CN211681520U - Monocrystalline silicon piece polishing machine with cleaning structure - Google Patents
Monocrystalline silicon piece polishing machine with cleaning structure Download PDFInfo
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- CN211681520U CN211681520U CN202020218520.0U CN202020218520U CN211681520U CN 211681520 U CN211681520 U CN 211681520U CN 202020218520 U CN202020218520 U CN 202020218520U CN 211681520 U CN211681520 U CN 211681520U
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Abstract
The utility model belongs to monocrystalline silicon wafer burnishing machine field specifically is a monocrystalline silicon wafer burnishing machine with clean structure, including polishing mechanism, polishing mechanism includes burnishing machine, polishing dish, the burnishing machine top is equipped with the polishing dish, be equipped with displacement mechanism in the polishing mechanism, be equipped with clean mechanism in the displacement mechanism, clean mechanism includes telescopic cylinder, connecting plate, clean support frame, motor one, clean brush roll, be equipped with on the telescopic cylinder telescopic link the connecting plate, the welding of connecting plate rear portion has clean support frame, just be located on the clean support frame connecting plate one side is equipped with motor one, be equipped with on the output shaft of motor one clean brush roll, clean brush roll one side is equipped with the water pipe, water pipe bottom evenly distributed has the water spout. The utility model discloses a clean mechanism and displacement mechanism to can clean single crystal silicon piece burnishing machine, consequently convenient to use.
Description
Technical Field
The utility model belongs to monocrystalline silicon piece burnishing machine field specifically is to relate to a monocrystalline silicon piece burnishing machine with clean structure.
Background
Single crystal silicon differs from polycrystalline silicon in that when molten elemental silicon solidifies, the silicon atoms are arranged in a diamond lattice as a plurality of crystal nuclei, and single crystal silicon is formed if these crystal nuclei grow into crystal grains having the same crystal plane orientation. If these crystal nuclei grow into crystal grains having different crystal plane orientations, polycrystalline silicon is formed. The difference between polycrystalline silicon and single crystal silicon is mainly expressed in terms of physical properties. For example, polycrystalline silicon is inferior to single crystal silicon in mechanical properties, electrical properties, and the like. Polycrystalline silicon may be used as a feedstock for pulling single crystal silicon. Single crystal silicon is the purest material in the world, and a general semiconductor device requires six or more than 9 degrees of silicon purity. The requirements for large scale integrated circuits are higher and the purity of silicon must reach nine 9. Single crystal silicon having a purity of twelve and 9 has been produced. Monocrystalline silicon is an indispensable basic material in modern science and technology such as electronic computers and automatic control systems.
The existing monocrystalline silicon piece polishing machine is inconvenient to clean and use.
It is noted that the information disclosed in this background section of the invention is only for enhancement of understanding of the general background of the invention, and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.
SUMMERY OF THE UTILITY MODEL
For solving the problem that exists among the prior art, the utility model discloses a clean mechanism and displacement mechanism to can clean single crystal silicon piece burnishing machine, therefore convenient to use.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a monocrystalline silicon piece burnishing machine with clean structure, includes polishing mechanism, polishing mechanism includes burnishing machine, polishing dish, the burnishing machine top is equipped with the polishing dish, be equipped with displacement mechanism in the polishing mechanism, be equipped with clean mechanism in the displacement mechanism, clean mechanism includes telescopic cylinder, connecting plate, clean support frame, motor one, clean brush roll, be equipped with on the telescopic cylinder telescopic link the connecting plate, the welding of connecting plate rear portion has clean support frame, just be located on the clean support frame connecting plate one side is equipped with motor one, be equipped with on the output shaft of motor one the clean brush roll, clean brush roll one side is equipped with the water pipe, water pipe bottom evenly distributed has the water spout.
On the basis of the technical scheme, the displacement mechanism comprises a supporting plate, a linear motor sliding rail and a linear motor rotor base, the supporting plate is arranged at the front part of the polishing machine, the linear motor sliding rail is arranged above the supporting plate, and the linear motor electronic base is arranged on the linear motor sliding rail.
On the basis of the technical scheme, the displacement mechanism comprises a supporting plate, a second motor, a screw rod, a displacement block and a displacement support, the supporting plate is arranged at the front part of the polishing machine, the displacement support is arranged at the top of the supporting plate, the second motor is arranged on one side of the displacement support, the screw rod is arranged on an output shaft of the second motor, and the displacement block is connected to the screw rod through threads.
On the basis of the technical scheme, the cleaning brush roller is rotatably connected with the cleaning support frame, and the cleaning support frame supports the cleaning brush roller to rotate.
On the basis of the technical scheme, the connecting plate is connected with the telescopic cylinder through a screw, and the connecting plate is connected and fastened with the telescopic cylinder.
