CN216068126U - Crystal bar slicing machine for semiconductor processing - Google Patents
Crystal bar slicing machine for semiconductor processing Download PDFInfo
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- CN216068126U CN216068126U CN202122071222.0U CN202122071222U CN216068126U CN 216068126 U CN216068126 U CN 216068126U CN 202122071222 U CN202122071222 U CN 202122071222U CN 216068126 U CN216068126 U CN 216068126U
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Abstract
The utility model belongs to the field of semiconductor processing, and particularly relates to a crystal bar slicing machine for semiconductor processing, which aims at the problems that the existing crystal bar slicing machine is poor in stability during slicing and easy to deviate during slicing. The crystal bar slicing machine has good stability during slicing, the crystal bar is not easy to deviate during slicing, and the slicing efficiency is high.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a crystal bar slicing machine for semiconductor processing.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor has wide application in radio, television and temperature measurement, for example, a diode is a device made of the semiconductor, the semiconductor refers to a material with controllable electric conductivity ranging from the insulator to the conductor, a common carrier of the semiconductor material is made of silicon, the processing process comprises the steps of firstly generating silicon into a crystal bar, then cutting the crystal bar into slices, and then grinding and polishing the slices to form a wafer, namely a main body of the semiconductor material; however, the existing crystal bar slicing machine has poor stability during slicing and is easy to shift during slicing.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a crystal bar slicing machine for semiconductor processing.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a crystal bar slicing machine for semiconductor processing comprises a processing table, two erection plates, two lifting adjusting seats, a slicing machine body, a lifting mechanism, a slicing seat and two clamping control mechanisms, wherein the two erection plates are fixedly arranged at the top of the processing table, adjusting grooves are formed in the sides, close to each other, of the two erection plates, the lifting adjusting seats are slidably arranged in the corresponding adjusting grooves, the slicing machine body is fixedly arranged between the two lifting adjusting seats, the lifting mechanism is arranged on the erection plates and is connected with the lifting adjusting seats, the slicing seat is fixedly arranged at the top of the processing table, the two clamping control mechanisms are arranged on the slicing seat, the lifting mechanism comprises two threaded rods, two driven sprockets, a stepping motor and a driving sprocket, two threaded holes are formed in the two lifting adjusting seats, and the threaded rods are installed in the two threaded holes in a threaded manner, the equal fixed mounting in top of two threaded rods has driven sprocket, one side fixed mounting who erects the board has step motor, fixedly connected with drive sprocket on step motor's the output shaft, drive sprocket and two driven sprocket transmission are connected with same chain.
Preferably, the clamping control mechanism comprises a clamping seat, a second rotating wheel, a moving block, a second rack, a lead screw, a second belt wheel, a first rotating wheel and a first belt wheel, a round hole is formed in the inner wall of the adjusting groove, a round rod is rotatably mounted in the round hole, the first rotating wheel and the first belt wheel are fixedly mounted at two ends of the round rod respectively, the first rack is fixedly mounted at one side of the lifting adjusting seat, and the first rack is meshed with the first rotating wheel.
Preferably, a fixing groove is formed in one side of the slicing seat, the clamping seat is rotatably mounted in the fixing groove, a rotating wheel II is fixedly mounted on one side of the clamping seat, a control groove is formed in the inner wall of the fixing groove, a moving block is slidably mounted in the control groove, a rack II is fixedly mounted on the moving block, the rack II is meshed with the rotating wheel II, a threaded hole I is formed in one side of the moving block, a lead screw is mounted in the threaded hole I, a belt wheel II is fixedly mounted at one end of the lead screw, and the belt wheel II and the belt wheel are in transmission connection with the same belt.
Preferably, the inner wall of the adjusting groove is provided with an auxiliary groove, one side of the lifting adjusting seat is fixedly provided with a sliding block, and the sliding block is slidably arranged in the auxiliary groove.
Preferably, one side fixed mounting of grip slipper has rotatory piece, has seted up on the inner wall of fixed slot and has rotated the groove, and rotatory piece rotates to be installed and rotates the inslot.
Preferably, the inner wall of the control groove is provided with a fixing hole, and the screw rod is rotatably installed in the fixing hole.
Compared with the prior art, the utility model has the beneficial effects that:
(1) according to the crystal bar slicing machine for semiconductor processing, disclosed by the utility model, the crystal bar can be stabilized in the slicing process, the crystal bar cannot deviate in the slicing process, and the stability is better.
(2) According to the crystal bar slicing machine for semiconductor processing, the clamping seats can be automatically driven to rotate while the slicing machine body is controlled to move up and down, the two clamping seats can automatically clamp the crystal bar, the clamping step is simple and convenient, and the operation step is time-saving and labor-saving.
