CN212874471U - Chip processing wafer clamping device - Google Patents
Chip processing wafer clamping device Download PDFInfo
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- CN212874471U CN212874471U CN202021104496.4U CN202021104496U CN212874471U CN 212874471 U CN212874471 U CN 212874471U CN 202021104496 U CN202021104496 U CN 202021104496U CN 212874471 U CN212874471 U CN 212874471U
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Abstract
The utility model discloses a chip processing wafer clamping device, include: the device comprises a base, a rotating mechanism, a spacing adjusting mechanism, a fixing mechanism and a controller; the rotating mechanism is arranged at the center of the top end of the inner side of the base along the vertical direction, and the top end of the rotating mechanism extends out of the upper surface of the base; the distance adjusting mechanism is arranged at the top end of the rotating mechanism along the left-right direction; the fixing mechanism is arranged at the top end of the distance adjusting mechanism; the controller is installed at the front center position of the base. This chip processing wafer clamping device, to prior art's wafer belt cleaning device be mostly fixed in putting into the mould of big or small adaptation with the wafer and fix, this kind of fixed mode can only fix the wafer of single specification, and the relatively poor problem of device suitability can be fixed the wafer of different specification and dimension, improves the device suitability to the wafer of being convenient for rotates and changes inclination, easy operation, and the practicality is strong.
Description
Technical Field
The utility model relates to a chip processing technology field specifically is a chip processing wafer clamping device.
Background
Chips, also known as microcircuits (microcircuits), microchips (microchips), and Integrated Circuits (ICs), refer to silicon chips containing integrated circuits, which are small in size, often part of computers or other electronic devices, and are usually fabricated on the surface of a semiconductor wafer in a way that miniaturizes the circuits (mainly including semiconductor devices, including passive components, etc.) and generally fabricate the circuits on the surface of the semiconductor chips, which are also known as thin-film (thin-film) integrated circuits. Another type of thick-film (thick-film) hybrid integrated circuit (ic) is a miniaturized circuit formed by a separate semiconductor device and a passive component integrated on a substrate or a circuit board, and is referred to herein as monolithic (monolithic) ic, i.e., thin film ic;
in the prior art, a wafer needs to be cleaned in a chip adding process, an existing wafer cleaning device in the market is mainly used for fixing the wafer in a die with the wafer placed in a matched size, the wafer can only be fixed in a single specification in a fixing mode, the device is poor in applicability, and a chip processing wafer clamping device is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip processing wafer clamping device to solve prior art's wafer belt cleaning device at least and be mostly fixed in putting into the mould of big or small adaptation with the wafer, this kind of fixed mode can only be fixed the wafer of single specification, the relatively poor problem of device suitability.
In order to achieve the above object, the utility model provides a following technical scheme: a chip processing wafer clamping device comprises:
a base;
the rotating mechanism is arranged at the center of the top end of the inner side of the base along the vertical direction, and the top end of the rotating mechanism extends out of the upper surface of the base;
the distance adjusting mechanism is arranged at the top end of the rotating mechanism along the left-right direction;
the fixing mechanism is arranged at the top end of the distance adjusting mechanism;
and the controller is arranged at the center of the front side of the base.
Preferably, the rotating mechanism includes: the rotating mechanism comprises a rotating mechanism shell, a rotating shaft, a first bevel gear, a first motor, a second bevel gear and a rotating disc; the rotating mechanism shell is arranged at the center of the top end of the inner side of the base; the rotating shaft is rotatably connected to the center of the inner cavity of the rotating mechanism shell through a bearing in the vertical direction, an inner ring of the bearing is in interference fit with the outer wall of the rotating shaft, an outer ring of the bearing is fixedly connected with the inner wall of the rotating mechanism shell, and the top end of the rotating shaft penetrates through the inner cavity of the rotating mechanism shell and extends out of the upper surface of the base; the first conical gear is connected with the bottom end of the outer wall of the rotating shaft in a key mode, and the second conical gear is meshed with the first conical gear; the first motor is arranged at the center of the left side of the inner cavity of the shell of the rotating mechanism along the left-right direction and is electrically connected with the controller; the second bevel gear screw is connected to the output end of the first motor; the rotating disc is fixedly arranged at the top end of the rotating shaft.
