CN219575574U

CN219575574U - Efficient UV membrane ultraviolet ray dispergator

Info

Publication number: CN219575574U
Application number: CN202320635490.7U
Authority: CN
Inventors: 邵玉成
Original assignee: Jiuyi Semiconductor Equipment Shanghai Co ltd
Current assignee: Jiuyi Semiconductor Equipment Shanghai Co ltd
Priority date: 2023-03-28
Filing date: 2023-03-28
Publication date: 2023-08-22
Anticipated expiration: 2033-03-28

Abstract

The utility model discloses a high-efficiency UV film ultraviolet debonder, which comprises: a de-glue mechanism; the feeding mechanism is fixedly connected to the top of the de-glue mechanism; the mounting mechanism is fixedly connected to the top of the feeding mechanism and comprises a fixing plate, the top of the fixing plate is fixedly connected with a supporting frame and a first cylinder respectively, the surface of the supporting frame is fixedly connected with a limiting piece, a piston rod of the first cylinder is fixedly connected with a clamp, and the bottom of the fixing plate is fixedly connected with a second cylinder. The utility model has the advantages of it is efficient, solved current UV membrane ultraviolet ray dispergation device at the in-process of using, be inconvenient for carrying out the centre gripping fixed to the wafer that needs the dispergation, lead to the wafer unstable at the in-process that removes easily, the wafer after the ejection dispergation of being inconvenient for influences the staff and takes out the wafer fast, reduces the problem of knowing the glue device work efficiency.

Description

Efficient UV membrane ultraviolet ray dispergator

Technical Field

The utility model relates to the technical field of semiconductor chip production, in particular to a high-efficiency UV film ultraviolet glue-removing device.

Background

The UV glue remover is a full-automatic glue removing device for reducing and removing the viscosity of the UV film and the cutting film adhesive tape. In the semiconductor chip production process, before dicing the chip, a wafer is fixed on a frame by a dicing film, and after the dicing process is completed, the fixing film is irradiated with UV light to enable the UV film to be sticky and solidified so as to reduce the sticky of the dicing fixing film, so that the subsequent packaging process can be smoothly produced. The UV tape has a strong adhesive strength, and the tape firmly adheres to the wafer during a wafer grinding process or a wafer dicing process. When irradiated with ultraviolet rays, the adhesive strength becomes low. Therefore, the wafer or chip is easy to peel off from the adhesive tape after ultraviolet irradiation, and the UV glue remover solves the problems that the UV glue remover in the glue removing process of the wafer, glass and ceramic cutting process is not only limited in the semiconductor packaging industry, but also applicable to the degumming of UV films such as optical lenses, LEDs, ICs, semiconductors, integrated circuit boards, mobile hard disks and the like, glass filters and the like, and UV adhesive tape degumming.

The utility model provides a UV membrane debonder of patent number CN 213519893U through increasing the gap between wafer and the board of placing, makes things convenient for the staff to take out the wafer after the debonding, increases the efficiency of debonding, but takes out the wafer through the gap and leads to its damage easily.

The existing UV film ultraviolet ray debonder is inconvenient to clamp and fix a wafer needing debonder in the use process, the wafer is unstable in the moving process easily, the wafer after debonder is inconvenient to eject, workers are affected to take out the wafer rapidly, and the working efficiency of the debonder is reduced.

Disclosure of Invention

The utility model aims to provide a high-efficiency UV film ultraviolet ray dispergation device which has the advantage of high efficiency, and solves the problems that the prior UV film ultraviolet ray dispergation device is inconvenient to clamp and fix a wafer needing dispergation in the use process, the wafer is unstable in the moving process, the wafer after dispergation is inconvenient to eject, the wafer is influenced by workers to be taken out quickly, and the working efficiency of the dispergation device is reduced.

