CN216633016U

CN216633016U - Wafer laser polishing adjusting mechanism

Info

Publication number: CN216633016U
Application number: CN202122993977.6U
Authority: CN
Inventors: 胡建军
Original assignee: Suzhou Yingerjie Semiconductor Co ltd
Current assignee: Suzhou Yingerjie Semiconductor Co ltd
Priority date: 2021-11-29
Filing date: 2021-11-29
Publication date: 2022-05-31
Anticipated expiration: 2031-11-29

Abstract

The utility model discloses a wafer laser polishing adjusting mechanism which comprises a base, wherein a first servo motor is installed on one side of the base, the output end of the first servo motor is connected with a first screw rod, a second servo motor is installed on the first screw rod, the output end of the second servo motor is connected with a second screw rod, and a moving plate is connected onto the second screw rod; the movable plate is provided with a first servo electric cylinder, a first clamp, a second servo electric cylinder and a second clamp, the output end of the first servo electric cylinder is connected with the first clamp, and the output end of the second servo electric cylinder is connected with the second clamp; the inner sides of the first clamp and the second clamp are both provided with arc-shaped grooves, roller grooves are formed in the arc-shaped grooves, rollers are arranged inside the roller grooves, and a third servo motor is fixedly mounted at one end of each roller.

Description

Wafer laser polishing adjusting mechanism

Technical Field

The utility model relates to the technical field of wafer polishing, in particular to a wafer laser polishing adjusting mechanism.

Background

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.

The main processing modes of the wafer are sheet processing and batch processing, i.e. 1 or more wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more and more advanced, so that new data characteristics appear in wafer processing. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and the reliability of the processed wafer is increased during wafer processing, and the particle number has new data characteristics along with the improvement of cleanness.

However, when polishing the existing wafer, the existing wafer cannot effectively adjust the equipment and the wafer, so that the wafer is very inconvenient when polishing the wafer, and the wafer polishing operation is very inconvenient when polishing the wafer.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wafer laser polishing adjusting mechanism which is convenient for clamping and rotating adjustment of a wafer and can realize adjustment processing of equipment so as to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme:

a wafer laser polishing adjusting mechanism comprises a base, wherein a first servo motor is fixedly installed on one side of the base, the output end of the first servo motor is connected with a first screw rod, a second servo motor is movably installed on the first screw rod, the output end of the second servo motor is connected with a second screw rod, and a movable plate is movably connected to the second screw rod;

the movable plate is provided with a first servo electric cylinder, a first clamp, a second servo electric cylinder and a second clamp, the output end of the first servo electric cylinder is fixedly connected with the first clamp, and the output end of the second servo electric cylinder is fixedly connected with the second clamp;

the first clamp and the second clamp are both provided with arc-shaped grooves on the inner sides, roller grooves are formed in the arc-shaped grooves, rollers are arranged in the roller grooves, one ends of the rollers are fixedly provided with third servo motors, and the third servo motors are fixedly arranged on the first clamp and the second clamp.

Preferably, a supporting plate groove is formed in the bottom end of the first clamp, a supporting plate is fixedly mounted at the bottom end of the second clamp, and the supporting plate is inserted into the supporting plate groove.

Preferably, a bearing seat is fixedly installed at one end of the base, a screw rod groove is formed in one end of the base, the first screw rod is located inside the screw rod groove, and one end of the first screw rod is rotatably connected with the bearing seat.

Preferably, a moving seat is connected to the first screw rod in a threaded manner, and the second servo motor is fixedly installed on the moving seat.

Preferably, the two ends of the base are respectively and fixedly provided with a fixed seat, and a sliding rod is fixedly arranged between the fixed seats.

Preferably, the sliding rod is connected with a sliding seat in a sliding mode, and one side of the sliding seat is connected with the second screw rod in a rotating mode.

Preferably, the second screw rod is in threaded connection with the movable plate, and movable wheels are fixedly mounted at four corners of the bottom of the movable plate respectively.

Compared with the prior art, the utility model has the beneficial effects that:

1. when the polishing clamp is used, the clamp can be moved through the servo electric cylinder to stably clamp and fix a wafer, the clamp is provided with the roller driven by the micro motor, the wafer is rotationally adjusted through rotation of the roller, and polishing treatment is performed on wafers at different angles;

2. when the positioning device is used, the moving base is moved and adjusted through the servo motor, so that the moving base can be precisely adjusted in position, polishing of a wafer is conveniently carried out for positioning, and the problem that the wafer cannot be precisely positioned when polished is avoided.

Drawings

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a second schematic structural diagram of the present invention;

fig. 3 is a partial structural schematic diagram of the present invention.

In the figure: 1. a base; 2. a first servo motor; 3. a first lead screw; 4. a second servo motor; 5. a second lead screw; 6. moving the plate; 7. a first servo electric cylinder; 8. a first clamp; 9. a second servo electric cylinder; 10. a second clamp; 11. an arc-shaped slot; 12. a roller groove; 13. a third servo motor; 14. a roller; 15. a support plate slot; 16. a support plate; 17. a bearing seat; 18. a screw rod groove; 19. a movable seat; 20. a fixed seat; 21. a slide bar; 22. a sliding seat.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution:

a wafer laser polishing adjusting mechanism comprises a base 1, wherein a first servo motor 2 is fixedly mounted on one side of the base 1, the output end of the first servo motor 2 is connected with a first screw rod 3, a second servo motor 4 is movably mounted on the first screw rod 3, the output end of the second servo motor 4 is connected with a second screw rod 5, and a moving plate 6 is movably connected to the second screw rod 5;

a first servo electric cylinder 7, a first clamp 8, a second servo electric cylinder 9 and a second clamp 10 are mounted on the moving plate 6, the output end of the first servo electric cylinder 7 is fixedly connected with the first clamp 8, and the output end of the second servo electric cylinder 9 is fixedly connected with the second clamp 10;

the first clamp 8 and the second clamp 10 are both provided with an arc-shaped groove 11 on the inner side, a roller groove 12 is formed in the arc-shaped groove 11, a roller 14 is arranged inside the roller groove 12, one end of the roller 14 is fixedly provided with a third servo motor 13, and the third servo motor 13 is fixedly arranged on the first clamp 8 and the second clamp 10.

