CN111952221A - Chip processing wafer belt cleaning device - Google Patents
Chip processing wafer belt cleaning device Download PDFInfo
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- CN111952221A CN111952221A CN202010508290.6A CN202010508290A CN111952221A CN 111952221 A CN111952221 A CN 111952221A CN 202010508290 A CN202010508290 A CN 202010508290A CN 111952221 A CN111952221 A CN 111952221A
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- inner cavity
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- wall
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- 238000004140 cleaning Methods 0.000 title claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 238000005507 spraying Methods 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 21
- 230000000670 limiting effect Effects 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 49
- 239000007921 spray Substances 0.000 description 11
- 230000009471 action Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- B08B1/20—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Abstract
The invention discloses a chip processing wafer cleaning device, which is characterized by comprising the following components: the device comprises a drainage tank, a shell, a controller, a feeding hole, a spraying pipe, a fixing mechanism and a lifting mechanism; the shell is arranged at the top end of the drainage groove, and the bottom end of the inner cavity of the shell is communicated with the top end of the inner cavity of the drainage groove; the controller is arranged at the center of the front side of the shell; the feed inlet is formed in the center of the top end of the inner cavity of the shell; the two spraying pipes are respectively arranged at the top ends of the front side and the rear side of the inner cavity of the shell along the left-right direction; the fixing mechanism is arranged in the middle of the inner cavity of the shell along the left-right direction; the lifting mechanism is installed at the bottom end of the inner cavity of the shell along the up-down direction. This chip processing wafer belt cleaning device can fix the wafer of different dimensions and can make the wafer keep rotating in the cleaning process simultaneously, improves the device suitability to can make the wafer wash the automatic device inner chamber that shifts out that finishes, conveniently take out, the practicality is strong.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a wafer cleaning device for chip processing.
Background
Chips, also known as microcircuits (microcircuits), microchips (microchips), and Integrated Circuits (ICs). The silicon chip containing integrated circuit is small in volume and is often a part of computer or other electronic equipment, the semiconductor IC process is developed gradually based on four basic processes (ion implantation, diffusion, epitaxial growth and photoetching) invented after the 50 th of the 20 th century, because each element and connecting wire in the integrated circuit are very fine, if the integrated circuit is polluted by dust particles and metal in the manufacturing process, the damage of the circuit function in the chip, short circuit or open circuit and the like are easily caused, the failure of the integrated circuit and the formation of geometric characteristics are influenced, therefore, in the manufacturing process, except for removing external pollution sources, wet cleaning or dry cleaning work is required in the manufacturing steps of the integrated circuit such as high-temperature diffusion, before ion implantation and the like, and the dry and wet cleaning work is carried out on the premise of not damaging the surface characteristics and the electrical characteristics of the wafer, effectively using chemical solution or gas to remove the residual impurities of micro-dust, metal ions and organic matters on the wafer;
in the prior art, the cleaning device for the wafer is mostly used for placing the wafer in the fixed die, and the wafer is driven to rotate under the matching of the die, so that the cleaning liquid is uniformly sprayed on the surface of the wafer.
Disclosure of Invention
The invention aims to provide a wafer cleaning device for chip processing, which at least solves the problems that a wafer cleaning device in the prior art adopts a fixed die, cannot be suitable for wafers with different sizes and specifications, has poor applicability and is inconvenient for taking out the wafers after the wafers are cleaned.
In order to achieve the purpose, the invention provides the following technical scheme: a chip processing wafer cleaning device comprises:
a water discharge tank;
the shell is arranged at the top end of the drainage groove, and the bottom end of the inner cavity of the shell is communicated with the top end of the inner cavity of the drainage groove;
a controller installed at a front center position of the housing;
the feed inlet is formed in the center of the top end of the inner cavity of the shell, and the upper side and the lower side of the inner cavity of the feed inlet are respectively communicated with the outer wall and the inner cavity of the shell;
the spraying pipes are arranged, the two spraying pipes are respectively installed at the top ends of the front side and the rear side of the inner cavity of the shell along the left-right direction, and the left sides of the spraying pipes extend out of the outer wall of the shell;
the fixing mechanism is arranged in the middle of the inner cavity of the shell along the left-right direction;
and the lifting mechanism is arranged at the bottom end of the inner cavity of the shell along the vertical direction.
