CN215240083U - Polishing equipment for semiconductor wafer production - Google Patents
Polishing equipment for semiconductor wafer production Download PDFInfo
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- CN215240083U CN215240083U CN202121120522.7U CN202121120522U CN215240083U CN 215240083 U CN215240083 U CN 215240083U CN 202121120522 U CN202121120522 U CN 202121120522U CN 215240083 U CN215240083 U CN 215240083U
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- semiconductor wafer
- mounting frame
- wafer production
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Abstract
The utility model discloses a polishing device for semiconductor wafer production, which comprises a base, wherein one end of the base is fixedly connected with a supporting plate, the supporting plate is provided with a mounting groove, a bearing is fixedly connected in the mounting groove, a supporting column is fixedly inserted in the bearing, one side of the top of the supporting column is fixedly connected with a mounting frame, the mounting frame is rotationally connected with a screw rod, the screw thread on the screw rod is sleeved with two movable plates, the screw threads in the screw threads of the two movable plates are oppositely arranged, one end of the two movable plates all penetrates through the mounting frame and is fixedly connected with a fixed plate, the mounting frame is provided with a sliding opening corresponding to the movable plates, one side of the fixed plate is provided with a groove, the utility model can fix a semiconductor wafer during polishing through a clamping mechanism, increase polishing stability, and can simultaneously polish the semiconductor wafer synchronously up and down to avoid the trouble of polishing and turning the wafer on one side, the efficiency is high.
Description
Technical Field
The utility model relates to a semiconductor wafer production relevant goods field specifically is a polishing equipment for semiconductor wafer production.
Background
The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, the semiconductor is a material with controllable conductivity ranging from the insulator to the conductor, the wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and doped into a silicon crystal seed crystal, the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely a wafer, and a grinding type process mode is usually adopted in a wafer thinning and polishing process in the field of semiconductor chip manufacturing.
However, the existing polishing equipment for semiconductor wafer production has a simple structure, can only polish a single surface of a wafer, and has low efficiency and certain defectiveness.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a polishing equipment for semiconductor wafer production to it is comparatively simple to provide the polishing equipment structure that is used for semiconductor wafer production that has now in solving above-mentioned background art, only can polish the wafer single face usually, the lower problem of efficiency.
In order to achieve the above object, the utility model provides a following technical scheme: a polishing device for semiconductor wafer production comprises a base, wherein one end of the base is fixedly connected with a supporting plate, the supporting plate is provided with a mounting groove, a bearing is fixedly connected in the mounting groove, a supporting column is fixedly inserted in the bearing, one side of the top of the supporting column is fixedly connected with a mounting frame, a lead screw is rotatably connected in the mounting frame, two movable plates are sleeved on the lead screw in a threaded manner, threads in the threads of the two movable plates are oppositely arranged, one end of each of the two movable plates penetrates through the mounting frame and is fixedly connected with a fixed plate, a sliding opening corresponding to the movable plate is arranged on the mounting frame, one side of the fixed plate is provided with a groove, a sliding rod is fixedly connected in the groove, a storage plate is sleeved on the sliding rod in a sliding manner, one side of the storage plate is fixedly connected with a motor, the output end of the motor penetrates through the movable plate and is fixedly connected with a polishing disc, the cover is equipped with the spring on the slide bar, the both ends of spring respectively with movable plate and recess inner wall fixed connection, the one end top of base is rotated and is connected with the ejector pin, the top fixedly connected with mounting plate of ejector pin, the mounting plate is equipped with and is equipped with places the chamber, the equal threaded insertion in both ends of mounting plate is equipped with the threaded rod, the threaded rod is located the one end of placing the intracavity and rotates and be connected with the grip block, the threaded rod is kept away from the one end fixedly connected with commentaries on classics piece of grip block.
Preferably, one side fixedly connected with locating piece of ejector pin, sliding on the locating piece and inserting and be equipped with the gag lever post, the top of base is equipped with a plurality of spacing grooves that correspond with the gag lever post.
Preferably, one end of the screw rod penetrates through the mounting frame and is fixedly connected with a handle.
Preferably, the bottom of the base is fixedly connected with a plurality of supporting legs.
Preferably, the fastening plate is positioned between the two moving plates.
Preferably, the two motors are arranged oppositely.