On the basis of the technical scheme, the telescopic cylinder is vertically arranged and can drive the connecting plate and the cleaning support frame to vertically lift.
Compared with the prior art, the beneficial effects of the utility model are that:
when needing to be clean, start backup pad and linear electric motor slide rail, make the linear electric motor slide rail drive telescopic cylinder displacement to polishing dish top, then start telescopic cylinder and drive connecting plate and clean support frame decline and make clean brush roll contact polishing cloth, then the cleaning brush roll rotation is driven to the starter motor, start the water source simultaneously and carry water to the water pipe and spout from the water spout, improve clean efficiency, can start the linear electric motor slide rail simultaneously and drive telescopic cylinder displacement, just so can clean convenient to use to the different positions of polishing cloth.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is an isometric view of an embodiment 1 of a monocrystalline silicon wafer polishing machine having a cleaning structure according to the present invention;
FIG. 2 is a diagram of a cleaning brush roller in example 1 of a monocrystalline silicon wafer polishing machine having a cleaning structure according to the present invention;
FIG. 3 is a top view of a water pipe in example 1 of a monocrystalline silicon wafer polishing machine having a cleaning structure according to the present invention;
FIG. 4 is an isometric view of embodiment 2 of a monocrystalline silicon wafer polishing machine having a cleaning structure according to the present invention.
The reference numerals are explained below:
1. a polishing mechanism; 101. polishing the machine; 102. a polishing disk; 2. a cleaning mechanism; 201. a telescopic cylinder; 202. a connecting plate; 203. cleaning the support frame; 204. a first motor; 205. cleaning the brush roll; 206. a water pipe; 207. a water spray nozzle; 3. a displacement mechanism; 301. a support plate; 302. a linear motor slide rail; 303. a linear motor electronic base; 304. a second motor; 305. a lead screw; 306. a displacement block; 307. and (5) displacing the support.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Example 1
Referring to fig. 1-3, the present invention provides a technical solution: a monocrystalline silicon wafer polishing machine with a cleaning structure comprises a polishing mechanism 1, wherein the polishing mechanism 1 comprises a polishing machine 101 and a polishing disc 102, the top of the polishing machine 101 is provided with the polishing disc 102, the polishing mechanism 1 is provided with a displacement mechanism 3, the displacement mechanism 3 is provided with a cleaning mechanism 2, the cleaning mechanism 2 comprises a telescopic cylinder 201, a connecting plate 202, a cleaning support frame 203, a motor I204 and a cleaning brush roller 205, the telescopic rod of the telescopic cylinder 201 is provided with the connecting plate 202, the connecting plate 202 is connected with the telescopic cylinder 201 through screws, the connecting plate 202 is connected and fastened with the telescopic cylinder 201, the telescopic cylinder 201 is vertically arranged, the telescopic cylinder 201 can drive the connecting plate 202 and the cleaning support frame 203 to vertically lift, the rear part of the connecting plate 202 is welded with the cleaning support frame 203, the cleaning brush roller 205 is rotatably connected with the cleaning support frame 203, the cleaning support frame 203 supports, the output shaft of the first motor 204 is provided with a cleaning brush roller 205, one side of the cleaning brush roller 205 is provided with a water pipe 206, and the bottom of the water pipe 206 is uniformly distributed with water nozzles 207.
On the basis of the above-described embodiment: the displacement mechanism 3 comprises a support plate 301, a linear motor slide rail 302 and a linear motor rotor base 303, the support plate 301 is arranged at the front part of the polishing machine 101, the linear motor slide rail 302 is arranged above the support plate 301, and the linear motor rotor base 303 is arranged on the linear motor slide rail 302.
The utility model discloses a theory of operation and use flow: when cleaning is needed, the supporting plate 301 and the linear motor sliding rail 302 are started, the linear motor sliding rail 302 drives the telescopic cylinder 201 to move to the position above the polishing disc 102, then the telescopic cylinder 201 is started to drive the connecting plate 202 and the cleaning supporting frame 203 to descend, so that the cleaning brush roller 205 is contacted with polishing cloth, then the first starting motor 204 drives the cleaning brush roller 205 to rotate, meanwhile, a water source is started to convey water to the water pipe 206 and spray the water from the water nozzle 207, the cleaning efficiency is improved, meanwhile, the linear motor sliding rail 302 can be started to drive the telescopic cylinder 201 to move, and therefore different parts of the polishing cloth can be cleaned conveniently.