Preferably, the drain tank further includes: the cleaning device comprises a first rotating shaft, a gear, a first motor and a cleaning roller; the number of the first rotating shafts is two, the two first rotating shafts are respectively arranged in the inner cavity of the shell along the left-right direction and are positioned on the front side and the rear side above the fixing mechanism, the inner ring of the bearing is in interference fit with the outer wall of the first rotating shaft, the outer ring of the bearing is fixedly connected with the inner wall of the shell, and the left side of the first rotating shaft extends out of the outer wall of the shell; the number of the gears is two, the two gears are respectively in key connection with the front end and the rear end of the left side of the front first rotating shaft and the rear first rotating shaft, and the front gear and the rear gear are meshed with each other; the first motor is arranged on the left side of the shell along the left-right direction, the output end of the first motor is connected with a left end screw of a first rotating shaft positioned on the rear side of the inner cavity of the drainage channel, and the first motor is electrically connected with the controller; the cleaning rollers are two in number and are arranged on the outer walls of the front first rotating shaft and the rear first rotating shaft in the left-right direction respectively.
Preferably, the fixing mechanism includes: the guide rail, the screw nut, the shell, the second motor, the first bevel gear, the screw rod and the second bevel gear; the guide rail is arranged in the middle of the inner cavity of the shell along the left-right direction; the number of the screw nuts is two, and the two screw nuts are respectively inserted at the left side and the right side of the inner cavity of the guide rail; the shell is arranged on the right side of the top end of the guide rail; the second motor is arranged on the right side of the guide rail through a support along the front-back direction, the output end of the second motor extends into the inner cavity of the shell, and the second motor is electrically connected with the controller; the first conical gear screw is connected to the output end of the second motor; the screw rod is rotatably connected to the inner cavity of the shell through a bearing along the left-right direction, the inner cavity of the bearing is in interference fit with the outer wall of the screw rod, the outer ring of the bearing is fixedly connected with the inner wall of the shell, the left side of the screw rod extends out of the outer wall of the shell, threads on the left side and the right side of the outer wall of the screw rod are positive and negative threads, and the left screw nut and the right screw nut are respectively in threaded connection with the left side and the right side of the outer; the second bevel gear is connected to the right side of the outer wall of the screw rod screw in a key mode, and the second bevel gear is meshed with the first bevel gear.
Preferably, the fixing mechanism includes: the third motor, the positioning seat and the positioning roller; the number of the third motors is two, the two third motors are respectively arranged at the top ends of the rear sides of the left and right screw nuts along the front-back direction, the output ends of the third motors extend out of the front sides of the screw nuts, and the third motors are electrically connected with the controller; the number of the positioning seats is two, the two positioning seats are respectively installed at the output ends of the left and right third motors, and the positioning seats are V-shaped; the number of the positioning rollers is two, the number of the positioning rollers in each group is two, the two positioning rollers are respectively connected to the inner end and the outer end of each positioning seat on the left side and the right side through pin shafts in a rotating mode, and clamping grooves are formed in the outer wall of each positioning roller along the circumferential direction.
Preferably, the lifting mechanism includes: the electric push rod, the fixed seat, the second rotating shaft, the fourth motor and the rotating roller; the electric push rod is arranged in the inner cavity of the shell through a bracket along the vertical direction and is electrically connected with the controller; the fixed seat is arranged at the top end of the electric push rod; the number of the second rotating shafts is two, the two second rotating shafts are rotatably connected to the left side and the right side of the inner cavity of the fixed seat through bearings along the front-back direction, the inner ring of each bearing is in interference fit with the outer wall of each second rotating shaft, and the outer ring of each bearing is fixedly connected with the inner wall of the fixed seat; the fourth motor is arranged on the rear side of the outer wall of the fixed seat along the front-back direction, the output end of the fourth motor extends into the inner cavity of the fixed seat and is connected with a second rotating shaft screw positioned on the right side of the inner cavity of the fixed seat, and the fourth motor is electrically connected with the controller; the number of the rotating rollers is two, the two rotating rollers are connected to the front sides of the outer walls of the left second rotating shaft and the right second rotating shaft in a keyed mode, the outer walls of the rotating rollers extend out of the inner cavity of the fixing base, and clamping grooves are formed in the outer walls of the rotating rollers along the circumferential direction.
Preferably, the shape of the fixing seat is a V shape.
