CN215920121U - Grinding pad adjusting device for grinding wafer - Google Patents
Grinding pad adjusting device for grinding wafer Download PDFInfo
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- CN215920121U CN215920121U CN202122261680.0U CN202122261680U CN215920121U CN 215920121 U CN215920121 U CN 215920121U CN 202122261680 U CN202122261680 U CN 202122261680U CN 215920121 U CN215920121 U CN 215920121U
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- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims abstract description 17
- 238000005498 polishing Methods 0.000 claims description 46
- 238000000034 method Methods 0.000 abstract description 8
- 239000008187 granular material Substances 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 39
- 239000002245 particle Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a grinding pad adjusting device for grinding a wafer, which belongs to the field of wafer processing and comprises a placing table and a connecting block, wherein the top of the placing table is fixedly connected with a lower grinding pad, the bottom of the placing table is fixedly connected with a rotating shaft, a wafer body is placed on the top of the lower grinding pad, the bottom of the connecting block is provided with a rotating mechanism, the bottom of the rotating mechanism is fixedly connected with an electric push rod, the bottom end of the electric push rod is fixedly connected with a transmission plate, the side surface of the transmission plate is fixedly connected with a connecting rod, and the side surface of the connecting rod is fixedly connected with a fixed column; through setting up fixed column, movable spring, fly leaf, movable rod, connecting plate and brush, can utilize the brush to carry out effectual cleaing away to remaining thick liquids and the remaining granule that produces because of grinding at the in-process that the wafer ground, avoided adsorbing the problem that causes the surface damage of wafer on the surface of wafer to the protectiveness to the wafer has been improved.
Description
Technical Field
The utility model belongs to the technical field of wafer processing, and particularly relates to a grinding pad adjusting device for grinding a wafer.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. The method comprises the steps of dissolving high-purity polycrystalline silicon, doping silicon crystal seeds, slowly pulling out the dissolved high-purity polycrystalline silicon to form cylindrical monocrystalline silicon, wherein the main processing modes of the wafers are wafer processing and batch processing, namely one or more wafers are processed simultaneously, and as the characteristic size of a semiconductor is smaller and smaller, processing and measuring equipment is more and more advanced, so that new data characteristics appear in wafer processing. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and reliability of the processed wafer is increased during wafer processing, and the particle number has new data characteristics along with the improvement of cleanness.
However, most of existing polishing pads for polishing wafers are not convenient for effectively removing residual slurry and residual particles generated by polishing in the process of polishing the wafers, and are easy to adsorb on the surface of the wafer to cause the surface damage of the wafer, so that the protection of the wafer is reduced, and most of existing polishing pads for polishing wafers are not convenient for dismounting and replacing the polishing pads, so that the problem that the polishing pads are time-consuming and labor-consuming in replacement is caused, so that inconvenience is brought to the replacement of the polishing pads, and therefore, the polishing pad adjusting device for polishing wafers is provided.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a polishing pad adjustment device for polishing a wafer, so as to solve the problems of the related art.
In order to achieve the purpose, the utility model provides the following technical scheme: a grinding pad adjusting device for grinding wafers comprises a placing table and a connecting block, wherein the top of the placing table is fixedly connected with a lower grinding pad, the bottom of the placing table is fixedly connected with a rotating shaft, the top of the lower grinding pad is provided with a wafer body, the bottom of the connecting block is provided with a rotating mechanism, the bottom of the rotating mechanism is fixedly connected with an electric push rod, the bottom end of the electric push rod is fixedly connected with a transmission plate, the side surface of the transmission plate is fixedly connected with a connecting rod, a fixed column is fixedly connected to the side surface of the connecting rod, a movable rod is movably sleeved at the bottom of the fixed column, the top end of the movable rod is fixedly connected with a movable plate, the top of the movable plate is fixedly connected with a movable spring, the bottom fixedly connected with connecting plate of movable rod, the bottom of connecting rod is provided with disassembly body, the side activity of disassembly body has cup jointed the grinding pad.
As a preferred embodiment, the rotating mechanism includes a fixed box, a rotating shaft is movably sleeved at the bottom of the fixed box, and a rotating motor is fixedly connected to the top end of the rotating shaft.
As a preferred embodiment, the top end of the movable spring is fixedly connected with the top of the inner cavity of the fixed column, and the movable spring is located in the middle of the top end of the inner cavity of the fixed column.
