CN114932636B - Automatic sheet taking machine - Google Patents
Automatic sheet taking machine Download PDFInfo
- Publication number
- CN114932636B CN114932636B CN202210471056.XA CN202210471056A CN114932636B CN 114932636 B CN114932636 B CN 114932636B CN 202210471056 A CN202210471056 A CN 202210471056A CN 114932636 B CN114932636 B CN 114932636B
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- guide wheel
- mounting
- wafer
- clamping
- peripheral
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- 235000012431 wafers Nutrition 0.000 claims abstract description 91
- 230000002093 peripheral effect Effects 0.000 claims abstract description 74
- 239000013078 crystal Substances 0.000 claims abstract description 64
- 238000005520 cutting process Methods 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 229910003460 diamond Inorganic materials 0.000 claims description 12
- 239000010432 diamond Substances 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 4
- 239000000178 monomer Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The application discloses an automatic wafer taking machine, which can separate wafers formed after cutting crystal bars one by one and has high separation efficiency, and the technical scheme is as follows: comprises a fixing structure for fixing the peripheral crystal support; the wafer manufacturing device further comprises a cutting assembly and a first driving assembly, wherein the first driving assembly is used for enabling the cutting assembly to move relative to the fixing structure so that the cutting assembly can cut the peripheral substrate, and the wafer manufacturing device belongs to the technical field of wafer manufacturing.
Description
Technical Field
The application belongs to the technical field of wafer preparation, and particularly relates to an automatic wafer taking machine.
Background
The crystal bar is cut to form a plurality of wafers, and a cutting device and a cutting process thereof can be shown by referring to a crystal bar cutting device and a crystal bar cutting method disclosed in patent publication No. CN 111976043A;
in practical application, the cutting process of the crystal bar is as follows: firstly, sticking the crystal bar on a resin substrate, and then, sticking the resin substrate on a crystal support; the crystal support is fixed on a cutting machine, and the crystal bar is cut into a plurality of wafers in a wire cutting mode.
The cut crystal bar completes slice taking work through the next working procedure, and the slice taking work can be shown by referring to a single crystal silicon bar positioning and slice taking mechanism disclosed in the patent publication No. CN 215150678U; the bearing seat is composed of a plurality of bearing monomers and is used for bonding the crystal bar, and after the crystal bar is cut, the bearing seat is decomposed into the plurality of bearing monomers, so that the wafer taking work is completed; as can be seen from the drawings, one carrier corresponds to a plurality of wafers; if the wafers are separated one by one in the mode, one bearing monomer corresponds to one wafer, and in the prior art, the crystal bars have a certain length, so that the wafer is separated one by the scheme, the more bearing monomers are needed, the more the number of the bearing monomers is, the more complicated the operation of combining the bearing monomers into the bearing seat is, and the production efficiency is affected.
Disclosure of Invention
The application mainly aims to provide an automatic wafer taking machine which can separate wafers formed after cutting crystal bars one by one and has high separation efficiency.
According to a first aspect of the present application, there is provided an automatic sheet taking machine, including a fixing structure for fixing an external wafer carrier; the device also comprises a cutting assembly and a first driving assembly, wherein the first driving assembly is used for enabling the cutting assembly to move relative to the fixed structure so as to enable the cutting assembly to cut the peripheral substrate.
In a specific embodiment of the present application, the present application further includes a frame, the fixing structure is a fixing groove disposed on the frame, one end of the fixing groove is an open end into which the external crystal support is inserted, two opposite sides of the fixing groove are respectively provided with a clamping rod, and the clamping rods extend towards the length direction of the fixing groove to form the fixing groove into an h-shaped groove structure.
In a specific embodiment of the present application, the apparatus further includes a first locking member detachably connected to the fixing groove for locking the peripheral crystal support in the fixing groove.
In a specific embodiment of the present application, the first driving assembly includes an electric sliding table disposed on the frame, and a mounting rack disposed on the electric sliding table;
the cutting assembly comprises a first guide wheel and a second guide wheel; the diamond wire is annular and is wound on the first guide wheel and the second guide wheel; the first guide wheel is driven to rotate by a second driving assembly; the first guide wheel and the second guide wheel are both rotatably arranged on the mounting frame.
