CN219457564U - Quartz ring special for semiconductor etching process - Google Patents

Abstract

The utility model discloses a quartz ring special for a semiconductor etching process, and belongs to the field of semiconductor etching processes. A quartz ring dedicated to a semiconductor etching process, comprising: the inner side of the quartz protection ring is embedded with a wafer bearing disc, and the outer side of the quartz protection ring is embedded with a grounding bearing disc; according to the utility model, the adsorption area is arranged on the quartz protection ring, so that the adsorption of the arc-shaped suction nozzle on the dismounting device is facilitated in the whole upward dismounting process of the quartz protection ring, and the adsorption area is slightly concave, so that the adsorption area of the arc-shaped suction nozzle is increased, and the vacuum negative pressure adsorption is more firm; the bump on the quartz protection ring is matched and clamped with the round hole on the grounding bearing disc, so that the quartz protection ring is prevented from deviating when in operation, and then the embedded ring, the bump, the round groove I, the flat opening and the round groove II on the quartz protection ring are matched and embedded with each other, so that the position of the quartz protection ring in the installation process is more accurate, and the assembly quality is more stable.

Description

Quartz ring special for semiconductor etching process

Technical Field

The utility model relates to the field of semiconductor etching processes, in particular to a quartz ring special for a semiconductor etching process.

Background

Semiconductor etching processes are a technique used to fabricate semiconductor devices with the aim of cutting semiconductor materials into specific shapes and sizes in order to fabricate a variety of complex integrated circuit elements, such as transistors, memories, transistor levels, etc. The main flow of the etching process is as follows: first, the semiconductor block is placed in an etching tank, and then a large amount of high-pressure water flow is used to wash away dirt and unwanted parts of the surface. Then, a chemical substance capable of dissolving or etching the semiconductor material is added to the tank, and when the chemical substance reacts with the semiconductor material, the semiconductor material is continuously etched away, and the specific shape and size are gradually reduced, so that different elements are manufactured. Finally, the semiconductor element manufactured by the etching process is placed on a wafer, and then the whole process of manufacturing the semiconductor device can be completed through ablation, cleaning and other processes.

The etching process is a relatively complex and important one of the semiconductor processes, and is a main process of patterning associated with photolithography, for which a quartz ring is used. The photoetching process is to make photoresist undergo the process of photoetching exposure treatment, and is equivalent to that the circuit diagram is "drawn" on the wafer by means of projection, and the etching process is that the pattern developed along the photoresist surface by means of chemical or physical method is used to remove unnecessary material from silicon wafer surface so as to make the circuit diagram on the wafer, in this process, the high-purity quartz ring mainly possesses protection function, and its combination with quartz gate can implement closed protection of cavity body, tightly surrounds the periphery of crystal body and can prevent various pollutions in the etching production process.

Such as Chinese patent application number: 202123343014.8 discloses a quartz ring dismounting device comprising: the support unit comprises a support column, a first flat plate and a second flat plate which are parallel to each other, wherein one end of the support column is fixed on a grounding bearing plate positioned at the periphery of a wafer bearing plate, the other end of the support column penetrates through the first flat plate, the second flat plate is fixed at a set height position of the support column, and the first flat plate is positioned on the second flat plate; the lifting unit comprises a screw rod which is fixed on the first flat plate and penetrates through the second flat plate; the adsorption unit comprises a connecting rod and a vacuum chuck, wherein one end of the connecting rod is fixed on the first flat plate, and the other end of the connecting rod penetrates through the second flat plate and is connected with the vacuum chuck.

The wafer bearing disc, the quartz ring and the grounding bearing disc in the above patent are mutually embedded and clamped together, the upper part of the quartz ring is not provided with a corresponding structure to be better connected with the wafer bearing disc and the grounding bearing disc, the assembly stability is convenient and can be insufficient, the upper part of the quartz ring is not provided with a corresponding adsorption area to be matched with a vacuum chuck for absorbing, and the situation of infirm adsorption can exist, so that the defects and defects in the prior art are necessarily improved.