Preferably, the lifting mechanism further comprises: the device comprises a belt pulley, a transmission belt, a first limiting wheel and a second limiting wheel; the number of the belt pulleys is two, and the two belt pulleys are connected to the rear sides of the outer walls of the left second rotating shaft and the right second rotating shaft in a key mode; the left end and the right end of the inner side of the transmission belt are respectively sleeved on the outer walls of the left belt pulley and the right belt pulley, and the transmission belt is in a V shape matched with the inner cavity of the fixed seat; the first limiting wheel is rotatably connected to the lower portion of the rear side of the inner cavity of the fixed seat through a pin shaft, and the outer wall of the first limiting wheel is in contact with the inner side bevel below the middle of the transmission belt; the second limiting wheel is rotatably connected to the upper portion of the rear side of the inner cavity of the fixing seat through a pin shaft, and the outer wall of the second limiting wheel is in contact with the outer side bevel above the middle of the transmission belt.
Compared with the prior art, the invention has the beneficial effects that: the wafer cleaning device for chip processing drives the positioning seats on the corresponding positions to drive the positioning rollers on the corresponding positions to rotate clockwise or anticlockwise to a state matched with the diameter of a wafer or the radian of the outer wall through the left and right third motors respectively, drives the rotating rollers to move to the height of a specified position and be clamped with the bottom end of the outer wall of the wafer 2 through the extension and shortening of the electric push rod under the matching of the fixed seat, drives the first bevel gear to rotate clockwise or anticlockwise through the second motor, drives the second bevel gear to drive the screw rod to rotate anticlockwise or clockwise under the rotating force of the first bevel gear, drives the positioning rollers to move inwards or outwards to be jointed with the outer diameter of the wafer under the rotating force of the screw rod through the left and right third motors, and drives the belt pulleys on the corresponding positions to rotate through the spraying pipe to spray cleaning liquid, the left side belt pulley is driven to rotate by the aid of the transmission belt and the right side belt pulley under the action of rotating force, the left second rotating shaft and the right second rotating shaft drive the rotating rollers at corresponding positions to rotate the wafer, the rear side gear is driven to rotate by the aid of the first motor, the front gear and the rear gear drive the first rotating shaft to rotate under the cooperation of the first rotating shaft at corresponding positions, so that the surface of the wafer is scrubbed, the electric push rod extends after the wafer is cleaned to push the wafer to move out of the inner cavity of the outer shell from the feed inlet under the cooperation of the rotating rollers, so that the wafer is clamped by the wafer transferring mechanical arm, the wafers with different sizes can be fixed, meanwhile, the wafers can keep rotating in a cleaning process, applicability of the device is improved, the inner cavity of the device can be automatically moved out after the wafer is cleaned, taking out is convenient.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of FIG. 1;
FIG. 3 is an exploded view of the securing mechanism of FIG. 1;
fig. 4 is an exploded view of the lift mechanism of fig. 1.
In the figure: 1. drainage tank, 2, shell, 3, controller, 4, feed inlet, 5, spray pipe, 6, fixed establishment, 61, guide rail, 62, screw nut, 63, casing, 64, second motor, 65, first conical gear, 66, screw rod, 67, second conical gear, 68, third motor, 69, positioning seat, 610, positioning roller, 7, elevating system, 71, electric push rod, 72, fixing seat, 73, second pivot, 74, fourth motor, 75, live-rollers, 76, belt pulley, 77, driving belt, 78, first spacing wheel, 79, second spacing wheel, 8, first pivot, 9, gear, 10, first motor, 11, cleaning roller.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a chip processing wafer cleaning device is characterized by comprising: the device comprises a drainage tank 1, a shell 2, a controller 3, a feed inlet 4, a spray pipe 5, a fixing mechanism 6 and a lifting mechanism 7, wherein the fixing mechanism 6 and the lifting mechanism 7 are all made of waterproof materials; the shell 2 is arranged at the top end of the drainage channel 1, the bottom end of the inner cavity of the shell 2 is communicated with the top end of the inner cavity of the drainage channel 1, and the drainage channel 1 can be connected with external collection to collect waste liquid; the controller 3 is arranged at the center of the front side of the shell 2, and the specific use model of the controller 3 is directly purchased, installed and used from the market according to the actual use requirement; the feed inlet 4 is arranged at the center of the top end of the inner cavity of the shell 2, and the upper side and the lower side of the inner cavity of the feed inlet 4 are respectively communicated with the outer wall and the inner cavity of the shell 2; the number of the spray pipes 5 is two, the two spray pipes 5 are respectively installed at the top ends of the front side and the rear side of the inner cavity of the shell 2 along the left-right direction, the left side of each spray pipe 5 extends out of the outer wall of the shell 2, and the spray pipes 5 are connected with external cleaning liquid to spray the cleaning liquid on the surface of the wafer; the fixing mechanism 6 is arranged in the middle of the inner cavity of the shell 2 along the left-right direction; the lifting mechanism 7 is installed at the bottom end of the inner cavity of the shell 2 along the vertical direction.
