine as claimed in claim 2, wherein the brush arm comprises a second upright column connected with the spindle, a second horizontal frame is connected with the top of the second upright column, and a brush head is arranged at the end of the second horizontal frame.

5. The wafer cleaning machine of claim 1, wherein the cleaning chamber comprises an annular housing having an arcuate edge at a top portion thereof.

6. The wafer cleaning machine as claimed in claim 1, wherein the waste discharging mechanism includes a receiving port on the machine platform, a waste material box is connected to a lower portion of the receiving port, and a negative pressure device is connected to a lower portion of the waste material box.