In a preferred embodiment, a brush is fixedly connected to the bottom of the connecting plate, and the brush is in close contact with the lower polishing pad.
As a preferred embodiment, the dismounting mechanism comprises a fixed rod, a supporting column is fixedly connected to the side surface of the fixed rod, a positioning rod is movably sleeved on the side surface of the supporting column, a positioning plate is fixedly connected to one end of the positioning rod, an adjusting spring is fixedly connected to the side surface of the positioning plate, and a pull rod is fixedly connected to the side surface of the positioning plate.
In a preferred embodiment, the pull rod is L-shaped, and the pull rod and the adjusting spring are parallel to each other.
Compared with the prior art, the utility model has the beneficial effects that:
according to the grinding pad adjusting device for grinding the wafer, the fixed column, the movable spring, the movable plate, the movable rod, the connecting plate and the hairbrush are arranged, so that residual slurry and residual particles generated by grinding can be effectively removed by the hairbrush in the process of grinding the wafer, the problem of surface damage of the wafer caused by adsorption on the surface of the wafer is avoided, and the protection of the wafer is improved;
this grind grinding pad adjusting device for wafer through setting up the disassembly body, can utilize the disassembly body to dismantle the change to the grinding pad at the in-process that the grinding pad used, has avoided the grinding pad to change the problem that wastes time and energy to the change of grinding pad has brought the facility.
Drawings
FIG. 1 is a schematic front view of the structure of the present invention;
FIG. 2 is a front cross-sectional view of the structure of the present invention;
FIG. 3 is an enlarged view taken at A of FIG. 2 according to the present invention;
fig. 4 is a perspective view of the fixing post of the present invention.
In the figure: 1. a placing table; 2. connecting blocks; 3. a lower polishing pad; 4. a rotating shaft; 5. a wafer body; 6. a rotation mechanism; 61. a fixed box; 62. a rotating shaft; 63. a rotating electric machine; 7. an electric push rod; 8. a drive plate; 9. a connecting rod; 10. fixing a column; 11. a movable spring; 12. a movable plate; 13. a movable rod; 14. a connecting plate; 15. a brush; 16. a disassembly mechanism; 161. fixing the rod; 162. a support pillar; 163. positioning a rod; 164. positioning a plate; 165. adjusting the spring; 166. a pull rod; 17. and (4) an upper polishing pad.
Detailed Description
The present invention will be further described with reference to the following examples.
The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model. The conditions in the embodiments can be further adjusted according to specific conditions, and simple modifications of the method of the present invention based on the concept of the present invention are within the scope of the claimed invention.
Referring to fig. 1 and 2, the present invention provides a polishing pad adjusting device for polishing a wafer, including a placing table 1, a connecting block 2, a brush 15 and an upper polishing pad 17, in order to rotate the upper polishing pad 17, a lower polishing pad 3 is fixedly connected to the top of the placing table 1, a rotating shaft 4 is fixedly connected to the bottom of the placing table 1, a wafer body 5 is placed on the top of the lower polishing pad 3, a rotating mechanism 6 is disposed at the bottom of the connecting block 2, an electric push rod 7 is fixedly connected to the bottom of the rotating mechanism 6, a transmission plate 8 is fixedly connected to the bottom of the electric push rod 7, the rotating mechanism 6 includes a fixed box 61, a rotating shaft 62 is movably sleeved to the bottom of the fixed box 61, a rotating motor 63 is fixedly connected to the top of the rotating shaft 62, when the rotating motor 63 is turned on, the rotating shaft 62 rotates the electric push rod 7, the electric push rod 7 rotates the transmission plate 8, the transmission plate 8 will drive the upper polishing pad 17 to rotate, so as to polish the wafer.
Referring to fig. 2 and 4, in order to protect the brush 15, a connecting rod 9 is fixedly connected to a side surface of the driving plate 8, a fixed column 10 is fixedly connected to a side surface of the connecting rod 9, a movable rod 13 is movably sleeved at a bottom of the fixed column 10, a movable plate 12 is fixedly connected to a top end of the movable rod 13, a movable spring 11 is fixedly connected to a top portion of the movable plate 12, a top end of the movable spring 11 is fixedly connected to a top portion of an inner cavity of the fixed column 10, and the movable spring 11 is located in a middle portion of a top end of the inner cavity of the fixed column 10, when the electric push rod 7 is opened, the electric push rod 7 drives the driving plate 8 to move downward, the driving plate 8 drives the fixed column 10 to move downward through the connecting rod 9, the fixed column 10 drives the movable rod 13 to move downward, the movable rod 13 drives the brush 15 to move downward, when the brush 15 contacts with the lower polishing pad 3, the movable rod 13 moves upward, buffering is carried out through the movable spring 11, and the problem that the electric push rod 7 damages the brush 15 due to overlarge pushing force is avoided.
