CN115351664A - Die bonding device for semiconductor wafer - Google Patents
Die bonding device for semiconductor wafer Download PDFInfo
- Publication number
- CN115351664A CN115351664A CN202211072554.3A CN202211072554A CN115351664A CN 115351664 A CN115351664 A CN 115351664A CN 202211072554 A CN202211072554 A CN 202211072554A CN 115351664 A CN115351664 A CN 115351664A
- Authority
- CN
- China
- Prior art keywords
- wafer
- die bonding
- grinding device
- sliding plate
- slide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 239000003082 abrasive agent Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000005498 polishing Methods 0.000 abstract description 38
- 230000000694 effects Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 33
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention discloses a die bonding device for a semiconductor wafer, which comprises: a support frame; the two end face polishing devices are used for polishing the end faces of the wafer, and one end face polishing device is detachably arranged on the supporting frame and can rotate on the supporting frame; the side surface polishing device is used for fixing the wafer and polishing the side surface of the wafer, and the side surface polishing device is detachably arranged on one end surface polishing device and can rotate on the end surface polishing device; the connecting frame is provided with a plurality of bolts, and the bolts are detachably connected with the end face polishing device and the side face polishing device; the electric driving device is used for driving the connecting frame to rotate; the pneumatic driving device is arranged on the supporting frame and used for driving the electric driving device to move up and down; three relays, three protection resistors, three time relays and a controller. According to the polishing device, the wafer can be polished in a segmented mode while being fixed, and the polishing device is good in effect.
Description
Technical Field
The invention relates to the technical field of wafer production, in particular to a semiconductor wafer die bonding device.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. The wafer mainly has the functions of processing various circuit elements, grinding and polishing the circuit elements in the wafer production process, and fixing the circuit elements by using a device.
Disclosure of Invention
The present invention is directed to solve the above problems and to provide a die bonding apparatus for semiconductor wafers.
The technical scheme of the invention is as follows: a die bonding apparatus for semiconductor wafers comprises:
a support frame;
the end face polishing device comprises two end face polishing devices, a polishing device and a polishing device, wherein the two end face polishing devices are used for polishing the end faces of the wafer, and one end face polishing device is detachably arranged on the supporting frame and can rotate on the supporting frame;
the side surface grinding device is used for fixing the wafer and grinding the side surface of the wafer, and the side surface grinding device is detachably arranged on one end surface grinding device and can rotate on the end surface grinding device;
the connecting frame is provided with a plurality of bolts, and the bolts are detachably connected with the end face polishing device and the side face polishing device;
the electric driving device is used for driving the connecting frame to rotate;
the pneumatic driving device is arranged on the supporting frame and used for driving the electric driving device to move up and down;
the three-phase relay comprises three relays, three protective resistors, three time relays and a controller, wherein the switch end of each relay is electrically connected with the coil end of each time relay, an electric driving device, the protective resistors and a power supply to form a driving loop.
Preferably, the end surface grinding device comprises a base, a first grinding material, a first sliding plate and a plurality of first elastic pieces, wherein the first grinding material is detachably arranged on the first sliding plate, the first elastic pieces are arranged between the base and the first sliding plate, the first sliding plate can slide on the base, and an annular groove and a plurality of first jacks are arranged on the base.
Preferably, a plurality of first screws are arranged on the first sliding plate.
Preferably, side grinding device includes annular seat, two second abrasives, two second slides and a plurality of elastic component, be provided with annular picture peg and a plurality of second jack on the annular seat, second abrasive detachably sets up on the second slide, the second elastic component sets up between annular seat and the second slide, the second slide can slide on the annular seat.
Preferably, a plurality of second screws are arranged on the second sliding plate.
Preferably, one end of the second abrasive is arc-shaped.
Preferably, a plurality of balls are arranged on the annular inserting plate.
The invention has the beneficial effects that: according to the polishing device, the wafer can be polished in a segmented mode while being fixed, and the polishing device is good in effect.
Drawings
FIG. 1 is a front elevational view of the overall construction of the preferred embodiment of the present invention;
FIG. 2 is a cross-sectional view of an end face grinding apparatus in a preferred embodiment of the present invention;
figure 3 is a cross-sectional view of a side grinding device in a preferred embodiment of the invention.
