CN221065669U - Material transfer device of processing equipment and processing equipment - Google Patents

Abstract

The utility model relates to the technical field of processing equipment, in particular to a material transfer device of the processing equipment and the processing equipment. The utility model aims to solve the technical problem that the existing transfer device is easy to pollute materials when transferring the cleaned materials. For this purpose, the material transfer device of the utility model comprises a fixed member, a translational driving mechanism, a first transfer member and a second transfer member, wherein the translational driving mechanism is arranged on the fixed member and is used for driving the first transfer member and the second transfer member to horizontally move, the first transfer member is used for transferring ground material to the cleaning device, and the second transfer member is used for transferring cleaned material. According to the material transferring device, the first transferring component and the second transferring component are arranged to transfer the material before cleaning and the material after cleaning respectively, so that the cleaned material can be prevented from being polluted.

Description

Material transfer device of processing equipment and processing equipment

Technical Field

The utility model relates to the technical field of processing equipment, in particular to a material transfer device of the processing equipment and the processing equipment.

Background

Semiconductor wafers are very important materials in various fields such as aerospace, optical fibers, and the like. During processing of wafers, if lapping is directly performed after the wafers are cut from the ingot, chipping is likely to occur, causing wafer scrap, and therefore chamfering of the wafers is required before lapping.

The wafer is transferred to the cleaning device through the transfer device to clean the wafer, and then the wafer is transferred to the next process through the transfer device after cleaning, however, the conventional transfer device is easy to pollute the wafer when transferring the cleaned wafer.

Accordingly, there is a need in the art for a new solution to the above-mentioned problems.

Disclosure of utility model

In order to solve at least one of the problems in the prior art, namely, the technical problem that the existing transfer device is easy to pollute materials when transferring the cleaned materials.

In a first aspect, the application provides a material transfer apparatus of a processing apparatus, the processing apparatus comprising a grinding device for grinding material and a cleaning device for cleaning the material, the material transfer apparatus comprising a fixed member, and a translational drive mechanism, a first transfer member and a second transfer member mounted on the fixed member, the translational drive mechanism for driving the first transfer member and the second transfer member to move horizontally, the first transfer member for transferring ground material to the cleaning device, and the second transfer member for transferring cleaned material.

In a preferred embodiment of the above material transfer apparatus, the first transfer member and the second transfer member are distributed in a vertical direction.

In a preferred embodiment of the above material transfer apparatus, the first transfer member is a first transfer suction cup, and/or the second transfer member is a second transfer suction cup.

In the preferred technical scheme of the material transfer device, the first transfer sucker is located below the second transfer sucker, the adsorption surface of the first transfer sucker is arranged downwards, and the adsorption surface of the second transfer sucker is arranged upwards.

In the preferable technical scheme of the material transfer device, the material transfer device further comprises a lifting driving mechanism fixedly installed on the translation driving mechanism, the first transfer member and the second transfer member are both installed on the lifting driving mechanism, and the lifting driving mechanism is used for driving the first transfer member and the second transfer member to vertically move.

In the preferred technical scheme of the material transfer device, the lifting driving mechanism comprises a lifting driving member and a lifting arm fixedly connected with the lifting driving member, the lifting arm is horizontally arranged, and the first transfer member and the second transfer member are both arranged on the lifting arm.

In the preferable technical scheme of the material transfer device, the lifting driving member is a lifting cylinder, and the lifting arm is fixedly connected with a piston rod of the lifting cylinder.

In the preferred technical scheme of the material transfer device, the translation driving mechanism comprises a translation motor, a horizontal screw and a sliding seat arranged on the horizontal screw, wherein the sliding seat is connected with the first transfer member and the second transfer member, the translation motor is used for driving the horizontal screw to rotate, and the sliding seat horizontally moves along the length direction of the horizontal screw along with the rotation of the horizontal screw.

In a second aspect of the application, the application also provides processing equipment, which comprises the material transfer device.

In a preferred technical scheme of the processing equipment, the processing equipment is a chamfering machine or a thinning machine.