In this embodiment, preferably, a supporting plate groove 15 is formed in the bottom end of the first clamp 8, a supporting plate 16 is fixedly mounted at the bottom end of the second clamp 10, and the supporting plate 16 is inserted into the supporting plate groove 15. The effect is that the support plate 16 can be set to support and place the wafer, and the support plate slot 15 can be set to clamp and insert the support plate 16.

In this embodiment, preferably, a bearing seat 17 is fixedly installed at one end of the base 1, a screw groove 18 is formed at one end of the base 1, the first screw 3 is located inside the screw groove 18, one end of the first screw 3 is rotatably connected with the bearing seat 17, a moving seat 19 is connected to the first screw 3 through a thread, and the second servo motor 4 is fixedly installed on the moving seat 19. The effect is that the screw groove 18 can facilitate the placement and movement of the first screw 3, and the setting of the moving seat 19 can facilitate the placement of the second servo motor 4 and facilitate the driving of the second servo motor 4 to move longitudinally.

In this embodiment, preferably, fixing seats 20 are respectively and fixedly installed at two ends of the base 1, a sliding rod 21 is fixedly installed between the fixing seats 20, a sliding seat 22 is slidably connected to the sliding rod 21, and one side of the sliding seat 22 is rotatably connected to the second lead screw 5. The effect is that the slide seat 22 is set to slide the second lead screw 5 on the slide rod 21, so as to facilitate the longitudinal movement adjustment of the moving plate 6.

In this embodiment, preferably, the second lead screw 5 is in threaded connection with the moving plate 6, and moving wheels are fixedly mounted at four corners of the bottom of the moving plate 6, so that the second lead screw 5 can move and adjust the moving plate 6 through the second servo motor 4, and the moving wheels are set to enable the moving plate 6 to move more easily and quickly.

The structure principle is as follows: when using, place the wafer in the backup pad 16 of second anchor clamps 10, then start first servo electric jar 7 and the servo electric jar 9 of second of both sides, the realization carries out the subtend promotion to first anchor clamps 8 and second anchor clamps 10, make first anchor clamps 8 and second anchor clamps 10 can realize carrying out the block centre gripping to the wafer, and backup pad 16 inserts the inside in backup pad groove 15, then detect according to the location, confirm base 1 position, then realize moving base 1 through first servo motor 2 and second servo motor 4 and adjust, make the wafer can effectually carry out accurate location, then when needs carry out angle regulation to the wafer, drive gyro wheel 14 through a plurality of third servo motor 13 and rotate, the realization is carried out angle regulation to the wafer, be convenient for carry out laser and polish.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer laser adjustment mechanism that polishes, includes base (1), its characterized in that: a first servo motor (2) is fixedly installed on one side of the base (1), the output end of the first servo motor (2) is connected with a first screw rod (3), a second servo motor (4) is movably installed on the first screw rod (3), the output end of the second servo motor (4) is connected with a second screw rod (5), and a moving plate (6) is movably connected on the second screw rod (5);

a first servo electric cylinder (7), a first clamp (8), a second servo electric cylinder (9) and a second clamp (10) are mounted on the moving plate (6), the output end of the first servo electric cylinder (7) is fixedly connected with the first clamp (8), and the output end of the second servo electric cylinder (9) is fixedly connected with the second clamp (10);

arc-shaped grooves (11) are formed in the inner sides of the first clamp (8) and the second clamp (10), roller grooves (12) are formed in the arc-shaped grooves (11), rollers (14) are arranged inside the roller grooves (12), a third servo motor (13) is fixedly mounted at one end of each roller (14), and the third servo motor (13) is fixedly mounted on the first clamp (8) and the second clamp (10).

2. The wafer laser grinding adjustment mechanism of claim 1, wherein: a supporting plate groove (15) is formed in the bottom end of the first clamp (8), a supporting plate (16) is fixedly mounted at the bottom end of the second clamp (10), and the supporting plate (16) is inserted into the supporting plate groove (15).

3. The wafer laser grinding adjustment mechanism of claim 1, wherein: the one end fixed mounting of base (1) has bearing frame (17), lead screw groove (18) have been seted up to the one end of base (1), first lead screw (3) are in the inside in lead screw groove (18), the one end of first lead screw (3) with bearing frame (17) rotate to be connected.

4. The adjustment mechanism for wafer laser grinding according to claim 1, wherein: and the first screw rod (3) is connected with a movable seat (19) through threads, and the second servo motor (4) is fixedly installed on the movable seat (19).

5. The wafer laser grinding adjustment mechanism of claim 1, wherein: the two ends of the base (1) are respectively fixedly provided with a fixing seat (20), and a sliding rod (21) is fixedly arranged between the fixing seats (20).

6. The wafer laser grinding adjustment mechanism of claim 5, wherein: the sliding rod (21) is connected with a sliding seat (22) in a sliding mode, and one side of the sliding seat (22) is rotatably connected with the second screw rod (5).

7. The adjustment mechanism for wafer laser grinding according to claim 1, wherein: the second screw rod (5) is in threaded connection with the moving plate (6), and moving wheels are fixedly mounted at four corners of the bottom of the moving plate (6) respectively.