In order to achieve the above purpose, the present utility model provides the following technical solutions: an efficient UV film ultraviolet debonder comprising:

a de-glue mechanism;

the feeding mechanism is fixedly connected to the top of the de-glue mechanism;

the mounting mechanism is fixedly connected to the top of the feeding mechanism and comprises a fixing plate, the top of the fixing plate is fixedly connected with a supporting frame and a first air cylinder respectively, a limiting part is fixedly connected to the surface of the supporting frame, a clamp is fixedly connected to a piston rod of the first air cylinder, a second air cylinder is fixedly connected to the bottom of the fixing plate, and the top of the second air cylinder extends to the top of the fixing plate and is fixedly connected with a pushing plate.

In order to facilitate the de-sizing, the efficient UV film ultraviolet de-sizing device is preferably selected as the efficient UV film ultraviolet de-sizing device, the de-sizing mechanism comprises a base, the top of the base is fixedly connected with a shell, the top of the shell is fixedly connected with a controller, and the top of an inner cavity of the shell is fixedly connected with an ultraviolet lamp.

In order to facilitate the observation of working conditions, the efficient UV film ultraviolet glue removing device is preferable, an observation window is formed in the top of the front face of the shell, and an indicator lamp is arranged at the bottom of the front face of the shell.

In order to facilitate the movement of the mounting mechanism, the efficient UV film ultraviolet glue removing device is preferably adopted, the feeding mechanism comprises a plate body, the top of the plate body is fixedly connected with a sliding rail and a fixing frame, and the top of the sliding rail is slidably connected with a moving part.

In order to facilitate the movement of the driving installation mechanism, the efficient UV film ultraviolet glue removing device is preferable in the utility model, the bottom of the fixing frame is fixedly connected with a motor, an output shaft of the motor is fixedly connected with a gear, the surface of the gear is meshed with a rack, and the rear side of the rack is fixedly connected with the front face of the moving part.

In order to facilitate limiting of the wafer, the efficient UV film ultraviolet dispergation device is preferable, wherein the number of the limiting pieces is a plurality of, and the limiting pieces are uniformly distributed on the surface of the supporting frame.

In order to facilitate ejection of the wafer, the efficient UV film ultraviolet debonding device is preferably adopted, and the pushing plate is positioned in the inner cavity of the supporting frame.

Compared with the prior art, the utility model has the following beneficial effects:

1. the utility model can facilitate the de-gluing of the wafer by arranging the de-gluing mechanism, the de-gluing mechanism comprises a controller, the controller is used for starting the ultraviolet lamp, the ultraviolet lamp emits ultraviolet rays to de-glue the wafer in the shell, the front surface of the shell is provided with the observation window and the indicator lamp, a worker can observe the working state of the ultraviolet lamp through the observation window, and the indicator lamp displays the working state of the de-gluing device.

2. According to the utility model, the feeding mechanism is arranged, so that the mounting mechanism can be conveniently driven to move to send the wafer into and out of the glue removing mechanism, the feeding mechanism comprises the motor, the output shaft of the motor drives the gear to rotate, the gear drives the rack and the moving piece to synchronously move to transversely adjust the mounting mechanism, the rack slides on the inner wall of the fixing frame in the moving process, the fixing frame limits the rack, the moving piece slides on the surface of the sliding rail in the moving process, and the sliding rail limits the moving piece to prevent the moving piece from shaking forwards and backwards.

3. The utility model can conveniently fix and eject the wafer by arranging the mounting mechanism, the mounting mechanism comprises the supporting frame, a worker places the wafer on the top of the supporting frame, the limiting piece limits the wafer to prevent the wafer from shifting, the first cylinder drives the clamp to retract to clamp the wafer, when the wafer needs to be taken out, the first cylinder drives the clamp to reset, the second cylinder drives the push plate to move upwards to eject the wafer out of the top of the supporting frame, so that the worker can take out the wafer quickly, and the working efficiency of the debonding device is increased.