Under the condition of adopting the technical scheme, the material transfer device disclosed by the utility model can be used for respectively transferring the material before cleaning and the material after cleaning by arranging the first transfer component and the second transfer component, so that the material after cleaning can be prevented from being polluted.

Further, the material transfer device of the present utility model can improve the working efficiency by distributing the first transfer member and the second transfer member in the vertical direction.

Still further, the material transfer device of the utility model is convenient for taking and placing materials and is not easy to fall off in the process of transferring materials by arranging the first transfer component and the second transfer component into the sucker structure.

Still further, the material transfer device of the utility model is convenient for transferring materials by arranging the first transfer sucker below the second transfer sucker and arranging the adsorption surface of the first transfer sucker and the adsorption surface of the second transfer sucker downwards and upwards respectively, thereby improving the working efficiency.

Still further, the material transfer device drives the first transfer member and the second transfer member to move vertically by arranging the lifting driving mechanism, so that the first transfer member and the second transfer member move more flexibly, and the material transfer is facilitated.

Drawings

The technical scheme of the application is described below with reference to a chamfering machine and the accompanying drawings. In the accompanying drawings:

FIG. 1 is a schematic view of a part of a chamfering machine according to the present application;

FIG. 2 is a schematic structural view of a cleaning device of the chamfering machine according to the present application;

FIG. 3 is a schematic view of a portion of the take-out assembly of the chamfering machine of the present application;

FIG. 4 is a schematic view of the spin-drying assembly of the chamfering machine of the present application;

FIG. 5 is a schematic view of the lifting drive mechanism, the first transfer member and the second transfer member of the chamfering machine according to the first embodiment of the present application;

FIG. 6 is a schematic diagram II of the lifting drive mechanism, the first transfer member and the second transfer member of the chamfering machine of the present application;

fig. 7 is a schematic structural view of a fixing member and a translational driving mechanism of the chamfering machine of the present application.

List of reference numerals

100. A grinding device; 200. a cleaning device; 300. a material transfer device; 400. a wafer; 1. a support member; 11. cleaning the chamber; 12. a support base; 13. a protective cover; 2. a spin-drying assembly; 21. a main shaft; 22. a spin-drying table; 23. spin-drying the motor; 24. a synchronous band group; 211. a shaft body; 212. a shaft sleeve; 221. a second suction hole; 241. a driving pulley; 242. a transmission belt; 243. a driven pulley; 3. a water spray pipe; 4. a material taking assembly; 41. a material taking sucker; 42. a material taking cylinder; 43. a connecting arm; 411. a plate-like body; 412. a connecting member; 4121. a first airway; 5. an air blowing pipe; 6. a fixing member; 7. a translational drive mechanism; 71. a translation motor; 72. a horizontal screw; 73. a slide; 81. a first transfer member; 82. a second transfer member; 821. a third suction hole; 9. a lifting driving mechanism; 91. a lifting driving member; 92. a lifting arm; 10. and (3) a bracket.

Detailed Description

Preferred embodiments of the present utility model are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are merely for explaining the technical principles of the present utility model, and are not intended to limit the scope of the present utility model. For example, although the embodiments described below are described in connection with chamfering machines, the technical solution of the present utility model is equally applicable to other types of processing equipment, such as thinning machines, etc., and such adjustments and changes to the application object do not depart from the principle and scope of the present utility model, and should be limited to the scope of the present utility model.

It should be noted that, in the description of the present application, terms such as "upper", "lower", "left", "right", and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, in the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "configured," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood by those skilled in the art according to the specific circumstances.

Specifically, the utility model provides a chamfering machine, as shown in fig. 1, which comprises a grinding device 100, a cleaning device 200 and a material transferring device 300, wherein the grinding device 100 is used for grinding materials, the cleaning device 200 is used for cleaning the materials, and the material transferring device 300 is used for transferring the materials.

