CN217371658U

CN217371658U - Grinding device for silicon wafer production and processing

Info

Publication number: CN217371658U
Application number: CN202220515305.6U
Authority: CN
Inventors: 吴美璇
Original assignee: Enengjie Jiaxing New Materials Co ltd
Current assignee: Enengjie Jiaxing New Materials Co ltd
Priority date: 2022-03-10
Filing date: 2022-03-10
Publication date: 2022-09-06
Anticipated expiration: 2032-03-10

Abstract

The utility model discloses a grinder is used in silicon wafer production and processing, including operation mesa, bracing piece, arc wall, support frame, carousel, driving motor, brush head, spliced pole, support post and adjusting bolt. The utility model relates to a silicon wafer is grinder for production and processing adjusts the brush head for the position of carousel through adjusting bolt to be convenient for adjust the position of brush head for the silicon wafer, be convenient for lead through the regulation direction of mutual complementary action to the backup pad between slider and the spout in addition, thereby be convenient for support the spliced pole to the backup pad, and then the effectual silicon wafer of brush head on the carousel of having guaranteed polishes.

Description

Grinding device for silicon wafer production and processing

Technical Field

The utility model relates to a silicon wafer processing correlation technique field specifically is a grinder is used in silicon wafer production and processing.

Background

Silicon is a semiconductor material and its own electrical conductivity is not very good, however, its resistivity can be precisely controlled by adding appropriate dopants, and before manufacturing semiconductors it must be converted into wafers, starting from the growth of the silicon ingot. Single crystal silicon is a solid in which atoms are periodically formed in a three-dimensional spatial pattern that extends throughout the material. Polycrystalline silicon is formed solely from a plurality of small single crystals having different crystal orientations and cannot be used in semiconductor circuits, and must be melted to a single crystal before being processed into a wafer for use in semiconductor applications;

the grinding device for the production and processing of the silicon wafer in the prior art is inconvenient for adjusting the position of the brush head relative to the silicon wafer due to the design characteristics of the grinding device, so that the grinding efficiency of the brush head on the silicon wafer is reduced, and various use requirements of the existing grinding device for the production and processing of the silicon wafer cannot be met;

therefore, a grinding device for silicon wafer production and processing is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a grinder is used in silicon wafer production and processing aims at improving the grinder is used in silicon wafer production and processing among the prior art because the design characteristics of its own, is not convenient for adjust the position of brush head for the silicon wafer to the problem of the efficiency of polishing is carried out to the silicon wafer to the brush head has been reduced.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a grinder is used in silicon wafer production and processing, is in including operation mesa, setting bracing piece, the setting of operation mesa lower extreme edge department all around are in the arc wall of terminal surface, setting before the operation mesa are in the support frame, the setting of operation mesa up end front end are in the carousel of support frame up end, be used for carrying out driven driving motor to the carousel, for the brush head of carousel setting, with the spliced pole that the brush head is connected, set up and be in support post and setting between spliced pole and the operation mesa are in adjusting bolt between support post and the spliced pole.

As a preferred aspect of the present invention, the supporting frame is set to be U-shaped, and the lower end surface of the supporting frame is connected to the operating table surface through a fixing screw.

As a preferred aspect of the present invention, the fixing base of the driving motor is connected to the lower end surface of the supporting frame through the fixing bolt, and the rotating electrical machine runs through the supporting frame and is connected to the turntable.

As a preferred aspect of the present invention, the supporting column is set to be "L" shaped, the one end of the supporting column is also connected to the operation table through the fixing screw, and the other end of the supporting column is set up above the turntable.

As a preferred aspect of the utility model, adjusting bolt run through in support column with the spliced pole is connected, be provided with on the spliced pole with the screw hole of adjusting bolt looks adaptation.

