CN216790702U - 5G semiconductor wafer drying device - Google Patents
5G semiconductor wafer drying device Download PDFInfo
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- CN216790702U CN216790702U CN202220387730.1U CN202220387730U CN216790702U CN 216790702 U CN216790702 U CN 216790702U CN 202220387730 U CN202220387730 U CN 202220387730U CN 216790702 U CN216790702 U CN 216790702U
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Abstract
The utility model discloses a 5G semiconductor wafer drying device, which comprises: the bottom plate, stoving frame structure is installed to the last wall of bottom plate, and stoving structure is installed respectively to the last wall of the lower wall of stoving frame structure and bottom plate, and delivery power structure is installed to the last wall of bottom plate, and delivery polished rod structure is installed to the last wall of bottom plate, and delivery power structure and delivery polished rod structure's externally mounted has a delivery structure, and three clamping structures of group are installed to the last wall of delivery structure. The utility model realizes the integrated design of wafer drying and feeding and discharging, greatly improves the efficiency of the wafer drying process, has the potential of automatic modification, can completely separate the wafer drying from manual participation, and improves the efficiency and the accuracy of the wafer drying.
Description
Technical Field
The utility model relates to the technical field of wafer processing, in particular to a 5G semiconductor wafer drying device.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Wafer drying is also a better wafer processing part, but the existing wafer drying is inconvenient because the feeding and the blanking are carried out manually and then the drying is carried out through an oven.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the utility model.
The utility model has been made in view of the above and/or problems with the existing infusion stand.
To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions:
A5G semiconductor wafer drying device comprises: the bottom plate, stoving frame structure is installed to the last wall of bottom plate, stoving structure is installed respectively to the last wall of the lower wall of stoving frame structure and bottom plate, delivery power structure is installed to the last wall of bottom plate, delivery polished rod structure is installed to the last wall of bottom plate, the externally mounted of delivery power structure and delivery polished rod structure has the delivery structure, three clamping structures of group are installed to the last wall of delivery structure.
As a preferable aspect of the 5G semiconductor wafer drying apparatus of the present invention, the drying frame structure includes: two drying vertical plates and a drying top plate; the two drying vertical plates are respectively arranged on the front wall surface and the rear wall surface of the bottom plate, and the drying top plate is arranged on the upper wall surfaces of the two drying vertical plates.
As a preferable aspect of the 5G semiconductor wafer drying apparatus of the present invention, the two sets of drying structures include: a drying disc and a drying power line; the drying disc is installed on the upper wall surface of the bottom plate, and one end of the drying power line is installed on the side wall surface of the drying disc.
As a preferable aspect of the 5G semiconductor wafer drying apparatus of the present invention, the carrying power structure includes: the conveying device comprises a conveying screw rod, two conveying screw rod supporting plates and a conveying power motor; the two carrying screw rod supporting plates are respectively arranged on the upper wall surface of the bottom plate, the carrying screw rod is arranged between the two carrying screw rod supporting plates, the carrying power motor is arranged on the upper wall surface of the bottom plate, and the driving end of the carrying power motor is arranged on the left wall surface of the carrying screw rod.
As a preferable aspect of the 5G semiconductor wafer drying apparatus of the present invention, the carrier optical rod structure includes: the device comprises a carrying polish rod and two carrying polish rod supporting plates; the two carrying polished rod supporting plates are respectively installed on the upper wall surface of the bottom plate, and the carrying polished rods are installed inside the two carrying polished rod supporting plates.
As a preferable aspect of the 5G semiconductor wafer drying apparatus of the present invention, the carrying structure includes: two carrying screw plates, two carrying polished rod plates and a carrying plate; the two carrying screw plates are respectively sleeved outside the carrying screws, the two carrying polished rod plates are respectively sleeved outside the carrying polished rods, and the carrying plates are arranged on the two carrying screw plates and the upper wall surfaces of the two carrying polished rod plates.
As a preferable aspect of the 5G semiconductor wafer drying device of the present invention, the clamping structure includes: the clamping device comprises a clamping base, a clamping screw, a clamping power motor and a clamping splint; the clamping base is installed on the upper wall surface of the carrying plate, the clamping screw rod is installed inside the clamping base, the clamping power motor is installed on the upper wall surface of the carrying plate, and the driving end of the clamping power motor is installed on the left wall surface of the clamping screw rod.