Taking the material as a wafer as an example, the grinding device 100 is used for chamfering and grinding the wafer, after the wafer is ground, the wafer is transferred to the cleaning device 200 by the material transfer device 300, then the material wafer is cleaned by the cleaning device 200, and after the wafer is cleaned, the wafer is also transferred by the material transfer device 300.

The following describes the technical scheme of the utility model by taking a wafer as an example.

Preferably, as shown in fig. 2, the cleaning apparatus 200 of the present utility model includes a support member 1, and a spin-drying assembly 2, a rinsing assembly, and a material taking assembly 4 mounted on the support member 1.

Wherein the supporting member 1 has a cleaning chamber 11, at least a portion of the spin-drying assembly 2 is located in the cleaning chamber 11, the spin-drying assembly 2 is used for carrying the wafer 400 and carrying the wafer 400 to rotate, the rinsing assembly is used for rinsing the wafer 400 located on the spin-drying assembly 2, and the material taking assembly 4 is used for taking the cleaned wafer 400 off the spin-drying assembly 2.

Specifically, the surface of the wafer 400 after grinding is provided with a lot of powder, the cleaning device of the utility model can clean the powder on the wafer 400, specifically, the wafer 400 can be placed on the spin-drying assembly 2, the washing assembly can spray water on the wafer 400 to wash the powder on the wafer 400, the spin-drying assembly 2 can rotate at a high speed with the wafer 400 to spin-dry the wafer 400, and after the wafer 400 is spin-dried, the wafer 400 is taken off from the spin-drying assembly 2 through the material taking assembly 4 so as to continuously clean other wafers 400, thereby improving the working efficiency.

Illustratively, the supporting member 1 includes a supporting seat 12 and a protecting cover 13 disposed on the supporting seat 12, wherein the bottom end of the protecting cover 13 is fixedly connected with or integrally disposed with the top surface of the supporting seat 12, a cleaning chamber 11 is formed in the protecting cover 13, and the top of the cleaning chamber 11 is disposed in an opening manner, so as to facilitate taking and placing the wafer 400.

Preferably, as shown in fig. 2 and 3, the material taking assembly 4 of the present utility model includes a first driving mechanism and a material taking chuck 41, wherein the first driving mechanism is in driving connection with the material taking chuck 41, and the first driving mechanism can drive the material taking chuck 41 to move, and the material taking chuck 41 is used for adsorbing the wafer 400 on the spin-drying assembly 2.

By adopting the material taking sucker 41 to absorb the wafer 400 positioned on the spin-drying assembly 2, the wafer 400 can be sucked very conveniently, and the working efficiency of the cleaning device can be improved.

It should be noted that, in practical applications, those skilled in the art may set the first driving mechanism as a motor driving mechanism, or may set the first driving mechanism as a hydraulic driving mechanism, or may set the first driving mechanism as a cylinder driving mechanism, etc., and such specific types of adjustment and modification of the first driving mechanism do not deviate from the principle and scope of the present utility model, and should be limited to the protection scope of the present utility model.

In addition, it should be noted that, in practical applications, the first driving mechanism may be configured to only drive the material taking suction cup 41 to move horizontally, or may be configured to only drive the material taking suction cup 41 to move vertically, or may be configured to drive the material taking suction cup 41 to move horizontally and move vertically, which do not deviate from the principle and scope of the present utility model, and such flexible adjustment and modification should be limited within the scope of the present utility model.

In addition, it should be noted that the number of the material taking suction cups 41 is not limited in the present utility model, for example, when the size of the wafer is small, only one material taking suction cup 41 may be provided, and when the size of the wafer is large, a plurality of material taking suction cups 41 may be provided, and the plurality of material taking suction cups 41 are distributed along the horizontal direction to jointly absorb the wafer.

Preferably, as shown in fig. 2 and 3, the first driving mechanism of the present utility model includes a material taking cylinder 42 and a connecting arm 43, wherein two ends of the connecting arm 43 are respectively connected with the material taking cylinder 42 and the material taking suction cup 41, and the material taking cylinder 42 drives the material taking suction cup 41 to move up and down along the vertical direction through the connecting arm 43.

