CN116276405A

CN116276405A - Polishing device for wafer processing

Info

Publication number: CN116276405A
Application number: CN202310559824.1A
Authority: CN
Inventors: 杨志勇; 王恒; 单庆喜; 李宰卿; 成鲁荣
Original assignee: Yangzhou Hansi Semiconductor Technology Co ltd
Current assignee: Yangzhou Hansi Semiconductor Technology Co ltd
Priority date: 2023-05-18
Filing date: 2023-05-18
Publication date: 2023-06-23

Abstract

The invention discloses a polishing device for wafer processing, which relates to the field of polishing and comprises a bottom plate, wherein a frame body is fixedly arranged at the upper end of the bottom plate, two sliding plates which are symmetrically arranged are arranged on the frame body in a sliding mode, sliding assemblies used for enabling the two sliding plates to slide oppositely or separately are arranged on the frame body, a first rotating pipe is arranged on the two sliding plates in a penetrating mode through a bearing, and a rotating center turntable is arranged at one end of the first rotating pipe in the opposite mode. Compared with the prior art, the invention has the advantages that: when carrying out the centre gripping to the wafer, even the graininess is protruding appears on the wafer surface, through the fixed subassembly of extrusion on central carousel or the edge swivel, the surface of laminating wafer that can both self-adaptation can make the sunken graininess arch of placing of elastic extrusion bag deformation, and then carries out firm support to the wafer and fix, and effectively avoids the condition to the protruding extrusion damage wafer of graininess.

Description

Polishing device for wafer processing

Technical Field

The invention relates to the field of polishing, in particular to a polishing device for wafer processing.

Background

Silicon wafers are widely used as substrate materials for semiconductor devices. A silicon wafer is manufactured by sequentially performing the following steps on a single crystal silicon ingot: peripheral grinding, slicing, grinding, etching, double-sided polishing, single-sided polishing, cleaning, and the like. The polishing process is a necessary process for removing the bulges on the surface of the wafer.

At present, the following defects exist when polishing a wafer:

1. the two sides cannot be polished simultaneously, so that the polishing efficiency is low;

2. during polishing, a plurality of positions on the edge of a wafer are usually required to be clamped and fixed, so that the clamping area of the wafer is smaller, the wafer is easy to clamp and crack, and the clamping effect is affected;

3. when clamping the wafer, when granular bulges appear on the surface of the wafer, the wafer is easy to be extruded when being extruded by the clamp;

4. in the process of clamping the wafer, the clamped position is difficult to polish because of being blocked, so that insufficient polishing is caused;

5. when the edge device of the wafer is clamped, polishing operation cannot be performed on the side surface of the wafer, so that the wafer cannot be sufficiently polished.

Disclosure of Invention

The invention aims to solve the technical problems and provide the polishing device for wafer processing, which is convenient for polishing two sides simultaneously, does not influence the clamping effect due to particles on the surface of a wafer and has sufficient polishing.

In order to solve the technical problems, the technical scheme provided by the invention is as follows: the polishing device for wafer processing comprises a bottom plate, wherein a frame body is fixedly arranged at the upper end of the bottom plate, two sliding plates which are symmetrically arranged are arranged on the frame body in a sliding manner, sliding assemblies which are used for the two sliding plates to slide oppositely or separately are arranged on the frame body, a first rotating pipe is arranged on the two sliding plates in a penetrating manner through a bearing, a rotating center rotating disc is arranged at one end of the first rotating pipe in the opposite direction, an edge rotating ring opposite to the rotating direction of the center rotating disc is arranged at the outer side of the center rotating disc, the edge rotating ring can lift at the outer side of the center rotating disc, and a reversing assembly which can enable the center rotating disc and the edge rotating ring to reversely rotate is arranged at the outer side of the first rotating pipe; the center carousel and edge swivel are all fixed along the fixed extrusion fixed subassembly that is equipped with a plurality of structures of circumferencial direction in one side of keeping away from the first rotation pipe, the center carousel is connected in one side of keeping away from the first rotation pipe and is equipped with a plurality of fixed polishing piece and slidable polishing piece two, polishing piece two can slide to the edge swivel direction, the edge swivel is connected in one side of keeping away from the first rotation pipe and is equipped with a plurality of fixed polishing piece three and slidable polishing piece four, polishing piece four can slide to the center carousel direction, be equipped with drive assembly on the sliding plate for the rotation of drive center carousel and edge swivel, one of them be equipped with the edge on the sliding plate and polish the subassembly.

Further, reversing assembly includes fixed column, fixed pipe, rotation pipe two and rotation pipe three, the fixed column passes through the bearing to be fixed in rotation pipe one inboard, the upper end of fixed column passes through L shaped plate and sliding plate fixed connection to make rotation pipe one can rotate in the outside of fixed column, the outside of rotation pipe lower extreme is fixed through one-way bearing and is equipped with the rotation pipe two that is fixed mutually with central carousel, the lower extreme outside of fixed column is fixed through one-way bearing and rotation pipe two, so that central carousel and marginal swivel can only rotate in single direction.

Specifically, the third rotating tube is fixed on the outer side of the first rotating tube through a one-way bearing, the fixed tube is fixed on the outer side of the third rotating tube through a one-way bearing, and one end of the fixed tube is fixed with the sliding plate.