Drawings

FIG. 1 is a perspective view of the present utility model;

FIG. 2 is a front view of the debonder of the present utility model;

FIG. 3 is a bottom exploded view of the debonder of the present utility model;

FIG. 4 is a front view of the feeding mechanism of the present utility model;

fig. 5 is a front exploded view of the mounting mechanism of the present utility model.

In the figure: 1. a de-glue mechanism; 101. a base; 102. a controller; 103. a housing; 104. an indicator light; 105. an ultraviolet lamp; 2. a feeding mechanism; 201. a plate body; 202. a slide rail; 203. a gear; 204. a motor; 205. a rack; 206. a fixing frame; 207. a moving member; 3. a mounting mechanism; 301. a fixing plate; 302. a push plate; 303. a support frame; 304. a limiting piece; 305. a first cylinder; 306. a clamp; 307. and a second cylinder.

Detailed Description

Referring to fig. 1-5, a high-efficiency UV film ultraviolet debonding apparatus includes:

a de-glue mechanism 1;

the feeding mechanism 2 is fixedly connected to the top of the de-glue mechanism 1;

the mounting mechanism 3, the top of mounting mechanism 3 fixed connection in feed mechanism 2, mounting mechanism 3 includes fixed plate 301, the top of fixed plate 301 is fixedly connected with support frame 303 and first cylinder 305 respectively, the fixed surface of support frame 303 is connected with locating part 304, the piston rod fixedly connected with anchor clamps 306 of first cylinder 305, the bottom fixedly connected with second cylinder 307 of fixed plate 301, the top of second cylinder 307 extends to the top of fixed plate 301 and fixedly connected with push pedal 302.

In this embodiment: through setting up installation mechanism 3, can be convenient for fix and ejecting to the wafer, installation mechanism 3 has included support frame 303, the staff places the wafer at the top of support frame 303, locating part 304 is spacing to the wafer prevents its skew, first cylinder 305 drives anchor clamps 306 and contracts and carry out the centre gripping to the wafer, when the wafer needs to be taken out, first cylinder 305 drives anchor clamps 306 and resets, second cylinder 307 drives push pedal 302 and upwards moves, the top of support frame 303 is ejecting to the wafer, make the staff can take out the wafer fast, increase the work efficiency of dispergator.

As a technical optimization scheme of the utility model, the de-glue mechanism 1 comprises a base 101, wherein the top of the base 101 is fixedly connected with a shell 103, the top of the shell 103 is fixedly connected with a controller 102, and the top of an inner cavity of the shell 103 is fixedly connected with an ultraviolet lamp 105.

In this embodiment: through setting up the de-glue mechanism 1, can be convenient for carry out the de-glue to the wafer, de-glue mechanism 1 has included controller 102, starts ultraviolet lamp 105 through controller 102, and ultraviolet lamp 105 sends the ultraviolet ray and carries out the de-glue to the wafer inside the casing 103.

As a technical optimization scheme of the utility model, an observation window is arranged at the top of the front surface of the shell 103, and an indicator lamp 104 is arranged at the bottom of the front surface of the shell 103.

In this embodiment: the front of the housing 103 is provided with an observation window and an indicator lamp 104, a worker can observe the working state of the ultraviolet lamp 105 through the observation window, and the indicator lamp 104 displays the working state of the glue removing device.

As a technical optimization scheme of the utility model, the feeding mechanism 2 comprises a plate body 201, a sliding rail 202 and a fixing frame 206 are fixedly connected to the top of the plate body 201, a moving member 207 is slidably connected to the top of the sliding rail 202, a motor 204 is fixedly connected to the bottom of the fixing frame 206, a gear 203 is fixedly connected to an output shaft of the motor 204, a rack 205 is meshed with the surface of the gear 203, and the rear side of the rack 205 is fixedly connected with the front face of the moving member 207.