Illustratively, as shown in fig. 2 and 3, the material taking cylinder 42 is installed outside the cleaning chamber 11, the connection arm 43 is horizontally disposed, one end of the connection arm 43 is fixedly connected with a piston rod of the material taking cylinder 42, the other end of the connection arm 43 extends from above the cleaning chamber 11 to above the spin-drying table 22 (see fig. 4 in detail) of the spin-drying assembly 2, and the material taking suction cup 41 is installed at the other end of the connection arm 43 just above the spin-drying table 22 so as to facilitate the suction of the wafer 400 located on the spin-drying table 22.

After the wafer 400 is cleaned, the material taking air cylinder 42 is lowered to a position close to the spin-drying table 22 by the material taking sucker 41 through the connecting arm 43, the material taking assembly 4 adsorbs the wafer 400 on the spin-drying table 22, the material taking air cylinder 42 is moved upwards by the connecting arm 43 by the material taking sucker 41 and the wafer 400, and then the material transferring device 300 moves to the position below the material taking sucker 41 to catch the wafer 400 and transfer the wafer 400 to other manipulators.

Preferably, as shown in fig. 2 and 3, the material taking suction cup 41 of the present utility model includes a plate-shaped body 411 and a connecting member 412 provided on the plate-shaped body 411, wherein the connecting member 412 is fixedly connected with a first driving mechanism, at least one first suction hole (not shown in the drawings) is provided on the bottom surface of the plate-shaped body 411, and a first ventilation groove (not shown in the drawings) communicating with the first suction hole is provided in the plate-shaped body 411, and the first ventilation groove communicates with a vacuum generator.

Wherein, the connecting member 412 is fixedly connected with the connecting arm 43 of the first driving mechanism, the bottom surface of the plate-shaped body 411 is preferably provided with a plurality of first air inlets to improve the adsorption force to the wafer 400, when the wafer 400 on the spin-drying assembly 2 needs to be removed, the vacuum generator is started, a negative pressure environment is formed in the plate-shaped body 411, the bottom surface of the plate-shaped body 411 has the adsorption force, the wafer 400 can be firmly adsorbed on the plate-shaped body 411, when the wafer 400 needs to be transferred to other manipulators, the vacuum generator is turned off, and the wafer 400 is automatically separated from the material taking sucker 41.

It should be noted that, in practical applications, those skilled in the art may set the connection member 412 as a connection frame, a connection rod, or a connection plate, and such modifications and changes to the specific structural form of the connection member 412 do not deviate from the principle and scope of the present utility model, and should be limited to the protection scope of the present utility model.

Preferably, as shown in fig. 2 and 3, the connection member 412 has a cylindrical structure, the top and bottom ends of the connection member 412 are connected to the first driving mechanism and the plate-shaped body 411, respectively, a first air passage 4121 extending in the axial direction thereof is provided in the connection member 412, and the bottom and top ends of the first air passage 4121 are communicated with the first air vent groove and the vacuum generator, respectively.

Illustratively, the connecting member 412 is a vertically disposed connecting rod, the connecting rod is a hollow structure, a first air channel 4121 is formed inside the connecting rod, the bottom end of the connecting rod is fixedly connected or integrally disposed with the plate-shaped body 411, the top end of the connecting rod is fixedly connected with the connecting arm 43 of the first driving mechanism, the bottom end of the first air channel 4121 is communicated with the first air channel in the plate-shaped body 411, and the top end of the first air channel 4121 is communicated with the vacuum generator through an air pipe.

Preferably, as shown in fig. 2 and 4, the spin-drying assembly 2 of the present utility model includes a second driving mechanism, a spindle 21, and a spin-drying table 22, the second driving mechanism is in driving connection with the spindle 21 and is capable of driving the spindle 21 to rotate, the spindle 21 is vertically disposed, and the top end of the spindle 21 extends into the cleaning chamber 11 from the bottom of the cleaning chamber 11, the spin-drying table 22 is fixedly installed at the top end of the spindle 21, and the spin-drying table 22 is used for carrying the wafer 400.