Reference numerals: the grinding device comprises a supporting frame 10, a connecting frame 2, a bolt 201, an electric driving device 3, a pneumatic driving device 4, a relay 5, a time relay 6, a controller 7, a base 8, an annular groove 801, a first insertion hole 802, a first grinding material 9, a first sliding plate 11, a first screw 111, a first elastic part 12, an annular seat 13, an annular insertion plate 131, a second insertion hole 132, a second grinding material 14, a second sliding plate 15, a second screw 151 and a second elastic part 16.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, a die bonding apparatus for a semiconductor wafer includes:
a support frame 10;
the two end face polishing devices are used for polishing the end faces of the wafer, and one end face polishing device is detachably arranged on the supporting frame 10 and can rotate on the supporting frame 10;
the side surface polishing device is used for fixing the wafer and polishing the side surface of the wafer, and the side surface polishing device is detachably arranged on one end surface polishing device and can rotate on the end surface polishing device;
the connecting frame 2 is provided with a plurality of bolts 201, and the bolts 201 are detachably connected with the end face polishing device and the side face polishing device;
the electric driving device 3 is used for driving the connecting frame 2 to rotate;
the pneumatic driving device 4 is arranged on the supporting frame 10 and used for driving the electric driving device 3 to move up and down;
the three-phase relay comprises three relays 5, three protective resistors, three time relays 6 and a controller 7, wherein the switch end of the relay 5 is electrically connected with the coil end of the time relay 6, the electric driving device 3, the protective resistors and a power supply to form a driving loop. In the invention, when in use, one end face grinding device is detachably arranged on the supporting frame 10, the original position of the other end face grinding device is arranged on the connecting frame 2 through the bolt 201, the end face grinding device is abutted against the top end inside the connecting frame 2, a wafer is placed in the side face grinding device to fix the wafer, the pneumatic driving device 4 drives the electric driving device 3 to move downwards to enable one end face grinding device to be in close contact with the top end of the wafer, the KM1 switch end of the first relay 5 is electrically connected with the KT1 coil end of the first time relay 6, the electric driving device 3, the protective resistor R1 and a power supply to form a driving circuit, the KT1 switch end of the first time relay 6 is electrically connected with the MCU signal input end of the controller 7, the output end of the controller 7 is electrically connected with the KM1 coil end of the first relay 5 to form a switch control circuit, the switch end of the KM1 of the first relay 5 is closed, the KT1 of the power driving device 3 and the first time relay 6 is electrified, when the KT1 of the first time relay 6 reaches a preset time, the coil end of the KT1 of the first time relay 7 attracts a switch to cause the switch end to be closed, the MCU of the controller 7 acquires a closing signal so as to close a switch control loop, the MCU of the controller 7 is linked with the switch end of the KT1 of the first relay 7 to be powered off, the power driving device 3 stops working, the top end of a wafer is polished, a bolt 201 connecting the end surface polishing device above with the connecting frame 2 is detached, the end surface polishing device below is connected with the connecting frame 2 through the bolt 201, similarly, the switch end of the KM2 of the second relay 5 is closed, the power driving device 3 and the KT2 of the second time relay 6 are electrified, when the KT2 of the second time relay 6 reaches the preset time, the KT2 coil end of a second time relay 7 attracts the switch and leads to the switch end closure, thereby closed switch control circuit is gathered to the MCU of controller 7, the MCU of controller 7 links the KT2 switch end outage of a second relay 7, 3 stop work of electric drive device, polish the processing to the lower terminal surface of wafer, pull down bolt 201 that following grinding device and link frame 2 are connected, side grinding device passes through bolt 201 and is connected with link frame 2, KM3 switch end closure when third relay 5, KT3 circular telegram of electric drive device 3 and third time relay 6, KT2 when third time relay 6 reachs the predetermined time, KT2 coil end attraction switch of third time relay 7 leads to the switch end closure, thereby closed switch control circuit is gathered to the MCU of controller 7 to the closed signal, the KT2 switch end outage of the linkage MCU of controller 7 of third relay 7, electric drive device 3 stop work, polish the side of wafer, this device can be fixed the wafer in the time, can also polish the processing to the wafer in the segmentation, can also polish effectually. Specifically, the electric drive device 3 is a motor; the pneumatic driving device 4 is a cylinder; the bolt 201 is screwed to the coupling frame 2.
As a preferred embodiment of the present invention, it may also have the following additional technical features:
in this embodiment, the end surface polishing device includes a base 8, a first abrasive 9, a first sliding plate 11 and a plurality of first elastic members 12, the first abrasive 9 is detachably disposed on the first sliding plate 11, the first elastic members 12 are disposed between the base 8 and the first sliding plate 11, the first sliding plate 11 can slide on the base 8, an annular groove 801 and a plurality of first insertion holes 802 are disposed on the base 8, a sliding groove is disposed on the base 8, the first elastic members 12 are disposed in the sliding groove, the first sliding plate 11 can freely slide in the sliding groove, when the pneumatic driving device 4 drives the base 8 to move downward, an end surface of the first abrasive 9 is in close contact with a top end of a wafer, the first abrasive 9 extrudes the first elastic members 12, the electric driving device 3 works to drive the first abrasive 9 to rotate, and further polish the end surface of the wafer. Specifically, the first elastic member 12 is a spring; the base 8 is provided with a plurality of through holes, so that the first screws 111 can be conveniently screwed; the bolt 201 may be inserted into the first insertion hole 802.