In a specific embodiment of the application, the first guide wheel, the second guide wheel and the diamond wire are matched to form a cutting plane; the first guide wheel is arranged on the mounting frame through a first adjusting structure, and the second guide wheel is arranged on the mounting frame through a second adjusting structure; the first adjusting structure is used for adjusting the distance between the first guide wheel and the fixed groove, and the second adjusting structure is used for adjusting the distance between the second guide wheel and the fixed groove, so that the distance between the cutting plane and the fixed groove is adjustable.
In a specific embodiment of the present application, the first guide wheel and the second driving assembly are arranged on a mounting block, and the mounting block is connected to the mounting frame in a manner of up-down sliding; the first adjusting structure comprises a supporting piece, wherein the supporting piece is positioned below the mounting block and extends upwards to limit the mounting block to slide; the support is mounted on the mounting frame in a clamping manner so that the height of the upward extension of the support is adjustable;
the second adjusting structure comprises a mounting column and a thread block, the thread block is fixedly connected to the mounting frame, and threads matched with the thread block are arranged on the mounting column; the second guide wheel is rotatably connected to the mounting column.
In a particular embodiment of the application, it further comprises a coolant outlet pipe, which is fixed to the mounting frame, the outlet end of the coolant outlet pipe being arranged in the direction of the diamond wire.
In a specific embodiment of the application, the wafer carrier further comprises a clamping assembly, wherein the clamping assembly comprises a mounting plate, a limiting groove is formed in the mounting plate, and a wafer carrier with a wafer carrier groove is placed in the limiting groove; the wafer bracket is arranged relative to the fixed slot; the mounting plate is driven by a third driving component to be close to or far away from the fixing groove.
In a specific embodiment of the application, the wafer clamping device further comprises a clamping rod, wherein the clamping rod is driven by a fourth driving assembly to clamp the peripheral crystal bar in the wafer bracket; the fourth drive assembly is disposed on the mounting plate.
In a specific embodiment of the present application, two ends of the wafer bracket in the length direction are open ends; the wafer clamping device also comprises 2 clamping plates for limiting the peripheral crystal bars in the wafer bracket; the clamping plates are arranged on the wafer supporting blocks through a third adjusting structure, so that the distance between the 2 clamping plates is adjustable.
In a specific embodiment of the present application, the third adjustment structure includes a mounting hole provided on the wafer support block, the mounting hole extending along a length direction of the wafer support groove; the clamping plate is characterized by further comprising a mounting rod arranged on the clamping plate, wherein the mounting rod is slidably connected in the mounting hole and can be locked through a second locking piece.
One of the above technical solutions of the present application has at least one of the following advantages or beneficial effects:
in practical application, peripheral hardware crystal bar bonds on peripheral hardware base plate, peripheral hardware base plate bonds on peripheral hardware crystal support, wire-electrode cutting's cutting depth reaches on the peripheral hardware base plate so that peripheral hardware crystal bar is cut into a plurality of wafers, peripheral hardware crystal bar is cut into a plurality of wafers after, with peripheral hardware crystal support fixed on fixed knot constructs, make cutting assembly and fixed knot construct produce relative movement so that cutting assembly cuts peripheral hardware base plate again by first drive assembly, can make the wafer one-to-one that forms after the peripheral hardware crystal bar cuts separate, separation efficiency is high, be convenient for go on of next process.
Drawings
The application is further described below with reference to the drawings and examples;
FIG. 1 is a block diagram of a crystal bar, substrate, susceptor fit;
FIG. 2 is a block diagram of an embodiment of the present application;
fig. 3 is a front view of an embodiment of the present application.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.
In practical application, the peripheral crystal bar a is adhered to the peripheral substrate b, the peripheral substrate is adhered to the peripheral crystal holder c, and the cutting depth of the wire cutting reaches a first position d on the peripheral substrate b so that the peripheral crystal bar a is cut into a plurality of wafers, and the peripheral crystal bar a is adhered to the peripheral substrate b after being cut; the structure diagram of the cooperation of the peripheral crystal bar a, the peripheral substrate b and the peripheral crystal holder c is shown by referring to FIG. 1, wherein the peripheral crystal bar a is cylindrical; the peripheral substrate b is in a long plate shape, a groove body matched with the peripheral crystal bar a is arranged on the peripheral substrate b, grooves for representing cutting positions are also formed in the peripheral substrate b, the grooves are respectively formed in two opposite sides of the peripheral substrate b, and the grooves are the first positions d; opposite sides of the peripheral crystal support c are provided with clamping grooves.