Referring to fig. 2 and 4, in order to effectively remove the residual particles, a connecting plate 14 is fixedly connected to the bottom end of a movable rod 13, a brush 15 is fixedly connected to the bottom of the connecting plate 14, the brush 15 is in close contact with a lower polishing pad 3, when a rotating motor 63 drives a transmission plate 8 to rotate, the transmission plate 8 drives a fixing column 10 to rotate through a connecting rod 9, the fixing column 10 drives the connecting plate 14 to rotate through the movable rod 13, the connecting plate 14 drives the brush 15 to rotate, the residual slurry and the residual particles generated by polishing are effectively removed, the problem of surface damage of a wafer caused by the fact that the wafer is adsorbed on the surface of the wafer is avoided, and therefore the wafer protection performance is improved.
Referring to fig. 2 and 3, in order to facilitate the removal of the polishing pad, a removal mechanism 16 may be disposed at the bottom of the connecting rod 9, the removal mechanism 16 includes a fixing rod 161, a supporting rod 162 is fixedly connected to a side surface of the fixing rod 161, a positioning rod 163 is movably sleeved on a side surface of the supporting rod 162, a positioning plate 164 is fixedly connected to one end of the positioning rod 163, a regulating spring 165 is fixedly connected to a side surface of the positioning plate 164, and a pull rod 166 is fixedly connected to a side surface of the positioning plate 164, when the polishing pad needs to be removed, the pull rod 166 is pulled, the positioning rod 163 is driven by the positioning plate 164 to move rightward, so that the positioning rod 163 and the upper polishing pad 17 are separated, the upper polishing pad 17 is pulled to be removed, the problem that the polishing pad is time-consuming and labor-consuming in replacement is avoided, and convenience is brought to the polishing pad replacement.
Referring to fig. 2 and 3, in order to save time and labor during the process of detaching the polishing pad, the polishing pad 17 may be movably sleeved on the side surface of the detaching mechanism 16, and the pull rod 166 is L-shaped, and the pull rod 166 and the adjusting spring 165 are parallel to each other, so that the pull rod 166 is conveniently pulled due to the L-shaped pull rod 166, which facilitates the pulling of the pull rod 166.
The working principle and the using process of the utility model are as follows: when the electric push rod 7 is firstly opened, the electric push rod 7 can drive the transmission plate 8 to move downwards, the transmission plate 8 can drive the fixed column 10 to move downwards through the connecting rod 9, the fixed column 10 can drive the movable rod 13 to move downwards, the movable rod 13 can drive the brush 15 to move downwards, when the brush 15 is contacted with the lower grinding pad 3, the movable rod 13 can move upwards and is buffered through the movable spring 11, the problem that the brush 15 is damaged due to overlarge driving force of the electric push rod 7 is solved, then the rotating motor 63 is opened, the rotating shaft 62 can rotate, the rotating shaft 62 can drive the electric push rod 7 to rotate, the electric push rod 7 can drive the transmission plate 8 to rotate, the transmission plate 8 can drive the upper grinding pad 17 to rotate, so as to grind the wafer, when the rotating motor 63 drives the transmission plate 8 to rotate, the transmission plate 8 can drive the fixed column 10 to rotate through the connecting rod 9, fixed column 10 can drive connecting plate 14 through movable rod 13 and take place to rotate, connecting plate 14 can drive brush 15 and rotate, carry out effectual cleaing away because of the remaining thick liquids and the remaining granule that grind the production, avoided adsorbing the problem that causes the surface damage of wafer on the surface of wafer, thereby the protectiveness to the wafer has been improved, when needs are dismantled the polishing pad, pulling pull rod 166, pull rod 166 can drive locating lever 163 through locating plate 164 and take place to remove right, make phase separation between locating lever 163 and last polishing pad 17, take out polishing pad 17 and dismantle this moment, the problem that polishing pad change is wasted time and energy has been avoided, thereby brought the facility for the change of polishing pad.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a grind polishing pad adjusting device for wafer, is including placing platform (1) and connecting block (2), its characterized in that: the wafer polishing device is characterized in that a lower grinding pad (3) is fixedly connected to the top of the placing table (1), a rotating shaft (4) is fixedly connected to the bottom of the placing table (1), a wafer body (5) is placed on the top of the lower grinding pad (3), a rotating mechanism (6) is arranged at the bottom of the connecting block (2), an electric push rod (7) is fixedly connected to the bottom of the rotating mechanism (6), a transmission plate (8) is fixedly connected to the bottom of the electric push rod (7), a connecting rod (9) is fixedly connected to the side face of the transmission plate (8), a fixed column (10) is fixedly connected to the side face of the connecting rod (9), a movable rod (13) is movably sleeved at the bottom of the fixed column (10), a movable plate (12) is fixedly connected to the top end of the movable rod (13), a movable spring (11) is fixedly connected to the top of the movable plate (12), and a connecting plate (14) is fixedly connected to the bottom end of the movable rod (13), the bottom of the connecting rod (9) is provided with a dismounting mechanism (16), and the side surface of the dismounting mechanism (16) is movably sleeved with an upper grinding pad (17).