As illustrated in fig. 2 and 4, the second driving mechanism is fixedly installed on the support base 12 of the support member 1, the second driving mechanism is located outside the cleaning chamber 11, the top surface of the support base 12 is provided with a through hole through which the spindle 21 passes, and the second driving mechanism drives the spindle 21 to rotate at a high speed with the spin-drying table 22 and the wafer 400 on the spin-drying table 22 during the cleaning of the wafer 400, so as to spin-dry the wafer 400.

It should be noted that, in practical applications, those skilled in the art may set the second driving mechanism in a structure of a motor and a speed reducer, or in a structure of a motor and a synchronous belt set, etc., and such adjustments and changes to the specific structure of the second driving mechanism do not deviate from the principle and scope of the present utility model, and should be limited to the protection scope of the present utility model.

Preferably, as shown in fig. 4, the top surface of the spin-drying table 22 is provided with at least one second suction hole 221, and a second ventilation groove (not shown) communicating with the second suction hole 221 is provided in the spin-drying table 22, the second ventilation groove communicating with the vacuum generator.

The wafer 400 to be cleaned is placed on the top surface of the spin-drying table 22, the vacuum generator is started, a negative pressure environment is generated in the spin-drying table 22, the wafer 400 is firmly adsorbed on the top surface of the spin-drying table 22, the wafer 400 is prevented from being separated from the spin-drying table 22 in the spin-drying process, after the wafer 400 is cleaned, the vacuum generator is turned off, and the wafer 400 is taken away by the material taking sucker 41.

It should be noted that the present utility model is not limited to the number of the second suction holes 221, and those skilled in the art may set the number of the second suction holes 221 to one or more, however, it is preferable to set the number of the second suction holes 221 to a plurality to increase the adsorption force of the spin-drying table 22 to the wafer 400.

In addition, it should be noted that the shape of the second suction hole 221 is not limited by the present utility model, and those skilled in the art may set the second suction hole 221 to be circular, square, or elongated, etc., and such flexible adjustment and modification should be limited within the scope and spirit of the present utility model.

In addition, the vacuum generator for the spin stand 22 and the vacuum generator for the take-out suction cup 41 are independent, and each is independently controlled to operate.

Preferably, a second air passage extending in the axial direction of the main shaft 21 is provided in the main shaft, and the top and bottom ends of the second air passage are respectively communicated with the second air passage and the vacuum generator.

Illustratively, as shown in fig. 4, the spindle 21 includes a shaft body 211 and a shaft sleeve 212 sleeved on the shaft body 211, the shaft sleeve 212 is fixedly connected with the supporting seat 12 of the supporting member 1, the shaft body 211 can rotate relative to the shaft sleeve 212, the top end of the shaft body 211 is fixedly connected with the spin-drying table 22, the second air passage extends from the top end of the shaft body 211 to the bottom end of the shaft body 211, the top end of the second air passage is communicated with the second air passage in the spin-drying table 22, a rotary joint is mounted at the bottom end of the second air passage, and the rotary joint is communicated with the vacuum generator through an air pipe.

Preferably, as shown in fig. 2 and 4, the second driving mechanism includes a spin-drying motor 23 and a synchronous belt set 24, and the spin-drying motor 23 is in driving connection with the main shaft 21 through the synchronous belt set 24.

Illustratively, as shown in fig. 2 and 4, the spin-drying motor 23 is vertically installed on the support base 12 of the support member 1, the driving shaft of the spin-drying motor 23 is disposed downward, and the synchronous belt set 24 includes a driving pulley 241 fixedly installed on the driving shaft of the spin-drying motor 23, a driven pulley 243 fixedly installed on the shaft body 211 of the main shaft 21, and a driving belt 242 for connecting the driving pulley 241 and the driven pulley 243, the spin-drying motor 23 drives the driving pulley 241 to rotate, the driving pulley 241 rotates with the driven pulley 243 and the shaft body 211 through the driving belt 242, and the shaft body 211 rotates with the spin-drying table 22 and the wafer 400.