Compared with the prior art, the utility model has the beneficial effects that: the carrying structure is used for carrying the wafer that the clamping is good, and the combined action of carrying polished rod structure and carrying power structure can let the carrying structure carry out linear motion to realized the automatic unloading of going up of wafer, stoving frame structure and two sets of stoving structures, the formation is with the region of a high temperature, can be used for carrying out stoving work to the wafer. The utility model realizes the integrated design of wafer drying and feeding and discharging, greatly improves the efficiency of the wafer drying process, has the potential of automatic modification, can completely separate the wafer drying from manual participation, and improves the efficiency and the accuracy of the wafer drying.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise. Wherein:
FIG. 1 is a schematic view of an overall structure of a 5G semiconductor wafer drying apparatus according to the present invention;
FIG. 2 is a schematic view of a carrying structure of a 5G semiconductor wafer drying apparatus according to the present invention;
fig. 3 is a schematic view of a clamping structure of a 5G semiconductor wafer drying apparatus according to the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Next, the present invention will be described in detail with reference to the drawings, wherein for convenience of illustration, the cross-sectional view of the device structure is not enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The present invention provides a 5G semiconductor wafer drying apparatus, please refer to fig. 1-3, comprising: bottom plate 1, the last wall of bottom plate 1 installs stoving frame structure, and stoving structure is installed respectively to the lower wall of stoving frame structure and the last wall of bottom plate 1, and delivery power structure is installed to the last wall of bottom plate 1, and delivery polished rod structure is installed to the last wall of bottom plate 1, and the externally mounted of delivery power structure and delivery polished rod structure has delivery structure, and three clamping structures of group are installed to the last wall of delivery structure.
Referring to fig. 1 and 2, the drying frame structure includes: two drying vertical plates 2 and a drying top plate 3; two stoving risers 2 are installed respectively in two preceding, back walls of bottom plate 1, and stoving roof 3 is installed in the last wall of two stoving risers 2. Two sets of stoving structures include: a drying disk 4 and a drying power line 5; drying disc 4 is installed at the upper wall face of bottom plate 1, and the lateral wall face at drying disc 4 is installed to the one end of stoving power cord 5, and is specific, stoving frame structure and two sets of stoving structures form with a high temperature region, can be used for drying work to the wafer.
Referring to fig. 2, the power carrying structure includes: the device comprises a carrying screw 6, two carrying screw supporting plates 7 and a carrying power motor 8; two carrying screw supporting plates 7 are respectively installed on the upper wall surface of the bottom plate 1, the carrying screw 6 is installed between the two carrying screw supporting plates 7, the carrying power motor 8 is installed on the upper wall surface of the bottom plate 1, and the driving end of the carrying power motor 8 is installed on the left wall surface of the carrying screw 6. The carrying polished rod structure includes: a carrier polish rod 9 and two carrier polish rod support plates 10; two carrying polish rod supporting plates 10 are respectively installed on the upper wall surface of the bottom plate 1, and a carrying polish rod 9 is installed inside the two carrying polish rod supporting plates 10. The carrying structure comprises: two carrying screw plates 11, two carrying polished rod plates 12 and a carrying plate 13; two carrying screw plates 11 are respectively sleeved outside the carrying screw 6, two carrying screw plates 11 are respectively sleeved outside the carrying polish rod 9, the carrying plate 13 is arranged on the upper wall surfaces of the two carrying screw plates 11 and the two carrying screw plates 12, concretely, the carrying structure is used for carrying the clamped wafer, and the carrying polish rod structure and the carrying power structure can enable the carrying structure to move linearly under the combined action, so that the automatic loading and unloading of the wafer are realized.
Referring to fig. 3, the clamping structure includes: the clamping device comprises a clamping base 14, a clamping screw 15, a clamping power motor 16 and a clamping splint 17; the clamping base 14 is installed on the upper wall surface of the carrying plate 13, the clamping screw 15 is installed inside the clamping base 14, the clamping power motor 16 is installed on the upper wall surface of the carrying plate 13, and the driving end of the clamping power motor 16 is installed on the left wall surface of the clamping screw 15.
When the drying rack is used, firstly, the initial position of the drying rack is determined, firstly, the carrying power motor 8 performs initial motion, specifically, the carrying power motor 8 controls a controller matched with the carrying power motor 8 to enable the carrying power motor 8 to perform reversal, then the carrying screw 6 performs reversal, at the moment, the two carrying screw plates 11 are driven by threads to perform linear motion back to the drying rack structure, and the two carrying light rod plates 12 also perform linear motion back to the drying rack structure on the carrying polished rod 9, under the combined action of the two carrying light rod plates 12 and the two carrying screw plates 11, the carrying plate 13 is made to perform linear motion back to the drying frame structure, the initial motion of the carrying structure is completed at this time, then the initial motion of the clamping is performed, namely, the clamping power motor 16 is made to rotate reversely through a controller matched with the clamping power motor 16, then the clamping splint 17 is driven to perform loose motion, the initial motion of the utility model is completed at this time, then the utility model can be normally used for working, when in use, an operator firstly places a wafer on the upper wall surface of the three clamping splint 17, then the three clamping power motors 16 rotate forwards, then the clamping screw 15 is driven to rotate forwards, at this time, the three clamping splint 17 move forwards, until the wafer is completely clamped, at this time, the installation of the wafer is completed, then the operator starts the two drying disks 4, and the space enclosed by the two drying vertical plates 2 and the drying top plate 3 becomes a high-temperature space, at this moment, the operator controls the controller matched with the carrying power motor 8 to rotate the carrying power motor 8 forwards, the carrying screw 6 rotates forwards at this moment, then the two carrying screw plates 11 are driven to move linearly, the carrying plate 13 and the wafers in the three-group clamping structure are driven to move linearly towards the drying structure, when the wafers are located between the two drying disks 4, the carrying power motor 8 stops moving, and at this moment, the two drying disks 4 dry the wafers.