2. The apparatus as claimed in claim 1, wherein the polishing pad adjusting device comprises: the rotating mechanism (6) comprises a fixed box (61), a rotating shaft (62) is movably sleeved at the bottom of the fixed box (61), and a rotating motor (63) is fixedly connected to the top end of the rotating shaft (62).
3. The apparatus as claimed in claim 1, wherein the polishing pad adjusting device comprises: the top end of the movable spring (11) is fixedly connected with the top of the inner cavity of the fixed column (10), and the movable spring (11) is located in the middle of the top end of the inner cavity of the fixed column (10).
4. The apparatus as claimed in claim 1, wherein the polishing pad adjusting device comprises: the bottom of the connecting plate (14) is fixedly connected with a hairbrush (15), and the hairbrush (15) is in close contact with the lower grinding pad (3).
5. The apparatus as claimed in claim 1, wherein the polishing pad adjusting device comprises: the disassembly mechanism (16) comprises a fixing rod (161), a side fixedly connected with supporting rod (162) of the fixing rod (161), a positioning rod (163) is sleeved on the side face of the supporting rod (162), a positioning plate (164) is fixedly connected with one end of the positioning rod (163), an adjusting spring (165) is fixedly connected with the side face of the positioning plate (164), and a pull rod (166) is fixedly connected with the side face of the positioning plate (164).
6. The apparatus as claimed in claim 5, wherein the polishing pad adjusting device comprises: the pull rod (166) is L-shaped, and the pull rod (166) and the adjusting spring (165) are parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122261680.0U CN215920121U (en) | 2021-09-17 | 2021-09-17 | Grinding pad adjusting device for grinding wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122261680.0U CN215920121U (en) | 2021-09-17 | 2021-09-17 | Grinding pad adjusting device for grinding wafer |
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| Publication Number | Publication Date |
|---|---|
| CN215920121U true CN215920121U (en) | 2022-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122261680.0U Active CN215920121U (en) | 2021-09-17 | 2021-09-17 | Grinding pad adjusting device for grinding wafer |
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| CN (1) | CN215920121U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114843212A (en) * | 2022-04-29 | 2022-08-02 | 浙江晶睿电子科技有限公司 | Multifunctional semiconductor cavity type processing equipment |
| CN116913825A (en) * | 2023-09-11 | 2023-10-20 | 深圳市星国华先进装备科技有限公司 | Multidirectional fault alarm equipment for wafer processing |
-
2021
- 2021-09-17 CN CN202122261680.0U patent/CN215920121U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114843212A (en) * | 2022-04-29 | 2022-08-02 | 浙江晶睿电子科技有限公司 | Multifunctional semiconductor cavity type processing equipment |
| CN114843212B (en) * | 2022-04-29 | 2023-01-24 | 浙江晶睿电子科技有限公司 | Multifunctional semiconductor cavity type processing equipment |
| CN116913825A (en) * | 2023-09-11 | 2023-10-20 | 深圳市星国华先进装备科技有限公司 | Multidirectional fault alarm equipment for wafer processing |
| CN116913825B (en) * | 2023-09-11 | 2023-12-22 | 深圳市星国华先进装备科技有限公司 | Multidirectional fault alarm equipment for wafer processing |
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