Preferably, the two sides of the third rotating pipe are fixedly provided with second electric push rods, the output ends of the second electric push rods are fixedly connected with lifting pipes which lift the third rotating pipe, and the edge positions of the lifting pipes are connected with supporting rods which are fixed with edge rotating rings.

Further, be located extrusion fixed subassembly on the central carousel includes electro-magnet one, reservoir box, elasticity extrusion bag one and elasticity extrusion bag two, the upper end and the central carousel of reservoir box are fixed, the upper end and the lower extreme intercommunication of reservoir box of elasticity extrusion bag one, elasticity extrusion bag two and reservoir box keep away from the one end intercommunication of rotation pipe one, electro-magnet one sets up in the one side that the reservoir box is close to rotation pipe one, electro-magnet one imbeds in the central carousel, all pack in reservoir box, elasticity extrusion bag one and the elasticity extrusion bag two and be equipped with the magneto-rheological fluid.

Specifically, the center carousel downside is equipped with spout two, the upside connection of polishing piece two is equipped with and spout two complex slider two, the both ends connection of spout two is equipped with the slip post one that slides and runs through slider two, the fixed electro-magnet two that is equipped with of downside of center carousel and sets up in polishing piece two and be close to rotation pipe one side, the outside cover of slip post one is equipped with spring one, the one end and the slider two of spring one are connected, the other end and the one end of spout two of spring one are connected, polishing piece two is magnetic material.

Preferably, the lower side of the edge swivel is provided with a third sliding groove, the upper side of the fourth polishing sheet is connected with a third sliding block matched with the third sliding groove, two ends of the third sliding groove are connected with a second sliding column which penetrates through the third sliding block in a sliding mode, the lower side of the edge swivel is fixedly provided with an electromagnet third arranged on one side, far away from the first rotating tube, of the fourth polishing sheet, a second spring is sleeved on the outer side of the second sliding column, one end of the second spring is connected with the third sliding block in a three-phase mode, the other end of the second spring is connected with one end of the third sliding groove, and the fourth polishing sheet is made of magnetic materials.

Further, the edge polishing assembly comprises a sliding column three, an adjusting plate and a screw rod, wherein the sliding column three is arranged to be multiple, the sliding column three is slidably inserted into one side of the edge swivel, the other end of the sliding column three is connected with the adjusting plate, the screw rod penetrates through the adjusting plate through a bearing, one end of the screw rod is inserted into one side of the edge swivel through threaded fit, a driving motor II is connected to the outer side of the adjusting plate, the output end of the driving motor II is connected with the screw rod, a polishing strip is connected to the lower side of the adjusting plate, and the inner side of the polishing strip is in an arc-shaped structure.

Specifically, the slip subassembly includes electric putter one, fixed block, slider one and spout one, the fixed intermediate position of setting in the framework is fixed to the fixed block, electric putter one sets up to two, and two electric putter one's stiff end is fixed mutually with the fixed block respectively, two electric putter one's output respectively with two the edge swivel is connected, two inner walls of framework all are equipped with spout one, spout one internal fit is equipped with the slider one that is connected with the edge swivel.

Preferably, the driving assembly comprises a first driving motor, a first bevel gear and a second bevel gear, wherein the first driving motor is fixed on one side of the sliding plate, the output end of the first driving motor is connected with the first bevel gear, and the second bevel gear is fixed on the outer side of the first rotating tube and meshed with the first bevel gear.

Compared with the prior art, the invention has the advantages that:

1. when clamping the wafer, even if particle bulges appear on the surface of the wafer, the surface of the wafer can be self-adaptively attached through the extrusion fixing component on the central turntable or the edge swivel, so that the elastic extrusion bag can be deformed to be concavely provided with the particle bulges, the wafer is stably supported and fixed, and the situation that the wafer is damaged by extrusion of the particle bulges is effectively avoided;

2. through the action of the extrusion fixing component, the elastic extrusion bag I can be solidified when the wafer is fixed, the wafer is stably supported, and the thickness of the extrusion fixing component can be reduced through the rotation of the central turntable or the edge swivel when the polishing operation is carried out, so that the thickness of the extrusion fixing component is smaller than that of the polishing sheet I, the polishing sheet II or the polishing sheet III and the polishing sheet IV, and the normal polishing operation is not influenced;

3. through the action of the reversing assembly, the rotation of the central turntable or the edge swivel is driven by virtue of the forward and reverse rotation of the driving motor, and other additional driving parts are not needed when the central turntable or the edge swivel is driven to rotate, so that the cost is saved;

4. the polishing of the area between the center turntable or the edge swivel can be realized through the functions of the polishing plate II and the polishing plate IV, so that the area missing during polishing on the surface of the wafer is avoided;

5. the edge polishing assembly has the advantages that the edge of the surface of the wafer can be polished and polished simultaneously, and the side surface of the wafer can be polished more fully;

6. the two surfaces of the wafer can be polished and polished simultaneously, and the polishing and polishing efficiency is higher;

7. the situation that the clamped position is difficult to polish in the prior art is avoided;

8. corresponding among the prior art to carry out the centre gripping to a plurality of positions of edge position, this application can carry out the centre gripping to the region that the wafer surface is more, and the centre gripping is more firm, and the clamping area is little when avoiding the centre gripping leads to the big extrusion of pressure to damage the condition of wafer.