Preferably, the spacing adjustment mechanism includes: the spacing adjusting mechanism comprises a spacing adjusting mechanism shell, a limiting groove, a second motor, a screw rod and a screw rod nut; the spacing adjusting mechanism shell is arranged on the upper surface of the rotating disc along the left-right direction; the spacing groove is formed in the upper surface of the spacing adjusting mechanism shell along the left-right direction; the second motor is arranged at the right center of the spacing adjusting mechanism shell along the left-right direction, the output end of the second motor extends into the inner cavity of the limiting groove, and the second motor is electrically connected with the controller; the screw rod screw is connected to the output end of the second motor along the left and right directions, and threads on the left and right sides of the outer wall of the screw rod screw are positive and negative threads; the number of the screw nuts is two, the two screw nuts are respectively screwed on the upper surface of the screw rod, and the top ends of the screw nuts extend out of the top end of the inner cavity of the limiting groove.
Preferably, the fixing mechanism includes: the vacuum chuck comprises a mounting plate, a first mounting seat, a second mounting seat and a vacuum chuck; the two mounting plates are respectively arranged at the top ends of the left screw nut and the right screw nut along the up-down direction; the first mounting seat is rotatably connected to the top end of the inner side of the mounting plate on the right side of the top end of the base through a bearing in the left-right direction, an inner ring of the bearing is in interference fit with the outer wall of the first mounting seat, and an outer ring of the bearing is fixedly connected with the inner wall of the mounting plate; the second mounting seat is rotatably connected to the top end of the inner side of the mounting plate on the left side of the top end of the base through a bearing in the left-right direction, an inner ring of the bearing is in interference fit with the outer wall of the second mounting seat, an outer ring of the bearing is fixedly connected with the inner wall of the mounting plate, and the outer side of the second mounting seat extends out of the outer side of the mounting plate on the corresponding position; the number of the vacuum suckers is two, and the two vacuum suckers are arranged on the inner sides of the first mounting seat and the second mounting seat respectively along the front-back direction.
Preferably, the fixing mechanism includes: the shell, the third motor, the multi-thread worm and the worm wheel; the outer shell is arranged on the outer side of the mounting plate on the left side of the top end of the base in the vertical direction, and the outer side of the second mounting seat extends into an inner cavity of the outer shell; the third motor is arranged at the bottom end of the front side of the shell along the front-back direction, the output end of the third motor extends into the inner cavity of the shell, and the third motor is electrically connected with the controller; the multi-thread worm is connected to the output end of the third motor along the front and back direction by a screw; the worm wheel is connected to the outer side of the outer wall of the second mounting seat in a key mode, and the worm wheel is meshed with the multi-thread worm.
Compared with the prior art, the beneficial effects of the utility model are that: the wafer clamping device for chip processing drives the screw rod to rotate clockwise or anticlockwise through the second motor, so that the screw nut is driven by the rotation force of the screw rod to be matched with the mounting plate at the corresponding position, the second mounting seat and the first mounting seat drive the left vacuum chuck and the right vacuum chuck to move to a distance matched with the outer diameter of a wafer to adsorb and fix a wafer workpiece, the first motor drives the second bevel gear to rotate, the first bevel gear drives the rotating shaft under the rotation force of the second bevel gear to drive the wafer to rotate under the matching of the rotating plate, the distance adjusting mechanism and the distance adjusting mechanism, the third motor drives the multi-thread worm to rotate clockwise or anticlockwise, the worm wheel drives the second mounting seat under the rotation force of the multi-thread worm to drive the vacuum chucks to drive the wafer to incline towards the appointed direction, thereby can fix the wafer of different specification and dimension, improve the device suitability to be convenient for the wafer rotate and change inclination, easy operation, the practicality is strong.
Drawings
Fig. 1 is a schematic structural view of the present invention;
figure 2 is an exploded view of the rotary mechanism of figure 1;
FIG. 3 is an exploded view of the spacing adjustment mechanism of FIG. 1;
fig. 4 is an exploded view of the rotary mechanism of fig. 1.