Disclosure of Invention

The utility model aims to solve the problems that in the prior art, a wafer bearing disc, a quartz ring and a grounding bearing disc are clamped together through mutual embedding, a corresponding structure is not arranged on the upper part of the quartz ring to be better connected with the wafer bearing disc and the grounding bearing disc, the assembly stability is convenient, the defect possibly exists, a corresponding adsorption area is not arranged on the upper part of the quartz ring to be matched with a vacuum chuck for adsorption, and the situation of unstable adsorption possibly exists.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

a quartz ring dedicated to a semiconductor etching process, comprising: the inner side of the quartz protection ring is embedded with a wafer bearing disc, the outer side of the quartz protection ring is embedded with a grounding bearing disc, and the whole formed by the quartz protection ring, the wafer bearing disc and the grounding bearing disc is clamped and fixed on the dismounting device; the dismounting device is provided with a workbench, the workbench is sequentially provided with dismounting components, the lower part of the dismounting component is provided with a translation component, the bottom of the translation component is fixedly connected with the upper part of the workbench, and the upper part of the translation component is slidably connected with a material placing frame.

By arranging the adsorption areas on the two sides of the quartz ring body on the quartz protection ring, the adsorption by matching the arc suction nozzle in the whole upward disassembly process of the quartz protection ring is facilitated, and the adsorption areas are slightly concave, so that the adsorption area of the arc suction nozzle is increased, the vacuum negative pressure adsorption is more firm, the convex points at the bottom of the quartz ring body on the quartz protection ring are matched and clamped with the round holes on the grounding bearing disk, the quartz protection ring is prevented from being separated from the wafer bearing disk and the grounding bearing disk in the working process, and the embedding rings and the convex blocks at the quartz ring body on the quartz protection ring are matched with the circular groove I, the flat opening of the disk body I and the circular groove II on the grounding bearing disk in the mounting process of the quartz protection ring, so that the position is more accurate and the assembly quality is more stable; when the whole formed by the quartz protection ring, the wafer bearing disc and the grounding bearing disc is required to be disassembled, the whole formed by the quartz protection ring, the wafer bearing disc and the grounding bearing disc can be fixed on the material placing frame, and then the whole can be quickly driven to move to the disassembling and assembling assembly to perform corresponding disassembly and assembly work by rotating the rocker at the end part of the translation assembly

Further, be provided with the quartz ring body on the quartz protection ring, the quartz ring body inboard is provided with the embedded ring, the embedded ring inboard is provided with the lug, quartz ring body upper portion is provided with the adsorption area, the adsorption area symmetry is provided with two sets of, quartz ring body bottom is provided with the bump, the bump is provided with four sets at least equidistance for symmetry with quartz ring body geometric center.

Further, a first disc body is arranged on the wafer bearing disc, a first circular groove and a flat opening are arranged on the first disc body, and the upper parts of the first circular groove and the flat opening are matched and clamped with the embedded ring and the protruding block.

Further, a second disc body is arranged on the grounding bearing disc, a second circular groove is formed in the inner side of the second disc body, a round hole is formed in the second circular groove, and at least four groups of round holes are symmetrically and equidistantly formed in the geometric center of the second disc body and are matched with the protruding points.

Further, be provided with U type frame, spacing slide bar, electricity on the dismouting subassembly and push away the jar, U type frame middle part below is connected with the holding down plate through electricity push away the telescopic link, the holding down plate lower part is connected with the rubber pressure disk, spacing slide bar runs through the rubber pressure disk and with rubber pressure disk sliding connection, the rubber pressure disk uses electricity push away the telescopic link as center bilateral symmetry to be provided with two sets of, electricity pushes away jar fixed connection in the workstation below, electricity pushes away jar upper portion and is connected with the lifter through the lifter, the lifter uses electricity to push away jar as center symmetry to be provided with two sets of, lifter sliding connection is on spacing slide bar, be provided with the arc suction nozzle on the lifter, the arc suction nozzle uses electricity to push away the telescopic link as center bilateral symmetry to be provided with two sets of.

Further, a sliding groove is formed in the translation assembly, a round rod and a screw rod are connected in the sliding groove in a rotating mode, the round rod is symmetrically arranged in two groups around the screw rod as the center, the round rod is in sliding connection with the material placing frame, and the screw rod is in threaded connection with the material placing frame.