Drawings

Fig. 1 is a schematic view of the structure of the present invention in a three-dimensional manner.

Fig. 2 is a schematic view of another perspective view of the present invention.

Fig. 3 is a schematic perspective view of the edge swivel and center turntable of the present invention.

Fig. 4 is a schematic view showing the bottom construction of the edge swivel and center turntable of the present invention.

Fig. 5 is a schematic top view of the present invention.

FIG. 6 is a schematic illustration of the cross-sectional structure of the position A-A of FIG. 5 in accordance with the present invention.

FIG. 7 is a schematic view of the structure of the invention in section at position B-B in FIG. 4.

FIG. 8 is a schematic view of the structure of the invention in section at the C-C position of FIG. 4.

FIG. 9 is a schematic view of the structure of the invention in section at the D-D position of FIG. 4.

Fig. 10 is an enlarged view of the structure of fig. 9 at the a position according to the present invention.

Fig. 11 is an enlarged view of the B position in fig. 7 according to the present invention.

Fig. 12 is an enlarged view of the C position of fig. 7 according to the present invention.

Fig. 13 is an enlarged view of the D position of fig. 8 according to the present invention.

Fig. 14 is an enlarged view of the E-position of fig. 3 according to the present invention.

As shown in the figure: 1. a bottom plate; 2. a frame; 3. a sliding plate; 4. rotating the first pipe; 5. a central turntable; 6. an edge swivel; 7. a reversing assembly; 8. extruding the fixing assembly; 9. polishing a first polishing sheet; 10. polishing a second polishing sheet; 11. polishing a third grinding sheet; 12. polishing a fourth polishing sheet; 13. a drive assembly; 14. an edge grinding assembly; 15. fixing the column; 16. a fixed tube; 17. a second rotating pipe; 18. rotating a third pipe; 19. an L-shaped plate; 20. an electric push rod II; 21. a lifting tube; 22. a support rod; 23. an electromagnet I; 24. the first elastic extrusion bag is arranged; 25. a second elastic extrusion bag; 26. a second chute; 27. a second slide block; 28. a sliding column I; 29. an electromagnet II; 30. a chute III; 31. a third slide block; 32. a sliding column II; 33. an electromagnet III; 34. a sliding column III; 35. an adjusting plate; 36. a screw; 37. polishing the strip; 38. a sliding assembly; 39. an electric push rod I; 40. a fixed block; 41. a first sliding block; 42. a first chute; 43. driving a first motor; 44. a liquid storage box; 45. and driving a second motor.

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.

Detailed Description

In the description of the present invention, it should be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more. In addition, the term "include" and any variations thereof are intended to cover a non-exclusive inclusion.

Referring to fig. 1, 2, 3, 5, 8 and 9, a polishing device for wafer processing includes a bottom plate 1, a frame 2 is fixedly disposed at an upper end of the bottom plate 1, two sliding plates 3 disposed symmetrically are slidably disposed on the frame 2, sliding assemblies 38 for sliding the two sliding plates 3 in opposite directions or in opposite directions are disposed on the frame 2, a rotating tube one 4 is disposed on each of the two sliding plates 3 in a penetrating manner through a bearing, a rotating central turntable 5 is disposed at one end of each of the two rotating tubes one 4 in opposite directions, an edge rotating ring 6 opposite to the rotating direction of the central turntable 5 is disposed at an outer side of the central turntable 5, the edge rotating ring 6 can lift on an outer side of the central turntable 5, and a reversing assembly 7 capable of reversely rotating the central turntable 5 and the edge rotating ring 6 is disposed at an outer side of the rotating tube one 4; the center carousel 5 and edge swivel 6 are all fixed along circumferencial direction to be equipped with a plurality of extrudees fixed subassembly 8 that the structure is the same in one side of keeping away from first 4 of swivel, center carousel 5 is connected in one side of keeping away from first 4 of swivel and is equipped with a plurality of fixed polishing piece one 9 and slidable polishing piece two 10, polishing piece two 10 can slide to the edge swivel 6 direction, edge swivel 6 is connected in one side of keeping away from first 4 of swivel and is equipped with a plurality of fixed polishing piece three 11 and slidable polishing piece four 12, polishing piece four 12 can slide to the center carousel 5 direction, be equipped with drive assembly 13 on the sliding plate 3 for the rotation of driving center carousel 5 and edge swivel 6, one of them be equipped with edge polishing subassembly 14 on the sliding plate 3.

Referring to fig. 1, 3, 4, 7 and 10, the reversing assembly 7 includes a fixing column 15, a fixing tube 16, a second rotating tube 17 and a third rotating tube 18, the fixing column 15 is fixed on the inner side of the first rotating tube 4 through a bearing, the upper end of the fixing column 15 is fixedly connected with the sliding plate 3 through an L-shaped plate 19, so that the first rotating tube 4 can rotate on the outer side of the fixing column 15, the outer side of the lower end of the first rotating tube 4 is fixedly provided with the second rotating tube 17 fixed with the central turntable 5 through a unidirectional bearing, and the outer side of the lower end of the fixing column 15 is fixed with the second rotating tube 17 through a unidirectional bearing, so that the central turntable 5 and the edge rotating ring 6 can only rotate in a single direction.