As a preferred aspect of the utility model, still including setting up the backup pad, the setting that the spliced pole is connected the department with the brush head are in the slider and the setting of the backup pad other end are in on the support post with the slide opening of slider looks adaptation, the lower terminal surface of spliced pole with backup pad fixed connection, the brush head runs through in the backup pad and is connected through block structure with the spliced pole.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model has the characteristics of reasonable in design and easy operation, the utility model relates to a silicon wafer is grinder for production and processing passes through adjusting bolt and adjusts the brush head for the position of carousel to be convenient for adjust the position of brush head for the silicon wafer, be convenient for lead through the regulation direction of mutual complementary action to the backup pad between slider and the spout in addition, thereby be convenient for support the spliced pole to the backup pad, and then the effectual silicon wafer of brush head on the carousel of having guaranteed polishes.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic structural view of a partial cross-sectional view of the overall structure of a polishing apparatus for silicon wafer production and processing according to the present invention;

FIG. 2 is a schematic structural view of the overall structure of the polishing apparatus for silicon wafer production and processing according to the present invention;

FIG. 3 is a schematic view of another perspective of the polishing apparatus for silicon wafer production and processing according to the present invention;

fig. 4 is a schematic structural view of the front view of fig. 2 in the polishing apparatus for silicon wafer production processing according to the present invention.

In the figure: 1-operation table top, 10-arc groove, 2-support bar, 3-support frame, 4-rotary table, 5-rotary motor, 6-brush head, 61-connection column, 7-support column, 71-sliding groove, 8-adjusting bolt, 9-support plate, 91-sliding block.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1, fig. 2, fig. 3 and fig. 4, the present invention provides a technical solution: a grinding device for silicon wafer production and processing comprises an operation table board 1, support rods 2 arranged at the peripheral corners of the lower end of the operation table board 1, an arc-shaped groove 10 arranged on the front end face of the operation table board 1, a support frame 3 arranged at the front end of the upper end face of the operation table board 1, a rotary table 4 arranged on the upper end face of the support frame 3, a driving motor for driving the rotary table 4, a brush head 6 arranged relative to the rotary table 4, a connecting column 61 connected with the brush head 6, a support upright 7 arranged between the connecting column 61 and the operation table board 1 and an adjusting bolt 8 arranged between the support upright 7 and the connecting column 61, in the utility model, the relative position of the brush head 6 relative to the rotary table 4 is convenient to adjust through the adjusting bolt 8, thereby the position of the brush head 6 relative to a silicon wafer is convenient to adjust, in addition, the adjustment direction of a support plate 9 is convenient to guide through the mutual complementary action between a slide block 91 and a chute 71, thereby be convenient for support spliced pole 61 to backup pad 9, and then the effectual silicon wafer of brush head 6 on to carousel 4 of having guaranteed polishes.

It is to be noted here that the design of the arc-shaped slot 10 facilitates the placing of the silicon wafer on the turntable 4 by the staff.

Referring to fig. 1, 2, 3 and 4, the support frame 3 is U-shaped, and the lower end surface of the support frame 3 is connected to the operation table top 1 through a fixing screw, so that the support frame 3 is conveniently connected to the operation table top 1 through the fixing screw, and the stability of the connection between the support frame 3 and the operation table top 1 is effectively ensured.

Referring to fig. 1, 2, 3 and 4, the fixing seat of the driving motor is connected with the lower end surface of the supporting frame 3 through a fixing bolt, so that the driving motor is conveniently fixed, and the rotating motor 5 penetrates through the supporting frame 3 and is connected with the rotating disc 4, so that the rotating motor 5 drives the rotating disc 4 to rotate, the silicon wafer on the rotating disc 4 is conveniently contacted with the brush head 6, and the brush head 6 is convenient to polish the silicon wafer.

Referring to fig. 1, 2, 3 and 4, the supporting column 7 is set to be "L" shaped, one end of the supporting column 7 is also connected with the operation table top 1 through a fixing screw, the other end of the supporting column 7 is arranged above the turntable 4, and the supporting column 7 is set to be "L" shaped, so that the supporting column 7 is conveniently connected with the operation table top 1, the stability of the connection between the supporting column 7 and the operation table top 1 is effectively ensured, and the brush head 6 is conveniently installed by the supporting column 7.