Preferably, the drain tank 1 further includes: a first rotating shaft 8, a gear 9, a first motor 10 and a cleaning roller 11; the number of the first rotating shafts 8 is two, the two first rotating shafts 8 are respectively arranged in the inner cavity of the shell 2 in the left-right direction and are positioned on the front side and the rear side above the fixing mechanism 6, the inner ring of the bearing is in interference fit with the outer wall of the first rotating shaft 8, the outer ring of the bearing is fixedly connected with the inner wall of the shell 2, the left side of the first rotating shaft 8 extends out of the outer wall of the shell 2, and the front gear 9 and the rear gear 9 can drive the first rotating shafts 11 to rotate inwards under the matching of the first rotating shafts 8 on corresponding positions so as to scrub the surfaces of wafers; the number of the gears 9 is two, the two gears 9 are respectively in key connection with the front and rear ends of the left sides of the front and rear first rotating shafts 8, the front and rear gears 9 are meshed with each other, and the front gear 9 rotates clockwise under the action of the rotating force of the rear gear 9; the first motor 10 is installed on the left side of the shell 2 along the left-right direction, the output end of the first motor 10 is connected with a left end screw of a first rotating shaft 8 positioned on the rear side of an inner cavity of the drainage tank 1, the first motor 10 is electrically connected with the controller 3, the specific use model of the first motor 10 is directly purchased, installed and used from the market according to the actual use requirement, and the controller 3 controls the first motor 10 to drive the rear side gear 9 to rotate anticlockwise; the number of the cleaning rollers 11 is two, and the two cleaning rollers 11 are respectively arranged on the outer walls of the front and the rear first rotating shafts 8 along the left-right direction.
Preferably, the fixing mechanism 6 further includes: a guide rail 61, a lead screw nut 62, a housing 63, a second motor 64, a first bevel gear 65, a lead screw 66 and a second bevel gear 67; the guide rail 61 is arranged in the middle of the inner cavity of the shell 2 along the left-right direction; the number of the screw nuts 62 is two, and the two screw nuts 62 are respectively inserted at the left side and the right side of the inner cavity of the guide rail 61; the housing 63 is mounted on the right side of the top end of the guide rail 61; the second motor 64 is arranged on the right side of the guide rail 61 through a bracket along the front-back direction, the output end of the second motor 64 extends into the inner cavity of the shell 63, the second motor 64 is electrically connected with the controller 3, the specific use model of the second motor 64 is directly purchased, installed and used from the market according to the actual use requirement, and the controller 3 controls and drives the second motor 64 to drive the first bevel gear 65 to rotate clockwise or anticlockwise; the first bevel gear 65 is screwed at the output end of the second motor 64; the screw rod 66 is rotatably connected to the inner cavity of the shell 63 through a bearing along the left-right direction, the inner cavity of the bearing is in interference fit with the outer wall of the screw rod 66, the outer ring of the bearing is fixedly connected with the inner wall of the shell 63, the left side of the screw rod 66 extends out of the outer wall of the shell 63, threads on the left side and the right side of the outer wall of the screw rod 66 are positive and negative threads, and the left screw nut 62 and the right screw nut 62 are respectively in threaded connection with the left side and the; the second bevel gear 67 is connected to the right side of the outer wall of the lead screw 66 in a key mode, the second bevel gear 67 is meshed with the first bevel gear 65, the second bevel gear 67 can drive the lead screw 66 to rotate anticlockwise or clockwise under the rotating force of the first bevel gear 65, and therefore the left lead screw nut 62 and the right lead screw nut 62 both move inwards or outwards under the rotating force of the lead screw 66.