Referring to fig. 1, 9 and 10, the third rotary tube 18 is fixed to the outer side of the first rotary tube 4 through a one-way bearing, the fixed tube 16 is fixed to the outer side of the third rotary tube 18 through a one-way bearing, and one end of the fixed tube 16 is fixed to the sliding plate 3.

Referring to fig. 4, 7 and 10, two sides of the third rotating tube 18 are fixedly provided with second electric push rods 20, output ends of the second electric push rods 20 are fixedly connected with lifting tubes 21 lifting the third rotating tube 18, and support rods 22 fixed with the edge rotating ring 6 are connected with edge positions of the lifting tubes 21.

Referring to fig. 1, 3, 9 and 11, the extrusion fixing assembly 8 disposed on the central turntable 5 includes an electromagnet first 23, a liquid storage box 44, an elastic extrusion bag first 24 and an elastic extrusion bag second 25, wherein the upper end of the liquid storage box 44 is fixed to the central turntable 5, the upper end of the elastic extrusion bag first 24 is communicated with the lower end of the liquid storage box 44, the elastic extrusion bag second 25 is communicated with one end of the liquid storage box 44 away from the first rotary pipe 4, the electromagnet first 23 is disposed on one side of the liquid storage box 44 close to the first rotary pipe 4, the electromagnet first 23 is embedded in the central turntable 5, and magnetorheological fluid is filled in the liquid storage box 44, the elastic extrusion bag first 24 and the elastic extrusion bag second 25.

Referring to fig. 4, 10 and 12, a sliding groove two 26 is provided at the lower side of the center turntable 5, a sliding block two 27 matched with the sliding groove two 26 is connected at the upper side of the polishing plate two 10, a sliding column two 28 which slidably penetrates through the sliding block two 27 is connected at two ends of the sliding groove two 26, an electromagnet two 29 which is arranged at the lower side of the center turntable 5 and is close to the rotating pipe two 4 side of the polishing plate two 10 is fixedly arranged at the lower side of the center turntable 5, a spring two is sleeved at the outer side of the sliding column two 28, one end of the spring two is connected with the sliding block two 27, the other end of the spring two is connected with one end of the sliding groove two 26, and the polishing plate two 10 is made of magnetic material.

Referring to fig. 10 and 13, a third sliding groove 30 is provided on the lower side of the edge swivel 6, a third sliding block 31 matched with the third sliding groove 30 is connected to the upper side of the fourth polishing plate 12, a second sliding column 32 penetrating through the third sliding block 31 in a sliding manner is connected to the two ends of the third sliding groove 30, an electromagnet 33 disposed on one side, far away from the first rotating tube 4, of the fourth polishing plate 12 is fixedly disposed on the lower side of the edge swivel 6, a second spring is sleeved on the outer side of the second sliding column 32, one end of the second spring is connected with the third sliding block 31, the other end of the second spring is connected with one end of the third sliding groove 30, and the fourth polishing plate 12 is made of magnetic material.

Referring to fig. 2, 3 and 14, the edge polishing assembly 14 includes a plurality of sliding columns three 34, an adjusting plate 35 and a screw 36, the sliding columns three 34 are slidably inserted into one side of the edge swivel 6, the other end of the sliding columns three 34 is connected with the adjusting plate 35, the screw 36 penetrates through the adjusting plate 35 through a bearing, one end of the screw 36 is inserted into one side of the edge swivel 6 through threaded fit, a second driving motor 45 is connected to the outer side of the adjusting plate 35, an output end of the second driving motor 45 is connected with the screw 36, a polishing strip 37 is connected to the lower side of the adjusting plate 35, and the inner side of the polishing strip 37 is in an arc structure.

Referring to fig. 1, 5 and 6, the sliding assembly 38 includes a first electric push rod 39, a fixed block 40, a first sliding block 41 and a first sliding groove 42, the fixed block 40 is fixedly disposed at a middle position in the frame 2, the first electric push rod 39 is provided in two, the fixed ends of the first electric push rod 39 are respectively fixed with the fixed block 40, the output ends of the first electric push rod 39 are respectively connected with the two sliding plates 3, the first sliding grooves 42 are respectively disposed on two inner walls of the frame 2, and the first sliding grooves 42 are internally matched with the first sliding blocks 41 connected with the sliding plates 3.

Referring to fig. 1, 2 and 9, the driving assembly 13 includes a first driving motor 43, a first bevel gear and a second bevel gear, the first driving motor 43 is fixed on one side of the sliding plate 3, an output end of the first driving motor 43 is connected with the first bevel gear, and the second bevel gear is fixed on the outer side of the first rotating tube 4 and meshed with the first bevel gear.