Utilize two sets of spouts on the translation subassembly to run through and put the work or material rest, can make to put the work or material rest and inject and carry out horizontal slip on the spout, through lead screw and put work or material rest threaded connection, made things convenient for and put the work or material rest to carry out horizontal migration at the in-process drive of rotating the lead screw.

Further, the dismounting device is provided with a control panel, and the control panel is electrically connected with the dismounting component.

In the operation process, an operator can directly open and close the electric push telescopic rod and the electric push cylinder on the disassembly and assembly through the control panel, so that the switch control of the operator is facilitated, the working efficiency is improved, and the operation needs to be described, however, the related electrical equipment on the disassembly and assembly device is electrically connected with an external power supply.

Compared with the prior art, the utility model provides the quartz ring special for the semiconductor etching process, which has the following beneficial effects:

1. by arranging the adsorption areas on the two sides of the quartz ring body on the quartz protection ring, the adsorption is conveniently carried out by matching with the arc-shaped suction nozzles on the dismounting device in the whole upward dismounting process of the quartz protection ring, and the adsorption areas are slightly concave, so that the adsorption area of the arc-shaped suction nozzles is increased, and the vacuum negative pressure adsorption is more firm;

2. the bump at the bottom of the quartz ring body on the quartz protection ring is clamped with the round hole on the grounding bearing disc in a matching manner, so that the quartz protection ring is prevented from deviating from the wafer bearing disc and the grounding bearing disc in the working process, and then the embedded ring and the bump at the quartz ring body on the quartz protection ring are matched with the round groove I at the first disc body on the wafer bearing disc, the flat opening and the round groove II on the grounding bearing disc in a matching manner, so that the quartz protection ring is ensured to be more accurate in position and more stable in assembly quality in the installation process.

Drawings

FIG. 1 is a schematic diagram of a quartz ring dedicated to a semiconductor etching process according to the present utility model;

FIG. 2 is a schematic diagram showing the structure of a quartz protection ring of a special quartz ring for a semiconductor etching process according to the present utility model;

FIG. 3 is a schematic diagram showing the structure of a quartz protection ring of a special quartz ring for a semiconductor etching process according to the present utility model;

FIG. 4 is a schematic diagram of a device for removing and installing a quartz ring dedicated to a semiconductor etching process according to the present utility model;

FIG. 5 is a schematic diagram showing a front view of a device for removing and installing a quartz ring for a semiconductor etching process according to the present utility model;

fig. 6 is a schematic diagram of a top view structure of a device for removing a quartz ring dedicated to a semiconductor etching process according to the present utility model.

In the figure: 1. a quartz protection ring; 11. a quartz ring body; 12. an embedded ring; 13. a bump; 14. an adsorption zone; 15. a bump; 2. a wafer carrier; 21. a first disc body; 22. a round groove I; 23. a flat mouth; 3. a grounded carrier plate; 31. a second disc body; 32. a round groove II; 33. a round hole; 4. a work table; 5. disassembling and assembling the assembly; 51. a U-shaped frame; 52. an electric push telescopic rod; 53. a lower pressing plate; 54. a rubber pressure plate; 55. a limit slide bar; 56. an electric pushing cylinder; 57. a lifting rod; 58. a lifting plate; 59. arc suction nozzle; 6. a translation assembly; 61. a chute; 62. a round bar; 63. a screw rod; 7. a material placing frame; 8. a control panel; 9. and (5) assembling and disassembling the device.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Examples:

referring to fig. 1-6, a quartz ring dedicated to a semiconductor etching process, comprising: the quartz protection ring 1, the inner side of the quartz protection ring 1 is embedded with the wafer bearing disc 2, the outer side of the quartz protection ring 1 is embedded with the grounding bearing disc 3, and the whole formed by the quartz protection ring 1, the wafer bearing disc 2 and the grounding bearing disc 3 is clamped and fixed on the dismounting device 9; the disassembly and assembly device 9 is provided with a workbench 4, the workbench 4 is sequentially provided with a disassembly and assembly component 5, the lower part of the disassembly and assembly component 5 is provided with a translation component 6, the bottom of the translation component 6 is fixedly connected with the upper part of the workbench 4, and the upper part of the translation component 6 is slidably connected with a material placing frame 7.