In order to enable wafers generated after cutting of peripheral crystal bars to be separated one by one, the application provides the following scheme:
referring to fig. 2 to 3, an automatic wafer taking machine includes a fixing structure 1 for fixing an external wafer carrier; the wafer cutting device further comprises a cutting assembly 2 and a first driving assembly 3, wherein the first driving assembly 3 is used for enabling the cutting assembly 2 and the fixed structure 1 to move relatively so that the cutting assembly 2 cuts the peripheral substrate, wafers formed after the peripheral crystal bars are cut can be separated one by one, the separation efficiency is high, and the next process is convenient to carry out;
specifically, when dicing the peripheral substrate, the dicing assembly 2 cuts the peripheral substrate at a position corresponding to the first position so that the wafers can be separated one by one.
In this embodiment, the device further includes a frame a, the fixing structure 1 is a fixing groove 11 disposed on the frame a, one end of the fixing groove 11 is an open end into which the peripheral crystal support is inserted, two opposite sides of the fixing groove 11 are respectively provided with a clamping rod 12, the clamping rods 12 extend toward the length direction of the fixing groove 11 to form an i-shaped groove structure for the fixing groove 11, and the clamping rods 12 are matched with the clamping grooves of the peripheral crystal support to enable the peripheral crystal support to be stably fixed in the fixing groove 11;
the crystal support fixing device further comprises a first locking piece 13, wherein the first locking piece 13 is detachably connected to the fixing groove 11 and used for locking the peripheral crystal support in the fixing groove 11, and the arrangement of the first locking piece 13 can further strengthen the stability of the peripheral crystal support in the fixing groove 11;
specifically, the first locking member 13 is a bolt, a threaded hole is formed in the side edge of the fixing groove 11, and the peripheral crystal support is locked in the fixing groove 11 in a manner that the screw penetrates through the threaded hole;
the first locking member 13 may also be a latch, so that the peripheral crystal support is locked in the fixing groove 11 in a manner of tightly pushing the peripheral crystal support, which is not limited in this embodiment.
In this embodiment, the first driving component 3 may drive the cutting component 2 to move, so as to make the cutting component 2 and the fixed structure 1 move relatively; the fixed structure 1 can also be driven to move so as to enable the cutting assembly 2 and the fixed structure 1 to move relatively; the cutting assembly 2 and the fixing structure 1 can be driven to move simultaneously so as to enable the cutting assembly 2 and the fixing structure 1 to move relatively, and the embodiment is not limited in this regard;
as a specific implementation of this embodiment, the first driving component 3 drives the cutting component 2 to move, so that the cutting component 2 and the fixed structure 1 move relatively;
specifically, the first driving assembly 3 includes an electric sliding table 31 provided on the frame a, and a mounting frame 32 provided on the electric sliding table 31;
the cutting assembly 2 comprises a first guide wheel 21 and a second guide wheel 22; the diamond wire 23 is annular and is wound on the first guide wheel 21 and the second guide wheel 22; the first guide wheel 21 is driven to rotate by a second driving assembly 24; the first guide wheel 21 and the second guide wheel 22 are both rotatably arranged on the mounting frame 32; the cutting assembly 2 is driven to move in a mode that the electric sliding table 31 drives the mounting frame 32 to move;
the second driving assembly 24 comprises a driving motor and a rotating shaft which are arranged on the mounting frame 32, the driving motor is in transmission connection with the rotating shaft in a V belt transmission mode, and the first guide wheel 21 is rotatably connected to the rotating shaft;
an auxiliary guide rail 33 is further arranged on the frame a and used for assisting the movement of the mounting frame 32 and guaranteeing the stability of the mounting frame 32 during the movement.
In the embodiment, the first guide wheel 21, the second guide wheel 22 and the diamond wire 23 are matched to form a cutting plane; the first guide wheel 21 is mounted on the mounting frame 32 through a first adjusting structure 4, and the second guide wheel 22 is mounted on the mounting frame 32 through a second adjusting structure 5; the first adjusting structure 4 is used for adjusting the distance between the first guide wheel 21 and the fixed slot 11, and the second adjusting structure 5 is used for adjusting the distance between the second guide wheel 22 and the fixed slot 11, so that the distance between the cutting plane and the fixed slot 11 is adjustable;
in particular, the cutting plane is arranged parallel to the fixed slot 11, and the first adjusting structure 4 and the second adjusting structure 5 can be arranged to fine-tune the distance between the cutting plane and the fixed slot 11, so that the cutting plane can cut at the first position.