Referring to fig. 1, 2, 3 and 4, the adjusting bolt 8 penetrates through the supporting column 7 and is connected with the connecting column 61, and the connecting column 61 is provided with a threaded hole matched with the adjusting bolt 8, so that the relative distance of the connecting column 61 relative to the supporting column 7 can be adjusted through the mutual complementary action between the adjusting bolt 8 and the threaded hole, and the distance of the brush head 6 relative to the rotating disc 4 can be adjusted conveniently.

Please refer to fig. 1, fig. 2, fig. 3 and fig. 4, further comprising a supporting plate 9 disposed at a connection position of the connecting column 61 and the brush head 6, a sliding block 91 disposed at the other end of the supporting plate 9, and a sliding hole disposed on the supporting upright 7 and adapted to the sliding block 91, wherein the lower end surface of the connecting column 61 is fixedly connected to the supporting plate 9, the brush head 6 penetrates through the supporting plate 9 and is connected to the connecting column 61 through a clamping structure, so as to support the lower end surface of the connecting column 61 through the supporting plate 9, and guide the adjusting direction of the supporting plate 9 through mutual complementary action between the sliding block 91 and the sliding groove 71.

The working principle is as follows: when using, place the silicon wafer on carousel 4, then through clockwise rotation adjusting bolt 8, adjusting bolt 8 drives spliced pole 61 and removes for the silicon wafer direction on carousel 4, support the lower terminal surface of spliced pole 61 through backup pad 9, and be convenient for lead the regulation direction of backup pad 9 through mutual complementary effect between slider 91 and the spout 71, when adjusting brush head 6 to suitable position, start rotating electrical machines 5, rotating electrical machines 5's output shaft drives carousel 4 and rotates, thereby be convenient for silicon wafer on carousel 4 and brush head 6 contact, thereby be convenient for brush head 6 polishes the silicon wafer.

The device obtained by the design can basically meet the use requirement of improving the problem that the position of the brush head relative to the silicon wafer is not convenient to adjust due to the design characteristics of the device, so that the grinding efficiency of the brush head for grinding the silicon wafer is reduced.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A grinding device for silicon wafer production and processing is characterized in that: including operation mesa (1), setting up bracing piece (2), the setting of operation mesa (1) lower extreme edge department all around are in arc wall (10), the setting of terminal surface are in before operation mesa (1) upper end support frame (3), the setting of terminal surface are in carousel (4) of support frame (3) up end for carry out driven driving motor to carousel (4), for the brush head (6) of carousel (4) setting, with connecting post (61) that brush head (6) are connected, setting are in support post (7) and setting between connecting post (61) and operation mesa (1) are in adjusting bolt (8) between support post (7) and connecting post (61).

2. The grinding device for silicon wafer production and processing according to claim 1, wherein the support frame (3) is provided in a "U" shape, and the lower end face of the support frame (3) is connected with the operation table (1) by a fixing screw.

3. The grinding device for the production and processing of silicon wafers according to claim 2, characterized in that the fixing seat of the driving motor is connected with the lower end face of the support frame (3) through a fixing bolt, and the rotating motor (5) penetrates through the support frame (3) and is connected with the rotating disc (4).

4. The grinding device for silicon wafer production and processing according to claim 3, characterized in that the supporting column (7) is provided in an "L" shape, one end of the supporting column (7) is also connected with the operation table (1) through a fixing screw, and the other end of the supporting column (7) is arranged above the turntable (4).

5. The grinding device for silicon wafer production and processing according to claim 4, characterized in that the adjusting bolt (8) penetrates through the supporting column (7) and is connected with the connecting column (61), and the connecting column (61) is provided with a threaded hole matched with the adjusting bolt (8).

6. The grinding device for silicon wafer production and processing according to claim 5, further comprising a support plate (9) arranged at the connection part of the connection column (61) and the brush head (6), a slide block (91) arranged at the other end of the support plate (9), and a slide hole arranged on the support column (7) and matched with the slide block (91), wherein the lower end face of the connection column (61) is fixedly connected with the support plate (9), and the brush head (6) penetrates through the support plate (9) and is connected with the connection column (61) through a clamping structure.