In the figure: 1. the device comprises a base, 2, a rotating mechanism, 21, a rotating mechanism shell, 22, a rotating shaft, 23, a first bevel gear, 24, a first motor, 25, a second bevel gear, 26, a rotating disc, 3, a spacing adjusting mechanism, 31, a spacing adjusting mechanism shell, 32, a limiting groove, 33, a second motor, 34, a screw rod, 35, a screw nut, 4, a fixing mechanism, 41, a mounting plate, 42, a first mounting seat, 43, a second mounting seat, 44, a vacuum chuck, 45, a shell, 46, a third motor, 47, a multi-thread worm, 48, a worm wheel, 6 and a controller.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a chip processing wafer clamping device comprises: the device comprises a base 1, a rotating mechanism 2, a spacing adjusting mechanism 3, a fixing mechanism 4 and a controller 6, wherein the base 1, the rotating mechanism 2, the spacing adjusting mechanism 3, the fixing mechanism 4 and the controller 6 are all made of waterproof materials; the rotating mechanism 2 is arranged at the center of the top end of the inner side of the base 1 along the vertical direction, and the top end of the rotating mechanism 2 extends out of the upper surface of the base 1; the spacing adjusting mechanism 3 is arranged at the top end of the rotating mechanism 2 along the left-right direction; the fixing mechanism 4 is arranged at the top end of the spacing adjusting mechanism 3; the controller 6 is installed at the front center position of the base 1, and the controller 6 is directly purchased from the market and installed and used according to the actual use requirement.
Preferably, the rotating mechanism 2 further includes: a rotating mechanism housing 21, a rotating shaft 22, a first bevel gear 23, a first motor 24, a second bevel gear 25 and a rotating disc 26; the rotating mechanism shell 21 is arranged at the center of the top end of the inner side of the base 1; the rotating shaft 22 is rotatably connected to the center position of the inner cavity of the rotating mechanism shell 21 through a bearing in the vertical direction, an inner ring of the bearing is in interference fit with the outer wall of the rotating shaft 22, an outer ring of the bearing is fixedly connected with the inner wall of the rotating mechanism shell 21, the top end of the rotating shaft 22 penetrates through the inner cavity of the rotating mechanism shell 21 and extends out of the upper surface of the base 1, and the rotating shaft 22 can drive the wafer to rotate under the cooperation of the rotating disc 26, the interval adjusting mechanism 3 and the interval adjusting mechanism 4; the first conical gear 23 is in key connection with the bottom end of the outer wall of the rotating shaft 22; the first motor 24 is arranged at the left center position of the inner cavity of the rotating mechanism shell 21 along the left-right direction, the first motor 24 is electrically connected with the controller 6, the specific usage model of the first motor 24 is directly purchased, installed and used from the market according to the actual usage requirement, and the controller 6 controls the first motor 24 to drive the second bevel gear 25 to rotate clockwise; the second bevel gear 25 is in screw connection with the output end of the first motor 24, the second bevel gear 25 is meshed with the first bevel gear 23, and the first bevel gear 23 drives the rotating shaft 22 to rotate anticlockwise under the rotating force of the second bevel gear 25; the rotary disk 26 is fixedly mounted on the top end of the rotary shaft 22.
Preferably, the distance adjustment mechanism 3 further includes: the spacing adjusting mechanism comprises a spacing adjusting mechanism shell 31, a limiting groove 32, a second motor 33, a lead screw 34 and a lead screw nut 35; a pitch adjustment mechanism housing 31 is provided on the upper surface of the rotating disk 26 in the left-right direction; the limiting groove 32 is formed in the upper surface of the spacing adjustment mechanism housing 31 in the left-right direction, and the limiting groove 32 can limit the screw nut 35; the second motor 33 is arranged at the right center of the spacing adjusting mechanism shell 31 along the left-right direction, the output end of the second motor 33 extends into the inner cavity of the limiting groove 32, the second motor 33 is electrically connected with the controller 6, the specific usage model of the second motor 33 is directly purchased, installed and used from the market according to the actual usage requirement, and the second motor 33 is controlled by the controller 6 to drive the screw rod 34 to rotate clockwise or anticlockwise; the screw rod 34 is connected to the output end of the second motor 33 along the left and right direction, and the threads on the left and right sides of the outer wall of the screw rod 34 are positive and negative threads; the number of the screw nuts 35 is two, the two screw nuts 35 are respectively screwed on the upper surface of the screw rod 34, the top end of the screw rod 35 extends out of the top end of the inner cavity of the limiting groove 32, and the screw rod nuts 35 can move inwards or outwards under the rotating force effect of the screw rod 34.