In practical application, the fixing groove 11 and the diamond wire 23 can be arranged up and down or left and right; in this embodiment, the fixing groove 11 and the diamond wire 23 are arranged up and down, the first guide wheel 21 and the second driving assembly 24 are arranged on a mounting block 25, and the mounting block 25 is connected to the mounting frame 32 in a manner of being capable of sliding up and down; in actual case, the mounting block 25 is slid down based on the action of gravity; the first adjusting structure 4 comprises a supporting member 41, wherein the supporting member 41 is located below the mounting block 25, and the supporting member 41 extends upwards to limit the sliding of the mounting block 25; the supporting piece 41 is installed on the installation frame 32 in a clamping mode so that the upward extending height of the supporting piece 41 can be adjusted, when the upward extending height of the supporting piece 41 needs to be adjusted, the supporting piece 41 is loosened, the upward extending height of the supporting piece 41 is manually adjusted, and the supporting piece 41 is locked after the adjustment, so that the distance between the first guide wheel 21 and the fixed groove 11 is finely adjusted;
the mounting frame 32 is provided with a clamping block 42, and the supporting piece 41 is locked by matching the bolt with the clamping block 42; the support 41 has a cylindrical structure.
The second adjusting structure 5 comprises a mounting column 51 and a threaded block 52, the threaded block 52 is fixedly connected to the mounting frame 32, and threads matched with the threaded block 52 are arranged on the mounting column 51; the second guide wheel 22 is rotatably connected to the mounting column 51, and the adjustment of the distance between the second guide wheel 22 and the fixed groove 11 is realized through a thread structure;
the distance between the first guide wheel 21 and the fixed slot 11 in this embodiment refers to the distance between the top surface of the first guide wheel 21 and the bottom surface of the fixed slot 11; the distance between the second guide pulley 22 and the fixing groove 11 refers to the distance between the top surface of the second guide pulley 22 and the bottom surface of the fixing groove 11.
In this embodiment, the cooling liquid output pipe 6 is further included, the cooling liquid output pipe 6 is fixed on the mounting frame 32, and the output end of the cooling liquid output pipe 6 is arranged towards the direction of the diamond wire 23; specifically, the output end of the coolant outlet pipe 6 is arranged in the direction of the first position, functioning to cool the cutting position and the diamond wire 23.
In practical application, the cut wafers can be received through manual operation, for example, the wafers are received through a handheld base plate, but the mode has high labor intensity and is easy to fall off by mistake;
in this embodiment, a wafer is received by a clamping assembly 7, the clamping assembly 7 includes a mounting plate 71, a limit groove is formed on the mounting plate 71, and a wafer support block 72 with a wafer support groove is placed in the limit groove; the wafer bracket is arranged relative to the fixed slot 11; the mounting plate 71 is driven by a third driving assembly 73 to be close to or far away from the fixing groove 11;
specifically, the third driving assembly 73 is a cylinder arranged on the frame a, the output end of the cylinder is connected with the mounting plate 71, and the mounting plate 71 is driven by the cylinder to approach or depart from the fixing groove 11;
in actual use, when the peripheral crystal support is mounted on the fixed slot 11, the peripheral crystal bars cut into a plurality of wafers are arranged in a suspended manner, at the moment, the third driving assembly 73 drives the mounting plate 71 to be close to the fixed slot 11 so that the wafer support blocks 72 support the peripheral crystal bars, after being cut by the cutting assembly 2, the wafers are separated one by one and are supported by the wafer support blocks 72, the wafers are prevented from falling and being damaged, manual operation is replaced, and the labor intensity is reduced;
after the dicing is completed, the third driving assembly 73 drives the mounting plate 71 away from the fixing groove 11, so as to facilitate the removal of the wafer carrier 72.
Preferably, the wafer clamping device also comprises clamping rods 74, wherein the clamping rods 74 are driven by a fourth driving assembly 75 to clamp the peripheral crystal bars in the wafer bracket; the fourth drive assembly 75 is disposed on the mounting plate 71;
after the wafer support block 72 supports the peripheral crystal bar, the fourth driving component 75 drives the clamping rod 74 to act so as to clamp the peripheral crystal bar in the wafer support groove, so that the stability of the peripheral crystal bar is ensured, and meanwhile, the stability of the cut wafer is also ensured;
specifically, the clamping rods 74 extend along the length direction of the wafer bracket, the number of the clamping rods 74 is 2, the clamping rods are respectively arranged at two sides of the length direction of the wafer bracket, and the fourth driving assembly 75 is used for driving the clamping rods 74 to rotate towards the direction of the wafer bracket so that the clamping rods 74 clamp the peripheral crystal bars in the wafer bracket; the fourth driving component 75 is an air cylinder, the clamping rod 74 is provided with a rotating block with a tooth-shaped structure, the telescopic rod of the air cylinder is provided with a rack structure, and the telescopic rod of the air cylinder stretches to drive the rotating block to rotate, so that the clamping rod 74 is driven to rotate;
the clamping rods 74 can also clamp the peripheral ingot in a translational manner, which is not limited in this embodiment.