Preferably, as shown in fig. 2, the cleaning apparatus of the present utility model further includes an air blowing assembly for blowing air toward the wafer 400 positioned on the spin-drying assembly 2.

By providing the blowing assembly to blow air onto the wafer 400, the cleaning efficiency of the wafer 400 can be improved.

Illustratively, as shown in fig. 2, the blowing assembly includes an air pump and a blowing pipe 5 communicated with the air pump, the blowing pipe 5 extends into the cleaning chamber 11, and in the process of cleaning the wafer 400, the air pump is started to blow air towards the wafer 400 through the blowing pipe 5, so that the wafer 400 is dried as soon as possible, and the cleaning efficiency is improved.

Preferably, as shown in fig. 2, the flushing assembly of the present utility model comprises a water storage member, a water pump installed in the water storage member, and a water spray pipe 3 communicating with the water pump, the water spray pipe 3 extending into the cleaning chamber 11.

When the wafer 400 needs to be washed, a water pump is started, the water pump pumps clean water in the water storage component into the water spraying pipe 3, and the water spraying pipe 3 sprays water towards the wafer 400 to wash away powder on the wafer 400.

Preferably, as shown in fig. 5 to 7, the material transfer apparatus 300 of the present utility model includes a fixing member 6, and a translation driving mechanism 7, a first transfer member 81 and a second transfer member 82 mounted on the fixing member 6, the translation driving mechanism 7 for driving the first transfer member 81 and the second transfer member 82 to horizontally move, the first transfer member 81 for transferring the ground wafer 400 to the cleaning apparatus, and the second transfer member 82 for transferring the cleaned wafer 400.

By providing the first transfer member 81 and the second transfer member 82 to transfer the wafer 400 before cleaning and the wafer 400 after cleaning, respectively, the wafer 400 after cleaning can be prevented from being contaminated.

Specifically, after the grinding of the wafer 400 is completed by the grinding device, the first transfer member 81 is driven by the translation driving mechanism 7 to horizontally move to a position close to the wafer 400, the wafer 400 is removed, then the wafer 400 is driven by the translation driving mechanism 7 to move to the cleaning device with the first transfer member 81, the wafer 400 is placed on the spin-drying table 22 of the spin-drying assembly 2, the cleaned wafer 400 is transferred to the second transfer member 82 by the material taking assembly 4 of the cleaning device, and the second transfer member 82 and the wafer 400 are driven by the translation driving mechanism 7 to move to the next process position.

It should be noted that, in practical applications, the first transferring member 81 and the second transferring member 82 may be disposed to be distributed along a horizontal direction, or the first transferring member 81 and the second transferring member 82 may be disposed to be distributed along a vertical direction, etc., which are flexibly adjusted and changed without departing from the principle and scope of the present utility model, and should be limited to the protection scope of the present utility model.

Preferably, as shown in fig. 5 and 6, the first transfer member 81 and the second transfer member 82 are distributed in the vertical direction.

By distributing the first transfer member 81 and the second transfer member 82 in the vertical direction, the work efficiency can be improved. Specifically, after the first transfer member 81 moves above the spin-drying table 22, the second transfer member 82 is aligned with the material taking suction cup 41 in the vertical direction, and the material taking suction cup 41 transfers the cleaned wafer 400 to the second transfer member 82 while the first transfer member 81 transfers the wafer 400 to the spin-drying table 22, so that the working efficiency is greatly improved.

Preferably, as shown in fig. 5 and 6, the first transfer member 81 is a first transfer suction cup.

It should be noted that, the first transferring member 81 of the present utility model is not limited to be configured as a suction cup, and for example, the first transferring member 81 may be configured as a fork, a tray, or the like, and of course, the present utility model preferably employs the first transferring member 81 as a suction cup, so that the wafer 400 is easy to be taken and placed, and the wafer 400 is not easy to fall during the process of transferring the wafer 400.