Example 2
Referring to fig. 4, the difference between the embodiment 2 and the embodiment 1 is that the displacement mechanism 3 includes a support plate 301, a second motor 304, a lead screw 305, a displacement block 306, and a displacement support 307, the support plate 301 is disposed at the front of the polishing machine 101, the displacement support 307 is disposed at the top of the support plate 301, the second motor 304 is disposed at one side of the displacement support 307, the lead screw 305 is disposed on an output shaft of the second motor 304, the displacement block 306 is connected to the lead screw 305 through a screw, the second motor 304 is started to drive the lead screw 305 to rotate so as to drive the displacement block 306 to displace through a screw, the displacement block 306 drives the telescopic cylinder 201 to displace to the upper side of the polishing disk 102, then the telescopic cylinder 201 is started to drive the connection plate 202 and the cleaning support 203 to descend so as to make the cleaning brush roller 205 contact the polishing cloth, then the first motor 204 is started to, meanwhile, the second motor 304 can be started to drive the telescopic cylinder 201 to move, so that different parts of the polishing cloth can be cleaned conveniently.
Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for purposes of illustration and is not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (6)
1. A monocrystalline silicon wafer polishing machine with a cleaning structure comprises a polishing mechanism (1), wherein the polishing mechanism (1) comprises a polishing machine (101) and a polishing disk (102), the polishing disk (102) is arranged on the top of the polishing machine (101), and the polishing machine is characterized in that: be equipped with displacement mechanism (3) on polishing mechanism (1), be equipped with clean mechanism (2) on displacement mechanism (3), clean mechanism (2) are including telescopic cylinder (201), connecting plate (202), clean support frame (203), motor (204), clean brush roll (205), be equipped with on telescopic cylinder (201) telescopic link connecting plate (202), the welding of connecting plate (202) rear portion has clean support frame (203), just be located on clean support frame (203) connecting plate (202) one side is equipped with motor (204), be equipped with on motor (204) output shaft clean brush roll (205), clean brush roll (205) one side is equipped with water pipe (206), water pipe (206) bottom evenly distributed has water spout (207).
2. A single crystal silicon wafer polishing machine having a cleaning structure according to claim 1, wherein: displacement mechanism (3) are including backup pad (301), linear electric motor slide rail (302), linear electric motor active cell seat (303), burnishing machine (101) front portion is equipped with backup pad (301), backup pad (301) top is equipped with linear electric motor slide rail (302), be equipped with on linear electric motor slide rail (302) linear electric motor electronic seat (303).
3. A single crystal silicon wafer polishing machine having a cleaning structure according to claim 1, wherein: displacement mechanism (3) are including backup pad (301), two (304) motors, lead screw (305), displacement piece (306), displacement support (307), burnishing machine (101) front portion is equipped with backup pad (301), backup pad (301) top is equipped with displacement support (307), displacement support (307) one side is equipped with two (304) motors, be equipped with on two (304) motor output shafts lead screw (305), there is displacement piece (306) through threaded connection on lead screw (305).
4. A single crystal silicon wafer polishing machine having a cleaning structure according to claim 1, wherein: the cleaning brush roller (205) is rotatably connected with the cleaning support frame (203).
5. A single crystal silicon wafer polishing machine having a cleaning structure according to claim 1, wherein: the connecting plate (202) is connected with the telescopic cylinder (201) through screws.
6. A single crystal silicon wafer polishing machine having a cleaning structure according to claim 1, wherein: the telescopic cylinder (201) is vertically arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020218520.0U CN211681520U (en) | 2020-02-27 | 2020-02-27 | Monocrystalline silicon piece polishing machine with cleaning structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020218520.0U CN211681520U (en) | 2020-02-27 | 2020-02-27 | Monocrystalline silicon piece polishing machine with cleaning structure |
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| Publication Number | Publication Date |
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| CN211681520U true CN211681520U (en) | 2020-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020218520.0U Active CN211681520U (en) | 2020-02-27 | 2020-02-27 | Monocrystalline silicon piece polishing machine with cleaning structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112621475A (en) * | 2020-12-15 | 2021-04-09 | 张家港台达机械制造有限公司 | Machine parts burnishing and polishing device |
| CN113560964A (en) * | 2021-09-24 | 2021-10-29 | 江东电子材料有限公司 | Polishing method and device |
-
2020
- 2020-02-27 CN CN202020218520.0U patent/CN211681520U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112621475A (en) * | 2020-12-15 | 2021-04-09 | 张家港台达机械制造有限公司 | Machine parts burnishing and polishing device |
| CN113560964A (en) * | 2021-09-24 | 2021-10-29 | 江东电子材料有限公司 | Polishing method and device |
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Effective date of registration: 20230822 Address after: No. 2, Building 2, No. 10 Yincang Road, Quzhou City, Zhejiang Province, 324000 Patentee after: Quzhou Bolai Narun Electronic Materials Co.,Ltd. Address before: 221300 East side of Yimengshan Road and south side of Songhuajiang Road, Pizhou Economic Development Zone, Pizhou City, Xuzhou City, Jiangsu Province Patentee before: Xuzhou Yongze New Material Technology Co.,Ltd. |