Compared with the prior art, the beneficial effects of the utility model are that:
the polishing equipment for producing the semiconductor wafer comprises a placing cavity for placing the semiconductor wafer to be polished in a fastening plate, a rotating block is rotated to drive a threaded rod to rotate so as to push a clamping block to clamp and fix the semiconductor wafer, an ejector rod is rotated to rotate the fastening plate between two polishing sheets, a screw rod is rotated in an installation frame, two movable plates mounted on the screw rod move relatively under the arrangement of opposite screw ports so as to drive a fixed plate to move, the fixed plate drives a motor mounted on a placing plate to move so as to enable the polishing sheets on a motor output shaft to polish the semiconductor wafer, the utility model can fix the semiconductor wafer during polishing through a clamping mechanism, thereby increasing the polishing stability, and the semiconductor wafer can be synchronously polished up and down at the same time, so that the trouble of polishing and turning the wafer on a single surface is avoided, and the efficiency is high.
Drawings
Fig. 1 is a schematic structural diagram of a polishing apparatus for semiconductor wafer production according to the present invention;
fig. 2 is an enlarged view of a polishing apparatus for semiconductor wafer production according to the present invention at a.
In the figure: 1. a base; 2. a support plate; 3. a bearing; 4. a support pillar; 5. installing a frame; 6. a screw rod; 7. moving the plate; 8. a fixing plate; 9. a slide bar; 10. a storage plate; 11. a motor; 12. grinding the sheets; 13. a spring; 14. a top rod; 15. a fastening plate; 16. a threaded rod; 17. a clamping block; 18. rotating the block; 19. positioning blocks; 20. a limiting rod; 21. a handle; 22. support the feet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-2, the present invention provides an embodiment: a polishing device for semiconductor wafer production comprises a base 1, wherein one end of the base 1 is fixedly connected with a supporting plate 2, the supporting plate 2 is provided with a mounting groove, a bearing 3 is fixedly connected in the mounting groove, a supporting column 4 is fixedly inserted in the bearing 3, one side of the top of the supporting column 4 is fixedly connected with a mounting frame 5, the mounting frame 5 is rotatably connected with a lead screw 6, two movable plates 7 are sleeved on the lead screw 6 in a threaded manner, the threads in the threads of the two movable plates 7 are oppositely arranged, one ends of the two movable plates 7 penetrate through the mounting frame 5 and are fixedly connected with a fixed plate 8, a sliding opening corresponding to the movable plate 7 is arranged on the mounting frame 5, one side of the fixed plate 8 is provided with a groove, a sliding rod 9 is fixedly connected in the groove, a material placing plate 10 is sleeved on the sliding rod 9 in a sliding manner, one side of the material placing plate 10 is fixedly connected with a motor 11, the output end of the motor 11 penetrates through the movable plate 7 and is fixedly connected with a polishing disc 12, the cover is equipped with spring 13 on slide bar 9, spring 13's both ends respectively with movable plate 7 and recess inner wall fixed connection, the one end top of base 1 is rotated and is connected with ejector pin 14, the top fixedly connected with mounting plate 15 of ejector pin 14, mounting plate 15 is equipped with and is equipped with places the chamber, threaded rod 16 is inserted to the equal screw thread in both ends of mounting plate 15, threaded rod 16 is located the one end of placing the intracavity and rotates and be connected with grip block 17, the one end fixedly connected with commentaries on classics piece 18 of grip block 17 is kept away from to threaded rod 16. Specifically, the rotating block 18 is rotated to drive the threaded rod 16 to rotate so as to push the clamping block 17 to clamp and fix the semiconductor wafer, the rotating ejector rod 14 rotates the fastening plate 15 to a position between the two polishing sheets 12, then the rotating screw rod 6 rotates in the mounting frame 5, at the moment, the two moving plates 7 mounted on the screw rod 6 move relatively under the arrangement of opposite screw ports to drive the fixing plate 8 to move, and the fixing plate 8 drives the motor 11 mounted on the moving plate 10 to move so that the polishing sheets 12 on the output shaft of the motor 11 abut against the semiconductor wafer to be polished.
Furthermore, a positioning block 19 is fixedly connected to one side of the ejector rod 14, a limiting rod 20 is slidably inserted into the positioning block 19, a plurality of limiting grooves corresponding to the limiting rod 20 are formed in the top of the base 1, and the limiting rod 20 is inserted into the limiting grooves after the ejector rod 14 rotates to a specified position to fix the ejector rod 14.
Further, one end of the screw rod 6 penetrates through the mounting frame 5 and is fixedly connected with a handle 21, so that the screw rod 6 can be conveniently rotated.
Further, a plurality of supporting legs 22 are fixedly connected to the bottom of the base 1 to support the base 1.
Further, a fastening plate 15 is provided between the two moving plates 7.
Further, the two motors 11 are oppositely arranged.