In practical use, the lengths of the peripheral crystal bars are different, and in order to ensure the adaptability of the automatic wafer taking machine to the peripheral crystal bars with different lengths, in the embodiment, two ends of the wafer bracket in the length direction are open ends; also included are 2 clamping plates 76 for confining the peripheral ingot within a wafer bracket, the clamping plates 76 being accessible from the open end of the wafer bracket; the clamping plates 76 are mounted on the wafer support blocks 72 through a third adjusting structure 8, so that the spacing between 2 clamping plates 76 is adjustable, and the spacing between 2 clamping plates 76 is adjusted according to the length of the peripheral crystal bars to be cut actually.
Specifically, the third adjusting structure 8 includes a mounting hole 81 provided on the wafer support block 72, and the mounting hole 81 extends along the length direction of the wafer support groove; the mounting rod 82 is arranged on the clamping plate 76, and the mounting rod 82 is slidably connected in the mounting hole 81 and can be locked by a second locking member 83;
wherein, the mounting holes 81 are respectively arranged at 2 sides of the wafer bracket, one mounting rod 82 is inserted from one end of the wafer bracket 72, and the other mounting rod 82 is inserted from the other end of the wafer bracket 72;
the clamping plate 76 is connected to the mounting bar 82 by a connecting bar, and the mounting hole 81 is in communication with the wafer bracket for the connecting bar to pass through.
The second locking member 83 is a bolt or a jackscrew, and the wafer support block 72 is provided with a threaded hole, so that the mounting rod 82 is locked on the wafer support block 72 by the bolt or the jackscrew.
In this embodiment, a handle is further disposed on the wafer support block 72, so as to facilitate the taking and placing of the wafer support block 72.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (7)
1. An automatic wafer taking machine is characterized by comprising a clamping component (7), a rack (A) and a fixing structure (1) which are used for fixing an external wafer holder; the cutting device comprises a frame (A), a cutting assembly (2), a first driving assembly (3) and a first locking piece (13), wherein the first driving assembly (3) is used for enabling the cutting assembly (2) and a fixing structure (1) to move relatively so that the cutting assembly (2) cuts a peripheral substrate, the fixing structure (1) is a fixing groove (11) arranged on the frame (A), one end of the fixing groove (11) is an open end for inserting a peripheral crystal support, clamping rods (12) are arranged on two opposite sides of the fixing groove (11), and the clamping rods (12) extend towards the length direction of the fixing groove (11) to enable the fixing groove (11) to form an I-shaped groove-shaped structure; the clamping assembly (7) comprises a mounting plate (71), wherein a limiting groove is formed in the mounting plate (71), a wafer supporting block (72) with a wafer supporting groove is placed in the limiting groove, and the wafer supporting groove is arranged relative to the fixing groove (11); the mounting plate (71) can be driven by a third driving assembly (73) to be close to or far away from the fixed groove (11), the first locking piece (13) is detachably connected to the fixed groove (11) and used for locking the peripheral crystal support in the fixed groove (11), and the first driving assembly (3) comprises an electric sliding table (31) arranged on the frame (A) and a mounting rack (32) arranged on the electric sliding table (31); the cutting assembly (2) comprises a first guide wheel (21) and a second guide wheel (22); the diamond wire (23) is annular and is wound on the first guide wheel (21) and the second guide wheel (22); the first guide wheel (21) is driven to rotate through a second driving assembly (24); the first guide wheel (21) and the second guide wheel (22) are both rotatably arranged on the mounting frame (32);
the peripheral crystal bar is adhered to the peripheral substrate, the peripheral substrate is adhered to the peripheral crystal support, the cutting depth of wire cutting reaches the peripheral substrate so that the peripheral crystal bar is cut into a plurality of wafers, the peripheral crystal bar is fixed on the fixing structure (1) after being cut into a plurality of wafers, and then the first driving assembly (3) enables the cutting assembly and the fixing structure (1) to move relatively so that the cutting assembly (2) cuts the peripheral substrate, so that wafers formed after the peripheral crystal bar is cut are separated one by one.