In this embodiment: through setting up feed mechanism 2, can be convenient for drive installation mechanism 3 and remove, come into wafer with send out the debonder 1, feed mechanism 2 has included motor 204, motor 204's output shaft drives gear 203 and rotates, gear 203 drives rack 205 and moving part 207 synchronous movement, carry out horizontal regulation to installation mechanism 3, rack 205 moves the in-process at the inner wall of mount 206 slides, mount 206 carries out spacingly to it, moving part 207 moves the in-process at slide rail 202's surface slip, slide rail 202 carries out spacingly to moving part 207 and prevents its back-and-forth rocking.

As a technical optimization scheme of the utility model, the number of the limiting pieces 304 is a plurality, the limiting pieces are uniformly distributed on the surface of the supporting frame 303, and the pushing plate 302 is positioned in the inner cavity of the supporting frame 303.

In this embodiment: through setting up a plurality of locating parts 304, can carry out spacingly to the wafer, prevent its in-process skew of installation, push pedal 302 is located the inside of support frame 303, can support the bottom of wafer to can ejecting the wafer.

Working principle:

during the use, the staff places the wafer at the top of support frame 303, limiting part 304 is spacing to the wafer prevents its skew, first cylinder 305 drives anchor clamps 306 and contracts and carry out the centre gripping to the wafer, the output shaft of motor 204 drives gear 203 and rotates, gear 203 drives rack 205 and moving part 207 synchronous motion, transversely adjust installation mechanism 3, make installation mechanism 3 drive the wafer enter into in the dispergator 1, start ultraviolet lamp 105 through controller 102, ultraviolet lamp 105 sends the wafer of ultraviolet to the inside of casing 103 and carries out the dispergation, when the wafer needs to take out, first cylinder 305 drives anchor clamps 306 and resets, second cylinder 307 drives push pedal 302 upward movement, the top of support frame 303 is ejecting the wafer, make the staff can take out the wafer fast, increase dispergation device's work efficiency.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. An efficient UV film ultraviolet debonder, comprising:

a de-glue mechanism (1);

the feeding mechanism (2), the feeding mechanism (2) is fixedly connected to the top of the de-glue mechanism (1);

the mounting mechanism (3), the top of mounting mechanism (3) fixedly connected with feed mechanism (2), mounting mechanism (3) are including fixed plate (301), the top of fixed plate (301) is fixedly connected with support frame (303) and first cylinder (305) respectively, the fixed surface of support frame (303) is connected with locating part (304), the piston rod fixedly connected with anchor clamps (306) of first cylinder (305), the bottom fixedly connected with second cylinder (307) of fixed plate (301), the top of second cylinder (307) extends to the top of fixed plate (301) and fixedly connected with push pedal (302).

2. The efficient UV film ultraviolet debonder of claim 1 wherein: the de-glue mechanism (1) comprises a base (101), wherein the top of the base (101) is fixedly connected with a shell (103), the top of the shell (103) is fixedly connected with a controller (102), and the top of an inner cavity of the shell (103) is fixedly connected with an ultraviolet lamp (105).

3. The efficient UV film ultraviolet debonder of claim 2 wherein: the top of casing (103) openly has seted up the observation window, casing (103) openly bottom is provided with pilot lamp (104).

4. The efficient UV film ultraviolet debonder of claim 1 wherein: the feeding mechanism (2) comprises a plate body (201), a sliding rail (202) and a fixing frame (206) are fixedly connected to the top of the plate body (201), and a moving part (207) is slidably connected to the top of the sliding rail (202).

5. The efficient UV film ultraviolet debonder of claim 4 wherein: the bottom fixedly connected with motor (204) of mount (206), the output shaft fixedly connected with gear (203) of motor (204), the surface engagement of gear (203) has rack (205), the front fixed connection of rear side and moving part (207) of rack (205).

6. The efficient UV film ultraviolet debonder of claim 1 wherein: the number of the limiting pieces (304) is a plurality of, and the limiting pieces are uniformly distributed on the surface of the supporting frame (303).

7. The efficient UV film ultraviolet debonder of claim 1 wherein: the push plate (302) is positioned in the inner cavity of the supporting frame (303).