As a preferable solution, further, the third motor 68, the positioning base 69 and the positioning roller 610; the number of the third motors 68 is two, the two third motors 68 are respectively arranged at the top ends of the rear sides of the left and right screw nuts 62 along the front-back direction, the output ends of the third motors 68 extend out of the front sides of the screw nuts 62, the third motors 68 are electrically connected with the controller 3, the specific usage models of the third motors 68 are directly purchased, installed and used from the market according to actual usage requirements, and the third motors 68 are controlled by the controller 3 to drive the positioning seats 69 at corresponding positions to rotate clockwise or anticlockwise; the number of the positioning seats 69 is two, the two positioning seats 69 are respectively installed at the output ends of the left and right third motors 68, and the positioning seats 69 are in a V shape; the quantity of registration rollers 610 is two sets ofly, and the quantity of every group registration roller 610 is two, and two sets of registration rollers 610 rotate the inside and outside both ends of connecting at each positioning seat 69 about two through the round pin axle respectively, and the draw-in groove has been seted up along circumference to the outer wall of registration roller 610, and positioning seat 69 drives registration roller 610 on the corresponding position and rotates to locating with wafer diameter department or outer wall radian looks adaptation state to carry out spacing fixed to the wafer.
Preferably, the lifting mechanism 7 further includes: the electric push rod 71, the fixed seat 72, the second rotating shaft 73, the fourth motor 74 and the rotating roller 75; the electric push rod 71 is installed in the inner cavity of the shell 2 through a support in the vertical direction, the electric push rod 71 is electrically connected with the controller 3, the electric push rod 71 is directly purchased, installed and used from the market according to actual use requirements, the controller 3 controls the electric push rod 71 to extend and shorten, and the rotating roller 75 is driven to move to a designated position height under the cooperation of the fixed seat 72; the fixed seat 72 is arranged at the top end of the electric push rod 71; the number of the second rotating shafts 73 is two, the two second rotating shafts 73 are rotatably connected to the left side and the right side of the inner cavity of the fixed seat 72 through bearings along the front-back direction, inner rings of the bearings are in interference fit with the outer walls of the second rotating shafts 73, and outer rings of the bearings are fixedly connected with the inner walls of the fixed seat 72; the fourth motor 74 is arranged on the rear side of the outer wall of the fixed seat 72 along the front-back direction, the output end of the fourth motor 74 extends into the inner cavity of the fixed seat 72 and is in screw connection with the second rotating shaft 73 positioned on the right side of the inner cavity of the fixed seat 72, the fourth motor 74 is electrically connected with the controller 3, the specific use model of the fourth motor 74 is directly purchased, installed and used from the market according to the actual use requirement, and the controller 3 controls and drives the second rotating shaft 73 on the right side to drive the belt pulley 76 on the corresponding position to rotate clockwise; the number of the rotating rollers 75 is two, the two rotating rollers 75 are connected to the front sides of the outer walls of the left second rotating shaft 73 and the right second rotating shaft 73 in a key mode, the outer wall of each rotating roller 75 extends out of the inner cavity of the corresponding fixing seat 72, a clamping groove is formed in the outer wall of each rotating roller 75 along the circumferential direction, and the inner wall of each clamping groove of each rotating roller 75 is made of rubber materials so as to increase the friction force between the inner wall and.
Preferably, the lifting mechanism 7 further includes a fixing base 72 having a V-shape, so that the fixing base 72 is adapted to the outer diameter of the wafer.
Preferably, the lifting mechanism 7 further includes: a belt pulley 76, a transmission belt 77, a first limit pulley 78 and a second limit pulley 79; the number of the belt pulleys 76 is two, the two belt pulleys 76 are connected to the rear sides of the outer walls of the left second rotating shaft 73 and the right second rotating shaft 73 in a key mode, and the left belt pulley 76 can drive the second rotating shaft 73 in the corresponding position to rotate clockwise under the action of the transmission belt 77 and the rotating force of the right belt pulley 76; the left end and the right end of the inner side of the transmission belt 77 are respectively sleeved on the outer walls of the left belt pulley 76 and the right belt pulley 76, and the transmission belt 77 is in a V shape matched with the inner cavity of the fixed seat 72; the first limit wheel 78 is rotatably connected to the lower part of the rear side of the inner cavity of the fixed seat 72 through a pin shaft, and the outer wall of the first limit wheel 78 is in contact with the inner bevel below the middle part of the transmission belt 77; the second limit wheel 79 is rotatably connected to the upper portion of the rear side of the inner cavity of the fixing seat 72 through a pin shaft, the outer wall of the second limit wheel 79 is in contact with the outer bevel of the upper portion of the middle of the transmission belt 77, and the first limit wheel 78 and the second limit wheel 79 play a role in limiting the transmission belt 77.