In addition, it should be noted that the number of the first transfer chucks is not limited, for example, when the size of the wafer is small, only one first transfer chuck may be provided, and when the size of the wafer is large, a plurality of first transfer chucks may be provided, and the plurality of first transfer chucks are distributed along the horizontal direction and jointly adsorb the wafer.

Preferably, as shown in fig. 5 and 6, the second transfer member 82 is a second transfer cup.

It should be noted that, the second transferring member 82 of the present utility model is not limited to be configured as a suction cup, and for example, the second transferring member 82 may be configured as a fork, a tray, or the like, and of course, the second transferring member 82 is preferably configured as a suction cup, so that the wafer 400 is easy to be taken and placed, and the wafer 400 is not easy to fall during the process of transferring the wafer 400.

In addition, it should be noted that the number of the second transfer chucks is not limited, for example, when the size of the wafer is small, only one second transfer chuck may be provided, and when the size of the wafer is large, a plurality of second transfer chucks may be provided, and the plurality of second transfer chucks are distributed along the horizontal direction and jointly adsorb the wafer.

Preferably, as shown in fig. 5 and 6, the first transfer chuck is located below the second transfer chuck with the suction surface of the first transfer chuck disposed downward and the suction surface of the second transfer chuck disposed upward.

As shown in fig. 5 and 6, the bottom surface of the first transfer chuck is provided with a suction hole (not shown in the drawings), the first transfer chuck is communicated with the vacuum generator through an air pipe, a negative pressure environment is generated in the first transfer chuck after the vacuum generator is started, the wafer 400 is firmly adsorbed on the bottom surface of the first transfer chuck, the top surface of the second transfer chuck is also provided with a suction hole, which is marked as a third suction hole 821, the second transfer chuck is also communicated with the vacuum generator through an air pipe, a negative pressure environment is generated in the second transfer chuck after the vacuum generator is started, and the wafer 400 is firmly adsorbed on the top surface of the second transfer chuck, wherein the vacuum generator communicated with the first transfer chuck and the vacuum generator communicated with the second transfer chuck are preferably two independent vacuum generators, and each of the vacuum generators is independently controlled to operate.

Preferably, as shown in fig. 5 to 7, the material transfer apparatus of the present utility model further includes a lift driving mechanism 9 fixedly installed on the translation driving mechanism 7, the first transfer member 81 and the second transfer member 82 are each installed on the lift driving mechanism 9, and the lift driving mechanism 9 is used to drive the first transfer member 81 and the second transfer member 82 to move vertically.

In order to avoid collision between the wafer 400 and the spin-drying table 22, a certain height difference exists between the first transfer member 81 and the spin-drying table 22, after the first transfer member 81 moves above the spin-drying table 22 with the wafer 400, the first transfer member 81 is driven by the lifting driving mechanism 9 to move downwards with the wafer 400, and when the wafer 400 approaches the top surface of the spin-drying table 22, the wafer 400 is released again.

Preferably, as shown in fig. 5 and 6, the elevation driving mechanism 9 includes an elevation driving member 91 and an elevation arm 92 fixedly connected to the elevation driving member 91, the elevation arm 92 being horizontally disposed, and the first transfer member 81 and the second transfer member 82 are mounted on the elevation arm 92.

Illustratively, one end of the lifting arm 92 is fixedly coupled to the lifting drive member 91, and both the first transfer member 81 and the second transfer member 82 are mounted to the other end of the lifting arm 92.

It should be noted that, in practical applications, those skilled in the art may set the lifting driving member 91 as a motor, a cylinder or a hydraulic cylinder, etc., and such modifications and changes to the specific structural form of the lifting driving member 91 do not deviate from the principle and scope of the present utility model, and should be limited to the protection scope of the present utility model.

Preferably, as shown in fig. 5 and 6, the elevation driving member 91 is an elevation cylinder, and the elevation arm 92 is fixedly connected with a piston rod of the elevation cylinder.