Working principle: in the utility model, the adsorption areas 14 are arranged on the two sides of the quartz ring body 11 on the quartz protection ring 1, so that the adsorption by matching with the arc suction nozzle 59 in the whole upward disassembly process of the quartz protection ring 1 is facilitated, the adsorption area of the arc suction nozzle 59 is increased by slightly concaved adsorption areas, so that the vacuum negative pressure adsorption is more firm, the convex points 15 at the bottom of the quartz ring body 11 on the quartz protection ring 1 are mutually matched and clamped with the round holes 33 on the grounding bearing disc 3, the quartz protection ring 1 is prevented from being separated from the wafer bearing disc 2 and the grounding bearing disc 3 in the working process, and then the embedded rings 12 and the convex blocks 13 at the quartz ring body 11 on the quartz protection ring 1 are matched with the round grooves I22 and II 32 on the disc body I21 and the flat openings 23 on the wafer bearing disc 2, so that the positions of the quartz protection ring 1 are more accurate in the installation process and the assembly quality is more stable; when the whole formed by the quartz protection ring 1, the wafer bearing disc 2 and the grounding bearing disc 3 is required to be disassembled, the whole formed by the quartz protection ring 1, the wafer bearing disc 2 and the grounding bearing disc 3 can be fixed on the material placing frame 7, and then the whole can be quickly driven to move to the disassembling and assembling assembly 5 to perform corresponding disassembling and assembling work by rotating the rocker at the end part of the translation assembly 6, so that the whole disassembling and assembling process is simple and efficient.

The quartz protection ring 1 is provided with a quartz ring body 11, the inner side of the quartz ring body 11 is provided with an embedded ring 12, the inner side of the embedded ring 12 is provided with a bump 13, the upper part of the quartz ring body 11 is provided with an adsorption area 14, the adsorption area 14 is symmetrically provided with two groups, the bottom of the quartz ring body 11 is provided with bumps 15, and the bumps 15 are at least equidistantly provided with four groups by taking the geometric center of the quartz ring body 11 as the symmetry.

The wafer bearing disc 2 is provided with a disc body I21, the disc body I21 is provided with a circular groove I22 and a flat opening 23, and the upper parts of the circular groove I22 and the flat opening 23 are matched and clamped with the embedded ring 12 and the protruding block 13.

The grounding bearing plate 3 is provided with a plate body II 31, the inner side of the plate body II 31 is provided with a circular groove II 32, the circular groove II 32 is provided with a circular hole 33, and the circular hole 33 is at least equidistantly provided with four groups which are symmetrical by taking the geometric center of the plate body II 31 as the geometric center and are matched with the convex points 15.