All the electrical components in the present application can be connected with an external adaptive power supply through a wire, and an adaptive external controller should be selected to connect according to specific actual use conditions to meet the control requirements of all the electrical components, and the specific connection mode and the control sequence thereof should be referred to in the following working principle that the electrical components are electrically connected in sequence, the detailed connection means thereof is a known technology in the art and is not described, and the following main description of the working principle and the process specifically works as follows.
When the cleaning device is used, a worker connects the spray pipe 5 with an external cleaning solution in advance, the spray pipe 2 is connected with an external collecting tank, the worker selects to fix the diameter position or the position below the outer wall of the wafer according to the outer diameter of the wafer and actual needs, the control controller 3 sequentially starts the spray pipe 68 and the electric push rod 71, the left and right third motors 68 respectively drive the positioning seat 69 on the corresponding position to rotate clockwise or anticlockwise, the positioning seat 69 drives the positioning roller 610 on the corresponding position to rotate to a state matched with the diameter position or the radian of the outer wall of the wafer, the electric push rod 71 is controlled to extend and shorten, the electric push rod 71 drives the rotating roller 75 to move to a specified position height under the cooperation of the fixing seat 72, the external wafer carrying mechanical arm penetrates the wafer through the inner cavity of the rotating roller 4 to move the inner cavity of the rotating roller 2 and penetrates the front and rear cleaning rollers 11 to enable the outer wall of the wafer to be clamped with, the worker controls the controller 3 to start the second motor 64 according to the dimension specification of the wafer workpiece, so that the second motor 64 drives the first bevel gear 65 to rotate clockwise or anticlockwise, because the second bevel gear 67 is meshed with the first bevel gear 65, the second bevel gear 67 drives the lead screw 66 to rotate anticlockwise or clockwise under the action of the rotation force of the first bevel gear 65, and because the threads on the left side and the right side of the outer wall of the lead screw 66 are positive and negative threads, the left lead screw nut 62 and the right lead screw nut 62 are both driven to move inwards or outwards under the action of the rotation force of the lead screw 66, and the positioning rollers 610 are driven to move inwards or outwards under the limiting action of the guide rail 61 and the matching of the positioning seats 69 on the corresponding positions, so that the clamping grooves on the outer wall of the positioning rollers 610 are attached to the outer diameter of the wafer, when cleaning is performed, cleaning liquid is sprayed out from, the controller 3 sequentially starts the fourth motor 74 and the first motor 10, the fourth motor 74 drives the right second rotating shaft 73 to drive the belt pulley 76 at the corresponding position to rotate clockwise, the transmission belt 77 is driven to rotate clockwise under the limiting action of the upper and lower second limiting wheels 79 and the first limiting wheel 78 and under the rotating force of the right belt pulley 76, the left and right belt pulleys 76 are in transmission connection through the transmission belt 77, the left belt pulley 76 is driven to rotate clockwise under the action of the transmission belt 77 and the rotating force of the right belt pulley 76, the left and right second rotating shafts 73 drive the rotating rollers 75 at the corresponding positions to rotate clockwise, so that the wafer rotates under the friction force of the rotating rollers 75 and the limiting action of the positioning rollers 610, the cleaning solution can be uniformly sprayed to the outside of the wafer, the first motor 10 drives the rear side gear 9 to rotate counterclockwise, because the front gear 9 and the rear gear 9 are meshed, the front gear 9 is driven to rotate clockwise under the action of the rotating force of the rear gear 9, the front gear 9 and the rear gear 9 drive the first rotating shaft 11 to rotate inwards under the coordination of the first rotating shaft 8 at corresponding positions so as to scrub the surface of the wafer, and after the cleaning is finished, the electric push rod 71 extends to push the wafer to move out of the inner cavity of the shell 2 from the feed port 4 under the coordination of the rotating roller 75, so that the wafer is convenient to be clamped by a wafer transferring mechanical arm, wafers with different sizes and specifications can be fixed and can be kept rotating in the cleaning process, the applicability of the device is improved, the wafer can be automatically moved out of the inner cavity of the device after the cleaning is finished, the taking-out,
in the description of the present invention, it is to be understood that the terms "top end", "bottom end", "one end", "front side", "rear side", "the other end", "up", "down", "inside", "outside", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated; also, unless expressly stated or limited otherwise, the terms "mounted," "screwed," "plugged," "interference fit," "disposed," and the like are to be construed broadly, e.g., as a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A chip processing wafer cleaning device is characterized by comprising:
a drainage channel (1);
the shell (2) is installed at the top end of the drainage groove (1), and the bottom end of an inner cavity of the shell (2) is communicated with the top end of the inner cavity of the drainage groove (1);
a controller (3) installed at a front center position of the housing (2);
the feed inlet (4) is formed in the center of the top end of the inner cavity of the shell (2), and the upper side and the lower side of the inner cavity of the feed inlet (4) are communicated with the outer wall and the inner cavity of the shell (2) respectively;
the number of the spraying pipes (5) is two, the two spraying pipes (5) are respectively installed at the top ends of the front side and the rear side of the inner cavity of the shell (2) along the left-right direction, and the left side of each spraying pipe (5) extends out of the outer wall of the shell (2);
the fixing mechanism (6) is arranged in the middle of the inner cavity of the shell (2) along the left-right direction;
and the lifting mechanism (7) is arranged at the bottom end of the inner cavity of the shell (2) along the vertical direction.