As shown in fig. 5 and 6, the material transferring apparatus of the present utility model further includes a bracket 10, a lifting cylinder is vertically installed on the bracket 10, a piston rod of the lifting cylinder protrudes upward, and a top end of the piston rod is fixedly connected with the lifting arm 92.

It should be noted that, in practical applications, those skilled in the art may set the translational driving mechanism 7 as a motor driving mechanism, a hydraulic driving mechanism, or an air driving mechanism, etc., and such modifications and changes to the specific structural form of the translational driving mechanism 7 do not deviate from the principle and scope of the present utility model, and should be limited to the protection scope of the present utility model.

Preferably, as shown in fig. 7, the translation driving mechanism 7 of the present utility model includes a translation motor 71, a horizontal screw 72, and a slider 73 mounted on the horizontal screw 72, the slider 73 being connected to a first transfer member 81 and a second transfer member 82, the translation motor 71 being configured to drive the horizontal screw 72 to rotate, the slider 73 being horizontally moved along the length direction of the horizontal screw 72 with the rotation of the horizontal screw 72.

As shown in fig. 5 to 7, the bottom surface of the bracket 10 is fixedly connected with the top surface of the sliding seat 73, the sliding seat 73 is provided with a threaded hole matched with the horizontal screw rod 72, and when the horizontal screw rod 72 is driven to rotate by the translation motor 71, the sliding seat 73 moves left and right along the horizontal screw rod 72, and simultaneously drives the bracket 10, the lifting cylinder, the lifting arm 92, the first transferring member 81 and the second transferring member 82 which are mounted on the sliding seat 73 to move left and right.

Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments. For example, in the claims of the present application, any of the claimed embodiments may be used in any combination.

Thus far, the technical solution of the present application has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present application is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present application, and such modifications and substitutions will fall within the scope of the present application.

Claims (10)

1. The utility model provides a processing equipment's material transfer device, its characterized in that, processing equipment includes grinding device and belt cleaning device, grinding device is used for grinding the material, belt cleaning device is used for wasing the material, material transfer device includes fixed component and installs translation actuating mechanism, first transfer component and the second transfer component on the fixed component, translation actuating mechanism is used for driving first transfer component with the second transfer component horizontal migration, first transfer component is used for transferring the material after grinding to belt cleaning device, the second transfer component is used for transferring the material that washs the completion.

2. The material transfer apparatus of claim 1, wherein the first transfer member and the second transfer member are distributed in a vertical direction.

3. The material transfer apparatus of claim 2, wherein the first transfer member is a first transfer suction cup; and/or the number of the groups of groups,

The second transfer member is a second transfer chuck.

4. A material transfer apparatus of a processing plant according to claim 3, wherein the first transfer suction cup is located below the second transfer suction cup, the suction side of the first transfer suction cup being disposed downwardly and the suction side of the second transfer suction cup being disposed upwardly.

5. The material transfer apparatus of claim 1, further comprising a lift drive fixedly mounted to the translational drive mechanism, the first transfer member and the second transfer member each mounted to the lift drive mechanism, the lift drive mechanism for driving the first transfer member and the second transfer member to move vertically.

6. The material transfer apparatus of claim 5, wherein the lift drive mechanism comprises a lift drive member and a lift arm fixedly connected to the lift drive member, the lift arm being horizontally disposed, the first transfer member and the second transfer member each being mounted on the lift arm.

7. The material transfer apparatus of claim 6, wherein the elevation drive member is an elevation cylinder, and the elevation arm is fixedly connected to a piston rod of the elevation cylinder.

8. The material transfer apparatus of any one of claims 1 to 7, wherein the translation driving mechanism includes a translation motor for driving rotation of the horizontal screw, a horizontal screw, and a slider mounted on the horizontal screw, the slider being connected to the first transfer member and the second transfer member, the slider being horizontally moved along a length direction of the horizontal screw with rotation of the horizontal screw.

9. A processing apparatus, characterized in that it comprises a material transfer device according to any one of claims 1 to 8.

10. The processing apparatus of claim 9, wherein the processing apparatus is a chamfering machine or a thinning machine.