2. The automatic sheet taking machine according to claim 1, wherein the first guide wheel (21), the second guide wheel (22) and the diamond wire (23) cooperate to form a cutting plane; the first guide wheel (21) is arranged on the mounting frame (32) through a first adjusting structure (4), and the second guide wheel (22) is arranged on the mounting frame (32) through a second adjusting structure (5); the first adjusting structure (4) is used for adjusting the distance between the first guide wheel (21) and the fixed groove (11), and the second adjusting structure (5) is used for adjusting the distance between the second guide wheel (22) and the fixed groove (11), so that the distance between the cutting plane and the fixed groove (11) is adjustable.
3. The automatic sheet taking machine according to claim 2, wherein the first guide wheel (21) and the second driving assembly (24) are arranged on a mounting block (25), and the mounting block (25) is connected to the mounting frame (32) in a manner of sliding up and down; the first adjusting structure (4) comprises a supporting piece (41), wherein the supporting piece (41) is positioned below the mounting block (25), and the supporting piece (41) extends upwards to limit the mounting block (25) to slide; the support (41) is mounted on the mounting frame (32) in a clamping manner so that the upwardly extending height of the support (41) is adjustable; the second adjusting structure (5) comprises a mounting column (51) and a thread block (52), the thread block (52) is fixedly connected to the mounting frame (32), and threads matched with the thread block (52) are arranged on the mounting column (51); the second guide wheel (22) is rotatably connected to the mounting column (51).
4. The automatic chip mounter according to claim 1, further comprising a coolant output pipe (6), said coolant output pipe (6) being fixed to said mounting frame (32), an output end of said coolant output pipe (6) being disposed toward said diamond wire (23).
5. The automatic wafer handling machine of claim 1, further comprising clamping bars (74), the clamping bars (74) being driven by a fourth drive assembly (75) for clamping peripheral ingots in wafer brackets; the fourth drive assembly (75) is disposed on the mounting plate (71).
6. The automatic sheet dispenser of claim 1, wherein both ends in the length direction of the wafer bracket are open ends; also included are 2 clamping plates (76) for confining the peripheral boule within the wafer support slots; the clamping plates (76) are mounted on the wafer support block (72) through a third adjusting structure (8) so that the interval between the 2 clamping plates (76) is adjustable.
7. The automatic wafer handling machine of claim 6, wherein the third adjustment structure (8) includes mounting holes (81) provided on the wafer support blocks (72), the mounting holes (81) extending along a length of the wafer support slots; the clamping plate (76) is provided with a clamping plate (82), and the clamping plate is provided with a clamping hole (81), and the clamping plate is provided with a second locking piece (83), wherein the clamping plate is provided with a clamping plate (82).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210471056.XA CN114932636B (en) | 2022-04-28 | 2022-04-28 | Automatic sheet taking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210471056.XA CN114932636B (en) | 2022-04-28 | 2022-04-28 | Automatic sheet taking machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114932636A CN114932636A (en) | 2022-08-23 |
| CN114932636B true CN114932636B (en) | 2023-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210471056.XA Active CN114932636B (en) | 2022-04-28 | 2022-04-28 | Automatic sheet taking machine |
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| CN (1) | CN114932636B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116587451B (en) * | 2023-06-21 | 2024-01-26 | 苏州博宏源机械制造有限公司 | Semiconductor wafer material processing device and method |
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| CN103958140A (en) * | 2011-09-23 | 2014-07-30 | 梅耶博格公司 | Wafer cutting sacrificial substrate for use in wafer cutting |
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| CN212684366U (en) * | 2020-09-28 | 2021-03-12 | 青岛高测科技股份有限公司 | Diamond wire reciprocating cutting machine head |
| CN113580402A (en) * | 2021-08-08 | 2021-11-02 | 王晶晶 | Monocrystalline silicon manufacturing machine capable of automatically discharging and using method thereof |
| WO2021258558A1 (en) * | 2020-06-24 | 2021-12-30 | 纵达电器有限公司 | Automatic welding tool for circuit breaker coil assembly |
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2022
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| WO2021258558A1 (en) * | 2020-06-24 | 2021-12-30 | 纵达电器有限公司 | Automatic welding tool for circuit breaker coil assembly |
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| CN114932636A (en) | 2022-08-23 |
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