The working principle and the use flow of the invention are as follows:

in embodiment 1, a wafer is placed on the inner sides of two edge rotating rings 6, so that the center position of the wafer is coincident with the center position of a center turntable 5, the edge rotating rings 6 and the wafer can be driven to abut against each other through a sliding component 38, when the driving component 13 rotates in one direction, the wafer is fixed through an extrusion fixing component 8 on the center turntable 5, the edge rotating rings 6 rotate to enable a polishing sheet three 11 and a polishing sheet four 12 to polish the edge of the wafer, the wafer is fixed through an extrusion fixing component 8 on the edge rotating rings 6 and the driving component 13 rotates in the other direction, in addition, the polishing sheet two 10 and the polishing sheet four 12 can slide, and further polish the position between the center turntable 5 and the edge rotating rings 6, so that polishing is more thorough.

Specifically, the edges of the upper and lower surfaces of the wafer are fixed through edge swivel rings 6 on the upper and lower sides;

placing a wafer to be polished on the edge swivel 6 at the lower side and propping against the extrusion fixing assembly 8 on the edge swivel 6, specifically propping against the elastic extrusion bag I24 on the extrusion fixing assembly 8, controlling the action of the electric push rod II 20 to enable the lifting tube 21 to slide at the outer side of the rotating tube III 18, driving the edge swivel 6 to slide in the direction away from the rotating tube I4 by matching with the support rod 22, enabling the two edge swivel 6 at the upper side and the lower side to be close, and enabling the center turntable 5 to be gradually far away from the wafer;

the first electric push rod 39 is opened to drive the two sliding plates 3 to be close, meanwhile, the first sliding block 41 slides in the first sliding groove 42, the sliding of the sliding plates 3 is firmer, the two sliding plates 3 further drive the two first rotating pipes 4 to slide oppositely, the third rotating pipe 18 is matched to drive the second electric push rod 20 to slide, the lifting pipe 21 and the supporting rod 22 are matched to enable the edge rotating rings 6 on the upper side and the lower side to be close, and the first elastic extrusion bags 24 on the two edge rotating rings 6 are extruded with wafers;

in this state, the thickness of the first elastic extrusion bag 24 on the edge swivel 6 is thicker than the height of the third polishing disc and the fourth polishing disc 12, the first elastic extrusion bag 24 can be attached to the surface of the wafer through the elasticity of the first elastic extrusion bag 24 and the second elastic extrusion bag 25, when the wafer is provided with protrusions, the wafer can be attached in a self-adaptive mode, extrusion damage caused by the protrusions on the surface of the wafer is avoided, the edge positions of the surface of the wafer are attached, extrusion and fixation are further carried out, when the first elastic extrusion bags 24 on the two edge swivel 6 are fully abutted against the wafer, the first electromagnet 23 is opened to generate a magnetic field, the first elastic extrusion bag 24, the second elastic extrusion bag 25 and the magnetorheological fluid in the liquid storage box 44 act, the first elastic extrusion bag 24 on the edge swivel 6 enables the magnetorheological fluid to be in a solid property, the first elastic extrusion bag 24 can firmly extrude the wafer, the wafer can not shake after being fixed, and the edge positions of the surface of the wafer are further fixed.

After the edge positions of the wafer are fixed, polishing sheets I9 and II 10 on the central turntable 5 are required to polish the central positions of the lower sides of the wafer;

the rotation of the driving motor I43 is started, the bevel gear I and the bevel gear II are matched to drive the rotation of the rotation tube I4, the action of the one-way bearing is matched to drive the rotation tube II 17 to rotate (meanwhile, the rotation tube II 17 rotates on the outer side of the fixed column 15 through the one-way bearing), as the rotation tube III 18 is fixed on the outer side of the rotation tube I4 through the one-way bearing, the rotation tube I4 rotates in the rotation tube III 18, the central turntable 5 is driven to rotate, the extrusion fixing assembly 8 on the inner sides of the two central turntable 5 is further rotated, magnetorheological fluid in the liquid storage box 44 and the elastic extrusion bag I24 is extruded into the elastic extrusion bag II 25 under the action of centrifugal force, so that the elastic extrusion bag II 25 transversely expands, the elastic extrusion bag I24 longitudinally contracts towards the central turntable 5, the thickness of the liquid storage box 44 is smaller than the thickness of the polishing sheet I9 and the polishing sheet II 10, at the moment, the electromagnet I23 is opened to generate a magnetic field, the magnetorheological fluid in the elastic extrusion bag II 25 and the liquid storage box II 44 is driven to rotate, the magnetorheological fluid is enabled to be solid, and the magnetorheological fluid in the magnetic fluid is enabled to be always in the state, when the polishing sheet I9 and the polishing sheet II are extruded by the elastic extrusion bag II and the polishing sheet 9 and the polishing sheet II and the polishing sheet 24 and the polishing sheet II and the polishing sheet 9 are prevented from being extruded by the elastic extrusion bag II and the polishing sheet 9 and the polishing sheet II is further;