In this embodiment, the first sliding plate 11 is provided with a plurality of first screws 111, so that the first abrasive 9 can be replaced conveniently.
In this embodiment, the side polishing device includes an annular seat 13, two second abrasives 14, two second sliding plates 15 and a plurality of second elastic members 16, an annular insert plate 131 and a plurality of second insertion holes 132 are disposed on the annular seat 13, the second abrasives 14 are detachably disposed on the second sliding plates 15, the second elastic members 16 are disposed between the annular seat 13 and the second sliding plates 15, the second sliding plates 15 can slide on the annular seat 13, the annular insert plate 131 is matched with the annular groove 801 to prevent the position of the annular seat 13 on the base 8 from changing when the annular seat 13 rotates, a sliding groove is disposed on the annular seat 13, the second sliding plates 15 can slide in the sliding groove to place the wafer between the two second abrasives 14, the second sliding plates 15 are forced to extrude the second elastic members 16 to fix the wafer, the electric driving device 3 works to drive the two second abrasives 14 to rotate, and polish the side portions of the wafer, specifically, the second elastic members 16 are springs; the annular seat 13 is provided with a plurality of through holes, so that the second screws 151 can be conveniently screwed off; the bolt 201 may be inserted in the second insertion hole 132.
In this embodiment, the second sliding plate 15 is provided with a plurality of second screws 151, which facilitates replacement of the second abrasive 14.
In this embodiment, one end of the second abrasive 14 is arc-shaped, which is convenient for fixing the wafer.
In this embodiment, the annular insert plate 131 is provided with a plurality of balls to reduce the friction force of the rotation of the annular seat 13.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A die bonding apparatus for a semiconductor wafer, comprising:
a support frame (10);
the two end face grinding devices are used for grinding the end faces of the wafer, and one end face grinding device is detachably arranged on the supporting frame (10) and can rotate on the supporting frame (10);
the side surface grinding device is used for fixing the wafer and grinding the side surface of the wafer, and the side surface grinding device is detachably arranged on one end surface grinding device and can rotate on the end surface grinding device;
the connecting frame (2) is provided with a plurality of bolts (201), and the bolts (201) are detachably connected with the end face grinding device and the side face grinding device;
the electric driving device (3) is used for driving the connecting frame (2) to rotate;
the pneumatic driving device (4) is arranged on the supporting frame (10) and used for driving the electric driving device (3) to move up and down;
the three-phase relay-type power supply comprises three relays (5), three protective resistors, three time relays (6) and a controller (7), wherein the switch end of each relay (5) is electrically connected with the coil end of each time relay (6), an electric driving device (3), the protective resistors and a power supply to form a driving loop.
2. The die bonding apparatus of claim 1, wherein: the end face grinding device comprises a base (8), a first grinding material (9), a first sliding plate (11) and a plurality of first elastic pieces (12), wherein the first grinding material (9) is detachably arranged on the first sliding plate (11), the first elastic pieces (12) are arranged between the base (8) and the first sliding plate (11), the first sliding plate (11) can slide on the base (8), and an annular groove (801) and a plurality of first jacks (802) are arranged on the base (8).
3. The die bonding apparatus of claim 2, wherein: the first sliding plate (11) is provided with a plurality of first screws (111).
4. The die bonding apparatus of claim 1, wherein: side grinding device includes annular seat (13), two second abrasive material (14), two second slide (15) and a plurality of second elastic component (16), be provided with annular picture peg (131) and a plurality of second jack (132) on annular seat (13), second abrasive material (14) detachably sets up on second slide (15), second elastic component (16) set up between annular seat (13) and second slide (15), second slide (15) can slide on annular seat (13).
5. The die bonding apparatus of claim 4, wherein: the second sliding plate (15) is provided with a plurality of second screws (151).