Drawings
FIG. 1 is a schematic structural diagram of a wafer slicing machine for processing a semiconductor according to a front view of the present invention;
FIG. 2 is a schematic perspective view of a slicing holder and a clamping holder of a slicing machine for processing a semiconductor wafer according to the present invention;
FIG. 3 is a schematic view of a portion A of a slicing apparatus for a semiconductor processing ingot according to the present invention;
fig. 4 is a schematic structural diagram of a portion B of a slicing machine for a semiconductor processing ingot according to the present invention.
In the figure: 1. a processing table; 2. erecting a plate; 3. a lifting adjusting seat; 4. a slicer body; 5. a first rack; 6. rotating the first wheel; 7. a first belt wheel; 8. a slicing seat; 9. a clamping seat; 10. a second rotating wheel; 11. a moving block; 12. a second rack; 13. a screw rod; 14. a second belt wheel; 15. a threaded rod; 16. a driven sprocket; 17. a stepping motor; 18. a drive sprocket.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the description and claims of this patent does not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one.
Referring to fig. 1-4, a crystal bar slicing machine for semiconductor processing comprises a processing table 1, two erection plates 2, two lifting adjusting seats 3, a slicing machine body 4 and a slicing seat 8, wherein the two erection plates 2 are fixedly mounted at the top of the processing table 1, adjusting grooves are formed in the mutually close sides of the two erection plates 2, the lifting adjusting seats 3 are slidably mounted in the corresponding adjusting grooves, the slicing machine body 4 is fixedly mounted between the two lifting adjusting seats 3, the slicing seat 8 is fixedly mounted at the top of the processing table 1, a round hole is formed in the inner wall of each adjusting groove, a round rod is rotatably mounted in the round hole, a rotating wheel I6 and a belt wheel I7 are respectively and fixedly mounted at the two ends of the round rod, a rack I5 is fixedly mounted at one side of the lifting adjusting seat 3, the rack I5 is meshed with the rotating wheel I6, a fixing groove is formed in one side of the slicing seat 8, a clamping seat 9 is rotatably mounted in the fixed groove, a rotating wheel II 10 is fixedly mounted on one side of the clamping seat 9, a control groove is formed in the inner wall of the fixed groove, a moving block 11 is slidably mounted in the control groove, a rack II 12 is fixedly mounted on the moving block 11, the rack II 12 is meshed with the rotating wheel II 10, a threaded hole I is formed in one side of the moving block 11, a lead screw 13 is mounted in the threaded hole I, a belt wheel II 14 is fixedly mounted at one end of the lead screw 13, the belt wheel II 14 and the belt wheel I7 are in transmission connection with the same belt, the lifting mechanism comprises two threaded rods 15, two driven chain wheels 16, a stepping motor 17 and a driving chain wheel 18, two threaded holes II are formed in each of the two lifting adjusting seats 3, threaded rods 15 are mounted in each of the two threaded holes II in a threaded manner, and driven chain wheels 16 are fixedly mounted at the top ends of the two threaded rods 15, one side of the erection plate 2 is fixedly provided with a stepping motor 17, an output shaft of the stepping motor 17 is fixedly connected with a driving chain wheel 18, and the driving chain wheel 18 and the two driven chain wheels 16 are in transmission connection with the same chain.
In this embodiment, seted up the auxiliary tank on the inner wall of adjustment tank, one side fixed mounting of lift adjustment seat 3 has the sliding block, and sliding block slidable mounting is in the auxiliary tank.
In this embodiment, one side fixed mounting of holder 9 has rotatory piece, has seted up on the inner wall of fixed slot and has rotated the groove, and rotatory piece rotates to be installed at rotating the inslot, drives rotatory piece at the rotation inslot rotation when holder 9 rotates, can guarantee holder 9 stability when rotating.
In this embodiment, the inner wall of the control groove is provided with a fixing hole, and the screw 13 is rotatably installed in the fixing hole.
In this embodiment, the stepping motor 17 drives the driving sprocket 18 to rotate, the driving sprocket 18 drives the chain to move, the driving sprocket 18 drives the two driven sprockets 16 to rotate, the driven sprockets 16 drive the corresponding threaded rods 15 to rotate, the threaded rods 15 drive the corresponding lifting adjusting seats 3 to move, the two lifting adjusting seats 3 can drive the slicer body 4 to move downwards, the lifting adjusting seats 3 drive the first racks 5 to move, the first racks 5 drive the first rotating wheels 6 to rotate, the first rotating wheels 6 can control the first belt wheels 7 to rotate, the first belt wheels 7 drive the belt to move, the belt drives the corresponding second belt wheels 14 to rotate, the second belt wheels 14 drive the corresponding lead screws 13 to rotate, the lead screws 13 control the corresponding moving blocks 11 to move, the moving blocks 11 can drive the corresponding second racks 12 to move, the second racks 12 drive the corresponding second rotating wheels 10 to rotate, the second rotating wheels 10 control the clamping seats 9 to rotate, and the two clamping seats 9 can stably clamp the crystal bars, the slicer body 4 continues to move downwards and slices the slicer body, and after the stepping motor 17 drives the slicer body 4 to reset, the fixing of the crystal bar can be cancelled again, and the position of the crystal bar can be adjusted.