in the process of rotating the central turntable 5, the two central turntable 5 need to slide towards the wafer direction to polish the central position of the wafer, and the specific operation is as follows: simultaneously, the shrinkage of the first electric push rod 39 and the shrinkage of the second electric push rod 20 are controlled, the shrinkage distance of the first electric push rod 39 is the same as the shrinkage distance of the second electric push rod 20, the two sliding plates 3 are close under the action of the first electric push rod 39, meanwhile, the first sliding block 41 slides in the first sliding groove 42, the sliding plate 3 slides more firmly, the two rotating pipes 4 slide oppositely, the central turntable 5 is close and gradually props against the wafer in cooperation with the second rotating pipe 17, meanwhile, the shrinkage and shortening of the second electric push rod 20 are offset on the distance same as the sliding distance of the first rotating pipe 4 towards the central turntable 5 (due to the action of the first electric push rod 39), and the positions of the lifting pipe 21, the supporting rod 22 and the edge rotating ring 6 are not moved, and the extrusion fixing assembly 8 on the edge rotating ring 6 still fixes the wafer;

along with the sliding of the two center turntables 5 rotating towards the wafer direction, the first polishing sheet 9 and the second polishing sheet 10 are polished until being propped against the wafer, in the polishing process, the second electromagnet 29 is turned on to generate a magnetic field, and as the second polishing sheet 10 is made of magnetic materials, the second polishing sheet 10 slides away from the first rotating tube 4 under the double effects of centrifugal force and magnetic field thrust (the second sliding block 27 slides on the outer side of the first sliding column 28 and overcomes the elastic force of the first spring), and when the second polishing sheet 10 slides to the maximum distance, the second polishing sheet 10 is close to and does not touch the third polishing sheet 11 and the fourth polishing sheet 12, so that most of areas between the center turntables 5 and the edge turntables can be polished;

meanwhile, when the polishing sheet I9 and the polishing sheet II 10 rotate and polish the wafer, steering force on the wafer is generated, the edge swivel 6, the supporting rod 22, the wafer, the lifting pipe 21, the electric push rod II 20 and the rotating pipe III 18 are all fixed together, so that steering force on the rotating pipe III 18 is generated, but because the fixed pipe 16 and the sliding plate 3 are fixed, the fixed pipe 16 is fixed on the outer side of the rotating pipe III 18 through a one-way bearing (at the moment, the one-way bearing is in a fixed state), the steering force on the wafer during polishing does not rotate the rotating pipe III 18, and a good fixing effect on the edge position of the wafer can be realized;

and then finish the polishing of the center positions of the upper surface and the lower surface of the wafer.

After polishing the center positions of the upper surface and the lower surface of the wafer is finished, fixing the center position of the wafer, and canceling the fixing and polishing the edge positions of the upper surface and the lower surface of the wafer, wherein the specific operation is as follows;

the two central turntables 5 are separated and slid under the pushing action of the first operation control electric push rod 39, the second operation control electric push rod 20 is used for enabling the edge swivel 6 to slide towards the first rotating tube 4 and the position of the central turntables 5 to be staggered, the first driving motor 43 is turned off, all the electromagnets 23 are turned off, the electromagnets 23 do not generate magnetic fields any more, magnetorheological fluid slides in the liquid storage box 44 to enable the first extrusion bag and the second extrusion bag to be restored to the initial state (the thickness of the liquid storage box 44 plus the elastic extrusion bag 24 is wider than that of the first polishing sheet 9, the second polishing sheet 10, the third polishing sheet 11 and the fourth polishing sheet 12), the electromagnets 29 are turned off, the second sliding block 27 is pushed by the action of the first spring, and the second polishing sheet 10 is restored to the initial state;

the upper and lower central turntables 5 are closed under the action of the operation control electric push rod 39, the extrusion fixing assembly 8 on the central turntables 5 is abutted against the wafer, the first elastic extrusion bag 24 is abutted against the wafer, the electromagnet 23 is opened to generate a magnetic field, magnetorheological fluid in the first elastic extrusion bag 24, the second elastic extrusion bag 25 and the liquid storage box 44 is acted, the magnetorheological fluid is solid, the first elastic extrusion bag 24 can firmly extrude the wafer, and the central position of the wafer cannot shake after being fixed;

the first driving motor 43 is turned on to rotate reversely, the first rotating tube 4 is driven to rotate reversely, the second rotating tube 18 is driven to rotate through the action of the one-way bearing (meanwhile, the second rotating tube 17 is not rotated through the action of the one-way bearing), the second electric push rod 20, the lifting tube 21 and the supporting rod 22 are matched to drive the edge rotating ring 6 to rotate, the extrusion fixing assembly 8 on the edge rotating ring 6 is acted by centrifugal force, magnetorheological fluid in the liquid storage box 44 and the first elastic extrusion bag 24 is extruded into the second elastic extrusion bag 25 under the action of centrifugal force, so that the second elastic extrusion bag 25 expands transversely, the first elastic extrusion bag 24 contracts longitudinally towards the direction of the central turntable 5, the thickness of the liquid storage box 44 and the first elastic extrusion bag 24 is smaller than that of the third polishing sheet 11 and the fourth polishing sheet 12, at the moment, the electromagnet 23 is turned on to generate a magnetic field, the magnetorheological fluid in the first elastic extrusion bag 24, the second elastic extrusion bag 25 and the liquid storage box 44 is solid, and the fourth polishing sheet 12 always have the thickness of the first elastic extrusion bag 24 narrower than that of the third polishing sheet 11 and the fourth polishing sheet 12, and the fourth polishing sheet 11 are prevented from being influenced by the fourth elastic extrusion bag 24 and the fourth polishing sheet 11;