Preferably, the fixing mechanism 4 further includes: a mounting plate 41, a first mounting seat 42, a second mounting seat 43, and a vacuum chuck 44; the number of the mounting plates 41 is two, and the two mounting plates 41 are respectively arranged at the top ends of the left and right screw nuts 35 along the up-down direction; the first mounting seat 42 is rotatably connected to the top end of the inner side of the mounting plate 41 on the right side of the top end of the base 1 along the left-right direction through a bearing, an inner ring of the bearing is in interference fit with the outer wall of the first mounting seat 42, an outer ring of the bearing is fixedly connected with the inner wall of the mounting plate 41, and the second mounting seat 42 plays a role in limiting and supporting a wafer; the second mounting seat 43 is rotatably connected to the top end of the inner side of the mounting plate 41 on the left side of the top end of the base 1 along the left-right direction through a bearing, an inner ring of the bearing is in interference fit with the outer wall of the second mounting seat 43, an outer ring of the bearing is fixedly connected with the inner wall of the mounting plate 41, and the outer side of the second mounting seat 43 extends out of the outer side of the mounting plate 41 at a corresponding position; the number of vacuum chuck 44 is two, and two vacuum chuck 44 set up the inboard at first mount pad 42 and second mount pad 43 along the fore-and-aft direction respectively, and vacuum chuck 44 specifically uses the model to directly purchase the installation and use from the market according to the in-service use requirement, and vacuum chuck 44 can be connected with outside vacuum air pump and fix in order to adsorb the wafer.
Preferably, the fixing mechanism 4 further includes: a housing 45, a third motor 46, a multi-wire worm 47 and a worm wheel 48; the outer shell 45 is arranged on the outer side of the left mounting plate 41 at the top end of the base 1 along the vertical direction, and the outer side of the second mounting seat 43 extends into the inner cavity of the outer shell 45; the third motor 46 is arranged at the bottom end of the front side of the shell 45 along the front-back direction, the output end of the third motor 46 extends into the inner cavity of the shell 45, the third motor 46 is electrically connected with the controller 6, the specific usage model of the third motor 46 is directly purchased, installed and used from the market according to the actual usage requirement, and the controller 6 controls the third motor 46 to drive the multi-wire worm 47 to rotate clockwise or anticlockwise; the multi-thread worm 47 is screwed to the output end of the third motor 46 in the front-rear direction; the worm wheel 48 is connected to the outer side of the outer wall of the second mounting seat 43 in a keyed mode, the worm wheel 48 is meshed with the multi-wire worm 47, and the worm wheel 48 and the multi-wire worm 47 are not locked in a single direction, so that the worm wheel 48 drives the second mounting seat 43 to rotate clockwise or anticlockwise under the rotating force of the multi-wire worm 47.
All the electrical components in the present application can be connected with an external adaptive power supply through a wire, and an adaptive external controller should be selected to connect according to specific actual use conditions to meet the control requirements of all the electrical components, and the specific connection mode and the control sequence thereof should be referred to in the following working principle that the electrical components are electrically connected in sequence, the detailed connection means thereof is a known technology in the art and is not described, and the following main description of the working principle and the process specifically works as follows.