The dismounting assembly 5 is provided with a U-shaped frame 51, a limiting slide bar 55 and an electric push cylinder 56, the lower part of the middle part of the U-shaped frame 51 is connected with a lower pressing plate 53 through an electric push telescopic rod 52, the lower part of the lower pressing plate 53 is connected with a rubber pressing plate 54, the limiting slide bar 55 penetrates through the rubber pressing plate 54 and is in sliding connection with the rubber pressing plate 54, the rubber pressing plate 54 is symmetrically arranged in left and right directions by taking the electric push telescopic rod 52 as a center, the electric push cylinder 56 is fixedly connected with the lower part of the workbench 4, the upper part of the electric push cylinder 56 is connected with a lifting plate 58 through a lifting rod 57, the lifting rod 57 is symmetrically arranged in two groups by taking the electric push cylinder 56 as a center, the lifting plate 58 is in sliding connection with the limiting slide bar 55, the lifting plate 58 is provided with an arc-shaped suction nozzle 59, and the arc-shaped suction nozzle 59 is symmetrically arranged in left and right directions by taking the electric push telescopic rod 52 as a center; when the whole formed by the quartz protection ring 1, the wafer bearing disc 2 and the grounding bearing disc 3 fixed on the opposite material frame 7 is required to be disassembled, an operator can fix the whole on the material frame 7, the rocker at the end part of the hand-operated translation assembly 6 drives the material frame 7 to move horizontally to the position right below the U-shaped frame 51, then the electric push telescopic rod 52 is started at the control panel 8 to drive the lower pressing plate 53 to slide downwards on the limit slide rod 55, the lower pressing plate 53 moves downwards to drive the rubber pressing plate 54 to pass through the annular area on the lifting plate 58 to tightly support the upper surface of the wafer bearing disc 2, then the control panel 8 starts the electric push cylinder 56 to drive the lifting rods 57 at two sides to slide downwards on the workbench 4, the top of the lifting rods 57 drives the lifting plate 58 to slide downwards on the limit slide rod 55, and the upper part of the arc suction nozzle 59 is in contact with the adsorption area 14 on the quartz protection ring 1 when being connected with an external vacuum generator through a connecting pipe, negative pressure is generated on the arc suction nozzle 59 to adsorb the whole quartz protection ring 1, and then the rubber pressing plate 54 is driven to pass through the annular area on the lifting plate 58 to tightly move upwards through the lifting rod 58 to clamp the upper surface of the quartz protection ring 1, and the upper surface of the quartz protection ring 2 can conveniently clamp the upper surface of the wafer bearing disc 2, and the upper surface of the lifting plate 3 can be clamped upwards, and the upper surface of the lifting plate 3 is clamped by the lifting plate 3 is convenient; similarly, the assembly and disassembly assembly 5 can also sequentially complete the integral assembly of the grounding bearing plate 3, the quartz protection ring 1 and the wafer bearing plate 2 by utilizing the mutual matching of the electric pushing telescopic rod 52, the rubber pressure plate 54, the electric pushing cylinder 56, the lifting rod 57 and the arc-shaped suction nozzle 59.

The translation assembly 6 is provided with a sliding groove 61, the sliding groove 61 is rotationally connected with a round rod 62 and a screw rod 63, the round rod 62 is symmetrically arranged in two groups left and right by taking the screw rod 63 as a center, the round rod 62 is in sliding connection with the material placing frame 7, and the screw rod 63 is in threaded connection with the material placing frame 7; two groups of sliding grooves 61 on the translation assembly 6 penetrate through the material placing frame 7, so that the material placing frame 7 can slide horizontally on the sliding grooves 61, and the material placing frame 7 is conveniently driven to move horizontally in the process of rotating the screw 63 through the screw 63 in threaded connection with the material placing frame 7.

The dismounting device 9 is provided with a control panel 8, and the control panel 8 is electrically connected with the dismounting assembly 5; in the operation process, an operator can directly open and close the electric push telescopic rod 52 and the electric push cylinder 56 on the dismounting assembly 5 through the control panel 8, so that the switch control of the operator is facilitated, the working efficiency is improved, and the operation needs to be described, however, the related electrical equipment on the dismounting device 9 is electrically connected with an external power supply.

In the utility model, the adsorption areas 14 are arranged on the two sides of the quartz ring body 11 on the quartz protection ring 1, so that the quartz protection ring 1 is conveniently matched with the arc-shaped suction nozzles 59 on the dismounting device 9 to be adsorbed in the whole upward dismounting process, and the adsorption areas 14 are slightly concave, so that the adsorption area of the arc-shaped suction nozzles 59 is increased, and the vacuum negative pressure adsorption is more firm; the bump 15 on the bottom of the quartz ring body 11 on the quartz protection ring 1 is matched and clamped with the round hole 33 on the grounding bearing disk 3, so that the quartz protection ring 1 is prevented from deviating from the wafer bearing disk 2 and the grounding bearing disk 3 in the working process, and then the embedded ring 12 and the bump 13 on the quartz ring body 11 on the quartz protection ring 1 are matched and embedded with the round groove one 22, the flat opening 23 and the round groove two 32 on the grounding bearing disk 3 on the first disk body 21 on the wafer bearing disk 2, so that the position of the quartz protection ring 1 is more accurate in the mounting process, and the assembly quality is more stable.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (7)