Compared with the prior art, the utility model has the technical progress that: the crystal bar slicing machine has good stability during slicing, the crystal bar is not easy to deviate during slicing, and the slicing efficiency is high.
Claims (6)
1. A crystal bar slicing machine for semiconductor processing is characterized by comprising a processing table (1), two erection plates (2), two lifting adjusting seats (3), a slicing machine body (4), a lifting mechanism, a slicing seat (8) and two clamping control mechanisms, wherein the two erection plates (2) are fixedly arranged at the top of the processing table (1), one sides of the two erection plates (2) close to each other are respectively provided with an adjusting groove, the lifting adjusting seats (3) are slidably arranged in the corresponding adjusting grooves, the slicing machine body (4) is fixedly arranged between the two lifting adjusting seats (3), the lifting mechanism is arranged on the erection plates (2), the lifting mechanism is connected with the lifting adjusting seats (3), the slicing seat (8) is fixedly arranged at the top of the processing table (1), and the two clamping control mechanisms are arranged on the slicing seat (8), elevating system includes two threaded rods (15), two driven sprocket (16), step motor (17) and drive sprocket (18), all sets up threaded hole two on two lift adjustment seats (3), and threaded rod (15) are installed to two internal equal screw threads of threaded hole, and the equal fixed mounting in top of two threaded rods (15) has driven sprocket (16), one side fixed mounting who erects board (2) has step motor (17), fixedly connected with drive sprocket (18) on the output shaft of step motor (17), drive sprocket (18) and two driven sprocket (16) transmission are connected with same chain.
2. The slicing machine for the crystal bar for processing the semiconductor as claimed in claim 1, wherein the clamping control mechanism comprises a clamping seat (9), a second rotating wheel (10), a moving block (11), a second rack (12), a screw rod (13), a second pulley (14), a first rotating wheel (6) and a first pulley (7), a round hole is formed in the inner wall of the adjusting groove, a round rod is rotatably mounted in the round hole, a first rotating wheel (6) and a first pulley (7) are respectively fixedly mounted at two ends of the round rod, a first rack (5) is fixedly mounted at one side of the lifting adjusting seat (3), and the first rack (5) is meshed with the first rotating wheel (6).
3. The slicing machine for the crystal bar used for processing the semiconductor as claimed in claim 2, wherein a fixing groove is formed in one side of the slicing seat (8), the clamping seat (9) is rotatably installed in the fixing groove, a rotating wheel II (10) is fixedly installed on one side of the clamping seat (9), a control groove is formed in the inner wall of the fixing groove, a moving block (11) is slidably installed in the control groove, a rack II (12) is fixedly installed on the moving block (11), the rack II (12) is meshed with the rotating wheel II (10), a threaded hole I is formed in one side of the moving block (11), a screw rod (13) is installed in a threaded hole I, a pulley II (14) is fixedly installed at one end of the screw rod (13), and the pulley II (14) and the pulley I (7) are in transmission connection with the same belt.
4. The slicing machine for the crystal bar used for processing the semiconductor according to claim 1, wherein an auxiliary groove is formed on the inner wall of the adjusting groove, a sliding block is fixedly installed on one side of the lifting adjusting seat (3), and the sliding block is slidably installed in the auxiliary groove.
5. The slicing machine for the crystal bar for processing the semiconductor as claimed in claim 3, wherein a rotating block is fixedly installed on one side of the clamping seat (9), a rotating groove is formed on the inner wall of the fixed groove, and the rotating block is rotatably installed in the rotating groove.
6. The crystal bar slicing machine for processing the semiconductor as claimed in claim 3, wherein a fixing hole is formed on the inner wall of the control groove, and the screw rod (13) is rotatably installed in the fixing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122071222.0U CN216068126U (en) | 2021-08-31 | 2021-08-31 | Crystal bar slicing machine for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122071222.0U CN216068126U (en) | 2021-08-31 | 2021-08-31 | Crystal bar slicing machine for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216068126U true CN216068126U (en) | 2022-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122071222.0U Active CN216068126U (en) | 2021-08-31 | 2021-08-31 | Crystal bar slicing machine for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216068126U (en) |
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2021
- 2021-08-31 CN CN202122071222.0U patent/CN216068126U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221201 Address after: 516000 No. 01, Floor 3, Building 25 #, No. 2, Wisdom Avenue, Lilin Town, Huizhou Zhongkai Hi tech Zone, Huizhou, Guangdong Patentee after: Huizhou Pegson Technology Co.,Ltd. Address before: 363000 No. 3003, building 1, Changfu community, south of Yingbin Road and east of No. 5 road, Longwen District, Zhangzhou City, Fujian Province Patentee before: Lin Yanqing |
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| TR01 | Transfer of patent right |