The working principle is as follows: at first place the intracavity of placing on mounting plate 15 with the semiconductor wafer of treating polishing, thereby rotate the piece 18 afterwards and drive threaded rod 16 and rotate and promote the grip block 17 to carry out the centre gripping fixedly to semiconductor wafer, rotate ejector pin 14 and revolve mounting plate 15 to between two polishing pieces 12, rotate lead screw 6 at the 5 internal rotations of installing frame afterwards, thereby two movable plates 7 of installing on lead screw 6 drive fixed plate 8 and remove under the setting of opposite screw thread this moment relative movement, thereby fixed plate 8 will drive the installation and put the motor 11 removal on the thing board 10 and make the polishing piece 12 on the motor 11 output shaft offset semiconductor wafer polish.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A polishing apparatus for semiconductor wafer production, comprising a base (1), characterized in that: the movable type bearing support is characterized in that one end of the base (1) is fixedly connected with a supporting plate (2), the supporting plate (2) is provided with a mounting groove, a bearing (3) is fixedly connected in the mounting groove, a supporting column (4) is fixedly inserted in the bearing (3), one side of the top of the supporting column (4) is fixedly connected with a mounting frame (5), a lead screw (6) is rotatably connected in the mounting frame (5), two movable plates (7) are sleeved on the lead screw (6) in a threaded manner, the threads in the threads of the two movable plates (7) are oppositely arranged, one ends of the two movable plates (7) penetrate through the mounting frame (5) and are fixedly connected with a fixed plate (8), a sliding opening corresponding to the movable plate (7) is arranged on the mounting frame (5), a groove is formed in one side of the fixed plate (8), a sliding rod (9) is fixedly connected in the groove, and a storage plate (10) is sleeved on the sliding rod (9), put one side fixedly connected with motor (11) of thing board (10), the output of motor (11) runs through movable plate (7) and fixedly connected with polishing piece (12), the cover is equipped with spring (13) on slide bar (9), the both ends of spring (13) respectively with movable plate (7) and recess inner wall fixed connection, the one end top of base (1) is rotated and is connected with ejector pin (14), top fixedly connected with mounting plate (15) of ejector pin (14), mounting plate (15) are equipped with and are equipped with places the chamber, the equal screw thread in both ends of mounting plate (15) is inserted and is equipped with threaded rod (16), threaded rod (16) are located the one end of placing the intracavity and rotate and are connected with grip block (17), the one end fixedly connected with that grip block (17) were kept away from in threaded rod (16) changes piece (18).
2. A polishing apparatus for semiconductor wafer production as set forth in claim 1, wherein: one side fixedly connected with locating piece (19) of ejector pin (14), sliding insert is equipped with gag lever post (20) on locating piece (19), the top of base (1) is equipped with a plurality of spacing grooves that correspond with gag lever post (20).
3. A polishing apparatus for semiconductor wafer production as set forth in claim 1, wherein: one end of the screw rod (6) penetrates through the mounting frame (5) and is fixedly connected with a handle (21).
4. A polishing apparatus for semiconductor wafer production as set forth in claim 1, wherein: the bottom of the base (1) is fixedly connected with a plurality of supporting legs (22).
5. A polishing apparatus for semiconductor wafer production as set forth in claim 1, wherein: the fastening plate (15) is arranged between the two moving plates (7).
6. A polishing apparatus for semiconductor wafer production as set forth in claim 1, wherein: the two motors (11) are oppositely arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121120522.7U CN215240083U (en) | 2021-05-24 | 2021-05-24 | Polishing equipment for semiconductor wafer production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121120522.7U CN215240083U (en) | 2021-05-24 | 2021-05-24 | Polishing equipment for semiconductor wafer production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215240083U true CN215240083U (en) | 2021-12-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121120522.7U Active CN215240083U (en) | 2021-05-24 | 2021-05-24 | Polishing equipment for semiconductor wafer production |
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| Country | Link |
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| CN (1) | CN215240083U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115351664A (en) * | 2022-09-02 | 2022-11-18 | 江西安芯美科技有限公司 | Die bonding device for semiconductor wafer |
| CN116276405A (en) * | 2023-05-18 | 2023-06-23 | 扬州韩思半导体科技有限公司 | Polishing device for wafer processing |
-
2021
- 2021-05-24 CN CN202121120522.7U patent/CN215240083U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115351664A (en) * | 2022-09-02 | 2022-11-18 | 江西安芯美科技有限公司 | Die bonding device for semiconductor wafer |
| CN116276405A (en) * | 2023-05-18 | 2023-06-23 | 扬州韩思半导体科技有限公司 | Polishing device for wafer processing |
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