opening the electric push rod II 20 to enable the edge swivel 6 on the upper side and the lower side to be close to a wafer until the polishing sheet III 11, the polishing sheet IV 12 and the edge of the wafer are propped against for polishing, opening the electromagnet III 33 to generate a magnetic field, and enabling the polishing sheet IV 12 to slide in the direction close to the first rotating tube 4 under the action of the magnetic field pushing force (the sliding block III 31 slides on the outer side of the sliding column II 32 and overcomes the elastic force of the second spring simultaneously), wherein the polishing sheet IV 12 approaches and does not touch the polishing sheet I9 and the polishing sheet II 10 when sliding to the maximum distance, most of the area between the central turntable 5 and the edge turntable can be polished, the polishing area of the polishing sheet IV 12 coincides with the polishing area of the polishing sheet II 10, and because the central turntable 5 and the edge swivel 6 of the application move and rotate mutually, gaps exist between the central turntable 5 and the edge swivel 6 to avoid scratch, the polishing is avoided through the scheme, and the polishing is more sufficient;

meanwhile, when the polishing sheet III 11 and the polishing sheet IV 12 rotate and polish the wafer, steering force is generated on the wafer, the wafer and the rotating tube II 17 are fixed together, so that steering force is generated on the rotating tube II 17, but because the fixed column 15 is fixed with the sliding plate 3 through the L-shaped plate 19, the outer side of the lower end of the fixed column 15 is fixed with the rotating tube II 17 through a one-way bearing, the rotating tube I4 rotates on the inner side of the rotating tube II 17 under the action of the one-way bearing, the rotating tube II 17 receives steering force on the wafer, but does not rotate on the rotating tube II 17 under the action of the one-way bearing between the rotating tube II 17 and the fixed column 15, and the center turntable 5 does not rotate, so that good fixing effect on the center position of the wafer can be realized;

after the edge position of the wafer surface is polished, the polished wafer can be taken down by controlling the first electric push rod 39 to separate the upper and lower central turntables 5 from the edge swivel 6.

Example 2 as a further modification of the above example,

when the edge position of the surface of the wafer is polished, the second driving motor 45 is turned on to drive the screw 36 to rotate, the screw 36 is driven to be gradually inserted into the edge swivel 6, and meanwhile the third sliding column 34 is inserted into the edge swivel 6 in a sliding manner, so that the arc polishing strip 37 is gradually close to the edge position of the wafer, and further the edge position of the wafer is polished.

Standard parts used in the invention can be purchased from the market, special-shaped parts can be customized according to the description of the specification and the drawings, the specific connection modes of all parts adopt conventional means such as mature bolts, rivets and welding in the prior art, the machinery, the parts and the equipment adopt conventional modes in the prior art, and the circuit connection adopts conventional connection modes in the prior art, so that details are not described in detail in the specification, and the invention belongs to the prior art known to the person skilled in the art.

The invention and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the invention as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present invention.

Claims

1. The utility model provides a burnishing device is used in wafer processing which characterized in that: the automatic lifting device comprises a bottom plate (1), wherein a frame body (2) is fixedly arranged at the upper end of the bottom plate (1), two sliding plates (3) which are symmetrically arranged are arranged on the frame body (2) in a sliding mode, sliding assemblies (38) which are used for the two sliding plates (3) to slide oppositely or separately are arranged on the frame body (2), a first rotating pipe (4) is arranged on the two sliding plates (3) in a penetrating mode through bearings, a rotating center rotary table (5) is arranged at one end of the first rotating pipe (4) in the opposite direction, an edge rotary ring (6) opposite to the rotating direction of the center rotary table (5) is arranged on the outer side of the center rotary table (5), and a reversing assembly (7) which enables the center rotary table (5) and the edge rotary ring (6) to reversely rotate is arranged on the outer side of the first rotating pipe (4);

the utility model discloses a rotary table, including central carousel (5) and edge swivel (6), a plurality of fixed subassembly (8) of extrusion that are equipped with of structure along circumferencial direction is fixed in one side of keeping away from first (4) of rotation, central carousel (5) are equipped with a plurality of fixed polishing piece (9) and slidable polishing piece two (10) in one side of keeping away from first (4) of rotation, polishing piece two (10) can slide to edge swivel (6) direction, edge swivel (6) are equipped with a plurality of fixed polishing piece three (11) and slidable polishing piece four (12) in one side of keeping away from first (4) of rotation, polishing piece four (12) can slide to central carousel (5) direction, be equipped with drive assembly (13) on slide plate (3) for the rotation of drive central carousel (5) and edge swivel (6), one of them be equipped with edge polishing subassembly (14) on slide plate (3).

2. The polishing apparatus for wafer processing according to claim 1, wherein: the reversing assembly (7) comprises a fixing column (15), a fixing tube (16), a rotating tube two (17) and a rotating tube three (18), wherein the fixing column (15) is fixed on the inner side of the rotating tube one (4) through a bearing, the upper end of the fixing column (15) is fixedly connected with the sliding plate (3) through an L-shaped plate (19), so that the rotating tube one (4) can rotate on the outer side of the fixing column (15), the outer side of the lower end of the rotating tube one (4) is fixedly provided with a rotating tube two (17) fixed with the central turntable (5) through a one-way bearing, and the outer side of the lower end of the fixing column (15) is fixed with the rotating tube two (17) through a one-way bearing, so that the central turntable (5) and the edge rotating ring (6) can only rotate in a single direction.