1. A quartz ring for a semiconductor etching process, comprising: the quartz protection ring (1), the inner side of the quartz protection ring (1) is embedded with a wafer bearing disc (2), the outer side of the quartz protection ring (1) is embedded with a grounding bearing disc (3), and the whole formed by the quartz protection ring (1), the wafer bearing disc (2) and the grounding bearing disc (3) is clamped and fixed on the dismounting device (9);

the automatic feeding and discharging device is characterized in that a workbench (4) is arranged on the dismounting device (9), a dismounting assembly (5) is sequentially arranged on the workbench (4), a translation assembly (6) is arranged at the lower part of the dismounting assembly (5), the bottom of the translation assembly (6) is fixedly connected with the upper part of the workbench (4), and a material placing frame (7) is connected to the upper part of the translation assembly (6) in a sliding manner.

2. The quartz ring special for the semiconductor etching process according to claim 1, wherein a quartz ring body (11) is arranged on the quartz protection ring (1), an embedded ring (12) is arranged on the inner side of the quartz ring body (11), a bump (13) is arranged on the inner side of the embedded ring (12), an adsorption area (14) is arranged on the upper portion of the quartz ring body (11), two groups of adsorption areas (14) are symmetrically arranged, protruding points (15) are arranged at the bottom of the quartz ring body (11), and at least four groups of protruding points (15) are symmetrically and equidistantly arranged by taking the geometric center of the quartz ring body (11) as a symmetry.

3. The quartz ring special for the semiconductor etching process according to claim 2, wherein a first disc body (21) is arranged on the wafer carrying disc (2), a first circular groove (22) and a flat opening (23) are arranged on the first disc body (21), and the upper parts of the first circular groove (22) and the flat opening (23) are matched and clamped with the embedded ring (12) and the protruding block (13).

4. The quartz ring special for the semiconductor etching process according to claim 2, wherein the grounding bearing disc (3) is provided with a disc body II (31), the inner side of the disc body II (31) is provided with a circular groove II (32), the circular groove II (32) is provided with round holes (33), and the round holes (33) are at least equidistantly provided with four groups which are symmetrical with the geometric center of the disc body II (31) and are matched with the convex points (15).

5. The quartz ring special for the semiconductor etching process according to claim 1, wherein the dismounting component (5) is provided with a U-shaped frame (51), a limit sliding rod (55) and an electric pushing cylinder (56), a lower pressing plate (53) is connected to the lower part of the middle part of the U-shaped frame (51) through an electric pushing telescopic rod (52), a rubber pressing plate (54) is connected to the lower part of the lower pressing plate (53), the limit sliding rod (55) penetrates through the rubber pressing plate (54) and is in sliding connection with the rubber pressing plate (54), the rubber pressing plate (54) is provided with two groups with the electric pushing telescopic rod (52) as a center in a bilateral symmetry manner, the electric pushing cylinder (56) is fixedly connected to the lower part of the workbench (4), the upper part of the electric pushing cylinder (56) is connected with a lifting plate (58) through a lifting rod (57), the lifting plate (58) is provided with two groups with the electric pushing cylinder (56) as a center symmetry manner, the lifting plate (58) is connected to the limit pressing plate (54) in a sliding manner, the lifting plate (58) is provided with two groups of electric pushing rods (59) as a center symmetry manner, and the arc-shaped suction nozzles (59) are provided with two groups of electric pushing rods (59) as arc-shaped suction nozzles.

6. The quartz ring special for the semiconductor etching process according to claim 1, wherein a sliding groove (61) is formed in the translation assembly (6), a round rod (62) and a screw rod (63) are rotationally connected to the sliding groove (61), the round rod (62) is symmetrically arranged in two groups around the screw rod (63), the round rod (62) is slidably connected with the material placing frame (7), and the screw rod (63) is in threaded connection with the material placing frame (7).

7. The quartz ring special for the semiconductor etching process according to claim 1, wherein the dismounting device (9) is provided with a control panel (8), and the control panel (8) is electrically connected with the dismounting assembly (5).