2. The apparatus of claim 1, wherein: the water drainage tank (1) further comprises:
the number of the first rotating shafts (8) is two, the two first rotating shafts (8) are respectively arranged in the inner cavity of the shell (2) in the left-right direction and are positioned on the front side and the rear side above the fixing mechanism (6), the inner ring of the bearing is in interference fit with the outer wall of the first rotating shaft (8), the outer ring of the bearing is fixedly connected with the inner wall of the shell (2), and the left side of the first rotating shaft (8) extends out of the outer wall of the shell (2);
the number of the gears (9) is two, the two gears (9) are respectively in key connection with the front end and the rear end of the left side of the front first rotating shaft (8) and the rear first rotating shaft (8), and the front gear and the rear gear (9) are meshed with each other;
the first motor (10) is installed on the left side of the shell (2) in the left-right direction, the output end of the first motor (10) is connected with a left end screw of a first rotating shaft (8) located on the rear side of the inner cavity of the drainage tank (1), and the first motor (10) is electrically connected with the controller (3);
the cleaning rollers (11), cleaning rollers (11) quantity is two, two cleaning rollers (11) set up the outer wall of two first pivot (8) in front and back respectively along left and right direction.
3. The apparatus of claim 1, wherein: the fixing mechanism (6) comprises:
the guide rail (61) is arranged in the middle of the inner cavity of the shell (2) along the left-right direction;
the number of the screw nuts (62) is two, and the two screw nuts (62) are respectively inserted at the left side and the right side of the inner cavity of the guide rail (61);
a housing (63) mounted on the right side of the top end of the guide rail (61);
the second motor (64) is arranged on the right side of the guide rail (61) through a support in the front-back direction, the output end of the second motor (64) extends into the inner cavity of the shell (63), and the second motor (64) is electrically connected with the controller (3);
the first conical gear (65) is connected to the output end of the second motor (64) through a screw;
the screw rod screw (66) is rotatably connected to the inner cavity of the shell (63) through a bearing along the left-right direction, the inner cavity of the bearing is in interference fit with the outer wall of the screw rod screw (66), the outer ring of the bearing is fixedly connected with the inner wall of the shell (63), the left side of the screw rod screw (66) extends out of the outer wall of the shell (63), threads on the left side and the right side of the outer wall of the screw rod screw (66) are positive and negative threads, and the left side and the right side of the outer wall of the screw rod screw (66) are respectively in threaded connection with the left side and the;
and the second bevel gear (67) is in key connection with the right side of the outer wall of the screw rod screw (66), and the second bevel gear (67) is meshed with the first bevel gear (65).
4. The apparatus of claim 3, wherein: the fixing mechanism (6) further comprises:
the number of the third motors (68) is two, the two third motors (68) are respectively arranged at the top ends of the rear sides of the left and right screw nuts (62) along the front-back direction, the output ends of the third motors (68) extend out of the front sides of the screw nuts (62), and the third motors (68) are electrically connected with the controller (3);
the number of the positioning seats (69) is two, the two positioning seats (69) are respectively arranged at the output ends of the left and right third motors (68), and the positioning seats (69) are V-shaped;
the positioning roller (610), the quantity of positioning roller (610) is two sets of, every group the quantity of positioning roller (610) is two, and is two sets of positioning roller (610) rotates the inside and outside both ends of connecting at two each positioning seats (69) about through the round pin axle respectively, the draw-in groove has been seted up along circumference to the outer wall of positioning roller (610).