3. The polishing apparatus for wafer processing according to claim 2, wherein: the rotary tube III (18) is fixed on the outer side of the rotary tube I (4) through a one-way bearing, the fixed tube (16) is fixed on the outer side of the rotary tube III (18) through a one-way bearing, and one end of the fixed tube (16) is fixed with the sliding plate (3).

4. A polishing apparatus for wafer processing according to claim 3, wherein: the two sides of the rotating tube III (18) are fixedly provided with electric push rods II (20), the output ends of the electric push rods II (20) are fixedly connected with lifting tubes (21) which are lifted at the rotating tube III (18), and the edge positions of the lifting tubes (21) are connected with supporting rods (22) which are fixed with the edge rotating ring (6).

5. The polishing apparatus for wafer processing according to claim 1, wherein: the extrusion fixing assembly (8) located on the center rotary table (5) comprises an electromagnet I (23), a liquid storage box (44), an elastic extrusion bag I (24) and an elastic extrusion bag II (25), wherein the upper end of the liquid storage box (44) is fixed with the center rotary table (5), the upper end of the elastic extrusion bag I (24) is communicated with the lower end of the liquid storage box (44), the elastic extrusion bag II (25) is communicated with the liquid storage box (44) at one end far away from the rotary tube I (4), the electromagnet I (23) is arranged on one side, close to the rotary tube I (4), of the liquid storage box (44), the electromagnet I (23) is embedded in the center rotary table (5), and magnetorheological fluid is filled in the liquid storage box (44), the elastic extrusion bag I (24) and the elastic extrusion bag II (25).

6. The polishing apparatus for wafer processing according to claim 1, wherein: the utility model discloses a polishing device, including two (26) slide, slide column (10) and slide column (10), center carousel (5) downside is equipped with spout two (26), the upside connection of polishing piece two (10) is equipped with two (27) of slider two (26) complex, the both ends connection of spout two (26) is equipped with slip post one (28) that runs through slider two (27), the downside of center carousel (5) is fixed to be equipped with and is set up in the electro-magnet two (29) that polishing piece two (10) are close to rotation pipe one (4) side, the outside cover of slip post one (28) is equipped with spring one, the one end of spring one is connected with slider two (27), the other end of spring one is connected with the one end of spout two (26), polishing piece two (10) are magnetic material.

7. The polishing apparatus for wafer processing according to claim 1, wherein: the edge swivel (6) downside is equipped with spout three (30), the upside connection of polishing piece four (12) is equipped with three (31) of slider with spout three (30), the both ends connection of spout three (30) are equipped with slip post two (32) that slip runs through slider three (31), the downside of edge swivel (6) is fixed to be equipped with and is set up in polishing piece four (12) and keep away from electro-magnet three (33) of rotation pipe one (4) one side, the outside cover of slip post two (32) is equipped with the spring two, the one end of spring two is connected with slider three (31), the other end of spring two is connected with the one end of spout three (30), polishing piece four (12) are magnetic material.

8. The polishing apparatus for wafer processing according to claim 1, wherein: the edge polishing assembly (14) comprises a sliding column three (34), an adjusting plate (35) and a screw rod (36), wherein the sliding column three (34) is arranged into a plurality of sliding columns, the sliding columns three (34) are all inserted into one side of an edge swivel (6) in a sliding mode, the other end of the sliding column three (34) is connected with the adjusting plate (35), the screw rod (36) penetrates through the adjusting plate (35) through a bearing, one end of the screw rod (36) is inserted into one side of the edge swivel (6) through threaded fit, a driving motor two (45) is connected to the outer side of the adjusting plate (35), the output end of the driving motor two (45) is connected with the screw rod (36), a polishing strip (37) is connected to the lower side of the adjusting plate (35), and the inner side of the polishing strip (37) is in an arc-shaped structure.

9. The polishing apparatus for wafer processing according to claim 1, wherein: the sliding assembly (38) comprises an electric push rod I (39), a fixed block (40), a sliding block I (41) and a sliding groove I (42), wherein the fixed block (40) is fixedly arranged at the middle position in the frame body (2), the electric push rod I (39) is arranged in two, the fixed ends of the electric push rod I (39) are respectively fixed with the fixed block (40), the output ends of the electric push rod I (39) are respectively connected with the sliding plates (3), the sliding grooves I (42) are respectively arranged on the two inner walls of the frame body (2), and the sliding block I (41) connected with the sliding plates (3) are matched in the sliding grooves I (42).

10. The polishing apparatus for wafer processing according to claim 1, wherein: the driving assembly (13) comprises a first driving motor (43), a first bevel gear and a second bevel gear, wherein the first driving motor (43) is fixed on one side of the sliding plate (3), the output end of the first driving motor (43) is connected with the first bevel gear, and the second bevel gear is fixed on the outer side of the first rotating tube (4) and meshed with the first bevel gear.