When the vacuum chuck 44 is connected with an external vacuum air pump in advance, the worker can fix the wafer size specification according to the requirement by controlling the controller 6 to start the second motor 33 to enable the second motor 33 to drive the lead screw 34 to rotate clockwise or anticlockwise, because the threads on the left and right sides of the outer wall of the lead screw 34 are positive and negative threads, and the left and right lead screw nuts 35 are respectively screwed with the threads on the left and right sides of the outer wall of the lead screw 34, the lead screw nuts 35 are enabled to move inwards or outwards under the action of the rotation force of the lead screw 34, and under the limiting action of the lead screw 32 and the matching of the mounting plate 41 on the corresponding position, the second mounting seat 43 and the first mounting seat 42 drive the left and right vacuum chucks 44 to move to the position matched with the outer diameter size of the wafer, the worker can control the controller 6 to start the vacuum chuck 44 to adsorb and fix the wafer workpiece, during cleaning, the worker controls the controller 6 to sequentially start the first motor 24 and the third motor 46, the first motor 24 drives the second bevel gear 25 to rotate clockwise, the first bevel gear 23 drives the spindle 22 to rotate counterclockwise under the rotation force of the second bevel gear 25 due to the meshing of the first bevel gear 23 and the second bevel gear 25, the spindle 22 drives the wafer to rotate under the cooperation of the rotating disc 26, the spacing adjustment mechanism 3 and the spacing adjustment mechanism 4, and the wafer is tilted, the worker controls the controller 6 to start the third motor 46, the third motor 46 drives the multi-thread worm 47 to rotate clockwise or counterclockwise, the worm wheel 48 is driven to drive the second mounting seat 43 to rotate clockwise or counterclockwise under the rotation force of the multi-thread worm 47 due to the meshing of the worm wheel 48 and the multi-thread worm 47, and under the limiting and supporting effects of the right second mounting seat 42, so that the vacuum chuck 44 drives the wafer to incline towards the designated direction, thereby fixing the wafers with different specifications and sizes, improving the applicability of the device, facilitating the rotation of the wafer and the change of the inclination angle, and having simple operation and strong practicability.
In the description of the present invention, it is to be understood that the terms "top end", "bottom end", "one end", "front side", "rear side", "other end", "upper", "lower", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated; also, unless expressly stated or limited otherwise, the terms "mounted," "screwed," "plugged," "interference fit," "disposed," and the like are to be construed broadly, e.g., as a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A chip processing wafer clamping device is characterized by comprising:
a base (1);
the rotating mechanism (2) is arranged at the center of the top end of the inner side of the base (1) along the vertical direction, and the top end of the rotating mechanism (2) extends out of the upper surface of the base (1);
the spacing adjusting mechanism (3) is arranged at the top end of the rotating mechanism (2) along the left-right direction;
the fixing mechanism (4) is arranged at the top end of the distance adjusting mechanism (3);
and the controller (6) is installed at the front center position of the base (1).
2. The wafer clamping device for chip processing according to claim 1, wherein: the rotating mechanism (2) comprises:
a rotating mechanism shell (21) which is arranged at the center of the top end of the inner side of the base (1);
the rotating shaft (22) is rotatably connected to the center of the inner cavity of the rotating mechanism shell (21) through a bearing in the vertical direction, an inner ring of the bearing is in interference fit with the outer wall of the rotating shaft (22), an outer ring of the bearing is fixedly connected with the inner wall of the rotating mechanism shell (21), and the top end of the rotating shaft (22) penetrates through the inner cavity of the rotating mechanism shell (21) and extends out of the upper surface of the base (1);
the first conical gear (23) is in key connection with the bottom end of the outer wall of the rotating shaft (22);
the first motor (24) is arranged at the left center position of the inner cavity of the rotating mechanism shell (21) along the left-right direction, and the first motor (24) is electrically connected with the controller (6);
the second bevel gear (25) is connected to the output end of the first motor (24) in a screw mode, and the second bevel gear (25) is meshed with the first bevel gear (23);
and the rotating disc (26) is fixedly arranged at the top end of the rotating shaft (22).