5. The apparatus of claim 1, wherein: the lifting mechanism (7) comprises:
the electric push rod (71) is arranged in the inner cavity of the shell (2) through a support in the vertical direction, and the electric push rod (71) is electrically connected with the controller (3);
the fixed seat (72) is installed at the top end of the electric push rod (71);
the number of the second rotating shafts (73) is two, the two second rotating shafts (73) are rotatably connected to the left side and the right side of an inner cavity of the fixing seat (72) through bearings along the front-back direction, inner rings of the bearings are in interference fit with outer walls of the second rotating shafts (73), and outer rings of the bearings are fixedly connected with the inner wall of the fixing seat (72);
the fourth motor (74) is arranged on the rear side of the outer wall of the fixed seat (72) along the front-back direction, the output end of the fourth motor (74) extends into the inner cavity of the fixed seat (72) and is in screw connection with a second rotating shaft (73) positioned on the right side of the inner cavity of the fixed seat (72), and the fourth motor (74) is electrically connected with the controller (3);
the rotating roller (75), the quantity of rotating roller (75) is two, two the outer wall front side of two second pivot (73) about rotating roller (75) key-type connection, the inner chamber of fixing base (72) is extended to the outer wall of rotating roller (75), the draw-in groove has been seted up along circumference to the outer wall of rotating roller (75).
6. The apparatus of claim 4, wherein: the fixing seat (72) is V-shaped.
7. The apparatus of claim 4, wherein: the lifting mechanism (7) further comprises:
the number of the belt pulleys (76) is two, and the two belt pulleys (76) are connected to the rear sides of the outer walls of the left second rotating shaft and the right second rotating shaft (73) in a key mode;
the left end and the right end of the inner side of the transmission belt (77) are respectively sleeved on the outer walls of the left belt pulley and the right belt pulley (76), and the transmission belt (77) is in a V shape matched with the inner cavity of the fixed seat (72);
the first limiting wheel (78) is rotatably connected to the lower portion of the rear side of the inner cavity of the fixing seat (72) through a pin shaft, and the outer wall of the first limiting wheel (78) is in contact with an inner bevel on the lower portion of the middle of the transmission belt (77);
the second limiting wheel (79) is rotatably connected to the upper portion of the rear side of the inner cavity of the fixing seat (72) through a pin shaft, and the outer wall of the second limiting wheel (79) is in contact with the outer side bevel on the upper portion of the middle of the transmission belt (77).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010508290.6A CN111952221A (en) | 2020-06-06 | 2020-06-06 | Chip processing wafer belt cleaning device |
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Application Number | Priority Date | Filing Date | Title |
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CN202010508290.6A CN111952221A (en) | 2020-06-06 | 2020-06-06 | Chip processing wafer belt cleaning device |
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CN111952221A true CN111952221A (en) | 2020-11-17 |
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CN202010508290.6A Withdrawn CN111952221A (en) | 2020-06-06 | 2020-06-06 | Chip processing wafer belt cleaning device |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112820627A (en) * | 2020-12-30 | 2021-05-18 | 江苏亚电科技有限公司 | Efficient wafer cleaning method |
CN112992747A (en) * | 2021-02-10 | 2021-06-18 | 江苏亚电科技有限公司 | Wafer cleaning feeding and discharging device |
CN114345778A (en) * | 2021-12-27 | 2022-04-15 | 浙江光特科技有限公司 | Wafer cleaning device |
CN116294465A (en) * | 2023-05-22 | 2023-06-23 | 泰州衡川新能源材料科技有限公司 | Battery diaphragm drying device capable of uniformly heating and drying method |
-
2020
- 2020-06-06 CN CN202010508290.6A patent/CN111952221A/en not_active Withdrawn
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112820627A (en) * | 2020-12-30 | 2021-05-18 | 江苏亚电科技有限公司 | Efficient wafer cleaning method |
CN112820627B (en) * | 2020-12-30 | 2022-10-18 | 江苏亚电科技有限公司 | Efficient wafer cleaning method |
CN112992747A (en) * | 2021-02-10 | 2021-06-18 | 江苏亚电科技有限公司 | Wafer cleaning feeding and discharging device |
CN112992747B (en) * | 2021-02-10 | 2022-01-25 | 江苏亚电科技有限公司 | Wafer cleaning feeding and discharging device |
CN114345778A (en) * | 2021-12-27 | 2022-04-15 | 浙江光特科技有限公司 | Wafer cleaning device |
CN116294465A (en) * | 2023-05-22 | 2023-06-23 | 泰州衡川新能源材料科技有限公司 | Battery diaphragm drying device capable of uniformly heating and drying method |
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Application publication date: 20201117 |