6. The die bonding apparatus of claim 4, wherein: one end of the second abrasive (14) is arc-shaped.
7. The die bonding apparatus of claim 4, wherein: the annular inserting plate (131) is provided with a plurality of balls.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211072554.3A CN115351664A (en) | 2022-09-02 | 2022-09-02 | Die bonding device for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211072554.3A CN115351664A (en) | 2022-09-02 | 2022-09-02 | Die bonding device for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115351664A true CN115351664A (en) | 2022-11-18 |
Family
ID=84006642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211072554.3A Pending CN115351664A (en) | 2022-09-02 | 2022-09-02 | Die bonding device for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115351664A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108922847A (en) * | 2018-09-12 | 2018-11-30 | 江苏英锐半导体有限公司 | A kind of face grinder assembly for wafer production processing |
| CN208663459U (en) * | 2018-07-20 | 2019-03-29 | 安徽博辰电力科技有限公司 | A kind of semiconductor packages wafer grinding device |
| CN111975507A (en) * | 2020-07-08 | 2020-11-24 | 大同新成新材料股份有限公司 | Grain processing device for semiconductor graphite wafer and operation method thereof |
| CN112589657A (en) * | 2021-01-12 | 2021-04-02 | 四川安珂华科技有限公司 | Semiconductor wafer polishing device |
| CN215240083U (en) * | 2021-05-24 | 2021-12-21 | 深圳市长方集团股份有限公司 | Polishing equipment for semiconductor wafer production |
| CN114012526A (en) * | 2021-09-23 | 2022-02-08 | 张永田 | Wafer semiconductor polishing device and using method thereof |
| CN114700857A (en) * | 2022-06-06 | 2022-07-05 | 徐州领测半导体科技有限公司 | Semiconductor wafer polishing device capable of completely removing ring-shaped oxide layer |
-
2022
- 2022-09-02 CN CN202211072554.3A patent/CN115351664A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208663459U (en) * | 2018-07-20 | 2019-03-29 | 安徽博辰电力科技有限公司 | A kind of semiconductor packages wafer grinding device |
| CN108922847A (en) * | 2018-09-12 | 2018-11-30 | 江苏英锐半导体有限公司 | A kind of face grinder assembly for wafer production processing |
| CN111975507A (en) * | 2020-07-08 | 2020-11-24 | 大同新成新材料股份有限公司 | Grain processing device for semiconductor graphite wafer and operation method thereof |
| CN112589657A (en) * | 2021-01-12 | 2021-04-02 | 四川安珂华科技有限公司 | Semiconductor wafer polishing device |
| CN215240083U (en) * | 2021-05-24 | 2021-12-21 | 深圳市长方集团股份有限公司 | Polishing equipment for semiconductor wafer production |
| CN114012526A (en) * | 2021-09-23 | 2022-02-08 | 张永田 | Wafer semiconductor polishing device and using method thereof |
| CN114700857A (en) * | 2022-06-06 | 2022-07-05 | 徐州领测半导体科技有限公司 | Semiconductor wafer polishing device capable of completely removing ring-shaped oxide layer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109176253B (en) | Corner grinding device is used in machining | |
| CN107803547B (en) | A kind of electronic component switch manufacture production copper sheet cutter device | |
| CN115351664A (en) | Die bonding device for semiconductor wafer | |
| CN215920121U (en) | Grinding pad adjusting device for grinding wafer | |
| CN214183354U (en) | Novel phosphor powder grinds device | |
| CN112476142A (en) | Auxiliary assembly for preventing mirror surface from being broken through self-adjusting clamping force for optical lens machining | |
| CN217942992U (en) | High-precision double-sided grinding machine | |
| CN215896362U (en) | Wafer rotating device | |
| CN216830074U (en) | Double-station quartz wafer chamfering grinding device | |
| CN216633704U (en) | Efficient plate grinder | |
| CN216504166U (en) | Convenient grinding device for processing of metal parts for automobile equipment who adjusts | |
| CN215788899U (en) | Polishing equipment for machining support | |
| CN211890165U (en) | Automobile bearing bush processing burr grinding device convenient to use | |
| CN113843741A (en) | Automatic assembling equipment for relay reed | |
| CN111230672B (en) | High-performance cathode roller off-line grinding machine | |
| CN207415011U (en) | One kind is used for plastic packing product corner angle sanding apparatus | |
| CN216681636U (en) | Polishing device for wafer transmission anti-static plastic gear production | |
| CN220699859U (en) | Battery film material wire cutting device | |
| CN220296803U (en) | Pipe fitting polishing machine | |
| CN221696291U (en) | Grinding disc device for wafer thinning | |
| CN218137119U (en) | Supporting seat grinding device for CNC equipment | |
| CN219562496U (en) | Indoor flame-retardant decorative board installation deburring device | |
| CN218427445U (en) | A apparatus for producing for goggles dull polish bag | |
| CN221145908U (en) | Fast-assembling formula LED display screen | |
| CN221364117U (en) | Paper cone deburring device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20221118 |