While the utility model has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the various features of the disclosed embodiments of the utility model may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the utility model not be limited to the particular embodiments disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (7)
1. A5G semiconductor wafer drying device comprises: bottom plate (1), its characterized in that, stoving frame structure is installed to the last wall of bottom plate (1), stoving structure is installed respectively to the lower wall of stoving frame structure and the last wall of bottom plate (1), delivery power structure is installed to the last wall of bottom plate (1), delivery polished rod structure is installed to the last wall of bottom plate (1), the externally mounted of delivery power structure and delivery polished rod structure has the delivery structure, three clamping structures of group are installed to the last wall of delivery structure.
2. The 5G semiconductor wafer drying device as claimed in claim 1, wherein the drying frame structure comprises: two drying vertical plates (2) and a drying top plate (3);
the two drying vertical plates (2) are respectively arranged on the front wall surface and the rear wall surface of the bottom plate (1), and the drying top plate (3) is arranged on the upper wall surfaces of the two drying vertical plates (2).
3. The 5G semiconductor wafer drying apparatus of claim 1, wherein the two sets of drying structures comprise: a drying disc (4) and a drying power line (5);
the drying disc (4) is arranged on the upper wall surface of the bottom plate (1), and one end of the drying power line (5) is arranged on the side wall surface of the drying disc (4).
4. The 5G semiconductor wafer drying apparatus of claim 1, wherein the carrier power structure comprises: a carrying screw (6), two carrying screw supporting plates (7) and a carrying power motor (8);
the two carrying screw supporting plates (7) are respectively installed on the upper wall surface of the bottom plate (1), the carrying screws (6) are installed between the two carrying screw supporting plates (7), the carrying power motor (8) is installed on the upper wall surface of the bottom plate (1), and the driving end of the carrying power motor (8) is installed on the left wall surface of the carrying screws (6).
5. The 5G semiconductor wafer drying apparatus of claim 1, wherein the carrier rod structure comprises: a carrier polish rod (9) and two carrier polish rod support plates (10);
the two carrying polish rod supporting plates (10) are respectively arranged on the upper wall surface of the bottom plate (1), and the carrying polish rods (9) are arranged inside the two carrying polish rod supporting plates (10).
6. The 5G semiconductor wafer drying apparatus of claim 1, wherein the carrying structure comprises: two carrying screw plates (11), two carrying polished rod plates (12) and a carrying plate (13);
the two carrying screw plates (11) are respectively sleeved outside the carrying screws (6), the two carrying polished rod plates (12) are respectively sleeved outside the carrying polished rods (9), and the carrying plates (13) are arranged on the upper wall surfaces of the two carrying screw plates (11) and the two carrying polished rod plates (12).
7. The 5G semiconductor wafer drying device as claimed in claim 1, wherein the clamping structure comprises: the clamping device comprises a clamping base (14), a clamping screw (15), a clamping power motor (16) and a clamping splint (17);
the clamping device is characterized in that the clamping base (14) is arranged on the upper wall surface of the carrying plate (13), the clamping screw (15) is arranged inside the clamping base (14), the clamping power motor (16) is arranged on the upper wall surface of the carrying plate (13), and the driving end of the clamping power motor (16) is arranged on the left wall surface of the clamping screw (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220387730.1U CN216790702U (en) | 2022-02-24 | 2022-02-24 | 5G semiconductor wafer drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220387730.1U CN216790702U (en) | 2022-02-24 | 2022-02-24 | 5G semiconductor wafer drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216790702U true CN216790702U (en) | 2022-06-21 |
Family
ID=82017399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220387730.1U Active CN216790702U (en) | 2022-02-24 | 2022-02-24 | 5G semiconductor wafer drying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216790702U (en) |
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2022
- 2022-02-24 CN CN202220387730.1U patent/CN216790702U/en active Active
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Effective date of registration: 20230628 Address after: 430000 room 4, floor 1-4, unit 0, building 3, Qingsong village and Honggang Village plastic products production line project, Yangluo Economic Development Zone, Xinzhou District, Wuhan City, Hubei Province Patentee after: Wuhan ZhongXunDa Electronic Co.,Ltd. Address before: 332000 Chai Hu Industrial Park, Chai sang District, Jiujiang, Jiangxi Patentee before: Jiujiang Huagu Electronic Technology Co.,Ltd. |