3. The wafer clamping device for chip processing according to claim 2, wherein: the pitch adjustment mechanism (3) includes:
a spacing adjustment mechanism housing (31) provided on the upper surface of the rotating disk (26) in the left-right direction;
a limit groove (32) which is arranged on the upper surface of the spacing adjusting mechanism shell (31) along the left and right direction;
the second motor (33) is arranged at the right center of the spacing adjusting mechanism shell (31) along the left-right direction, the output end of the second motor (33) extends into the inner cavity of the limiting groove (32), and the second motor (33) is electrically connected with the controller (6);
the screw rod (34) is in screw connection with the output end of the second motor (33) along the left-right direction, and threads on the left side and the right side of the outer wall of the screw rod (34) are positive and negative threads;
the number of the screw nuts (35) is two, the screw nuts (35) are respectively screwed on the upper surface of the screw rod screw (34), and the top ends of the screw nuts (35) extend out of the top ends of the inner cavities of the limiting grooves (32).
4. The wafer clamping device for chip processing according to claim 1, wherein: the fixing mechanism (4) comprises:
the number of the mounting plates (41) is two, and the two mounting plates (41) are respectively arranged at the top ends of the left screw nut and the right screw nut (35) along the vertical direction;
the first mounting seat (42) is rotatably connected to the top end of the inner side of the mounting plate (41) on the right side of the top end of the base (1) through a bearing along the left-right direction, an inner ring of the bearing is in interference fit with the outer wall of the first mounting seat (42), and an outer ring of the bearing is fixedly connected with the inner wall of the mounting plate (41);
the second mounting seat (43) is rotatably connected to the top end of the inner side of the mounting plate (41) on the left side of the top end of the base (1) through a bearing along the left-right direction, an inner ring of the bearing is in interference fit with the outer wall of the second mounting seat (43), an outer ring of the bearing is fixedly connected with the inner wall of the mounting plate (41), and the outer side of the second mounting seat (43) extends out of the outer side of the mounting plate (41) in a corresponding position;
the number of the vacuum suction cups (44) is two, and the two vacuum suction cups (44) are respectively arranged on the inner sides of the first mounting seat (42) and the second mounting seat (43) along the front-back direction.
5. The wafer clamping device for chip processing according to claim 4, wherein: the fixing mechanism (4) comprises:
the shell (45) is arranged on the outer side of the mounting plate (41) on the left side of the top end of the base (1) in the vertical direction, and the outer side of the second mounting seat (43) extends into an inner cavity of the shell (45);
the third motor (46) is arranged at the bottom end of the front side of the shell (45) along the front-back direction, the output end of the third motor (46) extends into the inner cavity of the shell (45), and the third motor (46) is electrically connected with the controller (6);
a multi-thread worm (47) screwed to the output end of the third motor (46) in the forward and backward directions;
and the worm wheel (48) is in key connection with the outer side of the outer wall of the second mounting seat (43), and the worm wheel (48) is meshed with the multi-wire worm (47).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021104496.4U CN212874471U (en) | 2020-06-16 | 2020-06-16 | Chip processing wafer clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021104496.4U CN212874471U (en) | 2020-06-16 | 2020-06-16 | Chip processing wafer clamping device |
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| Publication Number | Publication Date |
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| CN212874471U true CN212874471U (en) | 2021-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021104496.4U Active CN212874471U (en) | 2020-06-16 | 2020-06-16 | Chip processing wafer clamping device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116294465A (en) * | 2023-05-22 | 2023-06-23 | 泰州衡川新能源材料科技有限公司 | Battery diaphragm drying device capable of uniformly heating and drying method |
| CN116430087A (en) * | 2023-06-12 | 2023-07-14 | 南京银茂微电子制造有限公司 | Fixing mechanism for chip wafer test bench |
-
2020
- 2020-06-16 CN CN202021104496.4U patent/CN212874471U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116294465A (en) * | 2023-05-22 | 2023-06-23 | 泰州衡川新能源材料科技有限公司 | Battery diaphragm drying device capable of uniformly heating and drying method |
| CN116430087A (en) * | 2023-06-12 | 2023-07-14 | 南京银茂微电子制造有限公司 | Fixing mechanism for chip wafer test bench |
| CN116430087B (en) * | 2023-06-12 | 2023-09-01 | 南京银茂微电子制造有限公司 | Fixing mechanism for chip wafer test bench |
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